JP3150449B2 - Radiator - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radiator for radiating heat generated from semiconductor elements (heating elements) such as transistors and ICs.

[0002]

2. Description of the Related Art Generally, a radiator is known in which a plurality of rows of radiating fins are provided on one surface of an aluminum radiating substrate and a flat surface on which semiconductor elements such as transistors and ICs are mounted on the other surface. . In this type, heat generated from the semiconductor element is radiated to the atmosphere through a radiating substrate and radiating fins, but conventionally, the heat is radiated exclusively by air heat transfer.

[0003]

However, in the conventional structure, for example, when an attempt is made to cool a transistor for a controller of a motor in an electric vehicle, the temperature of the heat radiation substrate itself becomes high because the ambient temperature is high. However, there is a problem that the function of the transistor (semiconductor element) is degraded by heat and the life is shortened due to insufficient heat radiation.

[0004] In order to solve this problem, there has been proposed an arrangement in which a coolant flow path is provided in a base of a radiator board, and a coolant is caused to flow through the base to cool the radiator board itself (for example, see Japanese Utility Model Application Laid-Open No. H07-163,972). 55-84452).

However, according to this, the structure of the refrigerant flow path becomes complicated, so that the manufacturing cost increases and
Although the base of the heat dissipation board is cooled, the heat dissipation fins are not cooled, so that there is a problem that sufficient heat dissipation is not performed.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a radiator which can solve the above-mentioned problems of the prior art, is low in cost, and can enhance the heat radiation effect.

[0007]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a heat radiation substrate made of aluminum having a plurality of surfaces.
The heat radiation fins are provided over the ridges.
In addition to providing a plurality of rows of heat dissipating fins by shaving the fixed portion, a concave portion is formed between the plurality of heat dissipating fin scheduled portions.
Provided, fitted with a pipe for flowing the refrigerant into this recess ,
On the other side of the heat dissipation board, set a flat surface to attach a heating element.
It is characterized in that the digits.

[0008]

According to the present invention, when forming a heat dissipation board made of aluminum, for example, a pipe catch groove or the like is provided on any surface of the heat dissipation board, and then a heat dissipation fin is provided on any one surface. Finally, a pipe for flowing the refrigerant is fitted into the pipe catch groove. In the radiator thus assembled, not only the radiating substrate but also the radiating fins are efficiently cooled by flowing the refrigerant through the pipe, so that the radiating effect through the radiating fins is enhanced.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the radiator according to the present invention will be described below with reference to the drawings.

In FIG. 1, reference numeral 1 denotes a heat-dissipating substrate made of an extruded member made of pure aluminum or an aluminum alloy (hereinafter, simply referred to as aluminum).

The surface 1a of the heat radiating substrate 1 is provided with irregularities, and the convex portions 3 extending over a plurality of lines form heat radiating fin portions. A pipe catch groove 7 extending in the longitudinal direction is provided in the concave portion 5 formed between the heat radiating fin portions 3, and the pipe catch groove 7 has, as shown in FIG. It is a press-fitting portion 7a, and the inner portion is a substantially arc-shaped pipe holding portion 7b.

As shown in FIG. 3, a heat radiating fin 9 is provided on one surface 1a of the heat radiating substrate 1, and the heat radiating fin 9 has a predetermined pitch p and a constant height. It is formed by holding it at h and shaving it regularly. In addition, since such a construction method is publicly known, further description is omitted.

According to this embodiment, as shown in FIG. 3, a flat surface is provided on the other surface 1b of the heat radiating substrate 1, and a semiconductor such as a transistor or an IC to be radiated heat is provided on the flat surface 1b. An element (heating element) 11 is attached.

When assembling such a radiator, a radiating fin 9 is formed on the radiating fin planned portion 3 of the radiating substrate 1, and then a pipe provided between the rows of the radiating fins 9 as shown in FIGS. An aluminum pipe 13 for flowing a coolant is fitted into the catch groove 7. The pipe 13 is press-fitted into the pipe catch groove 7 using a press-fitting jig (not shown) or the like. The shape of the pipe 13 may be a meandering shape as shown in the figure, a loop shape, or a configuration in which the pipes 13 are arranged in parallel with each other and a header is provided at the entrance.

Regarding the assembling order of the radiator, first, the pipe catch grooves 7 between the rows of the radiating fins 9 are arranged.
A pipe 13 for flowing a refrigerant is fitted in the inside,
After that, the radiating fins 9 may be formed on the radiating fin portions 3 of the radiating substrate 1. This pipe 13 may be made of copper.

With this configuration, the heat generated by the heating element 11 is radiated through the heat dissipation board 1 and the heat dissipation fins 3 by air conduction.

Moreover, according to this embodiment, the pipe 13
By circulating the refrigerant through the inside, the heat radiation substrate 1 itself is cooled by the refrigerant, so that the efficiency can be improved even under a bad condition of high ambient temperature such as cooling a transistor for a controller of a motor in an electric vehicle. Good heat radiation is performed. Therefore, the life of the semiconductor element 11 and the like attached to the flat surface 1b can be improved.

Further, according to this embodiment, the mounting position of the pipes 13 is between the rows of the radiating fins 3. When the refrigerant is circulated between the pipes 13, not only the radiating fins 3 but also the radiating fins 3 are directly cooled. With this configuration, the heat radiation efficiency can be particularly improved as compared with the conventional configuration.

Further, according to this embodiment, the heat dissipation board 1
Since the pipe 13 for flowing the coolant is inserted into the pipe catch groove 7 of the heat dissipation board 1 without fitting the pipe 13 to the heat sink 1, the manufacturing cost can be reduced.

Although the present invention has been described based on one embodiment, it is apparent that the present invention is not limited to this.

For example, the pipe catch groove 7 can be formed from the flat surface 1b side of the heat radiating substrate 1 if the groove 7 is located between the rows of the heat radiating fins 3.

[0022]

As is apparent from the above description, according to the present invention, a pipe for flowing a refrigerant is provided between rows of radiating fins provided on a radiating substrate. Since not only the heat dissipation board but also the heat dissipation fins are efficiently cooled, the heat dissipation efficiency of the radiator can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a heat dissipation board according to the present invention.

FIG. 2 is a perspective view showing a pipe catch groove 7;

FIG. 3 is a side view showing one embodiment of a radiator according to the present invention.

FIG. 4 is a plan view of the same.

FIG. 5 is also an end view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heat dissipation board 1a One surface 3 Convex part 5 Concave part 7 Pipe catch groove 9 Heat dissipation fin 11 Semiconductor element (heating element) 13 Pipe

Claims (1)

(57) [Claims] 1. A plurality of aluminum heat radiating substrates are provided on one surface.
The heat radiation fins are provided over the ridges.
In addition to providing a plurality of rows of heat dissipating fins by shaving the fixed portion, a concave portion is formed between the plurality of heat dissipating fin scheduled portions.
Provided, fitted with a pipe for flowing the refrigerant into this recess ,
On the other side of the heat dissipation board, set a flat surface to attach a heating element.
Radiator, characterized in that digit.