JPH0722551A - Heat pipe type semiconductor cooling device - Google Patents

Abstract

PURPOSE:To provide a heat pipe type semiconductor cooling device which is mainly used for an electric vehicle and does not result in a remarkable drop of cooling effect in comparison with that in the running condition even when a vehicle is not operating. CONSTITUTION:A heat pipe type semiconductor cooling device comprising a block 2 which is provided with a semiconductor 4 in a heat absorbing part of a heat pipe 1 and a plurality of heat radiation fins 3 in a heat radiating part characterized in having a plurality of vents 6 in the heat radiation fins 3. (2) A heat pipe type semiconductor cooling device comprising a block which is provided with a semiconductor 4 in a heat absorbing part of a heat pipe 1 and a plurality of fins 3 in a heat radiating part characterized in having a plurality of cutout portions for ventilation to the external edges of the heat radiation fins 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat pipe type semiconductor cooler mainly mounted on an electric vehicle.

[0002]

2. Description of the Related Art In recent years, the movement to protect the global environment has been increasing more and more, and in order to avoid pollution caused by exhaust gas from automobiles, there is a strong demand for conversion from gasoline automobiles to pollution-free electric automobiles that emit no exhaust gas. The development of electric vehicles is becoming active.

Unlike a gasoline vehicle, an electric vehicle is equipped with an electric motor (motor) instead of an engine, and the electric vehicle is driven by this electric motor. Since the electric power source of the electric motor is a battery, a drive control device (inverter or the like) for converting this electric power into an automobile drive power source is required. However, a large number of power semiconductors such as power modules are used in this drive control device. ing.

For cooling the semiconductor, a heat sink or a heat pipe type semiconductor cooler made of an aluminum extruded material, an aluminum boozing sheet or the like is used depending on its capacity. Even for heat pipe type semiconductor coolers, natural air cooling and forced air cooling are used depending on the capacity and installation location.

FIG. 3 shows the structure of the conventional natural air cooling type heat pipe type semiconductor cooler. In FIG. 3, 1 is a heat pipe, 2 is a block, 3 is a radiation fin, 4 is a semiconductor, and 5 is a semiconductor fixing screw. As shown in FIG. 3, this heat pipe type semiconductor cooler has a block 2 for mounting the semiconductor 4 on one end (heat absorbing part) of the heat pipe 1 and a right angle to the axial direction of the heat pipe 1 on the other end (heat radiating part). Further, a plurality of plate-shaped heat radiation fins 3 are mounted at regular intervals. This heat pipe type semiconductor cooler is installed in a bottom heat mode with a block portion (heat absorbing portion) facing downward so that the heat characteristics of the heat pipe can be maximized. By installing in this way, the stability of the automobile against severe vibration is improved, and the reliability of the operation of the semiconductor is also improved.
This installation method is often used.

[0006]

However, in such a natural air-cooled heat pipe type semiconductor cooler, the fins are cooled by convection using the running wind when the vehicle is running, but when the vehicle is stopped, the fins are run. Since the wind cannot be expected at all, the cooling effect of the residual heat at idling and the like has been a problem in practical use.

[0007]

As a result of intensive studies in view of such a situation, the present invention has developed a heat pipe type semiconductor cooler in which the cooling effect is not significantly reduced even when the vehicle is stopped as compared to when the vehicle is running. According to the first aspect of the invention, the heat absorbing portion of the heat pipe has a block in which a semiconductor is mounted,
A heat pipe type semiconductor cooler having a plurality of heat radiating fins in a heat radiating part, wherein the heat radiating fin has a plurality of holes for ventilation, and the second invention is a heat pipe. In a heat pipe type semiconductor cooler having a block in which a semiconductor is mounted in the heat absorbing part and having a plurality of heat radiating fins in the heat radiating part, a plurality of cutouts for ventilation are provided on an outer edge of the heat radiating fin. It is a heat pipe type semiconductor cooler. Further, both the ventilation hole and the cutout may be provided in the radiation fin.

[0008]

In the present invention, the reason for providing the ventilation holes or cutouts in the radiation fins is to generate natural convection in the vertical direction passing through the holes or cutouts even when the vehicle is stationary and in a no-wind state. This is because the cooling effect is not significantly reduced in comparison. Therefore, the present invention is particularly effective in a vertical heat pipe type semiconductor cooler in which a block having a semiconductor, which is a heat absorbing portion, is located below. Further, even when the vehicle is running, it has the effect of enhancing the cooling effect by the turbulent flow effect of the air passing through the holes or the notches.

The shape, size, and number of the holes or notches provided in the radiating fins may be appropriate, but if the total area of the holes or notches is too large, the radiating area of the radiating fins will be small, and conversely cooling will occur. You need to be careful because it will reduce the effect. The position where the hole is provided is suitable at the peripheral portion of the heat radiation fin which is as far away as possible from the heat pipe. The reason is that since the peripheral portion is far from the heat pipe, the heat radiation amount (fin efficiency) is originally smaller than that in the central portion, and the above-mentioned adverse effect on the cooling effect due to the provision of the holes is small.

[0010]

EXAMPLES Next, the present invention will be described in more detail by way of examples. (Embodiment 1) FIG. 1 shows an embodiment of the present invention. In FIG. 1, 1 is a heat pipe, 2 is a block, 3 is a radiation fin, 4 is a semiconductor, 5 is a semiconductor fixing screw, and 6 is a hole.
The present embodiment is an example of a heat pipe type semiconductor cooler in which a plurality of ventilation holes 6 are provided in the peripheral portion of the heat radiation fin 3 in a vertical type. That is, a semiconductor 4 such as a power module is attached to a metal block 2 for attachment, a heat pipe 1 is joined to the block 2, and a plurality of holes 6 are provided in the peripheral portion at the upper end of the heat pipe 1. Radiating fin 3
Are inserted at regular intervals (8 to 10 mm in this case). When the heat pipe type semiconductor cooler is mounted on an electric vehicle, the semiconductor 4 is cooled by heat radiated from the heat radiation fins 3 by the running wind when the vehicle is running. Further, when stopped, natural convection in the vertical direction is generated through the plurality of holes 6 provided in the radiation fin 3, and a large reduction in cooling effect is not seen as compared with cooling by traveling wind. Here, the shape, size, and number of the holes 6 can be appropriately determined in consideration of the heat radiation amount and the temperature condition.

(Embodiment 2) FIG. 2 shows another embodiment of the present invention. In FIG. 2, 1 is a heat pipe, 2 is a block, 3 is a radiation fin, 4 is a semiconductor, 5 is a semiconductor fixing screw, and 7 is a notch. The present embodiment is an example of a heat pipe type semiconductor cooler in which the heat dissipating fin 3 is provided with a cutout 7 at the outer edge thereof in a vertical installation type. Also in the present embodiment, when the vehicle is stopped, due to the same effect as that of the hole 6 in the first embodiment, the notch 7 causes natural convection in the up-and-down direction, and the cooling effect is significantly larger than that in cooling during traveling. It is to prevent the deterioration. The shape, size, and number of the notches 7 can be appropriately determined in consideration of the heat radiation amount and the temperature condition, as in the first embodiment.

[0012]

As described above, according to the present invention, a heat pipe type semiconductor cooler for an electric vehicle or the like can be obtained in which the cooling effect is not significantly reduced even when the vehicle is stopped compared to when the vehicle is running. It has a remarkable industrial effect.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a perspective view showing another embodiment of the present invention.

FIG. 3 is a perspective view showing a conventional example.

[Explanation of symbols]

 1 heat pipe 2 block 3 radiating fin 4 semiconductor 5 semiconductor stop screw 6 hole 7 notch

Claims (2)

[Claims] 1. A heat-absorbing portion of a heat pipe 1 has a block 2 on which a semiconductor 4 is mounted, and a heat-dissipating portion has a plurality of heat-radiating fins 3.
A heat pipe type semiconductor cooler having a plurality of ventilation holes 6 in the radiation fin 3. 2. The heat pipe 1 has a block 2 having a semiconductor 4 mounted on a heat absorbing portion thereof, and a plurality of heat radiating fins 3 at a heat radiating portion.
A heat pipe type semiconductor cooler having a plurality of ventilation cutouts 7 on the outer edge of the radiation fin 3.