JPH0722652A - Injection molded printed board and its manufacture - Google Patents
Injection molded printed board and its manufactureInfo
- Publication number
- JPH0722652A JPH0722652A JP5161607A JP16160793A JPH0722652A JP H0722652 A JPH0722652 A JP H0722652A JP 5161607 A JP5161607 A JP 5161607A JP 16160793 A JP16160793 A JP 16160793A JP H0722652 A JPH0722652 A JP H0722652A
- Authority
- JP
- Japan
- Prior art keywords
- injection
- circuit board
- printed circuit
- molded printed
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本願発明は、射出成形プリント基
板の構造及びその製造方法に関するものであり、特に、
ＬＥＤチップの実装構造及びその製造方法に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of an injection-molded printed circuit board and a manufacturing method thereof, and in particular,
The present invention relates to a mounting structure of an LED chip and a manufacturing method thereof.
【０００２】[0002]
【従来の技術】射出成形プリント基板は射出成形による
成形部品上に回路パターンを形成した基板で、プリント
基板が不要となるため、機器の小型化、部品点数及び組
立工程の削減が図れるという特徴を有するものである。
射出成形プリント基板は、射出成形により形成され、基
板上に凹凸形状を容易に形成することができるため、Ｌ
ＥＤチップを実装する場合は、射出成形プリント基板上
に凹部を形成して実装する方法が多く用いられている図
４に基づき従来の射出成形プリント基板のＬＥＤチップ
実装構造について説明する。（ａ）はＬＥＤチップを実
装する凹部の斜視図、（ｂ）は A-A断面図である。図に
おいて、１は射出成形プリント基板、２はＬＥＤ実装用
凹部、３，４は回路パターン、５はＬＥＤチップ、６は
ボンディングワイヤ、７は透明封止樹脂、８はＬＥＤ実
装用凹部２内で回路パターン３と回路パターン４を絶縁
する絶縁帯である。但し、（ａ）では透明封止樹脂７の
図示は省略する。2. Description of the Related Art An injection-molded printed circuit board is a circuit board on which a circuit pattern is formed by injection molding. Since the printed circuit board is not required, the size of the device can be reduced and the number of parts and the assembly process can be reduced. I have.
The injection-molded printed circuit board is formed by injection molding, and the uneven shape can be easily formed on the board.
When mounting an ED chip, a method of forming a recess on an injection-molded printed circuit board for mounting is often used. A conventional LED-chip mounted structure of the injection-molded printed circuit board will be described with reference to FIG. (A) is a perspective view of a recess for mounting an LED chip, and (b) is a sectional view taken along line AA. In the figure, 1 is an injection-molded printed circuit board, 2 is an LED mounting recess, 3 and 4 are circuit patterns, 5 is an LED chip, 6 is a bonding wire, 7 is a transparent sealing resin, and 8 is an LED mounting recess 2. It is an insulating band that insulates the circuit pattern 3 from the circuit pattern 4. However, the illustration of the transparent sealing resin 7 is omitted in (a).
【０００３】図４で、回路パターン３，４は射出成形プ
リント基板１の表面からＬＥＤ実装用凹部２の底面まで
延設され、ＬＥＤ実装用凹部２を横断するように形成さ
れている絶縁帯８によって電気的に分離されている。Ｌ
ＥＤチップ５は、ＬＥＤ実装用凹部２の底面の回路パタ
ーン４上にダイボンドペーストを介して実装され、ボン
ディングワイヤ６によって回路パターン３と接続されて
いる。このようにＬＥＤチップ５はＬＥＤ実装用凹部２
内に実装され、透明封止樹脂７にて封止される。In FIG. 4, the circuit patterns 3 and 4 are extended from the surface of the injection-molded printed circuit board 1 to the bottom surface of the LED mounting recess 2 and are formed so as to cross the LED mounting recess 2. Electrically separated by. L
The ED chip 5 is mounted on the circuit pattern 4 on the bottom surface of the LED mounting recess 2 via a die bond paste, and is connected to the circuit pattern 3 by a bonding wire 6. In this way, the LED chip 5 has the LED mounting recess 2
It is mounted inside and is sealed with a transparent sealing resin 7.
【０００４】図５に基づき、異なる実装例についてその
構造を説明する。図はＬＥＤ実装部の斜視図で、図にお
いて、９は射出成形プリント基板、１０は略直方体の形
状の両側に側面視略台形の形状を設けたＬＥＤ実装台
で、ＬＥＤチップの実装位置を高くするために形成され
ている。その他、１１はＬＥＤ実装台１０の上面に形成
されたＬＥＤ実装用凹部、１２，１３は回路パターン、
１４はＬＥＤチップ、１５はボンディングワイヤ、１６
はＬＥＤ実装台１０の表面を横断するように設けられた
絶縁帯である。The structure of different mounting examples will be described with reference to FIG. The figure is a perspective view of the LED mounting portion. In the figure, 9 is an injection-molded printed circuit board, 10 is an LED mounting base provided with a trapezoidal shape in side view on both sides of the shape of a rectangular parallelepiped, and the mounting position of the LED chip is high. It is formed to do. In addition, 11 is an LED mounting recess formed on the upper surface of the LED mounting base 10, 12 and 13 are circuit patterns,
14 is an LED chip, 15 is a bonding wire, 16
Is an insulating strip provided across the surface of the LED mounting base 10.
【０００５】図５で、回路パターン１２，１３は、メッ
キ等により形成され、それぞれ射出成形プリント基板表
面からＬＥＤ実装台１０の表面を経由してＬＥＤ実装用
凹部１１の底面まで延設され、絶縁帯１６によって電気
的に分離されている。ＬＥＤチップ１４は、ＬＥＤ実装
用凹部１１内の回路パターン１２上にダイボンドペース
トを介して接合されていると共に、ボンディングワイヤ
１５を介して回路パターン１３に接続されている。ＬＥ
Ｄ実装用凹部１１内には透明封止樹脂が充填されるが図
示は省略している。In FIG. 5, the circuit patterns 12 and 13 are formed by plating or the like, and extend from the surface of the injection-molded printed circuit board to the bottom surface of the LED mounting recess 11 via the surface of the LED mounting base 10 and are insulated from each other. It is electrically separated by the strip 16. The LED chip 14 is bonded to the circuit pattern 12 in the LED mounting recess 11 via a die bond paste, and is also connected to the circuit pattern 13 via a bonding wire 15. LE
The D mounting recess 11 is filled with a transparent sealing resin, but is not shown.
【０００６】[0006]
【発明が解決しようとする課題】図４及び図５に示した
射出成形プリント基板を使用してＬＥＤチップを実装
し、ＬＥＤ実装用凹部内にエポキシ樹脂等の熱硬化性の
透明封止樹脂を充填した後、加熱炉に入れ加熱硬化させ
るが、加熱中に透明封止樹脂の粘度が一時的に低下する
ため、回路パターンと絶縁帯の境界部分に沿って透明封
止樹脂が這い上がりＬＥＤ実装用凹部外に流出してしま
い、ＬＥＤチップやボンディングワイヤの一部分が露出
して封止効果の低下を招くという不具合が発生した。ま
た、流出によって透明封止樹脂の厚みがばらつくため、
着色した透明封止樹脂を用いた場合、外部から認識でき
る発光色がばらつくという問題点があった。An LED chip is mounted using the injection-molded printed circuit board shown in FIGS. 4 and 5, and a thermosetting transparent sealing resin such as epoxy resin is placed in the LED mounting recess. After filling, it is placed in a heating oven and cured by heating, but the viscosity of the transparent encapsulation resin temporarily decreases during heating, so the transparent encapsulation resin crawls along the boundary between the circuit pattern and the insulation band to mount the LED. There is a problem in that the LED chips and the bonding wires are partially exposed because they flow out of the recesses for use, leading to a reduction in the sealing effect. Also, since the thickness of the transparent sealing resin varies due to outflow,
When a colored transparent sealing resin is used, there is a problem that the luminescent color that can be recognized from the outside varies.
【０００７】本発明は、上記問題点に鑑みなされたもの
で、その目的とするところは、ＬＥＤ実装用凹部に充填
された透明封止樹脂の流出を防止することができる射出
成形プリント基板の構造及びその製造方法を提供するこ
とにある。The present invention has been made in view of the above problems, and an object thereof is to provide a structure of an injection molded printed circuit board capable of preventing the transparent sealing resin filled in the LED mounting recess from flowing out. And to provide a manufacturing method thereof.
【０００８】[0008]
【課題を解決するための手段】上記課題を解決するた
め、請求項１記載の射出成形プリント基板は、射出成形
プリント基板上に形成した凹部にＬＥＤチップを実装し
透明樹脂にて封止する射出成形プリント基板において、
前記凹部周囲の前記射出成形プリント基板表面に透明樹
脂流出防止用樹脂層を形成したことを特徴とするもので
ある。In order to solve the above-mentioned problems, the injection-molded printed circuit board according to claim 1 has an LED chip mounted in a recess formed on the injection-molded printed circuit board and sealed with a transparent resin. In molded printed circuit boards,
A transparent resin outflow preventing resin layer is formed on the surface of the injection molded printed circuit board around the recess.
【０００９】また、請求項２記載の射出成形プリント基
板は、請求項１記載の射出成形プリント基板で、前記透
明樹脂流出防止用樹脂層が、前記射出成形プリント基板
の前記凹部周囲近傍の、回路パターンを形成しない箇所
及びその近傍にのみ形成されていることを特徴とするも
のである。An injection-molded printed circuit board according to a second aspect is the injection-molded printed circuit board according to the first aspect, wherein the transparent resin outflow preventing resin layer is in the vicinity of the concave portion of the injection-molded printed circuit board. It is characterized in that it is formed only in a portion where a pattern is not formed and in the vicinity thereof.
【００１０】また、請求項３記載の射出成形プリント基
板の製造方法は、請求項１または請求項２記載の射出成
形プリント基板を製造する際、透明樹脂流出防止用樹脂
をスタンピング法を使用して塗布し、透明樹脂流出防止
用樹脂層を形成したことを特徴とするものである。According to a third aspect of the present invention, there is provided a method of manufacturing an injection-molded printed circuit board, wherein the transparent resin outflow preventing resin is stamped when manufacturing the injection-molded printed circuit board of the first or second aspect. It is characterized by being applied to form a transparent resin outflow preventing resin layer.
【００１１】また、請求項４記載の射出成形プリント基
板の製造方法は、請求項１または請求項２記載の射出成
形プリント基板を製造する際、透明樹脂流出防止用樹脂
をディスペンサーにより供給して、透明樹脂流出防止用
樹脂層を形成したことを特徴とするものである。According to a fourth aspect of the present invention, there is provided a method for manufacturing an injection-molded printed circuit board, wherein when the injection-molded printed circuit board according to the first or second aspect is manufactured, a transparent resin outflow preventing resin is supplied by a dispenser. It is characterized in that a transparent resin outflow preventing resin layer is formed.
【００１２】[0012]
【作用】射出成形プリント基板のＬＥＤ実装用凹部に充
填された透明封止樹脂は、加熱硬化工程で、一時的に粘
度が低下するため、射出成形プリント基板本体と基板表
面に形成された回路パターン側面の境界部分に沿って毛
細管現象により這い上がり、ＬＥＤ実装用凹部外に流出
するので、少なくともその流出経路である境界部分に形
成された透明封止樹脂流出防止樹脂層は、その流出経路
を遮断して透明封止樹脂の流出を止めるように作用す
る。The transparent encapsulating resin filled in the LED mounting recesses of the injection-molded printed circuit board temporarily loses its viscosity during the heat-curing process. Therefore, the circuit pattern formed on the injection-molded printed circuit board body and the board surface. Since it crawls up along the boundary part of the side surface due to the capillary phenomenon and flows out to the outside of the LED mounting recess, at least the transparent sealing resin outflow prevention resin layer formed at the boundary part which is the outflow path blocks the outflow path. And acts to stop the outflow of the transparent sealing resin.
【００１３】[0013]
【実施例】本願発明の射出成形プリント基板の一実施例
を図１に示す。図１に示す実施例は、図４に示した従来
の射出成形プリント基板に透明封止樹脂の流出防止処理
を施したものであるので、従来例と同等構成については
同符号を付すこととする。（ａ）はＬＥＤチップを実装
する凹部の斜視図、（ｂ）は B-B断面図である。図にお
いて、１は液晶ポリマー等の高耐熱性熱可塑性樹脂製の
射出成形プリント基板、２はＬＥＤ実装用凹部、３，４
は回路パターン、５はＬＥＤチップ、６はボンディング
ワイヤ、７は透明封止樹脂、８はＬＥＤ実装用凹部２内
で回路パターン３と回路パターン４を絶縁する絶縁帯、
１７は透明封止樹脂７の流出を防止するために、ＬＥＤ
実装用凹部２の周囲に形成された透明封止樹脂流出防止
樹脂層（シリコン樹脂層）である。但し、（ａ）では透
明封止樹脂７の図示は省略する。FIG. 1 shows an embodiment of an injection-molded printed circuit board according to the present invention. In the embodiment shown in FIG. 1, the conventional injection-molded printed circuit board shown in FIG. 4 is subjected to a process for preventing the outflow of the transparent sealing resin. Therefore, the same components as those in the conventional example are designated by the same reference numerals. . (A) is a perspective view of a recess for mounting an LED chip, and (b) is a BB sectional view. In the figure, 1 is an injection-molded printed circuit board made of highly heat-resistant thermoplastic resin such as liquid crystal polymer, 2 is a recess for mounting LEDs, and 3 and 4 are shown.
Is a circuit pattern, 5 is an LED chip, 6 is a bonding wire, 7 is a transparent sealing resin, 8 is an insulating band that insulates the circuit pattern 3 and the circuit pattern 4 in the LED mounting recess 2.
17 is an LED for preventing the transparent sealing resin 7 from flowing out.
It is a transparent sealing resin outflow prevention resin layer (silicon resin layer) formed around the mounting recess 2. However, the illustration of the transparent sealing resin 7 is omitted in (a).
【００１４】ＬＥＤチップ６に電圧を印加し発光させる
ための回路パターン３，４が、射出成形プリント基板１
の表面からＬＥＤ実装用凹部２の底面まで延設され、Ｌ
ＥＤ実装用凹部２を横断するように形成されている絶縁
帯８によって電気的に分離されている。ＬＥＤチップ５
は、ＬＥＤ実装用凹部２の底面の回路パターン４上に、
導電性の接着剤であるダイボンドペーストを介して接着
され、直径18〜50μｍ程度のAuまたはAl製のボンディン
グワイヤ６によって回路パターン３と接続されている。
このようにＬＥＤチップ５はＬＥＤ実装用凹部２内に実
装され、外的障害からの保護のため、透明封止樹脂７に
て封止される。また、多くの場合、透明封止樹脂７は、
所定の発光色を得るために、赤や緑に着色されて用いら
れる。The circuit patterns 3 and 4 for applying a voltage to the LED chip 6 to cause it to emit light are the injection-molded printed circuit board 1.
From the front surface of the LED mounting recess 2 to the bottom surface of the LED mounting recess 2,
It is electrically separated by an insulating band 8 formed so as to cross the ED mounting recess 2. LED chip 5
On the circuit pattern 4 on the bottom surface of the LED mounting recess 2,
It is bonded via a die bond paste which is a conductive adhesive, and is connected to the circuit pattern 3 by a bonding wire 6 made of Au or Al having a diameter of about 18 to 50 μm.
Thus, the LED chip 5 is mounted in the LED mounting recess 2 and sealed with the transparent sealing resin 7 for protection from external obstacles. In many cases, the transparent sealing resin 7 is
It is used by being colored red or green in order to obtain a predetermined emission color.
【００１５】本願発明では、透明封止樹脂７の流出防止
のため、ＬＥＤ実装用凹部２の周囲に透明封止樹脂流出
防止樹脂を塗布し、透明封止樹脂流出防止樹脂層を形成
することを特徴とするものであるが、この流出現象は、
射出成形プリント基板１に用いる高耐熱性の熱可塑性樹
脂（本実施例では液晶ポリマー）に起因する現象であ
り、毛細管現象と同様な原理で発生するものと考えられ
るので、その流出経路である射出成形プリント基板１の
本体と回路パターン３，４の側面の境界部分をチクソ性
の高いシリコン樹脂或いはエポキシ樹脂で遮断すれば、
透明封止樹脂７の流出が防止できることになる。透明封
止樹脂７の流出状態によっては、ＬＥＤ実装用凹部２の
全周に透明封止樹脂流出防止樹脂を塗布しなくても、射
出成形プリント基板１の本体と回路パターン３，４の側
面の境界部分近傍のみに透明封止樹脂流出防止樹脂を塗
布するように構成してもよい。In the present invention, in order to prevent the transparent sealing resin 7 from flowing out, the transparent sealing resin outflow preventing resin is applied around the LED mounting recess 2 to form a transparent sealing resin outflow preventing resin layer. As a feature, this outflow phenomenon is
This is a phenomenon caused by a highly heat-resistant thermoplastic resin (liquid crystal polymer in this embodiment) used for the injection-molded printed circuit board 1 and is considered to occur on the same principle as the capillary phenomenon. If the boundary between the main body of the molded printed circuit board 1 and the side surfaces of the circuit patterns 3 and 4 is blocked with a highly thixotropic silicone resin or epoxy resin,
The transparent sealing resin 7 can be prevented from flowing out. Depending on the outflow state of the transparent encapsulation resin 7, even if the transparent encapsulation resin outflow prevention resin is not applied to the entire periphery of the LED mounting recess 2, the injection molded printed circuit board 1 and the side surfaces of the circuit patterns 3 and 4 may be removed. The transparent sealing resin outflow prevention resin may be applied only to the vicinity of the boundary portion.
【００１６】透明封止樹脂流出防止樹脂層１７を形成す
る時期（硬化させる時期）については、透明封止樹脂流
出防止樹脂を硬化させ、透明封止樹脂流出防止樹脂層１
７を形成した後、透明封止樹脂を硬化させる場合と、透
明封止樹脂流出防止樹脂と透明封止樹脂を一括して加熱
硬化させ、透明封止樹脂の硬化時に透明封止樹脂流出防
止樹脂層も形成する場合が考えられる。この点について
は、透明封止樹脂及び透明封止樹脂流出防止樹脂の性質
（加熱硬化時に、互いに混じり合ってしまう材料である
か等）によって決めればよい。The transparent sealing resin outflow prevention resin layer 17 is formed (cured) by curing the transparent sealing resin outflow prevention resin layer 1 and then curing it.
After forming 7, the transparent sealing resin outflow prevention resin and the case where the transparent sealing resin outflow prevention resin and the transparent sealing resin are collectively heat-cured It is possible that a layer is also formed. This point may be determined depending on the properties of the transparent sealing resin and the transparent sealing resin outflow preventing resin (whether they are materials that mix with each other at the time of heat curing).
【００１７】透明封止樹脂流出防止樹脂として、実施例
ではシリコン樹脂を用いているが、実験によれば、一般
半導体の液状樹脂封止に用いるようなシリカや炭酸カル
シウムといった充填剤を混合し、チクソ性を上げたエポ
キシ樹脂等を用いることもできる。As the transparent sealing resin outflow preventing resin, a silicone resin is used in the embodiment, but according to experiments, a filler such as silica or calcium carbonate, which is used for liquid resin sealing of general semiconductors, is mixed, It is also possible to use an epoxy resin having improved thixotropy.
【００１８】本願発明の射出成形プリント基板の異なる
実施例を図２に示す。図２に示す実施例は、図５に示し
た従来の射出成形プリント基板に透明封止樹脂流出防止
樹脂層を形成したものである。従来例と同等構成につい
ては、同符号を付すこととする。図２はＬＥＤ実装部の
斜視図で、９は射出成形プリント基板、１０は略直方体
の形状の両側に側面視略台形の形状を設けたＬＥＤ実装
台、１１はＬＥＤ実装台１０の上面に形成されたＬＥＤ
実装用凹部、１２，１３は回路パターン、１４はＬＥＤ
チップ、１５はボンディングワイヤ、１６はＬＥＤ実装
用凹部１１内で回路パターン１２と回路パターン１３を
絶縁する絶縁帯、１８は透明封止樹脂の流出を防止する
ために、ＬＥＤ実装用凹部１１の周囲に形成された透明
封止樹脂流出防止樹脂層である。但し、透明封止樹脂の
図示は省略する。A different embodiment of the injection-molded printed circuit board of the present invention is shown in FIG. In the embodiment shown in FIG. 2, a transparent sealing resin outflow preventing resin layer is formed on the conventional injection-molded printed circuit board shown in FIG. The same components as those of the conventional example are designated by the same reference numerals. FIG. 2 is a perspective view of the LED mounting portion, 9 is an injection molded printed circuit board, 10 is an LED mounting base having a trapezoidal shape in side view on both sides of a substantially rectangular parallelepiped shape, and 11 is an upper surface of the LED mounting base 10. LED
Mounting recess, 12 and 13 are circuit patterns, 14 is LED
A chip, 15 is a bonding wire, 16 is an insulating band that insulates the circuit pattern 12 and the circuit pattern 13 in the LED mounting recess 11, and 18 is a periphery of the LED mounting recess 11 to prevent the transparent sealing resin from flowing out. It is a transparent sealing resin outflow prevention resin layer formed on. However, illustration of the transparent sealing resin is omitted.
【００１９】ＬＥＤチップ１４に電圧を印加し発光させ
るための回路パターン１２，１３が、射出成形プリント
基板９の表面からＬＥＤ実装用凹部１１の底面まで延設
され、ＬＥＤ実装用凹部１１及びＬＥＤ実装台１０を横
断するように形成されている絶縁帯１６によって電気的
に分離されている。ＬＥＤチップ１４は、ＬＥＤ実装用
凹部１１の底面の回路パターン１２上に、導電性の接着
剤であるダイボンドペーストを介して接着され、直径18
〜50μｍ程度のAuまたはAl製のボンディングワイヤ１５
によって回路パターン１３と接続されている。このよう
にＬＥＤチップ１４はＬＥＤ実装用凹部１１内に実装さ
れ、外的障害からの保護のため、透明封止樹脂にて封止
される。また、多くの場合、透明封止樹脂は、所定の発
光色を得るために、赤や緑に着色されて用いられる。Circuit patterns 12 and 13 for applying a voltage to the LED chip 14 to cause it to emit light are extended from the surface of the injection-molded printed circuit board 9 to the bottom surface of the LED mounting recess 11, and the LED mounting recess 11 and the LED mounting are provided. It is electrically separated by an insulating band 16 formed so as to cross the table 10. The LED chip 14 is adhered onto the circuit pattern 12 on the bottom surface of the LED mounting recess 11 via a die bond paste, which is a conductive adhesive, and has a diameter of 18 mm.
~ 50μm Au or Al bonding wire 15
Is connected to the circuit pattern 13. Thus, the LED chip 14 is mounted in the LED mounting recess 11 and is sealed with a transparent sealing resin for protection from external obstacles. Further, in many cases, the transparent sealing resin is used by being colored red or green in order to obtain a predetermined emission color.
【００２０】図３に本願発明の射出成形プリント基板の
さらに異なる実施例を示す。図３に示す実施例は図２に
示した実施例に対して、透明封止樹脂流出防止樹脂の塗
布位置（透明封止樹脂流出防止樹脂層の形成位置）を変
えたものである。図２に示した実施例では、ＬＥＤ実装
用凹部１１を囲むＬＥＤ実装台１０の上面全面に透明封
止樹脂流出防止樹脂を塗布したが、図３に示す実施例
は、透明封止樹脂の流出経路であるＬＥＤ実装台１０上
面の、回路パターンが形成されていない絶縁帯上及び近
傍にのみ透明封止樹脂流出防止樹脂を塗布し、透明封止
樹脂流出防止樹脂層１９を形成したものである。FIG. 3 shows a further different embodiment of the injection-molded printed circuit board of the present invention. The embodiment shown in FIG. 3 differs from the embodiment shown in FIG. 2 in that the coating position of the transparent sealing resin outflow prevention resin (the formation position of the transparent sealing resin outflow prevention resin layer) is changed. In the embodiment shown in FIG. 2, the transparent sealing resin outflow prevention resin is applied to the entire upper surface of the LED mounting base 10 surrounding the LED mounting recess 11. However, in the embodiment shown in FIG. The transparent sealing resin outflow prevention resin layer 19 is formed by applying the transparent sealing resin outflow prevention resin layer only on the insulating band on which the circuit pattern is not formed and on the upper surface of the LED mounting base 10 which is the path. .
【００２１】透明封止樹脂流出防止樹脂の塗布方法とし
ては、射出成形プリント基板の表面は平坦でなく印刷法
では対応が困難であるため、スタンピング法或いはディ
スペンサーによる塗布が適切である。射出成形プリント
基板の成形材料は、液晶ポリマーに限定されるものでは
ない。As a method for applying the transparent sealing resin outflow preventing resin, a stamping method or a dispenser is suitable because the surface of the injection-molded printed circuit board is not flat and it is difficult to cope with it by a printing method. The molding material of the injection molded printed circuit board is not limited to the liquid crystal polymer.
【００２２】[0022]
【発明の効果】以上のように、本願発明の射出成形プリ
ント基板及びその製造方法によれば、透明封止樹脂の流
出経路を透明封止樹脂流出防止樹脂層によって遮断した
ので、ＬＥＤ実装用凹部に充填された透明封止樹脂が加
熱硬化時にＬＥＤ実装用凹部から流出するのを防止する
ことができる。As described above, according to the injection-molded printed circuit board and the method of manufacturing the same of the present invention, the outflow path of the transparent sealing resin is blocked by the transparent sealing resin outflow preventing resin layer. It is possible to prevent the transparent sealing resin with which the resin is filled from flowing out from the LED mounting recess during heat curing.
【図１】本願発明に係る射出成形プリント基板にＬＥＤ
チップを実装した一実施例を示す構造図である。（ａ）
はＬＥＤ実装部の斜視図、（ｂ）は B-B断面図である。FIG. 1 shows an LED on an injection-molded printed circuit board according to the present invention.
FIG. 3 is a structural diagram showing an example in which a chip is mounted. (A)
Is a perspective view of the LED mounting portion, and (b) is a BB sectional view.
【図２】本願発明に係る射出成形プリント基板にＬＥＤ
チップを実装した異なる実施例を示す斜視図である。FIG. 2 shows an LED on an injection-molded printed circuit board according to the present invention.
It is a perspective view which shows another Example which mounted the chip.
【図３】本願発明に係る射出成形プリント基板にＬＥＤ
チップを実装した、さらに異なる実施例を示す斜視図で
ある。FIG. 3 shows an LED on an injection molded printed circuit board according to the present invention.
It is a perspective view which shows another Example which mounted the chip.
【図４】従来の射出成形プリント基板にＬＥＤチップを
実装した例を示す構造図である。（ａ）はＬＥＤ実装部
の斜視図、（ｂ）は A-A断面図である。FIG. 4 is a structural diagram showing an example in which an LED chip is mounted on a conventional injection-molded printed circuit board. (A) is a perspective view of an LED mounting part, (b) is an AA sectional view.
【図５】従来の射出成形プリント基板にＬＥＤチップを
実装した異なる例を示す斜視図である。FIG. 5 is a perspective view showing another example in which an LED chip is mounted on a conventional injection molded printed circuit board.
１ 射出成形プリント基板 ２ ＬＥＤ実装用凹部 ３，４ 回路パターン ５ ＬＥＤチップ ６ ボンディングワイヤ ７ 透明封止樹脂 ８ 絶縁帯 ９ 射出成形プリント基板 １０ ＬＥＤ実装台 １１ ＬＥＤ実装用凹部 １２，１３ 回路パターン １４ ＬＥＤチップ １５ ボンディングワイヤ １６ 絶縁帯 １７，１８，１９ 透明封止樹脂流出防止樹脂層 DESCRIPTION OF SYMBOLS 1 Injection-molded printed circuit board 2 LED mounting recess 3, 4 Circuit pattern 5 LED chip 6 Bonding wire 7 Transparent sealing resin 8 Insulation band 9 Injection-molded printed circuit board 10 LED mounting base 11 LED mounting recess 12, 13 Circuit pattern 14 LED Chip 15 Bonding wire 16 Insulation band 17, 18, 19 Transparent encapsulation resin outflow prevention resin layer
Claims (4)
にＬＥＤチップを実装し透明樹脂にて封止する射出成形
プリント基板において、前記凹部周囲の前記射出成形プ
リント基板表面に透明樹脂流出防止用樹脂層を形成した
ことを特徴とする射出成形プリント基板。1. An injection-molded printed circuit board in which an LED chip is mounted in a recess formed on an injection-molded printed circuit board and sealed with a transparent resin. A transparent resin outflow preventing resin is provided on the surface of the injection-molded printed circuit board around the recess. An injection-molded printed circuit board having a layer formed thereon.
射出成形プリント基板の前記凹部周囲近傍の、回路パタ
ーンを形成しない箇所及びその近傍にのみ形成されてい
ることを特徴とする請求項１記載の射出成形プリント基
板。2. The transparent resin outflow preventing resin layer is formed only in the vicinity of the recess of the injection-molded printed circuit board and in the vicinity where the circuit pattern is not formed and in the vicinity thereof. The injection-molded printed circuit board described.
プリント基板を製造する際、透明樹脂流出防止用樹脂を
スタンピング法を使用して塗布し、前記透明樹脂流出防
止用樹脂層を形成したことを特徴とする射出成形プリン
ト基板の製造方法。3. When manufacturing the injection-molded printed circuit board according to claim 1 or 2, a transparent resin outflow preventing resin is applied using a stamping method to form the transparent resin outflow preventing resin layer. A method for manufacturing an injection-molded printed circuit board, comprising:
プリント基板を製造する際、透明樹脂流出防止用樹脂を
ディスペンサーにより供給して、前記透明樹脂流出防止
用樹脂層を形成したことを特徴とする射出成形プリント
基板の製造方法。4. When manufacturing the injection-molded printed circuit board according to claim 1 or 2, a transparent resin outflow preventing resin is supplied by a dispenser to form the transparent resin outflow preventing resin layer. A method of manufacturing an injection-molded printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16160793A JP3344006B2 (en) | 1993-06-30 | 1993-06-30 | Printed circuit board with chip and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16160793A JP3344006B2 (en) | 1993-06-30 | 1993-06-30 | Printed circuit board with chip and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0722652A true JPH0722652A (en) | 1995-01-24 |
| JP3344006B2 JP3344006B2 (en) | 2002-11-11 |
Family
ID=15738380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16160793A Expired - Fee Related JP3344006B2 (en) | 1993-06-30 | 1993-06-30 | Printed circuit board with chip and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3344006B2 (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03106089A (en) * | 1989-09-20 | 1991-05-02 | Fuji Electric Co Ltd | Semiconductor laser element |
| JPH03142880A (en) * | 1989-10-27 | 1991-06-18 | Matsushita Electric Ind Co Ltd | Semiconductor device and its image sensor and image sensor device |
| JPH04346867A (en) * | 1991-05-24 | 1992-12-02 | Hitachi Ltd | Liquid coating device with dispenser |
| JPH0529650A (en) * | 1991-07-19 | 1993-02-05 | Sharp Corp | Optical device |
| JPH0529664A (en) * | 1991-07-23 | 1993-02-05 | Sharp Corp | Photosemiconductor device |
| JPH05145121A (en) * | 1991-11-18 | 1993-06-11 | Matsushita Electric Works Ltd | Packaging structure of light emitting diode |
-
1993
- 1993-06-30 JP JP16160793A patent/JP3344006B2/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03106089A (en) * | 1989-09-20 | 1991-05-02 | Fuji Electric Co Ltd | Semiconductor laser element |
| JPH03142880A (en) * | 1989-10-27 | 1991-06-18 | Matsushita Electric Ind Co Ltd | Semiconductor device and its image sensor and image sensor device |
| JPH04346867A (en) * | 1991-05-24 | 1992-12-02 | Hitachi Ltd | Liquid coating device with dispenser |
| JPH0529650A (en) * | 1991-07-19 | 1993-02-05 | Sharp Corp | Optical device |
| JPH0529664A (en) * | 1991-07-23 | 1993-02-05 | Sharp Corp | Photosemiconductor device |
| JPH05145121A (en) * | 1991-11-18 | 1993-06-11 | Matsushita Electric Works Ltd | Packaging structure of light emitting diode |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3344006B2 (en) | 2002-11-11 |
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