JPH07237117A - Inclination lapping processing method - Google Patents
Inclination lapping processing methodInfo
- Publication number
- JPH07237117A JPH07237117A JP3240594A JP3240594A JPH07237117A JP H07237117 A JPH07237117 A JP H07237117A JP 3240594 A JP3240594 A JP 3240594A JP 3240594 A JP3240594 A JP 3240594A JP H07237117 A JPH07237117 A JP H07237117A
- Authority
- JP
- Japan
- Prior art keywords
- work
- processing
- lapping
- spindle
- inclining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は超精密製缶工具における
例えば絞り加工の押さえリング等のワークの数センチメ
ータ当たり数ミクロンメータ程度の勾配で傾斜していて
微少傾斜面を加工する傾斜ラッピング加工方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a slant lapping process for machining a minute slanted surface which is slanted at a gradient of about several micrometers per several centimeters of a work such as a pressing ring for drawing in an ultra-precision can manufacturing tool. Regarding the method.
【0002】[0002]
【従来の技術】超精密製缶における絞り加工の押さえリ
ングはその押さえ面を数センチメータ当たり数ミクロン
メータ程度の勾配で傾斜させる必要がある。しかして従
来上記微少傾斜面を有する押さえリングすなわちワーク
は特開昭61−274873号に示すようにラッピング
盤においてワークのスピンドルを傾斜させて定盤の平面
状の研磨面に当てて加工していた。2. Description of the Related Art In a pressing ring used for drawing an ultra-precision can, it is necessary to incline the pressing surface with a gradient of several micrometers per centimeter. However, hitherto, a pressing ring having a minutely inclined surface, that is, a work has been processed by inclining the spindle of the work in a lapping machine and abutting it on a flat polishing surface of a surface plate as shown in JP-A-61-274873. .
【0003】[0003]
【発明が解決しようとする課題】しかしながら、ラッピ
ング盤におけるスピンドルの傾斜が面倒で量産ができな
い。本発明はワークのスピンドルは垂直のままで、定盤
の研磨面を傾斜させて加工するものである。However, the inclination of the spindle in the lapping machine is troublesome and mass production is not possible. In the present invention, the work spindle is kept vertical and the polishing surface of the surface plate is inclined for processing.
【0004】[0004]
【課題を解決するための手段】本発明は上記の課題を解
決するため、定盤1の研磨面2を傾斜させてワーク3を
傾斜面4に加工することを特徴とし、又上記ワーク3の
傾斜面4の角度は1.8/40000〜2.0/200
00である。In order to solve the above problems, the present invention is characterized in that a polishing surface 2 of a surface plate 1 is inclined to machine a work 3 into an inclined surface 4, and the work 3 is The angle of the inclined surface 4 is 1.8 / 40000 to 2.0 / 200.
00.
【0005】[0005]
【作 用】ラップ盤においてはワーク3のスピンドル3
aを傾斜させず、垂直のまま加工する。[Operation] Spindle 3 of work 3 in lapping machine
A is not tilted and is machined vertically.
【0006】[0006]
【実施例】図1示のようにラッピング装置(ラップ盤、
平面、球面ロータリー研削盤及びファイングライティン
グ盤、ボリッシュ盤等を意味する)において定盤1の研
磨面2を傾斜させてワーク3を傾斜面4に加工する。図
2示のように上記ワーク3の傾斜面4の角度は1.8/
40000〜2.0/20000である。図3,4は本
発明に用いる定盤1の修正前の状態の断面図と図修正後
の状態の断面図を示すもので、ラッピング装置の定盤1
の研磨面2は回転する通常修正リング5によりその間に
砥石6の粉を介在させて研磨するが、通常は研磨面2は
平面に研磨している。しかし本発明の場合は定盤1の研
磨面2を修正リング5を用い図4示のように中低に加工
する。このように加工した定盤1を用いて図1示のよう
にワーク3の研磨面4を加工する。この中低量dは径6
00mmの定盤において中心で0.05〜0.06mm
である。EXAMPLE As shown in FIG. 1, a lapping device (lap machine,
A flat surface, a spherical rotary grinding machine, a filing writing machine, a bolishing machine, etc.) is used to incline the polishing surface 2 of the surface plate 1 to process the work 3 into the inclined surface 4. As shown in FIG. 2, the angle of the inclined surface 4 of the work 3 is 1.8 /
It is 40,000-2.0 / 20,000. 3 and 4 are a cross-sectional view of the surface plate 1 used in the present invention before correction and a cross-sectional view of the surface plate 1 after correction, respectively.
The polishing surface 2 is ground by the rotating normal correction ring 5 with the powder of the grindstone 6 interposed therebetween, but the polishing surface 2 is usually ground flat. However, in the case of the present invention, the polishing surface 2 of the surface plate 1 is machined to a low level as shown in FIG. The polishing surface 4 of the work 3 is processed as shown in FIG. 1 using the surface plate 1 processed in this way. This medium and low amount d has a diameter of 6
0.05 to 0.06 mm at the center on a 00 mm surface plate
Is.
【0007】このようにするとワーク3の研磨面2の数
センチメータ当たり数ミクロンの傾斜は定盤1の中低量
dにより自由に設定出来、また面粗度は0.4S以下
で、しかも鏡面となり、製品のキズは皆無となり、更に
加工は安定しているため同一寸法,同一精度の製品を必
要な数だけ揃えることが出来るものである。またラッピ
ング盤においてはワーク3のスピンドル3aを傾斜させ
ず、垂直のまま加工できるので、熟練工の手を借りずに
誰でも加工可能であると共に、スピンドルを複数個有す
るラッピング装置においては、ワーク3を各々のスピン
ドル3aに取り付けるだけで数個分のワーク3を一度に
加工が出来るものである。すなわち、ワーク3のスピン
ドル3aは垂直でかつ複数個にしてワークの量産が可能
となる。In this way, the inclination of the polishing surface 2 of the work 3 of several microns per several centimeters can be freely set by the medium-low amount d of the surface plate 1, and the surface roughness is 0.4S or less, and the mirror surface is obtained. Since there are no scratches on the product and the processing is stable, it is possible to prepare the required number of products with the same size and accuracy. Further, in the lapping machine, since the spindle 3a of the work 3 can be machined vertically without being tilted, anyone can machine it without the help of a skilled worker, and in a lapping machine having a plurality of spindles, the work 3 can be machined. It is possible to machine several work pieces 3 at a time by simply attaching them to each spindle 3a. That is, the spindle 3a of the work 3 is vertical and a plurality of work pieces 3 can be formed to mass-produce the work.
【0008】[0008]
【発明の効果】以上のように本発明によれば、ラッピン
グ装置の定盤1を、修正リング5を用いて、中低状に傾
斜加工し、傾斜した定盤1の研磨面2により、ワーク加
工は、安定した仕上りと精度が得られ、量産化が可能に
なるものである。As described above, according to the present invention, the surface plate 1 of the lapping device is tilted into a medium-low shape by using the correction ring 5, and the work surface is formed by the inclined polishing surface 2 of the surface plate 1. As for processing, stable finish and accuracy can be obtained, and mass production is possible.
【図1】本発明方法により加工するワークと定盤を示す
断面図である。FIG. 1 is a cross-sectional view showing a work and a surface plate to be processed by the method of the present invention.
【図2】その加工後のワークの断面図である。FIG. 2 is a cross-sectional view of the work after the processing.
【図3】本発明に用いる定盤の修正前の状態の断面図で
ある。FIG. 3 is a cross-sectional view of a surface plate used in the present invention before correction.
【図4】図修正後の状態の断面図である。FIG. 4 is a sectional view of a state after the figure is corrected.
1 定盤 2 研磨面 3 ワーク 3a スピンドル 4 傾斜面 5 修正リング 6 砥石 1 surface plate 2 polishing surface 3 work 3a spindle 4 inclined surface 5 correction ring 6 grindstone
Claims (2)
面に加工することを特徴とする傾斜ラッピング加工方
法。1. An inclined lapping method, wherein a polishing surface of a surface plate is inclined to process a work into an inclined surface.
0000〜2.0/20000である請求項1記載の傾
斜ラッピング加工方法。2. The angle of the inclined surface of the work is 1.8 / 4.
The inclined lapping method according to claim 1, which is 0000 to 2.0 / 20000.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3240594A JP2721642B2 (en) | 1994-03-02 | 1994-03-02 | Inclined lapping method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3240594A JP2721642B2 (en) | 1994-03-02 | 1994-03-02 | Inclined lapping method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07237117A true JPH07237117A (en) | 1995-09-12 |
JP2721642B2 JP2721642B2 (en) | 1998-03-04 |
Family
ID=12358051
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3240594A Expired - Fee Related JP2721642B2 (en) | 1994-03-02 | 1994-03-02 | Inclined lapping method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2721642B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103213062A (en) * | 2013-03-15 | 2013-07-24 | 上海华力微电子有限公司 | Chemical mechanical polishing equipment |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04315570A (en) * | 1991-04-15 | 1992-11-06 | Seiko Electronic Components Ltd | Flat surface lapping device |
-
1994
- 1994-03-02 JP JP3240594A patent/JP2721642B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04315570A (en) * | 1991-04-15 | 1992-11-06 | Seiko Electronic Components Ltd | Flat surface lapping device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103213062A (en) * | 2013-03-15 | 2013-07-24 | 上海华力微电子有限公司 | Chemical mechanical polishing equipment |
CN103213062B (en) * | 2013-03-15 | 2015-12-09 | 上海华力微电子有限公司 | Chemical-mechanical grinding device |
Also Published As
Publication number | Publication date |
---|---|
JP2721642B2 (en) | 1998-03-04 |
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