JPH07225945A - Production of magnetic recording medium - Google Patents

Production of magnetic recording medium

Info

Publication number
JPH07225945A
JPH07225945A JP1433594A JP1433594A JPH07225945A JP H07225945 A JPH07225945 A JP H07225945A JP 1433594 A JP1433594 A JP 1433594A JP 1433594 A JP1433594 A JP 1433594A JP H07225945 A JPH07225945 A JP H07225945A
Authority
JP
Japan
Prior art keywords
substrate
magnetic
recording medium
magnetic recording
electrolytic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1433594A
Other languages
Japanese (ja)
Inventor
Tomoo Shigeru
智雄 茂
Yasushi Makabe
保志 真壁
Kazuo Fujimoto
一男 藤本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chemical Corp filed Critical Mitsubishi Chemical Corp
Priority to JP1433594A priority Critical patent/JPH07225945A/en
Publication of JPH07225945A publication Critical patent/JPH07225945A/en
Pending legal-status Critical Current

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  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

PURPOSE:To improve the surface characteristics of an underlayer and to obtain a medium excellent in levitation characteristics, lubricity and wear resistance by placing cathodes on both sides of each textured substrate so that they confront each other and carrying out electrolysis. CONSTITUTION:Cathodes 2 are parallel placed on both sides of each textured substrate 1 so that they confront each other and electrolysis is carried out in an acidic electrolytic soln. 3 while impressing prescribed voltage on the substrate 1 from a DC power source 4. Protrusions and burrs on the surface of the substrate 1 are removed by electrolytic etching and the substrate 1 is finished to a smooth state. The pref. interval between the substrate 1 and each of the cathodes 2 is 5-30mm, the electrolytic soln. is preferably an aq. phosphoric acid soln. having 0.5-40wt.% concn. and current. density is preferably 0.1-25mA/cm<2>. An underlayer and a magnetic layer are then formed on the substrate 1 and the objective medium having a smooth surface is obtd.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は磁気記録媒体の製造方法
に関するものである。詳しくは、基板上の表面加工処理
を特定の方法を用いて行なうことで表面特性を改善し、
浮上特性、潤滑性、及び耐摩耗性に優れた磁気記録媒体
を製造する方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a magnetic recording medium. In detail, improve the surface characteristics by performing the surface processing on the substrate using a specific method,
The present invention relates to a method of manufacturing a magnetic recording medium having excellent flying characteristics, lubricity and wear resistance.

【0002】[0002]

【従来の技術】近年、コンピュータ等の情報処理技術の
発達に伴い、その外部記憶装置として磁気ディスク等の
磁気記録媒体が用いられている。従来、磁気記録媒体と
してはアルミニウム合金基板にアルマイト処理やNi−
Pメッキ等の非磁性メッキ処理を施した後に、Cr等の
下地層を被覆し、次いでCo系合金の磁性薄膜層を被覆
し、更に炭素質の保護膜が被覆されたものが使用されて
いる。
2. Description of the Related Art In recent years, with the development of information processing technology for computers and the like, magnetic recording media such as magnetic disks have been used as external storage devices. Conventionally, as a magnetic recording medium, an aluminum alloy substrate is subjected to alumite treatment or Ni-
A non-magnetic plating treatment such as P plating is applied, followed by coating an underlayer such as Cr, then a magnetic thin film layer of a Co-based alloy, and a carbonaceous protective film. .

【0003】上記磁気記録媒体(磁気ディスク)の高密
度化に伴ない、磁気ディスクと磁気ヘッドとの間隔、即
ち浮上量は益々小さくなっており、最近では0.15μ
m以下程度になっている。このように磁気ヘッドの浮上
量が著しく小さいため、磁気ディスク面に突起があると
ヘッドクラッシュを招き、ディスク表面を傷つけること
がある。また、ヘッドクラッシュに至らないような微小
な突起でも情報の読み書きの際の種々のエラーの原因と
なりやすい。
With the increase in density of the magnetic recording medium (magnetic disk), the distance between the magnetic disk and the magnetic head, that is, the flying height, has become smaller and smaller.
It is about m or less. As described above, since the flying height of the magnetic head is extremely small, a protrusion on the magnetic disk surface may cause a head crash, which may damage the disk surface. Further, even minute protrusions that do not lead to head crashes are likely to cause various errors when reading and writing information.

【0004】一方、磁気ディスクは大容量化、高密度化
と並行して小型化も進められており、スピンドル回転用
のモーター等も益々小さくなっている。このため、モー
ターのトルクが不足し、磁気ヘッドが磁気ディスク面に
固着したまま浮上しないという現象が生じやすい。この
磁気ヘッドの固着を、磁気ヘッドと磁気ディスク表面と
の接触を小さくすることにより防止する手段として、磁
気ディスクの基板表面に微細な溝を形成するテクスチャ
加工と称する表面加工を施す処理が行なわれている。
On the other hand, magnetic disks are being miniaturized in parallel with the increase in capacity and density, and motors for spindle rotation are becoming smaller and smaller. For this reason, the torque of the motor is insufficient, and the phenomenon that the magnetic head does not fly while being fixed to the magnetic disk surface is likely to occur. As a means for preventing the sticking of the magnetic head by reducing the contact between the magnetic head and the surface of the magnetic disk, a surface treatment called texturing for forming fine grooves on the substrate surface of the magnetic disk is performed. ing.

【0005】また、特開平4−95221号には、テク
スチャ加工を行い、洗浄後、ケミカルエッチングを施す
ことが提案されている。さらに、特開平5−12850
6号には、テクスチャ加工を施した基板表面に電解研磨
処理を行うことで、基板表面の異常突起を選択的に除去
することが開示されている。
Further, Japanese Patent Application Laid-Open No. 4-95221 proposes that texturing is performed, cleaning is performed, and then chemical etching is performed. Furthermore, JP-A-5-12850
No. 6 discloses that abnormal projections on the substrate surface are selectively removed by performing electrolytic polishing treatment on the textured substrate surface.

【0006】[0006]

【発明が解決しようとする課題】しかしながら、上記テ
クスチャ加工処理のみを用いた場合には、磁気ディスク
の浮上特性の改善は見られるものの、十分であるとは言
いがたい。また、特開平4−95221号に記載されて
いるケミカルエッチングによる方法では、エッチング条
件の選択による加工表面状態の制御がしにくく、また、
エッチング状態が不均一になりやすく、局部的な腐食が
発生しやすいことから、未だ満足できる表面状態のもの
が得られておらず、さらに磁気ディスクの浮上特性を改
善することが望まれている。
However, when only the above-mentioned texture processing is used, although the floating characteristics of the magnetic disk are improved, it cannot be said to be sufficient. Further, in the method by chemical etching described in JP-A-4-95221, it is difficult to control the processed surface state by selecting the etching conditions, and
Since the etching state is likely to be non-uniform and local corrosion is likely to occur, a satisfactory surface state has not yet been obtained, and it is desired to improve the floating characteristics of the magnetic disk.

【0007】さらに、特開平5−128506号に記載
された方法で工業的規模、すなわち、複数枚の基板を同
時に電解処理する際、電解処理による基板のエッチング
量が基板によってそれぞれ異なり、且つ、同じ基板であ
っても面内方向でエッチング量が異なり、基板表面の浮
上特性に影響を与えるという問題点がある。
Furthermore, when the method described in Japanese Patent Laid-Open No. 5-128506 is used on an industrial scale, that is, when a plurality of substrates are electrolytically treated at the same time, the etching amounts of the substrates due to the electrolytic treatment are different from each other and are the same. Even in the case of a substrate, the amount of etching varies in the in-plane direction, which affects the floating characteristics of the surface of the substrate.

【0008】[0008]

【課題を解決するための手段】本発明者らは、上記した
磁気ディスクにおける浮上特性をさらに改善すべく鋭意
検討した結果、基板上にテクスチャ加工を施した後、該
基板表面を酸性の電解液中で、特定の装置を用いて直流
電解処理することにより、基板表面特性が改善され、上
記目的が達成されることを見出し、本発明を完成するに
至った。
DISCLOSURE OF THE INVENTION The inventors of the present invention have made earnest studies to further improve the levitation characteristics of the above-mentioned magnetic disk, and as a result, after texturing the substrate, the substrate surface is treated with an acidic electrolytic solution. Among them, it has been found that the surface characteristics of the substrate are improved and the above object is achieved by performing the direct current electrolytic treatment using a specific apparatus, and the present invention has been completed.

【0009】即ち、本発明の要旨は、テクスチャ加工を
施こした非磁性基板の表面上に下地層及び磁性層を順次
形成する磁気記録媒体の製造方法において、テクスチャ
加工を施こした基板の両面に陰極を対向させて設置し、
酸性の電解液中で、該基板に直流電圧を印加して電解処
理した後、下地層及び磁性層を形成することを特徴とす
る磁気記録媒体の製造方法に存する。
That is, the gist of the present invention is a method for manufacturing a magnetic recording medium in which an underlayer and a magnetic layer are sequentially formed on the surface of a textured non-magnetic substrate. Install the cathode opposite to
A method for producing a magnetic recording medium is characterized in that a DC voltage is applied to the substrate in an acidic electrolytic solution to perform an electrolytic treatment, and then an underlayer and a magnetic layer are formed.

【0010】以下、本発明につき更に詳細に説明する。
本発明における磁気記録媒体の非磁性基板としては、一
般にアルミニウム合金からなるディスク状基板を所定の
厚さに加工した後、その表面を鏡面加工してから、非磁
性金属、例えばNi−P合金、又はNi−Cu−P合金
等を無電解メッキ処理等により約5〜20μmの膜厚の
表面層として形成されたものが用いられる。
The present invention will be described in more detail below.
As the non-magnetic substrate of the magnetic recording medium in the present invention, a disk-shaped substrate generally made of an aluminum alloy is processed to a predetermined thickness, and then the surface is mirror-finished, and then a non-magnetic metal such as Ni-P alloy, Alternatively, a Ni-Cu-P alloy or the like formed as a surface layer having a thickness of about 5 to 20 μm by electroless plating or the like is used.

【0011】上記基板の表面層上にポリッシュ加工を施
したものにテクスチャ加工を施すのが一般的である。ポ
リッシュ加工は例えば、表面に遊離砥粒を付着してしみ
込ませたポリッシュパッドの間に基板をはさみこみ、界
面活性剤水溶液等の研磨液を補給しながらポリッシュ加
工を行ない、通常2〜5μm程度ポリッシュしてその表
面を平均表面粗さRaが50Å以下、望ましくは30Å
以下に鏡面仕上げする。遊離砥粒としては、代表的に
は、アルミナ系スラリーのポリプラ700やポリプラ1
03(共に(株)フジミインコーポレーテッドの登録商
標)、ダイヤモンド系スラリー、SiC系スラリー等が
用いられる。ポリッシュパッドとしては、代表的には、
Surfin100やSurfinXXX−5(共に
(株)フジミインコーポレーテッドの登録商標)等の発
泡ウレタン等が用いられる。
It is general that the surface layer of the above-mentioned substrate is subjected to polishing and then textured. The polishing process is performed, for example, by sandwiching the substrate between polishing pads that are impregnated with free abrasive grains on the surface, and polishing the liquid while supplying a polishing solution such as a surfactant aqueous solution. Average surface roughness Ra is 50 Å or less, preferably 30 Å
The mirror finish is given below. As the loose abrasive grains, typically, alumina-based slurry polyplastics 700 and polyplastics 1 are used.
03 (both are registered trademarks of Fujimi Inc.), diamond-based slurry, SiC-based slurry and the like. As a polish pad, typically,
Urethane foams such as Surfin 100 and SurfinXXX-5 (both are registered trademarks of Fujimi Incorporated) are used.

【0012】また、テクスチャ加工としては例えば、2
500〜6000#程度のアルミナ砥粒を担持した研磨
テープを用いるテープ研削又は、遊離砥粒を用いるスラ
リー研削により、上記ポリッシュ加工を施した基板面
に、平均表面粗さRaが20Å以上、好ましくは30〜
300Å、さらに好ましくは50〜150Å、形成され
た条痕の交差する角度が好ましくは10〜40°、更に
好ましくは10〜30°の範囲の微細な溝もしくは凹凸
を精度よく形成すものであり、基板基面にクロスパター
ンの条痕を形成することは、吸着特性が改善されるとい
う点で好ましい。さらに基板表面の異常突起を除去する
ために、遊離砥粒を用いるスラリー研削による第2段テ
クスチャを施してもよい。このテクスチャ加工により、
磁気ヘッドと磁気記録媒体の吸着が防止でき、且つCS
S特性が改善され、さに磁気異方性が良好となる。
The texture processing is, for example, 2
The average surface roughness Ra is 20 Å or more, preferably on the surface of the substrate subjected to the above-mentioned polishing by tape grinding using a polishing tape carrying alumina abrasive grains of about 500 to 6000 # or slurry grinding using loose abrasive grains. 30 ~
300 Å, more preferably 50-150 Å, the angle of intersection of the formed striations is preferably 10-40 °, more preferably 10-30 ° to form fine grooves or irregularities with high precision, It is preferable to form a cross pattern striation on the base surface of the substrate because the adsorption property is improved. Further, in order to remove abnormal protrusions on the substrate surface, a second stage texture may be applied by slurry grinding using loose abrasive grains. By this texture processing,
Adhesion between the magnetic head and the magnetic recording medium can be prevented, and CS
The S characteristic is improved and the magnetic anisotropy is improved.

【0013】本発明においては、テクスチャ加工を施し
た基板表面を酸性の電解液中で、電流密度が好ましくは
0.1〜25mA/cm2 、さらに好ましくは0.1〜
10mA/cm2 の範囲内で、該基板に直流電圧を印加
して電解処理する。電解時間としては1〜400秒、好
ましくは2〜200秒の範囲が用いられ、電気量、すな
わち電流密度と電解時間の積としては2000mA・秒
/cm2 以下、好ましくは50〜1500mA・秒/c
2 の範囲が用いられる。また電解液中の温度としては
特に制限はないが、通常10〜70℃の範囲で実施され
る。
In the present invention, the surface of the textured substrate is preferably in the acidic electrolyte at a current density of 0.1 to 25 mA / cm 2 , more preferably 0.1 to 25 mA / cm 2 .
Within the range of 10 mA / cm 2 , a DC voltage is applied to the substrate for electrolytic treatment. As the electrolysis time, a range of 1 to 400 seconds, preferably 2 to 200 seconds is used, and the amount of electricity, that is, the product of current density and electrolysis time is 2000 mA · sec / cm 2 or less, preferably 50 to 1500 mA · sec / c
A range of m 2 is used. The temperature in the electrolytic solution is not particularly limited, but is usually in the range of 10 to 70 ° C.

【0014】上記電解液としては例えば硫酸、硝酸、塩
酸、クロム酸、リン酸、シュウ酸、酢酸等の一種又は二
種以上を組合せたものが用いられ、その濃度としては
0.5〜40重量%、好ましくは1〜30重量%の範囲
の水溶液として使用される。該電解液としてはリン酸が
好適である。
As the above-mentioned electrolytic solution, for example, sulfuric acid, nitric acid, hydrochloric acid, chromic acid, phosphoric acid, oxalic acid, acetic acid and the like are used, or a combination of two or more thereof is used, and the concentration thereof is 0.5 to 40 weight. %, Preferably used as an aqueous solution in the range of 1 to 30% by weight. Phosphoric acid is suitable as the electrolytic solution.

【0015】電解液としてリン酸を使用する場合には、
リン酸濃度は0.5〜40重量%、好ましくは1〜20
重量%の範囲である。電解処理条件としては、液温10
〜70℃の上記リン酸水溶液の電解液中で、電流密度が
0.1〜25mA/cm2 、好ましくは0.1〜10m
A/cm2 、さらに好ましくは1〜5mA/cm2 の範
囲で、電解時間が10〜400秒、好ましくは10〜2
00秒の範囲である。
When phosphoric acid is used as the electrolyte,
The phosphoric acid concentration is 0.5 to 40% by weight, preferably 1 to 20
It is in the range of% by weight. The electrolytic treatment condition is a liquid temperature of 10
In the electrolyte solution of the above phosphoric acid aqueous solution at ˜70 ° C., the current density is 0.1 to 25 mA / cm 2 , preferably 0.1 to 10 m.
A / cm 2 , more preferably 1 to 5 mA / cm 2 , and electrolysis time is 10 to 400 seconds, preferably 10 to 2 seconds.
It is in the range of 00 seconds.

【0016】本発明においては上記テクスチャ加工を施
した基板表面を酸性の電解液中で電解処理する際、該基
板の両面に陰極を平行して対向させるように設置し、該
基板に直流電圧を印加して電解処理する。本発明の実施
態様の一例を図1を用いて説明する。
In the present invention, when the surface of the textured substrate is subjected to electrolytic treatment in an acidic electrolytic solution, cathodes are installed on both sides of the substrate so as to face each other in parallel, and a DC voltage is applied to the substrate. Apply and electrolyze. An example of the embodiment of the present invention will be described with reference to FIG.

【0017】図1において、基板(陽極)(1)の両面
に平行して対向させるように陰極(2)を設置し、酸性
の電解液(3)中で直流電源(4)より所定の電圧を基
板(1)に印加しながら電解処理して、基板表面の突起
やバリを電解エッチングにより除去し、基板表面をなめ
らかな表面状態に仕上げる。該基板(1)と陰極(2)
との電極間の距離としては、5〜30mm、好ましくは
10〜20mmの範囲であることが、エッチング量が均
一になるという点で好ましい。該陰極としてはステンレ
ス、アルミニウムカーボン等が用いられ、その形状とし
ては上記基板と同程度の大きさの円板やドーナツ型形状
のものが使用される。該電解処理に際し、基板の面内方
向のエッチング量を均一化するには、上記電流密度、電
極間距離、陰極形状やそのサイズを適宜調節することに
より行なう。
In FIG. 1, a cathode (2) is installed so as to face both sides of a substrate (anode) (1) in parallel, and a predetermined voltage is applied from a DC power source (4) in an acidic electrolytic solution (3). Is applied to the substrate (1) for electrolytic treatment to remove protrusions and burrs on the surface of the substrate by electrolytic etching to finish the substrate surface into a smooth surface state. The substrate (1) and cathode (2)
It is preferable that the distance between the electrodes and is in the range of 5 to 30 mm, preferably 10 to 20 mm, because the etching amount becomes uniform. As the cathode, stainless steel, aluminum carbon, or the like is used, and as the shape thereof, a disk having a size similar to that of the substrate or a donut shape is used. In order to make the etching amount in the in-plane direction of the substrate uniform during the electrolytic treatment, the current density, the distance between the electrodes, the shape of the cathode and the size thereof are appropriately adjusted.

【0018】上記電解処理方法によって、テクスチャ加
工後の基板表面の突起やバリ等が電解エッチングにより
均一に除去され、基板表面がなめらかな表面状態とな
り、浮上特性やCSS特性が大幅に改善される。
By the above electrolytic treatment method, projections, burrs and the like on the substrate surface after texture processing are uniformly removed by electrolytic etching, the substrate surface becomes a smooth surface state, and the levitation characteristics and CSS characteristics are greatly improved.

【0019】また、電解処理終了後、必要に応じて下地
層及び磁性層積層に先立って、遊離砥粒をセルロース製
不織布等の基材表面に付着してしみ込ませたもの、ある
いはアルミナ等の砥粒の比較的細かいものを担持したテ
ープ等を基板面に押圧して再度テクスチャ処理を施す仕
上げ処理を行ってもよい。上記電解処理を施した基板表
面上に第2次下地層としてクロムをスパッタリングによ
り形成する。該クロム下地層の膜厚としては通常50〜
2000Åの範囲である。
After completion of the electrolytic treatment, if necessary, prior to laminating the underlayer and the magnetic layer, loose abrasive grains are adhered and impregnated on the surface of a substrate such as a cellulose nonwoven fabric, or an abrasive such as alumina. You may perform the finishing process which presses the tape etc. which carry comparatively fine grain | grains on a board | substrate surface, and performs a texture process again. Chromium is formed as a secondary underlayer by sputtering on the surface of the substrate that has been subjected to the electrolytic treatment. The thickness of the chromium underlayer is usually 50 to
It is in the range of 2000Å.

【0020】このような基板のCr下地層上に形成され
る金属磁性薄膜層としては、Co−Cr,Co−Ni,
Co−Cr−X,Co−Ni−X,Co−W−X等で表
わされるCo系合金の磁性薄膜層が好適である。ここで
XとしてはLi,Si,Ca,Ti,V,Cr,Ni,
As,Y,Zr,Nb,Mo,Ru,Rh,Ag,S
b,Hf,Ta,W,Re,Os,Ir,Pt,Au,
La,Ce,Pr,Nd,Pm,Sm、及び、Euより
なる群から選ばれた1種又は2種以上の元素が挙げられ
る。
As the metal magnetic thin film layer formed on the Cr underlayer of such a substrate, Co--Cr, Co--Ni,
A magnetic thin film layer of a Co-based alloy represented by Co-Cr-X, Co-Ni-X, Co-W-X or the like is suitable. Here, X is Li, Si, Ca, Ti, V, Cr, Ni,
As, Y, Zr, Nb, Mo, Ru, Rh, Ag, S
b, Hf, Ta, W, Re, Os, Ir, Pt, Au,
Examples include one or more elements selected from the group consisting of La, Ce, Pr, Nd, Pm, Sm, and Eu.

【0021】このようなCo系合金からなる金属磁性薄
膜層は、通常スパッタリング等の手段によって基板の下
地層上に被着形成される。該金属磁性薄膜層の膜厚とし
ては、通常100〜1000Åの範囲とされる。上記金
属磁性薄膜層上に形成される保護薄膜層としては炭素質
膜が好ましく、炭素質保護薄膜層は、通常、アルゴン、
ヘリウム等の希ガスの雰囲気下、又は少量の水素の存在
下で、カーボンをターゲットとしてスパッタリングによ
りアモルファス状カーボン膜や水素化カーボン膜等が被
着形成される。該保護薄膜層の膜厚は、通常50〜50
0Åの範囲とされる。また、摩擦係数を小さくするため
に、保護薄膜層上に更に潤滑膜を形成させてもよい。
The metal magnetic thin film layer made of such a Co-based alloy is usually deposited and formed on the underlayer of the substrate by means such as sputtering. The film thickness of the metal magnetic thin film layer is usually in the range of 100 to 1000Å. The protective thin film layer formed on the metal magnetic thin film layer is preferably a carbonaceous film, and the carbonaceous protective thin film layer is usually argon,
In a rare gas atmosphere such as helium or in the presence of a small amount of hydrogen, an amorphous carbon film, a hydrogenated carbon film or the like is deposited by sputtering with carbon as a target. The thickness of the protective thin film layer is usually 50 to 50.
It is set in the range of 0Å. Further, in order to reduce the friction coefficient, a lubricating film may be further formed on the protective thin film layer.

【0022】[0022]

【実施例】次に、実施例により本発明を更に具体的に説
明するが、本発明はその要旨を超えない限り以下の実施
例に限定されるものではない。
EXAMPLES Next, the present invention will be described in more detail by way of examples, but the present invention is not limited to the following examples as long as the gist thereof is not exceeded.

【0023】実施例1 無電解メッキ法によりNi−Pメッキを15μm程度の
厚みで施した3.5インチのアルミニウム合金ディスク
状基板の表面を、ポリッシュ加工により表面平均粗さ
(Ra)が約20〜30Åの膜面とし、次いで研磨テー
プを用いたテクスチャ加工により微細な溝を、表面平均
粗さ(Ra)100Å程度の大きさで形成させた。次に
該ディスク基板10枚およびディスク基板と同一形状の
ステンレス陰極11枚を図1に示したように、電極間距
離12mmとして、ディスク面を対向させて平行に交互
に配置し、10重量%リン酸水溶液中で液温20℃、電
流密度2mA/cm2 、電解時間100秒の条件下で直
流電圧を基板に印加して、電解処理を行なった。同様に
してテクスチャ加工を施した基板について、電解時間2
00秒、600秒の条件下で電解処理を行った。得られ
た各基板について、電解エッチング前後のディスク基板
の重量変化(エッチング量)を測定し、このエッチング
量を、各電解時間について、10枚のディスク位置に対
してプロットしたものを図3に示す。
Example 1 The surface of a 3.5-inch aluminum alloy disk-shaped substrate plated with Ni-P to a thickness of about 15 μm by electroless plating has a surface average roughness (Ra) of about 20 by polishing. A film surface having a thickness of -30 Å was formed, and then fine grooves were formed by texturing with a polishing tape to have a surface average roughness (Ra) of about 100 Å. Next, as shown in FIG. 1, 10 disk substrates and 11 stainless steel cathodes having the same shape as the disk substrate were arranged in parallel with the disk surfaces facing each other with a distance between electrodes of 12 mm, and 10 wt% phosphorus. Electrolytic treatment was carried out by applying a DC voltage to the substrate in an acid aqueous solution at a liquid temperature of 20 ° C., a current density of 2 mA / cm 2 , and an electrolysis time of 100 seconds. Electrolysis time 2 for substrates that have been similarly textured
The electrolytic treatment was performed under the conditions of 00 seconds and 600 seconds. For each of the obtained substrates, the weight change (etching amount) of the disk substrate before and after electrolytic etching was measured, and this etching amount was plotted against the position of 10 disks for each electrolysis time and is shown in FIG. .

【0024】さらに、電解時間600秒の条件下で電解
処理を行った場合の基板について、ディスク中心からの
距離(mm)に従って、図2に示すようなA〜Dの各部
分のエッチング深さ(Å)を下記方法により測定した結
果を図4に示す。
Further, regarding the substrate subjected to the electrolytic treatment under the condition of the electrolysis time of 600 seconds, the etching depths (A) to (D) shown in FIG. Fig. 4 shows the result of measuring Å) by the following method.

【0025】〈エッチング深さ測定方法〉電解処理前の
ディスク基板上のA〜Dの4箇所につき、半径方向に幅
1mmのイミドテープを貼りつけた。この状態で電解処
理を行った後、洗浄乾燥し、テープ付着部の粘着成分を
イソプロピルアルコールで拭き取った。以上のようにし
て作製したサンプルの段差をTalystep(Tay
lon−Hobson社製、形式ST−200S)によ
り測定し、エッチング深さ(Å)を求めた。図3より、
各ディスク基板間でエッチング量の変化はほとんど見ら
れず一定であることがわかる。また、図4よりディスク
中心からの距離にかかわらず、エッチング深さはほぼ一
定であることがわかる。
<Method of Measuring Etching Depth> An imide tape having a width of 1 mm was attached in the radial direction at four positions A to D on the disk substrate before electrolytic treatment. After performing electrolytic treatment in this state, it was washed and dried, and the adhesive component on the tape adhering portion was wiped off with isopropyl alcohol. The step of the sample manufactured as described above is measured by Talystep (Tay
The etching depth (Å) was determined by measurement with a lon-Hobson model, ST-200S). From Figure 3,
It can be seen that there is almost no change in the etching amount between the disk substrates and it is constant. Further, it can be seen from FIG. 4 that the etching depth is almost constant regardless of the distance from the center of the disk.

【0026】比較例1 実施例1と同様にしてテクスチャ加工を施したディスク
基板4枚を図6に示す内周吊り治具に取り付け、図5に
示す装置を用いて、10重量%リン酸水溶液中で、液温
20℃、電流密度2mA/cm2 、電解時間45秒の条
件下で直流電解処理を行った。同様にして、テクスチャ
加工を施したディスク基板6枚及び25枚を、図6に示
すように内周吊り治具に取り付け、電解処理を行った。
得られた各基板についてエッチング量を測定し、図6に
示したサンプルNo.に対してプロットしたものを図7
に示す。
Comparative Example 1 Four disc substrates textured in the same manner as in Example 1 were attached to an inner circumference hanging jig shown in FIG. 6, and a 10 wt% phosphoric acid aqueous solution was used by using the apparatus shown in FIG. In this, direct current electrolysis treatment was performed under the conditions of a liquid temperature of 20 ° C., a current density of 2 mA / cm 2 , and an electrolysis time of 45 seconds. Similarly, as shown in FIG. 6, 6 and 25 disk substrates subjected to texture processing were attached to an inner circumference hanging jig and subjected to electrolytic treatment.
The etching amount was measured for each of the obtained substrates, and the sample No. shown in FIG. Plotted against Figure 7
Shown in.

【0027】比較例2 電解時間600秒の条件下で電解処理を行ったこと以外
は、比較例1と同様にして、ディスク基板4枚を処理
し、得られたディスクについて実施例2と同様にしてエ
ッチング深さ(Å)を測定した結果を図8に示す。
Comparative Example 2 Four disc substrates were treated in the same manner as in Comparative Example 1 except that the electrolytic treatment was carried out under the condition of electrolysis time of 600 seconds, and the obtained disc was treated in the same manner as in Example 2. 8 shows the result of measuring the etching depth (Å) by etching.

【0028】[0028]

【発明の効果】本発明方法を用いて基板表面を電解処理
することにより、基板表面が均一にエッチング処理され
て、異常突起やバリが選択的に除去され、なめらかな表
面状態となるため、浮上特性やCSS特性が大幅に改善
された磁気記録媒体を提供することができる。
By electrolytically treating the substrate surface using the method of the present invention, the substrate surface is uniformly etched, abnormal projections and burrs are selectively removed, and a smooth surface condition is obtained. It is possible to provide a magnetic recording medium having significantly improved characteristics and CSS characteristics.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施態様の一例を示す説明図である。FIG. 1 is an explanatory diagram showing an example of an embodiment of the present invention.

【図2】エッチング量面内分布の測定における、ディス
ク表面A〜Dの説明図である。
FIG. 2 is an explanatory diagram of disk surfaces A to D in measurement of in-plane distribution of etching amount.

【図3】実施例1の各ディスクのエッチング量分布を示
す。
FIG. 3 shows an etching amount distribution of each disk of Example 1.

【図4】実施例2のエッチング量面内分布を示す。FIG. 4 shows an in-plane distribution of an etching amount in Example 2.

【図5】本発明の比較例を示す説明図である。FIG. 5 is an explanatory diagram showing a comparative example of the present invention.

【図6】図5における内周吊り治具(SUS316製)
(6)の拡大図である。
FIG. 6 is an inner circumference hanging jig (made of SUS316) in FIG.
It is an enlarged view of (6).

【図7】比較例1の各ディスクのエッチング量分布を示
す。
7 shows an etching amount distribution of each disk of Comparative Example 1. FIG.

【図8】比較例2のエッチング量面内分布を示す。8 shows an in-plane distribution of etching amount in Comparative Example 2. FIG.

【符号の説明】[Explanation of symbols]

1 基板(陽極) 2 陰極 3 電解液 4 直流電源 5 電解槽 6 内周吊り治具 1 substrate (anode) 2 cathode 3 electrolyte 4 DC power supply 5 electrolysis tank 6 inner circumference jig

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 テクスチャ加工を施こした非磁性基板
の表面上に下地層及び磁性層を順次形成する磁気記録媒
体の製造方法において、テクスチャ加工を施こした基板
の両面に陰極を対向させて設置し、酸性の電解液中で該
基板に直流電圧を印加して表面を電解処理した後、下地
層及び磁性層を形成することを特徴とする磁気記録媒体
の製造方法。
1. A method of manufacturing a magnetic recording medium in which an underlayer and a magnetic layer are sequentially formed on the surface of a textured non-magnetic substrate, and a cathode is opposed to both sides of the textured substrate. A method for producing a magnetic recording medium, which comprises placing the substrate, applying a DC voltage to the substrate in an acidic electrolytic solution to subject the surface to electrolytic treatment, and then forming an underlayer and a magnetic layer.
【請求項2】 電流密度が0.1〜25mA/cm2
範囲内の条件下で電解処理する請求項1に記載の磁気記
録媒体の製造方法。
2. The method for producing a magnetic recording medium according to claim 1, wherein the electrolytic treatment is performed under the condition that the current density is in the range of 0.1 to 25 mA / cm 2 .
【請求項3】 電解液として、0.5〜40重量%のリ
ン酸水溶液を用いる請求項1又は2に記載の磁気記録媒
体の製造方法。
3. The method for producing a magnetic recording medium according to claim 1, wherein a 0.5-40 wt% phosphoric acid aqueous solution is used as the electrolytic solution.
【請求項4】 基板と陰極との距離が5〜30mmの範
囲内である請求項1から3に記載の磁気記録媒体の製造
方法。
4. The method for producing a magnetic recording medium according to claim 1, wherein the distance between the substrate and the cathode is in the range of 5 to 30 mm.
JP1433594A 1994-02-08 1994-02-08 Production of magnetic recording medium Pending JPH07225945A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1433594A JPH07225945A (en) 1994-02-08 1994-02-08 Production of magnetic recording medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1433594A JPH07225945A (en) 1994-02-08 1994-02-08 Production of magnetic recording medium

Publications (1)

Publication Number Publication Date
JPH07225945A true JPH07225945A (en) 1995-08-22

Family

ID=11858203

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1433594A Pending JPH07225945A (en) 1994-02-08 1994-02-08 Production of magnetic recording medium

Country Status (1)

Country Link
JP (1) JPH07225945A (en)

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