JPH07235852A - Pi type filter - Google Patents

Pi type filter

Info

Publication number
JPH07235852A
JPH07235852A JP2537894A JP2537894A JPH07235852A JP H07235852 A JPH07235852 A JP H07235852A JP 2537894 A JP2537894 A JP 2537894A JP 2537894 A JP2537894 A JP 2537894A JP H07235852 A JPH07235852 A JP H07235852A
Authority
JP
Japan
Prior art keywords
capacitor
green sheets
forming
mixture
pie
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2537894A
Other languages
Japanese (ja)
Inventor
Akira Uchida
彰 内田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP2537894A priority Critical patent/JPH07235852A/en
Publication of JPH07235852A publication Critical patent/JPH07235852A/en
Withdrawn legal-status Critical Current

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  • Coils Or Transformers For Communication (AREA)
  • Filters And Equalizers (AREA)

Abstract

PURPOSE:To prevent production of a crack due to a difference in a contraction rate and to attain stable manufacture by allowing a 1st layer forming A capacitor part and a 2nd layer forming a ferrite bead part to include a mixture between a dielectric body and a magnetic body. CONSTITUTION:Green sheets 1-7 are formed by coating a slurry of a mixture between a dielectric body and a magnetic body to a polyester base sheet and drying the slurry. After the green sheets 1-7 are formed, a conductive paste is printed onto the green sheets 2,5,6 by the screen print method to form internal electrodes 8-10. Then the three green sheets 1-3 forming a ferrite bead 11 and the four green sheets 5-7 forming a capacitor section 12 are all laminated, baked and a sintered body is obtained. Thus, a capacitor element and an inductor element are laminated and the laminates are stably baked simultaneously.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電子機器のノイズ除去
等に用いられるパイ形フィルタに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pie filter used for noise removal of electronic equipment.

【0002】[0002]

【従来の技術】従来、電子機器の高周波ノイズ対策用と
してチップコンデンサ,フェライトチップビーズ,T形
EMIフィルタ等の電子チップ部品が販売されている
が、パイ形のチップフィルタは販売されていない。この
ため、パイ形フィルタが必要な場合は、チップコンデン
サとフェライトチップビーズを組み合わせて使用してい
る。
2. Description of the Related Art Conventionally, electronic chip components such as a chip capacitor, a ferrite chip bead, and a T-type EMI filter have been sold as countermeasures against high frequency noise in electronic equipment, but a pie-type chip filter has not been sold. For this reason, when a pie filter is required, a chip capacitor and ferrite chip beads are used in combination.

【0003】[0003]

【発明が解決しようとする課題】パイ形のチップフィル
タが一般に販売されていない理由は、その製作の困難性
にある。すなわち、チップコンデンサを構成する誘電体
とフェライトチップビーズを構成する磁性体を積層して
同時に焼成すると誘電体と磁性体との収縮の違いにより
クラックが発生してしまい、そのままでは安定した製造
を行うことはできない。このため、パイ形のチップフィ
ルタを製造するには、チップコンデンサとフェライトチ
ップビーズを互いに独立した工程で焼成した後、貼り合
わせる必要があり、工数,コストがかかるという問題が
ある。
The reason why pie-type chip filters are not generally sold is that they are difficult to manufacture. That is, when the dielectric material forming the chip capacitor and the magnetic material forming the ferrite chip beads are laminated and fired at the same time, a crack occurs due to the difference in contraction between the dielectric material and the magnetic material, and stable manufacturing is performed as it is. It is not possible. Therefore, in order to manufacture a pie-shaped chip filter, it is necessary to bond the chip capacitors and the ferrite chip beads to each other after firing them in independent steps, which results in a problem of increasing man-hours and costs.

【0004】本発明は、上記事情に鑑み、低コストかつ
安定した製造が可能なパイ形フィルタを提供することを
目的とする。
In view of the above circumstances, an object of the present invention is to provide a pie filter which can be manufactured at low cost and stably.

【0005】[0005]

【課題を解決するための手段】上記目的を達成する本発
明のパイ形フィルタは、誘電体を含む第1の層と、その
第1の層の両面に形成されるとともに少なくともその第
1の層の一面側が複数に分離されてなる内部電極とから
形成された複数のコンデンサ素子を有するコンデンサ
部、および、磁性体を含む複数の第2の層と、それら複
数の第2の層に挟まれた内部電極とから形成されるイン
ダクタ素子を有するフェライトビーズ部が互いに積層さ
れるとともに、上記複数のコンデンサ素子と、上記イン
ダクタ素子とによりパイ形フィルタ回路が形成されてな
るパイ形フィルタであって、上記コンデンサ部を形成す
る第1の層と上記フェライトビーズ部を形成する第2の
層が、誘電体と磁性体との混合体を含有するものである
ことを特徴とするものである。
A pie filter according to the present invention which achieves the above object is provided with a first layer containing a dielectric material and both surfaces of the first layer and at least the first layer. A capacitor part having a plurality of capacitor elements formed of internal electrodes having one surface separated into a plurality of parts; a plurality of second layers containing a magnetic material; and a plurality of second layers sandwiched between the plurality of second layers. A pie-type filter formed by laminating ferrite bead portions having inductor elements formed of internal electrodes with each other and forming a pie-type filter circuit with the plurality of capacitor elements and the inductor element, It is also characterized in that the first layer forming the capacitor portion and the second layer forming the ferrite bead portion contain a mixture of a dielectric substance and a magnetic substance. It is.

【0006】ここで、本発明において、コンデンサ部に
は誘電体リッチの混合体を用い、フェライトビーズ部に
は磁性体リッチの混合体を用いてもよい。
In the present invention, a dielectric rich mixture may be used for the capacitor portion and a magnetic rich mixture may be used for the ferrite bead portion.

【0007】[0007]

【作用】本発明のパイ形フィルタは、コンデンサ部を形
成する第1の層とフェライトビーズ部を形成する第2の
層が誘電体と磁性体との混合体を含有するものであるた
め、収縮率の相違によるクラックの発生等が防止され
る。したがって、コンデンサ部とフェライトビーズ部を
互いに積層した後に焼成することができ、従来のように
独立した工程で焼成して張り合せるという手間は不要で
あり、工数,コストが削減される。
In the pie filter of the present invention, since the first layer forming the capacitor portion and the second layer forming the ferrite bead portion contain the mixture of the dielectric substance and the magnetic substance, the shrinkage occurs. The occurrence of cracks due to the difference in rate is prevented. Therefore, the capacitor part and the ferrite bead part can be fired after being laminated on each other, and there is no need for the conventional process of firing and pasting in separate steps, and the number of steps and cost can be reduced.

【0008】尚、誘電体と磁性体とを混合すると、誘電
率の低下,初期透磁率の低下を来たすが、近年パーソナ
ルコンピュータ等のクロック信号はますます高速化して
きており、一方、ノイズ対策に使用されるコンデンサの
容量値は1000pF以下が主流になってきている。し
たがって誘電体に磁性体を混合することにより誘電率が
低下しても容量値的には全く問題はない。また、初期透
磁率にしても高周波ノイズ対策の観点から考えれば若干
低下しても十分なノイズ除去効果があり、この点も問題
はない。
It should be noted that when a dielectric material and a magnetic material are mixed, the dielectric constant and the initial magnetic permeability are lowered, but in recent years, the clock signals of personal computers and the like have become faster and faster, and on the other hand, as a measure against noise. The capacitance value of the capacitor used is becoming less than 1000 pF. Therefore, even if the dielectric constant is lowered by mixing the magnetic substance with the dielectric substance, there is no problem in terms of capacitance value. Further, even if the initial magnetic permeability is considered to be a measure against high frequency noise, even if it is slightly lowered, there is a sufficient noise removing effect, and there is no problem in this respect.

【0009】[0009]

【実施例】以下、本発明の実施例について説明する。図
1は、積層されるシートの一例を積層順に並べた平面図
である。ここでは図示の7枚のグリーンシート1〜7が
用意される。それらのグリーンシート1〜7は、ポリエ
ステルのベースシートに誘電体と磁性体との混合体スラ
リーをドクターブレード法によりコーティングし乾燥す
ることにより形成される。ここで用いた誘電体材料は、
PbO,La23 ,ZrO2 ,TiO2 を湿式混合
し、1150℃2時間焼成後湿式ミルで粉砕した、平均
粒径0.1μmの粉体であり、Pb0.88La0.12Zr
0.7 Ti0.30.08の組成を有するものである。また、
ここで用いた磁性体材料は、NiO,ZnO,CuO,
Fe23 を湿式混合し、1000℃2時間焼成後湿式
ミルで粉砕した、平均粒径0.1μmの粉体であり、N
0.14Zn0.22Cu0.06Fe0.961.88の組成を有する
ものである。
EXAMPLES Examples of the present invention will be described below. FIG. 1 is a plan view showing an example of laminated sheets arranged in the order of lamination. Here, seven illustrated green sheets 1 to 7 are prepared. The green sheets 1 to 7 are formed by coating a polyester base sheet with a slurry of a mixture of a dielectric material and a magnetic material by a doctor blade method and drying the slurry. The dielectric material used here is
Pb 0.88 La 0.12 Zr is a powder having an average particle size of 0.1 μm, which is obtained by wet-mixing PbO, La 2 O 3 , ZrO 2 , and TiO 2 and firing at 1150 ° C. for 2 hours and then pulverizing with a wet mill.
It has a composition of 0.7 Ti 0.3 O 0.08 . Also,
The magnetic material used here is NiO, ZnO, CuO,
Fe 2 O 3 was wet-mixed, fired at 1000 ° C. for 2 hours, and then pulverized by a wet mill to obtain a powder having an average particle size of 0.1 μm.
i 0.14 Zn 0.22 Cu 0.06 Fe 0.96 O 1.88 .

【0010】ここでは、上記の混合体として、上述の誘
電体材料と磁性体材料を各々仮焼きした後、粉砕し、6
0:40の重量比で混合し、更にバインダを入れて粉砕
したものを用いた。尚、上記混合体には、上記誘電体と
磁性体の他、それら誘電体と磁性体との反応防止と焼結
温度低下のための改良剤を加えることが好ましい。ここ
では、以下の改良剤を加えたものと加えないものとの双
方について実験を行なった。改良剤としては、CdO,
ZnO,B23 を1:1:1のモル比で混合し、90
0℃1時間焼成後ミル粉砕し、平均粒径0.1μmの粉
体としたものを用いた。改良剤を加えるときは、誘電
体:磁性体:改良剤を40:60:1.5重量比とし
た。
Here, as the above mixture, the above-mentioned dielectric material and magnetic material are calcined and then pulverized to obtain 6
The mixture was mixed at a weight ratio of 0:40, and a binder was further added and pulverized. In addition to the above-mentioned dielectric and magnetic material, it is preferable to add an improving agent for preventing the reaction between the dielectric and magnetic material and lowering the sintering temperature to the mixture. Here, experiments were carried out both with and without addition of the following improving agents. As the improving agent, CdO,
ZnO and B 2 O 3 were mixed at a molar ratio of 1: 1: 1, and 90
The powder was fired at 0 ° C. for 1 hour and then milled to obtain a powder having an average particle diameter of 0.1 μm. When the improver was added, the weight ratio of dielectric: magnetic substance: improver was 40: 60: 1.5.

【0011】以上のようなグリーンシート1〜7を形成
した後、グリーンシート2,5,6にそれぞれ図示の形
状となるように導電性ペーストをスクリーン印刷法によ
り印刷し、これにより内部電極8,9a,9b,10を
形成した。これらの内部電極8,9a,9b,10のう
ち、内部電極2は磁性体に取り囲まれてインダクタ素子
を構成し、内部電極9a,9b,10は、誘電体を挟ん
で2つのコンデンサ素子を構成する。
After forming the green sheets 1 to 7 as described above, a conductive paste is printed on each of the green sheets 2, 5 and 6 by a screen printing method so as to have the illustrated shape, whereby the internal electrodes 8 and 9a, 9b and 10 were formed. Of these internal electrodes 8, 9a, 9b and 10, the internal electrode 2 is surrounded by a magnetic material to form an inductor element, and the internal electrodes 9a, 9b and 10 form two capacitor elements with a dielectric material sandwiched therebetween. To do.

【0012】以上のようにして形成されたフェライトビ
ーズ部11を構成する3枚のグリーンシート1〜3およ
びコンデンサ部12を構成する4枚のグリーンシート5
〜7を全て積層し、約1時間焼成して焼結体を得た。焼
成温度は、改良剤を加えない混合体を用いた場合は10
30℃、改良剤を加えた混合体の場合は950℃であ
る。
The three green sheets 1 to 3 forming the ferrite bead portion 11 and the four green sheets 5 forming the capacitor portion 12 are formed as described above.
7 to 7 were all stacked and fired for about 1 hour to obtain a sintered body. The firing temperature is 10 when the mixture containing no modifier is used.
30 ° C., 950 ° C. in the case of a mixture added with a modifier.

【0013】図2は、この実施例におけるパイ形チップ
フィルタの外観斜視図、図3はそのパイ形フィルタ回路
の等価回路図である。上記のようにして焼結体を得た
後、その焼結体の側面から内部電極8,9a,9b,1
0が露出するようにその焼結体をバレル研磨し、内部電
極8,9a,9b,10が露出した部分に、それぞれ、
Agを主成分とした導電性ペーストを塗布し、これによ
り、内部電極8及び内部電極9aと接続された電極1
3、内部電極8及び内部電極9bと接続された電極1
4,さらに内部電極11と接続された電極15a,15
bを形成した。
FIG. 2 is an external perspective view of the pie-type chip filter in this embodiment, and FIG. 3 is an equivalent circuit diagram of the pie-type filter circuit. After obtaining the sintered body as described above, the internal electrodes 8, 9a, 9b, 1
The sintered body was barrel-polished so that 0 was exposed, and the internal electrodes 8, 9a, 9b, and 10 were exposed to the exposed portions, respectively.
An electrode 1 connected with the internal electrode 8 and the internal electrode 9a is obtained by applying a conductive paste containing Ag as a main component.
3, the electrode 1 connected to the internal electrode 8 and the internal electrode 9b
4, electrodes 15a, 15 connected to the internal electrode 11
b was formed.

【0014】これを図3に示す等価回路と対照すると、
内部電極9aと内部電極10、およびそれらの内部電極
9a,10に挟まれた誘電体によりコンデンサ素子16
が形成され、内部電極9bと内部電極10、およびそれ
らの内部電極9a,10に挟まれた誘電体によりコンデ
ンサ素子17が形成され、さらにそれら2つのコンデン
サ素子16,17の間を結ぶように、内部電極8および
その内部電極8を取り巻く磁性体によりインダクタ素子
18が形成され、これにより、全体としてパイ形フィル
タ回路が構成されている。
Contrasting this with the equivalent circuit shown in FIG.
The capacitor element 16 includes the internal electrode 9a and the internal electrode 10, and the dielectric material sandwiched between the internal electrodes 9a and 10.
Is formed, a capacitor element 17 is formed by the internal electrode 9b and the internal electrode 10, and a dielectric material sandwiched between the internal electrodes 9a and 10, and the two capacitor elements 16 and 17 are connected to each other. The inductor element 18 is formed by the internal electrode 8 and the magnetic material surrounding the internal electrode 8, and thus a pie filter circuit is configured as a whole.

【0015】上記のように製作したパイ形チップフィル
タの特性を調べたところ良好であり、また分解して観察
しても、クラック等の発生は見られなかった。尚、上記
実施例では、グリーンシート1〜7の全てについて同一
組成の混合体が用いられているが、フェライトビーズ部
11を構成するグリーンシート1〜3には磁性体リッチ
の混合体を用い、コンデンサ部12を構成するグリーン
シート4〜7には誘電体リッチの混合体を用いてもよ
い。
When the characteristics of the pie-type chip filter manufactured as described above were examined, it was satisfactory, and no cracks or the like were found when disassembled and observed. In addition, in the above-mentioned embodiment, the mixture of the same composition is used for all of the green sheets 1 to 7, but the mixture of the magnetic substance rich is used for the green sheets 1 to 3 constituting the ferrite bead portion 11, A dielectric rich mixture may be used for the green sheets 4 to 7 forming the capacitor portion 12.

【0016】図4は、積層されるシートの他の例を積層
順に並べた平面図である。図1に示すシートと同一の構
成部分には図1に付した符号を付して示し、相違点につ
いてのみ説明する。図4に示す例では、シート5に内部
電極9cが形成されている。この内部電極9cは、図2
に示すように完成した状態ではシート6の内部電極10
と接続され、グラウンドとして使用される。この場合、
2つのコンデンサ16,17がグラウンドとして内部電
極9cにより分離されることになり、それらのコンデン
サ16,17間のクロストークの低減化が図られる。
FIG. 4 is a plan view showing another example of laminated sheets arranged in the order of lamination. The same components as those of the seat shown in FIG. 1 are designated by the reference numerals shown in FIG. 1, and only different points will be described. In the example shown in FIG. 4, the internal electrode 9c is formed on the sheet 5. This internal electrode 9c is shown in FIG.
The inner electrode 10 of the sheet 6 in the completed state as shown in FIG.
Connected with and used as ground. in this case,
The two capacitors 16 and 17 are separated as the ground by the internal electrode 9c, and the crosstalk between the capacitors 16 and 17 is reduced.

【0017】[0017]

【発明の効果】以上説明したように、本発明によれば、
誘電体と磁性体の収縮率の相違によるクラックの発生等
が防止され、コンデンサ素子とインダクタ素子を互いに
積層して同時に安定的に焼成することができ、工数,コ
ストが低減化される。
As described above, according to the present invention,
The occurrence of cracks due to the difference in contraction rate between the dielectric material and the magnetic material is prevented, and the capacitor element and the inductor element can be stacked on each other and stably fired at the same time, which reduces the number of steps and cost.

【図面の簡単な説明】[Brief description of drawings]

【図1】積層されるシートの一例を積層順に並べた平面
図である。
FIG. 1 is a plan view showing an example of laminated sheets arranged in the order of lamination.

【図2】パイ形チップフィルタの外観斜視図である。FIG. 2 is an external perspective view of a pie-type chip filter.

【図3】パイ形フィルタ回路の等価回路図である。FIG. 3 is an equivalent circuit diagram of a pie filter circuit.

【図4】積層されるシートの他の例を積層順に並べた平
面図である。
FIG. 4 is a plan view showing another example of laminated sheets arranged in the order of lamination.

【符号の説明】[Explanation of symbols]

1,2,…,7 グリーンシート 8,9a,9b,9c,10 内部電極 11 フェライトビーズ部 12 コンデンサ部 13,14,15a,15b 電極 16,17 コンデンサ素子 18 インダクタ素子 1, 2, ..., 7 Green sheet 8, 9a, 9b, 9c, 10 Internal electrode 11 Ferrite bead portion 12 Capacitor portion 13, 14, 15a, 15b Electrode 16, 17 Capacitor element 18 Inductor element

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 誘電体を含む第1の層と、該第1の層の
両面に形成されるとともに少なくとも該第1の層の一面
側が複数に分離されてなる内部電極とから形成された複
数のコンデンサ素子を有するコンデンサ部、および、磁
性体を含む複数の第2の層と、該複数の第2の層に挟ま
れた内部電極とから形成されるインダクタ素子を有する
フェライトビーズ部が互いに積層されるとともに、前記
複数のコンデンサ素子と、前記インダクタ素子とにより
パイ形フィルタ回路が形成されてなるパイ形フィルタで
あって、 前記コンデンサ部を形成する前記第1の層と前記フェラ
イトビーズ部を形成する前記第2の層が、誘電体と磁性
体との混合体を含有するものであることを特徴とするパ
イ形フィルタ。
1. A plurality of first layers including a dielectric material and a plurality of internal electrodes formed on both surfaces of the first layer and having at least one surface of the first layer separated into a plurality of internal electrodes. A capacitor part having a capacitor element, and a ferrite bead part having an inductor element formed of a plurality of second layers containing a magnetic material and internal electrodes sandwiched by the plurality of second layers are laminated on each other. And a pie-type filter formed by forming a pie-type filter circuit with the plurality of capacitor elements and the inductor element, the first layer forming the capacitor section and the ferrite bead section being formed. The pi-shaped filter, wherein the second layer contains a mixture of a dielectric substance and a magnetic substance.
JP2537894A 1994-02-23 1994-02-23 Pi type filter Withdrawn JPH07235852A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2537894A JPH07235852A (en) 1994-02-23 1994-02-23 Pi type filter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2537894A JPH07235852A (en) 1994-02-23 1994-02-23 Pi type filter

Publications (1)

Publication Number Publication Date
JPH07235852A true JPH07235852A (en) 1995-09-05

Family

ID=12164198

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2537894A Withdrawn JPH07235852A (en) 1994-02-23 1994-02-23 Pi type filter

Country Status (1)

Country Link
JP (1) JPH07235852A (en)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000196391A (en) * 1998-12-24 2000-07-14 Mitsubishi Materials Corp Filter
US6331926B1 (en) 1997-04-08 2001-12-18 Anthony A. Anthony Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US6373673B1 (en) 1997-04-08 2002-04-16 X2Y Attenuators, Llc Multi-functional energy conditioner
US6498710B1 (en) 1997-04-08 2002-12-24 X2Y Attenuators, Llc Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US6509807B1 (en) * 1997-04-08 2003-01-21 X2Y Attenuators, Llc Energy conditioning circuit assembly
US6580595B2 (en) 1997-04-08 2003-06-17 X2Y Attenuators, Llc Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning
US6603646B2 (en) 1997-04-08 2003-08-05 X2Y Attenuators, Llc Multi-functional energy conditioner
US6636406B1 (en) 1997-04-08 2003-10-21 X2Y Attenuators, Llc Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioning
US6650525B2 (en) 1997-04-08 2003-11-18 X2Y Attenuators, Llc Component carrier
US6687108B1 (en) 1997-04-08 2004-02-03 X2Y Attenuators, Llc Passive electrostatic shielding structure for electrical circuitry and energy conditioning with outer partial shielded energy pathways
US6738249B1 (en) 1997-04-08 2004-05-18 X2Y Attenuators, Llc Universal energy conditioning interposer with circuit architecture
KR100471151B1 (en) * 2002-09-19 2005-03-10 삼성전기주식회사 Multilayered lc filter
US6995983B1 (en) 1997-04-08 2006-02-07 X2Y Attenuators, Llc Component carrier
KR100732128B1 (en) * 2005-11-10 2007-06-25 (주) 래트론 A bead-varistor integrated device with different materials
US9001486B2 (en) 2005-03-01 2015-04-07 X2Y Attenuators, Llc Internally overlapped conditioners
US9019679B2 (en) 1997-04-08 2015-04-28 X2Y Attenuators, Llc Arrangement for energy conditioning
US9036319B2 (en) 1997-04-08 2015-05-19 X2Y Attenuators, Llc Arrangement for energy conditioning
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit

Cited By (20)

* Cited by examiner, † Cited by third party
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US6687108B1 (en) 1997-04-08 2004-02-03 X2Y Attenuators, Llc Passive electrostatic shielding structure for electrical circuitry and energy conditioning with outer partial shielded energy pathways
US9036319B2 (en) 1997-04-08 2015-05-19 X2Y Attenuators, Llc Arrangement for energy conditioning
US6373673B1 (en) 1997-04-08 2002-04-16 X2Y Attenuators, Llc Multi-functional energy conditioner
US6498710B1 (en) 1997-04-08 2002-12-24 X2Y Attenuators, Llc Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US6509807B1 (en) * 1997-04-08 2003-01-21 X2Y Attenuators, Llc Energy conditioning circuit assembly
US6580595B2 (en) 1997-04-08 2003-06-17 X2Y Attenuators, Llc Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning
US6594128B2 (en) 1997-04-08 2003-07-15 X2Y Attenuators, Llc Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US6636406B1 (en) 1997-04-08 2003-10-21 X2Y Attenuators, Llc Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioning
US9373592B2 (en) 1997-04-08 2016-06-21 X2Y Attenuators, Llc Arrangement for energy conditioning
US6331926B1 (en) 1997-04-08 2001-12-18 Anthony A. Anthony Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US6603646B2 (en) 1997-04-08 2003-08-05 X2Y Attenuators, Llc Multi-functional energy conditioner
US6738249B1 (en) 1997-04-08 2004-05-18 X2Y Attenuators, Llc Universal energy conditioning interposer with circuit architecture
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US6995983B1 (en) 1997-04-08 2006-02-07 X2Y Attenuators, Llc Component carrier
US6650525B2 (en) 1997-04-08 2003-11-18 X2Y Attenuators, Llc Component carrier
US9019679B2 (en) 1997-04-08 2015-04-28 X2Y Attenuators, Llc Arrangement for energy conditioning
JP2000196391A (en) * 1998-12-24 2000-07-14 Mitsubishi Materials Corp Filter
KR100471151B1 (en) * 2002-09-19 2005-03-10 삼성전기주식회사 Multilayered lc filter
US9001486B2 (en) 2005-03-01 2015-04-07 X2Y Attenuators, Llc Internally overlapped conditioners
KR100732128B1 (en) * 2005-11-10 2007-06-25 (주) 래트론 A bead-varistor integrated device with different materials

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