JPH07225398A - Liquid crystal display device - Google Patents

Liquid crystal display device

Info

Publication number
JPH07225398A
JPH07225398A JP1806394A JP1806394A JPH07225398A JP H07225398 A JPH07225398 A JP H07225398A JP 1806394 A JP1806394 A JP 1806394A JP 1806394 A JP1806394 A JP 1806394A JP H07225398 A JPH07225398 A JP H07225398A
Authority
JP
Japan
Prior art keywords
scanning signal
signal electrode
connection terminal
transparent conductive
liquid crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1806394A
Other languages
Japanese (ja)
Inventor
Tsutomu Sato
努 佐藤
Genshirou Kawachi
玄士朗 河内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1806394A priority Critical patent/JPH07225398A/en
Publication of JPH07225398A publication Critical patent/JPH07225398A/en
Pending legal-status Critical Current

Links

Landscapes

  • Liquid Crystal (AREA)
  • Thin Film Transistor (AREA)

Abstract

PURPOSE:To eliminate variations in contact resistance of scanning signal electrodes and transparent conductive films and to suppress the generation of display difects by separating the scanning signal electrodes and the transparent conductive films by insulating films and connecting both by using different metals. CONSTITUTION:An Al film deposited on an insulating substrate 20 is patterned in a photoresist stage to form the scanning signal electrodes 11 and power feed lines for anodic oxidation. Next, only the central parts on the scanning signal electrode are anodically oxidized to form anodically oxidized films 18. Next, a transparent conductive film of an indium tin oxide (ITO) is deposited by sputtering and pixel electrodes are formed simultaneously with connecting terminals 16 by the photoresist stage. Cr and Al are then successively laminated by sputtering and video signal electrodes, source electrodes and connecting wirings 17 are formed by the photoresist stage. Metals, such as Zr, Mo, Ti, Ta, V, Nb, W, Hf, etc., are used in addition to the Cr for connection of the scanning signal electrodes 11 and the transparent conductive films.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は液晶表示装置、特に、外
部回路との接続端子部の構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device, and more particularly to a structure of a connection terminal portion for connecting to an external circuit.

【0002】[0002]

【従来の技術】ガラスなどの絶縁基板上に薄膜トランジ
スタをマトリクス状に形成し、これらをスイッチング素
子として用いるアクティブマトリクス方式の液晶表示装
置は、高画質のフラットパネルディスプレイとして期待
が大きい。
2. Description of the Related Art An active matrix type liquid crystal display device in which thin film transistors are formed in a matrix on an insulating substrate such as glass and used as switching elements is expected to be a flat panel display with high image quality.

【0003】液晶表示装置と外部回路を接続する場合、
テープキャリアパッケージ(TCP)を用いることにより
接続しているが、走査信号電極,映像信号電極に直接T
CPで接続すると電食等信頼性に問題がある。この問題
を解決する方法としては、特開昭62−299819号公報があ
る。
When connecting a liquid crystal display device and an external circuit,
Although it is connected by using a tape carrier package (TCP), the T signal is directly connected to the scanning signal electrode and the video signal electrode
When connecting with CP, there is a problem in reliability such as electrolytic corrosion. As a method for solving this problem, there is JP-A-62-299819.

【0004】[0004]

【発明が解決しようとする課題】上記の方法を用いた場
合、各電極とITOとのコンタクト抵抗が問題となる
が、特に走査信号電極にアルミニウム(Al)などの酸
素を取り込みやすい材料を用いると、ITOとの接触時
にITOから酸素を引き抜いてコンタクト部の所々にA
l酸化物を形成しコンタクト抵抗がばらつき、結果とし
て接続端子部の抵抗値がばらついて液晶表示装置駆動時
に横線状の表示不良が発生する。
When the above method is used, the contact resistance between each electrode and the ITO becomes a problem, but particularly when a material such as aluminum (Al) which easily takes in oxygen is used for the scanning signal electrode. , At the time of contact with ITO, oxygen is extracted from the ITO and A
1 oxide is formed, the contact resistance is varied, and as a result, the resistance value of the connection terminal portion is varied, and a horizontal linear display defect occurs when the liquid crystal display device is driven.

【0005】このように従来技術では走査信号電極に接
続端子となる透明導電膜を直接接続して端子部を形成し
たので、走査信号電極と透明導電膜とのコンタクト抵抗
がばらつき、液晶表示装置に表示不良を発生させるとい
う問題が有った。
As described above, according to the prior art, since the transparent conductive film serving as the connection terminal is directly connected to the scanning signal electrode to form the terminal portion, the contact resistance between the scanning signal electrode and the transparent conductive film varies, and the liquid crystal display device is provided. There was a problem of causing display failure.

【0006】本発明の目的は、この問題点を解決する技
術を提供することにある。
An object of the present invention is to provide a technique for solving this problem.

【0007】[0007]

【課題を解決するための手段】上記目的を達成するため
に、本発明では以下の手段を用いることとする。
In order to achieve the above object, the present invention uses the following means.

【0008】[手段1]基板上に複数本の走査信号電極
と,複数本の映像信号電極と,複数個の薄膜トランジス
タを有し、前記走査信号電極と外部回路とを接続する部
分が透明導電膜からなる接続端子部を有する液晶表示装
置において、前記走査信号電極及び前記透明導電膜が直
接接触しない構造を持ち、異種金属を用いて前記走査信
号電極及び前記透明導電膜を接続する。
[Means 1] A transparent conductive film having a plurality of scanning signal electrodes, a plurality of video signal electrodes, and a plurality of thin film transistors on a substrate, and a portion connecting the scanning signal electrodes and an external circuit. In the liquid crystal display device having a connection terminal portion made of, the scanning signal electrode and the transparent conductive film have a structure in which they do not directly contact each other, and the scanning signal electrode and the transparent conductive film are connected using a different metal.

【0009】[手段2]基板上に複数本の走査信号電極
と,複数本の映像信号電極と,複数個の薄膜トランジス
タを有し、前記走査信号電極と外部回路とを接続する部
分が透明導電膜からなる接続端子部を有する液晶表示装
置において、前記走査信号電極及び前記透明導電膜が直
接接触しない構造を持ち、前記映像信号電極を用いて前
記走査信号電極及び前記透明導電膜を接続する。
[Means 2] A plurality of scanning signal electrodes, a plurality of video signal electrodes, and a plurality of thin film transistors are provided on a substrate, and a portion connecting the scanning signal electrodes and an external circuit is a transparent conductive film. In the liquid crystal display device having a connection terminal portion made of, the scanning signal electrode and the transparent conductive film have a structure in which they do not directly contact each other, and the scanning signal electrode and the transparent conductive film are connected using the video signal electrode.

【0010】[手段3]基板上に複数本の走査信号電極
と,複数本の映像信号電極と,複数個の薄膜トランジス
タを有する液晶表示装置において、前記映像信号電極及
び前記走査信号電極と外部回路とを接続する接続端子部
が透明導電膜より構成され、前記走査信号電極と前記接
続端子部を高融点金属で接続する。
[Means 3] In a liquid crystal display device having a plurality of scanning signal electrodes, a plurality of video signal electrodes, and a plurality of thin film transistors on a substrate, the video signal electrodes, the scanning signal electrodes, and an external circuit. A connection terminal portion for connecting the scanning signal electrode and the connection terminal portion is connected by a high melting point metal.

【0011】[手段4]上記手段1,2または3におい
て、前記走査信号電極はAlまたはAl合金からなり、
前記透明導電膜はインジウム−スズ酸化物からなること
とした。
[Means 4] In the above means 1, 2, or 3, the scanning signal electrode is made of Al or Al alloy,
The transparent conductive film is made of indium-tin oxide.

【0012】[手段5]上記手段1または2において、
前記走査信号電極と前記透明導電膜を絶縁膜により分離
することとした。
[Means 5] In the above means 1 or 2,
The scanning signal electrode and the transparent conductive film are separated by an insulating film.

【0013】[手段6]上記手段5において、前記絶縁
膜は前記走査信号電極の陽極酸化膜からなることとし
た。
[Means 6] In the above means 5, the insulating film is made of an anodic oxide film of the scanning signal electrode.

【0014】[手段7]上記手段1または2において、
前記走査信号電極と前記透明導電膜が同一平面上で別々
に形成することとした。
[Means 7] In the above means 1 or 2,
The scanning signal electrode and the transparent conductive film are separately formed on the same plane.

【0015】[手段8]上記手段1または2において、
前記走査信号電極及び前記走査信号電極と外部回路とを
接続する接続端子部を接続する金属にZr,Cr,M
o,Ti,Ta,V,Nb,W,Hfのうち少なくとも
一つを用いることとした。
[Means 8] In the above means 1 or 2,
Zr, Cr, M is added to the metal connecting the scanning signal electrode and the connection terminal portion connecting the scanning signal electrode and an external circuit.
At least one of o, Ti, Ta, V, Nb, W, and Hf is used.

【0016】[0016]

【作用】本発明では、接続端子となる透明導電膜と走査
信号電極が直接接触しない構造を持つ。このため、透明
導電膜と走査信号電極との間での原子のやり取りがな
く、透明導電膜と走査信号電極の界面での不必要な結合
が生じなくなり、コンタクト抵抗のばらつきがなくな
る。つまり、端子部全体としてみたときの抵抗ばらつき
が抑えられ、表示不良発生が抑制できる。
In the present invention, the transparent conductive film serving as the connection terminal does not directly contact the scanning signal electrode. Therefore, there is no exchange of atoms between the transparent conductive film and the scanning signal electrode, unnecessary bonding does not occur at the interface between the transparent conductive film and the scanning signal electrode, and the contact resistance does not vary. That is, variations in resistance when viewed as the entire terminal portion can be suppressed, and occurrence of display defects can be suppressed.

【0017】[0017]

【実施例】以下、本発明の実施例を説明する。EXAMPLES Examples of the present invention will be described below.

【0018】図1は本発明の第1の実施例を示す平面図
である。11はAlまたはAl合金からなる走査信号電
極、12は映像信号電極、13はソース電極、14は半
導体層、15はインジウム−スズ酸化物からなる画素電
極、16はインジウム−スズ酸化物からなる接続端子、
17は走査信号電極1と電気的接続をとるための接続配
線である。
FIG. 1 is a plan view showing a first embodiment of the present invention. Reference numeral 11 is a scanning signal electrode made of Al or Al alloy, 12 is a video signal electrode, 13 is a source electrode, 14 is a semiconductor layer, 15 is a pixel electrode made of indium-tin oxide, and 16 is a connection made of indium-tin oxide. Terminal,
Reference numeral 17 is a connection wiring for electrically connecting to the scanning signal electrode 1.

【0019】また、図2は図1中のA−A′で示す方向
における断面図である。18は走査信号電極11を陽極
酸化した部分、19は保護膜である。本実施例では、走
査信号電極11と接続端子16とが電気的に絶縁されて
いるところに特徴がある。こうすることで走査信号電極
11と接続端子16の接触による界面での走査信号電極
11の酸化物生成がなく、接続端子部のコンタクト抵抗
のばらつきがなくなり、液晶表示装置の横線不良発生が
著しく抑えられ、製造コスト低減が望める。
FIG. 2 is a sectional view taken along the line AA 'in FIG. Reference numeral 18 is a portion where the scanning signal electrode 11 is anodized, and 19 is a protective film. The present embodiment is characterized in that the scanning signal electrode 11 and the connection terminal 16 are electrically insulated. By doing so, the oxide of the scanning signal electrode 11 is not generated at the interface due to the contact between the scanning signal electrode 11 and the connection terminal 16, the contact resistance of the connection terminal portion does not vary, and the occurrence of horizontal line defects in the liquid crystal display device is significantly suppressed. Therefore, the manufacturing cost can be reduced.

【0020】次に、図3および図4を用いて液晶表示装
置端子部及びこれを用いた液晶表示装置の製造方法を説
明する。
Next, a liquid crystal display device terminal portion and a method of manufacturing a liquid crystal display device using the same will be described with reference to FIGS.

【0021】ガラスなどの絶縁性基板20上に、例え
ば、スパッタリング法によりAlまたはAl合金を28
0nm堆積する。次にホト工程により走査信号電極11
及び陽極酸化のための給電線を形成する(図3(a))。
走査信号電極及び給電線の幅は80〜100μmが望ま
しい。次にホト工程またはノズル等で直接描画すること
により走査信号電極11の一部をホトレジストで覆う。
本実施例では、接続端子部で走査信号電極11上の中央
部分のみを陽極酸化するためにパターンの両端5〜10
μmをホトレジストで覆った。この状態で陽極酸化液に
浸し、外部より基板内に形成した給電線を介して直流電
圧を印加し陽極酸化することにより陽極酸化膜18を1
80nm形成する。陽極酸化液は、3%酒石酸をエチレ
ングリコールまたはプロピレングリコール液で希釈し、
アンモニアでpH7.0±0.5に調整した液を用いる
(図3(b))。次にスパッタリング法によりインジウム
−スズ酸化物(ITO)を280nm堆積する。次にホ
ト工程により接続端子16を形成する(図3(c))。な
お、この時同時に画素電極15も形成する。
On the insulating substrate 20 such as glass, for example, Al or Al alloy 28 is formed by the sputtering method.
Deposit 0 nm. Next, the scanning signal electrode 11 is formed by a photo process.
And a power supply line for anodic oxidation is formed (FIG. 3A).
The width of the scanning signal electrode and the power supply line is preferably 80 to 100 μm. Next, a part of the scanning signal electrode 11 is covered with a photoresist by directly drawing with a photo process or a nozzle.
In this embodiment, both ends of the pattern are 5 to 10 in order to anodize only the central portion on the scanning signal electrode 11 at the connection terminal portion.
The μm was covered with photoresist. In this state, the anodizing film 18 is dipped in an anodizing solution, and a DC voltage is applied from the outside through a power supply line formed in the substrate to anodize the anodizing film 18
80 nm is formed. Anodizing solution is 3% tartaric acid diluted with ethylene glycol or propylene glycol solution,
A liquid adjusted to pH 7.0 ± 0.5 with ammonia is used (FIG. 3 (b)). Next, 280 nm of indium-tin oxide (ITO) is deposited by the sputtering method. Next, the connection terminal 16 is formed by a photo process (FIG. 3C). At this time, the pixel electrode 15 is also formed at the same time.

【0022】この後、窒化シリコン(SiN)膜を20
0nm,非晶質シリコン(a−Si)膜を200nm、リ
ンをドープしたn型a−Si膜を50nmプラズマCV
D法により順次積層、その後ホト工程によりそれぞれ形
成する。これらの膜は、薄膜トランジスタ部に用いられ
る。
After this, a silicon nitride (SiN) film is formed on
0 nm, amorphous silicon (a-Si) film 200 nm, phosphorus-doped n-type a-Si film 50 nm plasma CV
The layers are sequentially laminated by the D method and then formed by the photo process. These films are used in the thin film transistor section.

【0023】次に、スパッタリング法によりCr,Al
をそれぞれ60nm,400nm順次積層し、ホト工程
により映像信号電極12,ソース電極13,接続配線1
7を形成する(図4(a))。最後に、保護膜19として
SiN膜をプラズマCVD法などにより1μm堆積し、
外部回路と接続する部分のSiN膜を除去して薄膜トラ
ンジスタ及び接続端子部は完成する(図4(b))。
Next, by sputtering, Cr, Al
60 nm and 400 nm respectively are sequentially laminated, and the video signal electrode 12, the source electrode 13 and the connection wiring 1 are formed by a photo process.
7 is formed (FIG. 4A). Finally, a SiN film as the protective film 19 is deposited to a thickness of 1 μm by plasma CVD or the like,
The SiN film in the portion connected to the external circuit is removed to complete the thin film transistor and the connection terminal portion (FIG. 4B).

【0024】これらの後、配向膜塗布,ラビング,液晶
封入等の工程を経て液晶表示装置は完成するが、本発明
の骨子には関係しないので省略する。
After that, the liquid crystal display device is completed through the steps of coating the alignment film, rubbing, encapsulating the liquid crystal, etc., but since it is not related to the essence of the present invention, it is omitted.

【0025】本実施例では、走査信号電極11の中央部
分のみを陽極酸化したが、図4に示すように走査信号電
極11のパターン片側を残して陽極酸化膜18が形成さ
れていてもよい。このように構成すれば、接続端子16
の面積を大きく取ることが可能となり、TCPと接続す
る際の接触抵抗をより低減できる。
In the present embodiment, only the central portion of the scanning signal electrode 11 was anodized, but as shown in FIG. 4, the anodic oxide film 18 may be formed except for one side of the pattern of the scanning signal electrode 11. With this structure, the connection terminal 16
It is possible to take a large area and to further reduce the contact resistance when connecting with TCP.

【0026】本実施例では、走査信号電極にAlもしく
はAl合金を用いたが、酸素を膜内に取り込みやすい金
属、例えばTa,Ti,Zr,Nbもしくはこれらを母
材とする合金でもよい。これらの金属は、陽極酸化が可
能であり、さらに高融点金属特有の耐薬品性に優れてい
るために電極の信頼性が向上する。
In the present embodiment, Al or Al alloy is used for the scanning signal electrode, but a metal that easily takes oxygen into the film, for example, Ta, Ti, Zr, Nb or an alloy having these as a base material may be used. Since these metals can be anodized and have excellent chemical resistance peculiar to refractory metals, the reliability of electrodes is improved.

【0027】本実施例では、走査信号電極の陽極酸化膜
で接続端子と電気的に絶縁させたが、陽極酸化膜のかわ
りにSiN膜や二酸化シリコン(SiO2)膜でもよいこ
とはいうまでもない。SiN膜やSiO2 膜で実施した
場合、走査信号電極の膜厚を陽極酸化によって減らすこ
とがないので、走査信号電極の抵抗値を変えることなく
液晶表示装置が構成できる。
Although the anodic oxide film of the scanning signal electrode is electrically insulated from the connection terminal in this embodiment, it goes without saying that a SiN film or a silicon dioxide (SiO 2 ) film may be used instead of the anodic oxide film. Absent. When the SiN film or the SiO 2 film is used, the film thickness of the scanning signal electrode is not reduced by anodic oxidation, so that the liquid crystal display device can be configured without changing the resistance value of the scanning signal electrode.

【0028】図5は本発明の第3の実施例を示す平面
図、また図6は図5中のB−B′で示す方向における断
面図である。走査信号電極11と接続端子16は基板上
で異種平面上にあり、これらは接続配線17を通じて電
気的に接続されている。このように構成することによ
り、走査信号電極11及び接続端子16と接続配線17
とのコンタクト面積を大きく取ることができ、接続端子
部全体としての抵抗を下げることができるので、外部回
路より入力された信号波形を変えることなく表示装置へ
伝達でき、画質が向上する。また、この場合走査信号電
極を陽極酸化するときの給電線は、接続端子部と反対側
に形成する。
FIG. 5 is a plan view showing a third embodiment of the present invention, and FIG. 6 is a sectional view taken along the line BB 'in FIG. The scanning signal electrode 11 and the connection terminal 16 are on different planes on the substrate, and they are electrically connected through the connection wiring 17. With this configuration, the scanning signal electrode 11, the connection terminal 16 and the connection wiring 17 are provided.
Since a large contact area can be secured and the resistance of the entire connection terminal portion can be reduced, the signal waveform input from the external circuit can be transmitted to the display device without changing, and the image quality is improved. Further, in this case, the power supply line for anodizing the scanning signal electrode is formed on the side opposite to the connection terminal portion.

【0029】図7は本発明の第4の実施例を示す断面図
である。本実施例では、走査信号電極11と接続端子1
6との間に高融点金属21を挿入し、映像信号電極12
と接続端子16を透明導電膜で構成した点に特徴があ
る。このように構成すると、走査信号電極11と接続端
子16の間での原子の相互拡散が抑えられるばかりでな
く、映像信号電極12及び画素電極15及び接続端子1
6が透明導電膜で構成されるので液晶表示装置の低コス
ト化が可能となる。
FIG. 7 is a sectional view showing a fourth embodiment of the present invention. In this embodiment, the scanning signal electrode 11 and the connection terminal 1
The refractory metal 21 is inserted between 6 and the video signal electrode 12
And the connection terminal 16 is made of a transparent conductive film. With this configuration, not only the mutual diffusion of atoms between the scanning signal electrode 11 and the connection terminal 16 is suppressed, but also the video signal electrode 12, the pixel electrode 15, and the connection terminal 1 are formed.
Since 6 is composed of a transparent conductive film, the cost of the liquid crystal display device can be reduced.

【0030】次に、図9および図10を用いて本実施例
の製造方法について説明する。
Next, the manufacturing method of this embodiment will be described with reference to FIGS.

【0031】第1の実施例と同様に、ガラスなどの絶縁
性基板20上にスパッタリング法によりAlまたはAl
合金を280nm堆積し、ホト工程により走査信号電極
11及び陽極酸化のための給電線を形成し、ホト工程ま
たはノズル等で直接描画することにより走査信号電極1
1の一部をホトレジストで覆い、陽極酸化する(図9
(a))。次に窒化シリコン(SiN)膜22を200n
m,非晶質シリコン(a−Si)膜14を200nm、
リンをドープしたn型a−Si膜23を50nmプラズ
マCVD法により順次積層、その後、ホト工程により半
導体層,ゲート絶縁膜をそれぞれ形成する(図9
(b))。次に、スパッタリング法などによりCr等の高
融点金属を60nm堆積し、ホト工程により所定の場所
へ形成する。この時、接続端子部にもCrを形成する
(図10(a))。次に、スパッタリング法などによりイ
ンジウム−スズ酸化物を堆積し、映像信号電極12,画
素電極15,接続端子16を形成する。次に、これらを
マスクとしてn型a−Si層をドライエッチング法など
によりエッチングする(図10(b))。次に、保護膜1
9として、プラズマCVD法などによりSiN膜を1μ
m堆積し、ホト工程により所定の場所に形成する。この
後の製造工程は第1の実施例と同様である。
Similar to the first embodiment, Al or Al is formed on the insulating substrate 20 such as glass by the sputtering method.
The scanning signal electrode 1 is formed by depositing an alloy of 280 nm, forming a scanning signal electrode 11 and a power supply line for anodization by a photo process, and drawing directly with a photo process or a nozzle.
1 is covered with photoresist and anodized (FIG. 9).
(a)). Next, a silicon nitride (SiN) film 22 is formed to a thickness of 200 n.
m, the amorphous silicon (a-Si) film 14 is 200 nm,
An n-type a-Si film 23 doped with phosphorus is sequentially stacked by a 50 nm plasma CVD method, and then a semiconductor layer and a gate insulating film are formed by a photo process (FIG. 9).
(b)). Next, a refractory metal such as Cr is deposited to a thickness of 60 nm by a sputtering method or the like, and is formed at a predetermined place by a photo process. At this time, Cr is also formed on the connection terminal portion (FIG. 10A). Next, indium-tin oxide is deposited by a sputtering method or the like to form the video signal electrode 12, the pixel electrode 15, and the connection terminal 16. Next, the n-type a-Si layer is etched by using these as a mask by a dry etching method or the like (FIG. 10B). Next, the protective film 1
9, the SiN film 1 μm by plasma CVD method, etc.
m, and formed at a predetermined place by a photo process. The subsequent manufacturing process is similar to that of the first embodiment.

【0032】本実施例では走査信号電極11と接続端子
16との間にCrを用いたが、Ti,Ta,Nb,V,
Mo,Zr,W,Hfを用いても効果は同様である。ま
た、薄膜の製造方法は、スパッタリングのほかに電子ビ
ーム蒸着法や抵抗加熱蒸着法等、基板上に均一な薄膜を
形成できる方法であればよい。
In this embodiment, Cr is used between the scanning signal electrode 11 and the connection terminal 16, but Ti, Ta, Nb, V,
The same effect is obtained by using Mo, Zr, W, and Hf. Further, the method for producing the thin film may be any method that can form a uniform thin film on the substrate, such as an electron beam evaporation method and a resistance heating evaporation method in addition to sputtering.

【0033】[0033]

【発明の効果】本発明によれば接続端子となる透明導電
膜と走査信号電極のコンタクト抵抗のばらつきをなくせ
るので、端子部の抵抗ばらつきが抑えられ、表示不良発
生が抑制できる。
According to the present invention, it is possible to eliminate the variation in the contact resistance between the transparent conductive film serving as the connection terminal and the scanning signal electrode, so that the variation in the resistance of the terminal portion can be suppressed and the occurrence of display defects can be suppressed.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の第1の実施例を示す平面図。FIG. 1 is a plan view showing a first embodiment of the present invention.

【図2】本発明の第1の実施例における接続端子部の断
面図。
FIG. 2 is a sectional view of a connection terminal portion according to the first embodiment of the present invention.

【図3】本発明の第1の実施例における接続端子部の製
造工程を示す断面図。
FIG. 3 is a cross-sectional view showing the manufacturing process of the connection terminal portion according to the first embodiment of the present invention.

【図4】本発明の第1の実施例における接続端子部の製
造工程を示す断面図。
FIG. 4 is a cross-sectional view showing the manufacturing process of the connection terminal portion according to the first embodiment of the present invention.

【図5】本発明の第2の実施例を示す断面図。FIG. 5 is a sectional view showing a second embodiment of the present invention.

【図6】本発明の第3の実施例を示す平面図。FIG. 6 is a plan view showing a third embodiment of the present invention.

【図7】本発明の第3の実施例における接続端子部の断
面図。
FIG. 7 is a sectional view of a connection terminal portion in a third embodiment of the present invention.

【図8】本発明の第4の実施例における接続端子部の断
面図。
FIG. 8 is a sectional view of a connection terminal portion according to a fourth embodiment of the present invention.

【図9】本発明の第4の実施例における接続端子部の製
造工程を示す断面図。
FIG. 9 is a cross-sectional view showing the manufacturing process of the connection terminal portion according to the fourth embodiment of the present invention.

【図10】本発明の第4の実施例における接続端子部の
製造工程を示す断面図。
FIG. 10 is a cross-sectional view showing the manufacturing process of the connection terminal portion according to the fourth embodiment of the present invention.

【符号の説明】[Explanation of symbols]

11…走査信号電極、16…接続端子、17…接続配
線、18…陽極酸化膜、19…保護膜、20…ガラス基
板。
11 ... Scan signal electrode, 16 ... Connection terminal, 17 ... Connection wiring, 18 ... Anodized film, 19 ... Protective film, 20 ... Glass substrate.

Claims (8)

【特許請求の範囲】[Claims] 【請求項1】基板上に複数本の走査信号電極と,複数本
の映像信号電極と,複数個の薄膜トランジスタを有し、
前記走査信号電極と外部回路とを接続する部分が透明導
電膜からなる接続端子部を有する液晶表示装置におい
て、前記走査信号電極及び前記透明導電膜が直接接触し
ない構造を持ち、異種金属を用いて前記走査信号電極及
び前記透明導電膜を接続することにより構成した接続端
子部を有することを特徴とする液晶表示装置。
1. A substrate having a plurality of scanning signal electrodes, a plurality of video signal electrodes, and a plurality of thin film transistors,
In a liquid crystal display device having a connection terminal part formed of a transparent conductive film in a portion connecting the scanning signal electrode and an external circuit, a structure in which the scanning signal electrode and the transparent conductive film do not come into direct contact is used, and a different metal is used. A liquid crystal display device comprising a connection terminal portion formed by connecting the scanning signal electrode and the transparent conductive film.
【請求項2】基板上に複数本の走査信号電極と,複数本
の映像信号電極と,複数個の薄膜トランジスタを有し、
前記走査信号電極と外部回路とを接続する部分が透明導
電膜からなる接続端子部を有する液晶表示装置におい
て、前記走査信号電極及び前記透明導電膜が直接接触し
ない構造を持ち、前記映像信号電極を用いて前記走査信
号電極及び前記透明導電膜を接続することにより構成し
た接続端子部を有することを特徴とする液晶表示装置。
2. A substrate having a plurality of scanning signal electrodes, a plurality of video signal electrodes, and a plurality of thin film transistors,
In a liquid crystal display device having a connection terminal portion made of a transparent conductive film in a portion connecting the scanning signal electrode and an external circuit, the scanning signal electrode and the transparent conductive film have a structure in which they do not directly contact each other, and the video signal electrode is A liquid crystal display device comprising a connection terminal portion formed by connecting the scanning signal electrode and the transparent conductive film using the liquid crystal display device.
【請求項3】基板上に複数本の走査信号電極と,複数本
の映像信号電極と,複数個の薄膜トランジスタを有する
液晶表示装置において、前記映像信号電極及び前記走査
信号電極と外部回路とを接続する接続端子部が透明導電
膜より構成され、前記走査信号電極と前記接続端子部を
高融点金属で接続することにより構成した接続端子部を
有することを特徴とする液晶表示装置。
3. A liquid crystal display device having a plurality of scanning signal electrodes, a plurality of video signal electrodes, and a plurality of thin film transistors on a substrate, wherein the video signal electrodes and the scanning signal electrodes are connected to an external circuit. The liquid crystal display device is characterized in that the connection terminal portion is formed of a transparent conductive film and has a connection terminal portion formed by connecting the scanning signal electrode and the connection terminal portion with a refractory metal.
【請求項4】請求項1,2または3において、前記走査
信号電極はAl,Ti,Ta,Zr,Nbまたはこれら
を母材とする合金からなり、前記透明導電膜はインジウ
ム−スズ酸化物からなる接続端子部を有する液晶表示装
置。
4. The scanning signal electrode according to claim 1, wherein the scanning signal electrode is made of Al, Ti, Ta, Zr, Nb or an alloy having these as a base material, and the transparent conductive film is made of indium-tin oxide. Liquid crystal display device having a connection terminal part that is
【請求項5】請求項1または2において、前記走査信号
電極と前記透明導電膜が絶縁膜により分離された接続端
子部を有する液晶表示装置。
5. The liquid crystal display device according to claim 1, further comprising a connection terminal portion in which the scanning signal electrode and the transparent conductive film are separated by an insulating film.
【請求項6】請求項5において、前記絶縁膜は前記走査
信号電極の陽極酸化膜からなる液晶表示装置。
6. The liquid crystal display device according to claim 5, wherein the insulating film is an anodic oxide film of the scanning signal electrode.
【請求項7】請求項1または2において、前記走査信号
電極と前記透明導電膜が同一平面上で別々に形成された
構造を持つ接続端子部を有する液晶表示装置。
7. The liquid crystal display device according to claim 1, further comprising a connection terminal portion having a structure in which the scanning signal electrode and the transparent conductive film are separately formed on the same plane.
【請求項8】請求項1,2または3において、前記走査
信号電極及び前記走査信号電極と外部回路とを接続する
接続端子部を接続する金属にZr,Cr,Mo,Ti,
Ta,V,Nb,W,Hfのうち少なくとも一つを用い
た接続端子部を有する液晶表示装置。
8. The metal for connecting the scanning signal electrode and the connection terminal portion for connecting the scanning signal electrode and an external circuit to the metal for connecting Zr, Cr, Mo, Ti,
A liquid crystal display device having a connection terminal portion using at least one of Ta, V, Nb, W, and Hf.
JP1806394A 1994-02-15 1994-02-15 Liquid crystal display device Pending JPH07225398A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1806394A JPH07225398A (en) 1994-02-15 1994-02-15 Liquid crystal display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1806394A JPH07225398A (en) 1994-02-15 1994-02-15 Liquid crystal display device

Publications (1)

Publication Number Publication Date
JPH07225398A true JPH07225398A (en) 1995-08-22

Family

ID=11961233

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1806394A Pending JPH07225398A (en) 1994-02-15 1994-02-15 Liquid crystal display device

Country Status (1)

Country Link
JP (1) JPH07225398A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009142089A1 (en) * 2008-05-20 2009-11-26 シャープ株式会社 Substrate for display panel, display panel provided with the substrate, method for manufacturing substrate for display panel, and method for manufacturing display panel

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009142089A1 (en) * 2008-05-20 2009-11-26 シャープ株式会社 Substrate for display panel, display panel provided with the substrate, method for manufacturing substrate for display panel, and method for manufacturing display panel

Similar Documents

Publication Publication Date Title
JPH0862628A (en) Liquid crystal display element and its production
KR930005549B1 (en) Display panel and display panel making method
JPH0580650B2 (en)
JP2741883B2 (en) Liquid crystal panel manufacturing method
JPH03190141A (en) Thin-film transistor for plate display and manufacture thereof
JPH07225398A (en) Liquid crystal display device
JP3076483B2 (en) Method for manufacturing metal wiring board and method for manufacturing thin film diode array
JP3175225B2 (en) Method for manufacturing thin film transistor
JPH06160905A (en) Liquid crystal display device and its production
JP2948436B2 (en) Thin film transistor and liquid crystal display device using the same
JPH01219721A (en) Metal insulator construction and liquid crystal display device
JP3047363B2 (en) Semiconductor device and manufacturing method thereof
JP3536762B2 (en) Liquid crystal image display device and method of manufacturing semiconductor device for image display device
JP2618034B2 (en) Matrix substrate and manufacturing method thereof
JP2817737B2 (en) Liquid crystal display
JPS5995514A (en) Manufacture of liquid-crystal display device
JPH01248136A (en) Production of thin film transistor for liquid crystal display
JP3006990B2 (en) Active matrix substrate and manufacturing method thereof
JPH07114043A (en) Liquid crystal display device and its production
JPH10333179A (en) Liquid crystal image display device and manufacture of semiconductor device for image display device
JP2001264812A (en) Method of manufacturing liquid crystal display device
JPS62297892A (en) Driving circuit board for display unit
JP2989286B2 (en) Electrode forming method and electrode structure in liquid crystal display device
JPH06265933A (en) Liquid crystal display device and its production
JPS63126277A (en) Field effect thin film transistor