JPH0723105Y2 - 半田こて先用ビット - Google Patents
半田こて先用ビットInfo
- Publication number
- JPH0723105Y2 JPH0723105Y2 JP1990046957U JP4695790U JPH0723105Y2 JP H0723105 Y2 JPH0723105 Y2 JP H0723105Y2 JP 1990046957 U JP1990046957 U JP 1990046957U JP 4695790 U JP4695790 U JP 4695790U JP H0723105 Y2 JPH0723105 Y2 JP H0723105Y2
- Authority
- JP
- Japan
- Prior art keywords
- bit
- soldering iron
- solder
- alloy
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 title claims description 47
- 238000005476 soldering Methods 0.000 title claims description 20
- 229910052742 iron Inorganic materials 0.000 title claims description 19
- 229910045601 alloy Inorganic materials 0.000 claims description 17
- 239000000956 alloy Substances 0.000 claims description 17
- 238000007747 plating Methods 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 description 17
- 229910000679 solder Inorganic materials 0.000 description 17
- 239000010949 copper Substances 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 229910017767 Cu—Al Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910017827 Cu—Fe Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990046957U JPH0723105Y2 (ja) | 1990-05-01 | 1990-05-01 | 半田こて先用ビット |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990046957U JPH0723105Y2 (ja) | 1990-05-01 | 1990-05-01 | 半田こて先用ビット |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH046364U JPH046364U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-01-21 |
JPH0723105Y2 true JPH0723105Y2 (ja) | 1995-05-31 |
Family
ID=31562475
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990046957U Expired - Lifetime JPH0723105Y2 (ja) | 1990-05-01 | 1990-05-01 | 半田こて先用ビット |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0723105Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4927462A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1972-07-10 | 1974-03-11 | ||
US4424930A (en) * | 1981-06-29 | 1984-01-10 | Cooper Industries, Inc. | Carbon-based soldering and de-soldering tip and method of manufacturing same |
-
1990
- 1990-05-01 JP JP1990046957U patent/JPH0723105Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH046364U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-01-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |