JPH0722790A - Electronic component mounting machine - Google Patents

Abstract

PURPOSE:To provide an electronic component mounting machine which prevents an electronic component from being mounted erroneously and which prevents a defect such as a short circuit or a deviation even when the electronic component which has been mounted erroneously is not noticed even in its regular mounting land position because the electronic component is mounted without recognizing a mounting land position in an electronic component mounting process. CONSTITUTION:A mounting-land-position recognition camera 3 and a removal nozzle 4 which detects an erroneously mounted electronic component and which removes the electronic component are installed at an electronic component mounting part 1. Thereby, it is possible to reduce a defect such as a short circuit or a deviation due to the influence of the erroneously mounted electronic component.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting machine for mounting electronic components on a printed circuit board.

[0002]

2. Description of the Related Art In recent years, in order to mount electronic parts with high precision in an electronic parts mounting machine, a parts recognition camera or a board for recognizing a picking up status for preventing picking up errors of electronic parts and mounting of defective parts is provided. A table on which electronic components are mounted by holding and driving (hereinafter referred to as XY table)
A board recognition camera is used to recognize a printed board.

The mounting process of the electronic component mounting machine is performed as shown in FIG. In the electronic component mounting part, first, after the origin of the nozzle is returned by the rotary head (#
1), the size of the nozzle is returned to the largest size, and the nozzle is switched (# 2, # 3). After confirming that the size of the nozzle is correct (# 4), the electronic component is sucked by the selected nozzle (# 5), and the nozzle is rotated to match the land position on the substrate (# 6). After that, the electronic component sucked by the nozzle is recognized (# 7), the component suction is detected and the correction rotation is performed (# 9), and the electronic component is mounted on the land of the board (# 10). If a suction error or a component defect occurs in the mounting process, the component is discharged after the component mounting process.

[0004]

However, in the above-described conventional configuration, when an electronic component is mounted on the land of the printed circuit board in the mounting process of the electronic component mounting machine, the electronic component mounting machine has already erroneously mounted another electronic component. Even if it is done, the erroneously mounted component cannot be found. Therefore, even if an electronic component that should be properly mounted is mounted on the land where the mounting is wrong, there is a problem that a mounting error occurs and a defect such as a short circuit or a displacement occurs. . In addition, the number of 1005 chips mounted is increasing as electronic components are mounted at higher densities. However, during the process of mounting 1005 chips on the board by the electronic component mounting machine, a suction error or mounting The number of mistakes is also large, and as shown in FIGS. 4 (a) and 4 (b), the microchip components 5 and 7 are properly mounted by jumping or shifting to other mounting positions due to a mounting error. There has been a problem that the electronic parts 6 and 8 to be made have a defect such as a short circuit or a deviation.

In view of the above problems, the present invention makes it possible to find an electronic component having a suction error or a mounting error by a mounting position recognition camera and remove the electronic component.
It is intended to provide a means for reducing the cause of a defective component to be properly mounted.

[0006]

In order to solve the above problems, the electronic component mounting machine of the present invention recognizes the presence or absence of an erroneously mounted component on the land of the board in the mounting process in the electronic component mounting portion, If a component is erroneously mounted, the removal nozzle removes the erroneously mounted component and normal mounting is performed.

[0007]

In the electronic component mounting machine of the present invention, the board position recognition camera recognizes the state of the land position where the board should be mounted properly, so that the conventional mounting land position of the board can only be set by a program. However, it becomes possible to know whether or not other components are erroneously mounted. Further, since the erroneously mounted component detected by using the board position recognition camera is removed by the nozzle, the electronic component that should be properly mounted on the land where the other component is erroneously mounted is affected by the erroneously mounted component. It will be installed without it. Therefore, as shown in FIG. 4, a defect such as a short circuit or a shift which is caused by an erroneously mounted component does not occur.

Therefore, since the above steps are performed, the number of defects due to an electronic component mounting error after reflow is reduced, and the quality is improved.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows an electronic component mounting portion 1 in this embodiment, and an LED 2, a CCD camera 3, and a removing nozzle 4 are installed on the electronic component mounting portion 1.

The operation of the electronic component mounting machine configured as described above will be described. The LED 2 and the CCD camera 3 installed on both sides of the mounting head in the component mounting station of the electronic component mounting unit 1 perform recognition on the land of the substrate. Since the area of the cream solder printed on the land to be installed is preset in the program, if the recognized area is within the preset range of the area of cream solder, the electronic components to be installed are It will be mounted on the land. When the recognized area exceeds the permissible range of the area of the preset cream solder, it is determined that the erroneous mounting component is found. At this time, the warning means issues a warning. When an erroneously mounted component is found, the XY table is moved to the position of the removal nozzle 4 of the electronic component mounting unit 1 by moving the XY table, and the removal nozzle 4 adsorbs the erroneously mounted component to the disposal box. Will be discarded. The electronic components to be properly mounted are mounted on the lands on the printed circuit board from which the erroneously mounted components have been removed by the removal nozzle 4, and thereafter the electronic components are mounted in the order in which they should be originally mounted. The above operation status is shown in the flowchart of FIG. 2 below. Electronic component suction is performed in step # 1, the mounting land position is recognized in step # 2, and if there is no erroneous mounting component in step # 3, step # 6 is performed as it is.
The electronic component is mounted by the procedure described above, but if an erroneous component is found, it is removed in step # 4 to the position with the nozzle X-.
The Y table moves, and the removal nozzle removes the erroneously mounted component in step # 5, and the electronic component is mounted in step # 6.

[0011]

According to the electronic component mounting machine of the present invention, even if an electronic component that has been erroneously mounted in the past exists on a printed circuit board land that should be properly mounted, the erroneously mounted electronic component is found. It was not possible to do so, and it caused defects such as misalignment and short circuit, but when recognizing the land to be mounted and finding a mis-installed component, the removal nozzle 4 removes the mis-installed component. It is possible to reduce the causes of defects such as misalignment and short circuit due to parts.

[Brief description of drawings]

FIG. 1 is a perspective view of an electronic component mounting portion of this embodiment.

FIG. 2 is a flowchart of an electronic component mounting method according to this embodiment.

FIG. 3 is an explanatory diagram of the mounting operation of the electronic component mounting machine.

FIG. 4A is an explanatory diagram showing a state of a defect caused by an erroneously mounted component (resistor or capacitor). FIG. 4B is an explanatory diagram showing a state of a defect caused by an erroneously mounted component (transistor).

[Explanation of symbols]

 1 electronic component mounting portion 2 LED 3 CCD camera 4 removal nozzle 5, 7 erroneous mounting component 6, 8 regular mounting component

Claims (2)

[Claims] 1. An electronic component mounting machine for mounting an electronic component on a printed circuit board, a mounting land position recognizing unit for recognizing whether a regular electronic component is mounted on a land of the printed circuit board, and a land to be mounted normally. An electronic component mounting machine having a nozzle portion for removing an erroneously mounted electronic component already mounted on the electronic component mounting machine. 2. An electronic component mounting machine for mounting an electronic component on a printed circuit board, recognizing means for recognizing whether or not a regular electronic component is mounted on a land of the printed circuit board.
Comprising: comparing means for comparing the component information on the printed circuit board to be mounted with the component information obtained by the recognizing means; and warning means for issuing a warning to those judged to be erroneous by the comparing means. An electronic component mounting machine characterized by.