JPH07221006A - Method and equipment for forming flattened film - Google Patents

Abstract

PURPOSE:To form such a flattened film that its surface is simply flattened over the whole region of the surface of a board, and to provide an equipment for forming the flattened film. CONSTITUTION:In a method for forming a flattened film, a coating agent 31 is fed to a surface 11a of a board 11 in a first process, and the coating agent 31 is so pressed down in a second process by both the surface 11a and a flat surface 21a of a flattening substrate 21 which is opposed in parallel to the surface 11a that the coating agent 31 is extended over the whole region of the surface 11a. Subsequently, in a third process, the extended coating agent 31 is cured, and thereby, a thin film 35 is formed. Thereafter, in a fourth process, the flattening substrate 21 is separated from the film 35. Also, an equipment for forming the flattened film comprises a stage (not shown in the figure) for putting the board 11 thereon, the flattening substrate 21 having the flat surface 21a opposed in parallel to the surface 11a of the board 11 put on the stage, and a driving part for elevating the flattening substrate 21 and pressing down the flattening substrate 21 on the side of the stage.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a flattening film and a forming apparatus for forming a thin film having a flat surface over the entire surface of a substrate in a semiconductor device manufacturing process.

[0002]

2. Description of the Related Art As the miniaturization of semiconductor devices progresses, the exposure wavelength of lithography in the manufacturing process has become shorter. Therefore, the depth of focus of exposure is becoming shallower. On the other hand, as the number of multi-layered wiring advances, the step difference in the chip becomes larger. Then, in order to perform highly accurate pattern formation, it is necessary to keep the step within the exposure focal depth.

Therefore, for example, a so-called global planarization method using a polishing technique has been proposed as a method of reducing the surface step of the interlayer insulating film. In this method, an insulating film is formed on the interlayer insulating film by, for example, a CVD method, and then the surface side of the insulating film is polished to achieve flattening of the insulating film surface.

By spin coating, for example, SOG (Sp
There is also proposed a method of forming a flat insulating film by applying an in on glass) liquid and curing it. In the spin coating method, a so-called dummy pattern is formed in a region having a wide wiring interval in order to further improve the flatness of the insulating film surface.

[0005]

However, in the global flattening method by the above-mentioned polishing technique, as shown in FIG. 17, the wirings 121 to 123 provided on the substrate 111 are provided.
Film 13 on the interlayer insulating film 131 formed in a state of covering the
2 is polished, the surface of the insulating film 132 on the widest wiring 121 of the wirings 121 to 123 and the wirings 121, 1
The height is different from that of the surface of the insulating film 132 above the gap 22. That is, a gentle step h ₁ is produced. Therefore, so-called global flattening cannot be performed.

Further, as shown in FIG. 18, when the coating film 133 is formed on the interlayer insulating film 131 covering the wirings 121 to 123 by the spin coating method, the height of the coating film 133 on the wiring 121 and the wiring 121. , 122 is different from the height of the coating film 133 on the region having a wide interval. Therefore, the coating film 133 has a gentle step h ₂ .

Therefore, in order to form an insulating film having a flat surface by the spin coating, as shown in FIG.
A so-called dummy pattern 141 is formed in a region having a large interval between 1,122. Then, after forming the interlayer insulating film 131, the coating film 134 is formed by spin coating. By this method, the surface 134a of the coating film 134 can be formed flat. However, when the wirings 121 to 123 and the dummy pattern 141 are formed of the same film, the wiring capacitance increases. If the dummy pattern 141 is formed of an insulating material, a mask process for patterning the dummy pattern 141 must be added.

It is an object of the present invention to provide a method and apparatus for forming a flattening film which is excellent in easily forming a film having a flat surface on a substrate.

[0009]

The present invention is a method for forming a planarizing film and an apparatus for forming the same, which are made to achieve the above object.

As a method of forming a flattening film, in a first step, a coating agent is supplied to one surface of a substrate, and in a second step, a flat surface parallel to the substrate and the surface to which the coating agent is supplied is formed. The coating agent is pressed by the flattening substrate and spread in the substrate surface. Then, in the third step, the spread coating agent is cured,
A thin film made of a hardened coating material is formed on the surface of the substrate.
Then, in a fourth step, the flattening substrate is separated from the thin film.

In the above-mentioned flattening method, the above-mentioned first to third
After performing the step, the flattening substrate may be removed by etching in the fourth step.

In the third step, the coating agent spread from one side or both sides of the substrate side and the flattening substrate side is heated to cure the coating agent.

When a thermoplastic material is used as the above-mentioned coating agent, in the second step, the coating agent is pressed by the substrate and the flattening substrate, and either the substrate side or the flattening substrate side is pressed. The coating agent is spread on the surface of the substrate by heating from one side or both sides, and then, in the third step, the spreading coating agent is cooled and cured.

When a photocurable coating material is used, the coating material is spread within the surface of the substrate. Then, the coating agent is cured by irradiating with a light ray which passes through the flattening substrate and cures the coating agent.

When pressing the coating material between the substrate and the flattening substrate, one or both of the substrate and the flattening substrate may be convexly warped to the opposite side. .

When pressing and spreading the coating agent between the substrate and the flattening substrate, one or both of the substrate and the flattening substrate may be rotated to push and spread the coating agent. .

At least the second step may be performed in a vacuum atmosphere.

The first flattening film forming apparatus is provided with a stage on which a substrate is placed. A flattening substrate having a flat surface that faces the surface of the substrate mounted on the stage in parallel is provided. This flattened substrate contains
A drive unit is provided that raises and lowers the flattening substrate and presses the flattening substrate toward the stage.

The second flattening film forming apparatus is provided with a stage on which a substrate is placed. A flattening substrate having a flat surface that faces the surface of the substrate mounted on the stage in parallel is provided. The stage is provided with a drive unit that moves the stage up and down and presses the stage toward the flattening substrate.

In the above flattening film forming apparatus, a heater may be provided on either one or both of the flattening substrate and the stage.

In the above flattening film forming apparatus, the flattening substrate is made of a light-transmitting material. A light irradiator that generates a light beam that cures the coating agent is provided on the side opposite to the stage with respect to the flattening substrate.

Further, the flattening film forming apparatus may be provided with a substrate pressing means which can be moved up and down substantially at the center of the stage. Alternatively, the flattening substrate may be provided with a substrate pushing unit that pushes the flattening substrate toward the stage side to warp it in a convex shape.
Alternatively, the flattening substrate may be formed of a shape memory material that remembers that the surface on the stage side warps in a convex shape and the flat surface.

Further, the flattening film forming apparatus may be provided with one or both of a base body rotating means for rotating the flattening substrate and a stage rotating means for rotating the stage.

[0024]

In the above-described method of forming the flattening film, the coating agent is supplied to one surface of the substrate, and the coating agent is pressed by the substrate and the flattening substrate to spread it within the surface of the substrate. Then, the coating material is hardened to form a thin film, so that the surface of the thin film is in a state where the flat surface of the flattening substrate is transferred. Therefore, the surface becomes flat.

Since the flattening substrate is etched and removed by the above flattening method, when the thin film formed is thick, it is possible to continuously etch the flattening substrate and the thin film.

In the third step, the coating agent is cured by heating either one or both of the substrate side and the flattening substrate side, so that the curing time of the coating agent is shortened.

Since a thermoplastic material is used as the above-mentioned coating material and the coating material is pressed while being heated, the coating material is likely to spread within the surface of the substrate. Further, since the substrate is cooled to cure the coating agent, the coating agent is cured in a state where the flat surface of the flattening substrate is transferred. Therefore, the surface of the thin film made of the hardened coating material is formed into a flat surface.

Since a photocurable coating agent is used as the coating agent and the coating agent is pressed and spread within the surface of the substrate, the coating agent is irradiated with a light beam that passes through the flattening substrate to cure the coating agent. Is cured with the flat surface of the flattening substrate transferred. Therefore, similarly to the above, the surface of the thin film is formed as a flat surface.

When the coating material is pressed and spread between the substrate and the flattening substrate, one or both of the substrate and the flattening substrate should be convexly warped to the opposite side. Therefore, it becomes difficult for bubbles to enter between the coating agent and the flattening substrate.

When the coating agent is pressed and spread by the substrate and the flattening base, the coating agent is pressed and spread while rotating either or both of the substrate and the flattening base. It becomes difficult for bubbles to enter between the coating agent and the flattening substrate.

Since at least the step of spreading the coating material is carried out in a vacuum, bubbles do not enter between the coating material and the flattening substrate.

In the first flattening film forming apparatus, a flattening substrate having a flat surface facing in parallel to the surface of the substrate mounted on the stage, and a drive unit for pressing the flattening substrate to the stage side are provided. Therefore, the flattening substrate is pressed toward the stage by the drive unit. Therefore, if the coating material is pressed by the substrate placed on the stage and the flattening substrate,
The coating agent spreads thinly so that its surface is flat.

In the second flattening film forming apparatus, the flattening substrate having a flat surface facing the surface of the substrate mounted on the stage in parallel with the stage is moved up and down, and the flattening substrate side is provided. Since the drive unit for pressing the stage is provided, the stage is pressed toward the flattening substrate side by the drive unit. Therefore, when the coating agent is pressed by the substrate placed on the stage and the flattening substrate, the coating agent spreads thinly so that its surface is flat.

In the above flattening film forming apparatus, since the heater for heating the coating agent is provided on one or both of the flattening substrate and the stage, the curing of the coating agent is accelerated.

Further, the flattening substrate is formed of a light-transmitting material,
Since the light irradiator for curing the photocurable coating agent is provided, when the coating agent is a photocurable material, if the light is irradiated to the coating agent through the flattening substrate from the light irradiator, The coating material is cured.

In the flattening film forming apparatus described above, the substrate pressing means that can be moved up and down is provided at substantially the center of the stage on the substrate mounting surface side. Alternatively, a substrate pressing unit that presses the flattening substrate toward the stage is provided at approximately the center of the flattening substrate. Alternatively, since the flattening substrate is formed of a shape memory material that remembers that the surface on the stage side is convexly warped and that the surface is flat, a coating agent is applied between the substrate and the flattening substrate. When pressing and spreading, the coating material is spread from the central part side of the substrate to the peripheral part side. Therefore, it becomes difficult for bubbles to enter between the flattening substrate and the coating agent.

Further, since the flattening film forming apparatus is provided with either one or both of the substrate rotating means and the stage rotating means, the coating agent is applied to the center of the substrate between the substrate and the planarizing substrate. It becomes easy to spread from the part side to the peripheral part side. Therefore, it becomes difficult for bubbles to enter between the flattening substrate and the coating agent.

[0038]

EXAMPLE An example of a method for forming a planarizing film according to the present invention will be described with reference to the forming process chart of FIG.

As shown in FIG. 1A, a plurality of wirings 12 are formed on the substrate 11. Furthermore each wiring 1
An interlayer insulating film 13 is formed so as to cover 2. First, in the first step, the coating material 31 is supplied to the surface of the interlayer insulating film 13 on the substantially central portion of the substrate 11. The above coating agent 3
1 is a high-polymer resin such as photoresist dissolved in a solvent, or SOG (Spin on glass).
) Such as an inorganic substance dissolved in a solvent is used. Examples of the high molecular weight polymer resin include urea resin,
Melamine resin, phenol resin, epoxy resin, unsaturated polyester resin, alkyd resin, urethane resin or ebonite resin can be used.

Subsequently, as shown in FIG. 1B, the second step is performed. In this step, the flattening substrate 21 having the flat surface 21a facing the substrate 11 parallel to the surface of the substrate 11 is pressed to the substrate 11 side to spread the coating material 31. Alternatively, the substrate 11 may be pressed against the flattening substrate 21 side. Then, the coating material 31 is spread on the surface of the substrate 11.

Next, the third step shown in FIG. 1C is performed. In this step, the spread coating material (31) is cured to form a thin film 35 made of the coating material (31).

Then, the fourth step shown in FIG. 1D is performed. In this step, from the thin film 35 to the flattening substrate 2
Release one. Although not shown, the thin film 35 formed thereafter is formed.
If the film thickness is thick, the entire surface of the thin film 35 is etched back to adjust the film thickness of the thin film 35.

In the method of forming a flattening film described with reference to FIG. 1 above, the coating material 31 is supplied to the surface of the substrate 11, the substrate 11 and the flattening substrate 31 are pressed and spread, and then cured. Since the thin film 35 is formed, the surface 3 of the thin film 35 is formed.
5a is in a state where the flat surface 21a of the flattening substrate 21 is transferred. Therefore, the surface 35a becomes a flat surface.

In the method of forming a flattening film, after performing the first step to the third step, as shown in FIG.
In the fourth step, the flattening substrate 21 (portion indicated by a chain double-dashed line) may be removed by etching. In this case, the flattening substrate 21 is made of a material that can be etched and is in the form of a wafer. For example, a wafer made of a hard and brittle material such as a silicon wafer, a quartz wafer, or a ceramics wafer is used.

In the flattening method, the flattening substrate 21 is removed by etching, so that when the thin film 35 is thick, the flattening substrate 21 and the thin film 35 can be continuously etched.

Next, an example of a method of curing the coating film 31 spread on the surface of the substrate 11 will be described. First, the first step and the second step described in FIG. 1 are performed, and as shown in FIG. 3, the flattening substrate 21 is pressed against the substrate 11 side to spread the coating agent (31).

Then, the third step is performed. In this step, for example, the flattening substrate 21 is heated. If the heater 42 is built in the flattening substrate 21, the heating is performed using the heater 42. When the flattening substrate 21 does not have a heater built therein, the flattening substrate 21 is heated from the outside of the flattening substrate 21. Then, the heat is transmitted to the spread coating agent (31) and cured to form the thin film 35. Alternatively, the coating material (31) may be heated by heating the substrate 11 from the stage (not shown) side on which the substrate 11 is placed. Alternatively, the coating agent (31) may be heated from the substrate 11 side and the flattening substrate 21 side.

After that, the fourth step is performed.

Since the coating agent is heated and cured as described above, the curing time of the coating agent is shortened.

Next, the case where a thermoplastic material is used as the coating material will be described with reference to FIG.

In the same manner as described above with reference to FIG. 1A, as shown in FIG. 4A, the thermoplastic coating material 32 is supplied onto the interlayer insulating film 13 formed on the substrate 11. . The coating material 32 is formed of, for example, one or more of polystyrene, polyethylene, polyvinyl chloride, and polyamide.

Subsequently, as shown in FIG. 4B, in the second step, the coating material 32 is pressed between the substrate 11 and the flattening substrate 21. At this time, the substrate 11 side and the flattening substrate 2
The coating agent 32 is heated from either one side or both sides of the one side. In this way, the coating agent 32
Are spread in a plane on the substrate 11.

Next, in a third step, the coating material 32 spread by cooling the substrate 11 is hardened. Then, as shown in (3) of FIG. 4, a thin film 35 made of the hardened coating material (32) is formed on the surface of the substrate 11.

Then, the flattening substrate 21 is separated from the thin film 35 by performing the fourth step described in FIG. 1 (4).
Therefore, the surface 35a of the thin film 35 is in a state in which the surface 21a of the flattening substrate 21 is transferred.

As described above with reference to FIG. 4, when the thermoplastic coating material 32 is used, the coating material 32 is spread in the surface of the substrate 11 while being heated. 32 becomes easy to spread. Further, since the substrate 11 is cooled to cure the coating agent 32, the coating agent 32 is cured in a state where the flat surface 21a of the flattening substrate 21 is transferred. Therefore, the surface 35a of the thin film 35 made of the hardened coating material 32 is formed into a flat surface.

Next, the case where a photocurable coating agent is used will be described with reference to FIG.

In the same manner as described in (1) of FIG. 1, as shown in (1) of FIG. 5, a photo-curable coating agent 33 is supplied on the interlayer insulating film 13 formed on the substrate 11. To do. The coating agent 33 has a property of being cured by being irradiated with light having a specific wavelength and a certain intensity.

Subsequently, as shown in FIG. 5B, in the second step, the coating material 33 is pressed between the substrate 11 and the flattening substrate 21. Then, the coating material 33 is spread over the surface of the substrate 11. The flattening substrate 21 is formed of a material that transmits a light ray having a wavelength that cures the coating agent 33, for example, quartz glass.

Next, the third step shown in FIG. 5C is performed. In this step, the flattening substrate 21 is penetrated to obtain the coating agent 33.
The light ray L for curing the is irradiated. Then, the spread coating material (33) is cured to form the thin film 35.

Then, the flattening substrate 21 is separated from the thin film 35 by performing the fourth step described in FIG. 1 (4).
The surface 35 a of the thin film 35 is the surface 2 of the flattening substrate 21.
1a is transferred.

As described above with reference to FIG. 5, when the photo-curable coating agent 33 is used, the coating agent 33 is spread within the surface of the substrate 11 and then the flattening substrate 21 is applied for coating. Since the light ray L for curing the agent 33 is applied, the coating agent 33 is cured in a state where the flat surface 21a of the flattening substrate 21 is transferred. Therefore, the thin film 35 made of the hardened coating material 33
The surface 35a of is formed as a flat surface.

In the method of forming each flattening film described above, in the second step, as shown in FIG. 6, for example, the flattening substrate 21 is warped in a convex shape with respect to the substrate 11 side, and then the coating agent is applied. 31 (32, 33) may be pressed by the flattening substrate 21. The flattening substrate 21 may be bent before or after the coating material 31 (32, 33) is supplied onto the substrate 11. Then, the flattening substrate 21 is pressed against the substrate 11 in a warped state to spread the coating material 31 (32, 33). When the coating material 31 (32, 33) has a predetermined film thickness, the flattening substrate 21 is returned to its original state. Alternatively, although not shown, the substrate 11 may be curved in a convex shape with respect to the flattening substrate 21 side, or the substrate 11 and the flattening substrate 21 may be bent.
Both may be convexly warped with respect to the opposite side.

As described above, one or both of the substrate 11 and the flattening substrate 21 is bent in a convex shape with respect to the opposite side, and then the substrate 31 and the flattening substrate 21 are coated with the coating agent 31 ( 32, 33) is pressed, the coating agent 31 (3, 3) is spread when the coating agent 31 (32, 33) is spread.
2, 33) and the flattening substrate 21 are less likely to contain bubbles.

In the method of forming each flattening film described above, in the second step, as shown in FIG.
The coating material 31 (32, 33) may be pressed between the substrate 11 and the flattening substrate 21 while rotating in the direction of arrow A.
At this time, the flattening substrate 21 is not rotated.

Alternatively, although not shown, the flattening substrate 21
While rotating the substrate 11, or both the substrate 11 and the planarizing substrate 21.
The coating material 31 (32, 33) may be pressed with and. When the substrate 11 and the flattening substrate 21 are rotated, each of them is rotated so that one of them is relatively rotated.

As described above, the substrate 11 and the flattening substrate 21
When pressing the coating material 31 (32, 33) with and
Since the coating agent 31 (32, 33) is pressed and spread while rotating either one or both of 1 and the planarizing substrate 21, the coating agent 31 (32, 33) and the planarizing substrate 21 It becomes difficult for bubbles to enter in between.

In the above-described method for forming each flattening film, at least the second step may be performed in vacuum, although not shown and described. Since at least the step of spreading the coating material is performed in a vacuum as described above, bubbles do not enter between the coating material and the flattening substrate.

In the flattening method described with reference to FIGS. 1 to 7, the surface of the substrate 11 is coated with the coating material 31 (32, 3).
3) A material having poor adhesion to the substrate, for example, a material that improves the adhesion between the surface of the substrate 11 and the coating material 31 (32, 33) when it is formed of silicon oxide. 11 is applied to the surface of
Supply (32, 33).

Next, a first embodiment of the flattening film forming apparatus of the present invention will be described with reference to the schematic diagram of FIG. In the figure, the same components as those described in FIG. 1 are designated by the same reference numerals.

As shown in FIG. 8, a stage 41 on which the substrate 11 is placed is provided. The flattening substrate 21 having a flat surface 21 a facing in parallel to the surface 11 a of the substrate 11 mounted on the stage 41 is the stage 41.
Is provided above. Further, the flattening substrate 21 is provided with a drive unit 51 for raising and lowering it in the arrow direction and pressing it toward the stage 41 via a drive shaft 52. The flattening film forming apparatus 1 is configured as described above.

The flattening film forming apparatus 1 is provided with a coating agent feeder 61 for feeding the coating agent 31.
The coating agent feeder 61 includes, for example, a coating agent storage section 62,
It comprises a pump 63 connected to it and a supply nozzle 64 connected to the pump 63.

Next, the operation of the flattening film forming apparatus 1 will be described.
This will be described with reference to FIG. First, the substrate 11 is placed on the stage 41. Subsequently, the coating agent feeder 61 supplies the coating agent 31 from the supply nozzle 64 onto the substrate 11. After that, the supply nozzle 64 is moved to the upper side of the stage 41, and the flattening substrate 21 is moved to the substrate 11 by the driving unit 51.
Drive to the side. Then, by pressing the flattening substrate 21 toward the substrate 11, the coating material 31 is spread within the surface of the substrate 11. Subsequently, the coating material 31 is cured to form a thin film (not shown). After the thin film is formed, the flattening substrate 21 is separated from the thin film by the driving unit 51.

As described above, in the flattening film forming apparatus 1,
A flattening substrate 21 having a flat surface 21a placed on the stage 41 and facing in parallel to the surface 11a of the substrate 11.
And a drive unit 5 that moves it up and down and presses it toward the stage 41.
1 is provided. Therefore, by driving the drive unit 51 and pressing the flattening substrate 21 toward the stage 41, the substrate 11 placed on the stage 41 and the flattening substrate 21 are pressed.
The coating material 31 between and spreads in a flat state.

Next, a second embodiment of the flattening film forming apparatus of the present invention will be described with reference to the schematic diagram of FIG. In the figure, the same components as those described in FIG. 8 are designated by the same reference numerals.

As shown in FIG. 9, a stage 41 on which the substrate 11 is placed is provided. The flattening substrate 21 having a flat surface 21 a facing in parallel to the surface 11 a of the substrate 11 mounted on the stage 41 is the stage 41.
Is located above. Also, on the stage 41,
A drive unit 53 for raising and lowering it in the direction of arrow and pressing it toward the flattening substrate 21 side is provided via a drive shaft 54. The flattening film forming apparatus 2 is configured as described above.

As in the case of the connection in FIG. 8, the flattening film forming apparatus 2 is provided with a coating agent feeder 61 for feeding the coating agent 31.

Next, the operation of the flattening film forming apparatus 2 will be described.
This will be described with reference to FIG. First, the substrate 11 is placed on the stage 41. Subsequently, the coating material 31 is supplied onto the substrate 11. Then, the driving unit 53 drives the stage 41 toward the flattening substrate 21 side to press the substrate 11 toward the flattening substrate 21 side, thereby spreading the coating material 31 in the plane of the substrate 11. After that, the coating material 31 is cured to form a thin film (not shown).
After the formation of the
The substrate 11 on which a thinner film is formed is separated.

As described above, in the flattening film forming apparatus 2,
A flattening substrate 21 having a flat surface 21a placed on the stage 41 and facing in parallel to the surface 11a of the substrate 11.
And a drive unit 52 for moving the stage 41 up and down and pressing it toward the flattening substrate 21 side. Therefore, by driving the drive unit 53 to press the stage 41 toward the flattening substrate 21, the coating agent 31 between the substrate 11 placed on the stage 41 and the flattening substrate 21 has a flat surface. Spread to.

Next, what is provided with a heater for heating the coating material will be described with reference to the schematic diagram of FIG. In the figure, the same components as those described with reference to FIG. 8 are designated by the same reference numerals.

As shown in FIG. 10, the flattening film forming apparatus 3
Is a heater 71 provided inside the flattening substrate 21 of the flattening film forming apparatus (1) described in FIG. The heater 71 is formed of, for example, a heating wire and a power source (not shown) that supplies a current to the heating wire. The positional relationship among the stage 41 on which the substrate 11 is placed, the flattening substrate 21, and the drive unit 51 is the same as that in the flattening film forming apparatus (1).
Therefore, the description is omitted here. Further, the heater 71 is provided inside the flattening substrate 21, but may be provided outside. As the heating base 71 in that case, a lamp or a laser light oscillator can be used in addition to the heating wire.

Although not shown, the heater 71 may be provided inside the stage 41. Alternatively, it may be provided on both the flattening substrate 21 and the stage 41. further,
Similarly to the flattening film forming apparatus (2), the heater 7 as described above is used.
It is also possible to provide 1.

The operation of the flattening film forming apparatus 3 will be described with reference to FIG. Spreading the coating material 31 within the surface of the substrate 11 is the same as in the flattening film forming apparatus (1). Therefore, the description is omitted here. Coating agent 31
After spreading, the flattening substrate 21 is heated by the heater 71. Then, after the spread coating material 31 is cured to form a thin film (not shown), the flattening substrate 21 is separated from the thin film formed on the substrate 11.

As described above, in the flattening film forming apparatus 3, since the flattening substrate 21 is provided with the heater 71, curing of the spread coating agent 31 is accelerated.

Next, the flattening film forming apparatus 4 for forming a thin film using a photo-curable coating material will be described with reference to the schematic configuration diagram of FIG. In the figure, the same components as those described with reference to FIG. 8 are designated by the same reference numerals.

As shown in the figure, the flattening film forming apparatus 4 is
The flattening substrate 21 of the flattening film forming apparatus (1) described with reference to FIG. 8 is formed of a light-transmissive material, and the flattening substrate 21 is provided with a photocurable substrate on the side opposite to the stage 41 side. Coating agent 3
3 is provided with a light irradiator 75 for generating a light ray L having a wavelength at which 3 is cured. The flattening substrate 21 is made of, for example, quartz. Usually, transparent quartz transmits a light ray having a wavelength of about 190 nm. The light irradiator 75 is, for example, a tungsten halogen lamp or a wavelength of 150 nm to 35 nm.
It is composed of a laser light oscillator having an oscillation wavelength in the range of about 0 nm (for example, an excimer laser light oscillator, a semiconductor laser light oscillator, etc.). The drive unit 51 is attached, for example, to the end side of the flattening base 21 via the drive shaft 52 and the attachment jig 55 at a position that does not block the optical path of the light beam L. It should be noted that the illustration of the coating agent feeder (61) is omitted in the figure.

In the above description, the flattening substrate 21 of the flattening film forming apparatus (1) is formed of a transparent material. However, for example, the flattening film forming apparatus (2) described above is flat. The compliant substrate 21 can also be formed of a translucent material. Also in this configuration, the light irradiator 75 is provided at the same position as above.

The operation of the flattening film forming apparatus 4 will be described with reference to FIG. Spreading the coating material 31 within the surface of the substrate 11 is the same as in the flattening film forming apparatus (1). Therefore, the description is omitted here. Coating agent 31
After the light is spread, a light ray L is emitted from the light irradiator 75, and the light ray L passes through the flattening substrate 21 and is applied to the coating agent 33.
Then, the coating agent 33 is cured to form a thin film (not shown). Then, the flattening substrate 21 is separated from the thin film formed on the substrate 11.

As described above, in the flattening film forming apparatus 4, since the flattening substrate 21 is made of the translucent material, it is possible to use the photocurable material for the coating agent 33. Then, a light irradiator 7 that emits a light ray L that cures the coating agent 33.
5 is provided, the flattening substrate 21 is penetrated to obtain the coating agent 3
By irradiating 3 with the light beam, the coating agent 33 can be cured.

Further, in the above-described flattening film forming apparatuses 1 to 4, a flattening film forming apparatus provided with a means for bending the substrate 11 will be described with reference to the schematic configuration diagram of FIG. In the figure, the same components as those described with reference to FIG. 8 are designated by the same reference numerals.

As shown in the figure, the flattening film forming apparatus 5 is
The substrate pressing means 81 is provided on the stage 41 constituting the flattening film forming apparatus (1) described in FIG.
Therefore, the flattening substrate 21, the stage 41, and the drive unit 5
The positional relationship of 1 is the same as that of the flattening film forming apparatus (1). Therefore, the description is omitted here. The illustration of the coating agent feeder 61 is omitted. The stage 41 sucks the substrate 11 onto the substrate mounting surface 41a by vacuum suction, for example, and a vacuum suction hole (not shown) is formed over substantially the entire surface of the substrate mounting surface 41a. In addition, a hole 42 is provided in a substantially central portion of the stage 41 on the substrate mounting surface 41a side. The hole 42 is provided with a pin 82 for freely raising and lowering the inside thereof. Further, a drive unit 83 that is connected to the pin 82 and moves the pin 82 up and down is provided inside the stage 41. The tip of the pin 82 is, for example, rounded so as not to damage the back surface of the substrate 11. The drive unit 83 may be provided outside the stage 41. Further, it is possible to provide holes 42 at a plurality of positions on the substrate mounting surface 41a side and provide pins 82 in each hole 42.

Although not shown, the substrate pressing means 81 is similarly used in the above-described flattening film forming apparatus (2-4).
Can be provided.

Next, the operation of the flattening film forming apparatus 5 will be described.
This will be described with reference to FIG. First, the substrate 11 is placed on the stage 41. Subsequently, the coating material 31 is supplied onto the substrate 11. Then, the drive unit 83 raises the pin 82 to slightly push up the vicinity of the center of the substrate 11. The height to be pushed up is, for example, 0. It is about several mm. At this time, the substrate 11 is pressed so that the substrate 11 is not peeled off from the substrate mounting surface 41a, that is, vacuum suction is maintained. By pushing up the substrate 11 in this manner, the substrate 11 warps in a convex shape toward the flattening substrate 21 side. In this state,
The drive unit 51 drives the flattening base 21 toward the substrate 11 side to press the flattening base 21 toward the substrate 11 side. Then, the coating material 31 is pressed by the substrate 11 and the flattening substrate 21 to spread it within the surface of the substrate 11. At that time, the coating agent 31
Are spread within the surface of the substrate 11 and
Is lowered to return the substrate 11 to the original state. Then, the entire back surface of the substrate 11 is brought into close contact with the substrate mounting surface 41a.
After that, the coating material 31 is hardened to form a thin film (not shown), and then the drive unit 51 separates the flattening substrate 21 from the thin film.

In such a flattening film forming apparatus 5 as described above,
Since the substrate pressing means 81 having the vertically movable pins 82 is provided in the substantially central portion of the stage 41 on the substrate mounting surface 41a side, when the substrate 11 and the flattening substrate 21 press and spread the coating material 31. In addition, the coating material 31 can be easily spread from the central portion side of the substrate 11 to the peripheral portion side. Therefore, the flattening substrate 21
It becomes difficult for bubbles to enter between the coating material 31 and the coating material 31.

Further, the flattening film forming apparatus having the means for deflecting the flattening substrate 21 in the flattening film forming apparatuses 1 to 3 will be described with reference to the schematic configuration diagram of FIG. In addition,
In the figure, the same components as those described in FIG. 8 are designated by the same reference numerals.

As shown in the figure, the flattening film forming apparatus 6 is
The flattening substrate 21 constituting the flattening film forming apparatus (1) described with reference to FIG. 8 is provided with the substrate pressing means 85. Therefore, the flattening substrate 21, the stage 41, and the driving unit 51 are the same as those in the flattening film forming apparatus (1). Therefore, the description is omitted here. See also Stage 4 above
A substrate holder 25 is provided above 1. A vacuum suction hole (not shown) for vacuum-sucking and holding the flattening substrate 21, for example, is provided on the side of the substrate holding surface 25a of the substrate holder 25. Therefore, the flattening substrate 21 is attracted to the substrate holding surface 25a so that the flattening surface 21a of the flattening substrate 21 and the surface 11a of the substrate 11 placed on the stage 41 are positioned in parallel with each other. It is held by the base body holder 25. The substrate holder 25 may be, for example, an electrostatic chuck or a clamp as long as it holds the flattened substrate 21. Further, the drive unit 51 is connected to the substrate holder 25.

The substrate mounting surface 25 of the substrate holder 25 described above.
A hole 26 is provided at a substantially central portion on the a side. The hole 26 is provided with a pin 86 that moves up and down. Further, a drive unit 87 that is connected to the pin 86 and moves up and down the pin 86 is provided inside the base body holder 25. The tip of the pin 86 is, for example, rounded so as not to damage the back surface of the flattening substrate 21. As described above, the base pressing means 85 is composed of the pin 86 and the drive portion 87. The drive unit 87 may be provided outside the substrate holder 25.

Although not shown, the substrate pressing means 85 is similarly applied to the above-described flattening film forming apparatus (2, 3).
Can be provided.

Next, the operation of the flattening film forming apparatus 6 will be described.
This will be described with reference to FIG. First, the substrate 11 is placed on the stage 41. Subsequently, the coating material 31 is supplied onto the substrate 11. Then, the drive unit 87 lowers the pin 86 to the position indicated by the chain double-dashed line and slightly pushes down the vicinity of the center of the flattening substrate 21. The height to be pushed down is, for example, 0. It is about several mm to several mm. By pushing down the central portion of the flattening substrate 21 in this manner, the flattening substrate 21 warps in a convex shape toward the substrate 11 as shown by the chain double-dashed line. In such a state, the drive unit 51 drives the flattening base 21 toward the substrate 11 side, and presses the flattening base 21 toward the substrate 11 side. Then, the coating material 31 is applied to the base 11 and the flattening base 21.
It is pressed by and to spread it within the surface of the substrate 11. At this time, the coating material 31 is spread over the surface of the substrate 11 and the pins 86 are raised to bring the entire back surface of the substrate 11 into close contact with the substrate mounting surface 41a. After that, the coating material 31 is cured,
After the thin film (not shown) is formed, the flattening substrate 21 is separated from the thin film by the driving unit 51.

In such a flattening film forming apparatus 6 as described above,
Since the substrate pressing means 85 having the pin 86 that pushes down substantially the central portion of the flattening substrate 21 is provided, the coating agent 31 is flattened when the coating agent 31 is pressed and spread by the substrate 11 and the flattening substrate 21. It becomes easy to spread from the central part side of the base 21 to the peripheral part side. Therefore, it becomes difficult for bubbles to enter between the flattening substrate 21 and the coating material 31.

In the flattening film forming devices 1 to 5, the flattening substrate 21 itself may be warped. Such a flattening film forming apparatus will be described with reference to the schematic configuration diagram of FIG. In the figure, as a representative, a case is shown in which the flattening substrate 21 itself of the flattening film forming apparatus (1) described in FIG. In the figure, the same components as those described with reference to FIG. 8 are designated by the same reference numerals.

As shown in the figure, the flattening substrate 21 explained to the driving unit 51 of the flattening film forming apparatus 7 via the drive shaft 52 has a state in which the surface on the stage 41 side is convexly warped ( It is formed of a shape memory material that stores a state shown by a solid line and a state where it becomes a flat surface (state shown by a two-dot chain line). The shape memory material is made of a material whose shape is changed by a temperature change, for example, an alloy of nickel and titanium, an alloy of copper, zinc and aluminum, and an alloy of iron, manganese and silicon. . A heater 72 is provided on the opposite side of the flattening substrate 21 from the stage 41. The heater 72 may be, for example, one that uses a heating wire, one that uses a lamp that generates a heat wire, or one that uses a laser light oscillator, as long as it generates heat. In this flattening film forming apparatus 7, the stage 4 on which the flattening substrate 21 and the substrate 11 are placed.
1. The positional relationship between the drive unit 51 and the flattening film forming apparatus (1)
Is the same as. Therefore, the description of those positional relationships is omitted here.

Although not shown, it is possible to form the flattening substrate 21 of the above-described flattening film forming apparatus (2, 3, 5) with a shape memory material.

Next, the operation of the flattening film forming apparatus 7 will be described.
This will be described with reference to FIG. First, the substrate 11 is placed on the stage 41. Subsequently, the coating material 31 is supplied onto the substrate 11. Then, the flattening substrate 21 is heated by the heater 72, and the flattening substrate 21 is warped toward the stage 41 side to be deformed. The warp amount at this time is, for example, 0. It is set to about several mm to several mm. In this state where the flattening substrate 21 is warped, the driving unit 51 presses the flattening substrate 21 toward the substrate 11. Then, the coating material 31 is pressed between the substrate 11 and the flattening substrate 21,
Spread in the plane of. Almost at the same time, heating by the heater 72 is stopped and the flattening substrate 21 is returned to room temperature. Therefore, the surface of the flattening substrate 21 on the stage 41 side is a flat surface. After that, the coating material 31 is cured to form a thin film (not shown), and then the drive unit 51 separates the flattening substrate 21 from the thin film.

Alternatively, the flattening substrate 21 is warped at room temperature. When the flattening substrate 21 is pressed against the stage 41 side, the flattening substrate 21 is heated by the heater 72.
May be heated to a predetermined temperature to deform the surface of the flattening substrate 21 on the stage 41 side into a flat surface.

In the flattening film forming apparatus 7, the flattening substrate 21 is made of a shape memory material that stores a state in which the surface of the flattening substrate 21 on the stage 41 side warps in a convex shape and a state in which the surface becomes a flat surface. 21 is formed, the substrate 11 and the flattening substrate 2 are formed.
When the coating material 31 is pressed and spread by 1 and 1, the coating material spreads from the central portion side of the substrate 11 to the peripheral portion side. Therefore, it becomes difficult for bubbles to enter between the flattening substrate 21 and the coating material 31.

FIG. 15 is a schematic block diagram of the flattening film forming apparatus including the means for spreading the coating agent while rotating the flattening substrate and the substrate in the flattening film forming apparatuses 1 to 7 as described above. Explained by. In the figure, the same components as those described with reference to FIG. 8 are designated by the same reference numerals.

As shown in the figure, the flattening film forming apparatus 8 is
The flattening substrate 21 constituting the flattening film forming apparatus (1) described with reference to FIG. 8 is provided with the substrate rotating means 91. Therefore, the individual configurations of the flattening substrate 21, the stage 41 on which the substrate 11 is placed, and the drive unit 51 are the same as those of the flattening film forming apparatus (1). Therefore, the description is omitted here. The flattening base 21 is connected to the drive shaft 52 of the drive unit 51 through the base rotating means 91. The base body rotation means 91 is composed of a rotation drive unit 92 and a drive shaft 93 connected thereto. The rotation drive unit 92 is connected to the drive shaft 93 of the drive unit 51, and the drive shaft 93 is connected to the flattening base 21. Alternatively, although not shown, a jig for holding the flattening substrate 21 may be provided between the drive shaft 93 and the flattening substrate 21.

Next, the operation of the flattening film forming apparatus 8 will be described.
This will be described with reference to FIG. First, the substrate 11 is placed on the stage 41. Subsequently, the coating material 31 is supplied onto the substrate 11. Then, the driving unit 92 is driven to drive the flattening substrate 21.
For example, while rotating in the arrow direction, the drive unit 51 presses the flattening base 21 toward the substrate 11. Then, the coating material 31 is pressed by the substrate 11 and the flattening substrate 21 to spread it within the surface of the substrate 11. When the coating material 31 is spread, the drive of the rotation drive unit 92 is stopped. After that, the coating material 31 is cured to form a thin film (not shown), and then the driving unit 51.
The flattening substrate 21 is separated from the thin film by.

As described above, the flattening film forming apparatus 8 includes
Since the base rotating means 91 connected to the flattening base 21 is provided, the coating material 31 is provided between the substrate 11 and the flattening base 21.
Can be easily spread from the central portion side of the substrate 11 to the peripheral portion side. Therefore, it becomes difficult for bubbles to enter between the flattening substrate 21 and the coating material 31.

Although not shown, on the other hand, the stage (41)
In the flattening film forming apparatus (2) to which the drive unit (52) is connected to, the substrate rotating means (91) is connected only to the flattening substrate (21). Also in this configuration, a jig for holding the flattening substrate (21) may be provided between the substrate rotating means (91) and the flattening substrate (21).

Further, as shown in FIG. 16, a base body rotating means 91 for rotating the stage 41 of the flattening film forming apparatus 1 as shown in FIG. 8 may be provided, for example, in the arrow D direction. . This rotation direction may be reversed. The stage rotating means 94 is the base rotating means (9) described above.
It has the same configuration as 1). That is, it is composed of the rotation drive unit 95 and the drive shaft 96 connected thereto. The drive shaft 96 is connected to the stage 41. In addition,
The positional relationship between the flattening substrate 21 and the stage 41 on which the substrate 11 is placed is the same as in the flattening film forming apparatus (1). Therefore, the description is omitted here. Also, stage 4
In the case where the drive unit (52) is connected to 1, the stage rotating means (94) is provided between the drive unit (52) and the stage 41. Alternatively, the drive unit (53) may be provided with stage rotating means (94).

Although not shown, the flattening substrate (2
The base body rotating means (91) is provided in 1), and the stage (41)
A stage rotating means (94) may be provided in the.

In the above description, the drive shaft (93) or (96) is directly connected to the rotated flattening substrate 21 or the rotated stage 41.
The rotation force of the rotation drive unit (92) or the rotation drive unit (95) may be transmitted by a gear transmission mechanism, a winding transmission mechanism, or the like.

[0114]

As described above, according to the method for forming a flattening film of the present invention, the coating agent supplied to one surface of the substrate is pressed by the substrate and the flattening substrate to spread it in the plane of the substrate. Since it is cured to form a thin film, the surface shape of the thin film is
The flat surface of the flattened substrate is transferred. For this reason,
The thin film surface can be formed into a flat surface. In this way, the flattening film can be easily formed.

According to the method of etching and removing the flattening substrate by the above-described flattening method, the flattening substrate and the thin film can be continuously etched. Therefore, when the thin film is thick, the thickness of the thin film can be adjusted by one etching.

According to the method of curing the coating agent by heating, the curing time of the coating agent can be shortened.

According to the method of using a thermoplastic material as the coating agent and spreading the coating agent in the substrate surface while heating, the coating agent can be easily spread in the substrate surface. Further, since the substrate is cooled to cure the coating agent, the coating agent can be cured in a shape in which the flat surface of the flattening substrate is transferred. Therefore, the surface of the thin film formed by curing can be formed into a flat surface.

According to the method of using a photocurable coating agent to spread the coating agent on the surface of the substrate and then irradiating it with light to cure the coating agent, the flat surface of the flattening substrate is formed into a thin film. The thin film can be cured while being transferred to the surface. Therefore, the surface of the flattening film can be formed with high precision.

According to a method in which one or both of the substrate and the flattening substrate are convexly warped with respect to the opposite side, and then the substrate and the flattening substrate are pressed with the coating agent, When pressing, it becomes difficult for bubbles to enter between the coating agent and the flattening substrate. Therefore, no recess is formed on the surface of the formed thin film, and the surface becomes a flat surface.

Also by the method of pressing and spreading the coating material while rotating either one or both of the substrate and the flattening substrate, it is possible to prevent bubbles from entering between the flattening substrate and the coating material in the same manner as described above. Become.

According to the method in which at least the step of spreading the coating material is carried out in a vacuum, bubbles do not enter between the coating material and the flattening substrate. Therefore, it becomes possible to form a high quality thin film.

According to the first flattening film forming apparatus of the present invention, a flattening substrate having a flat surface facing in parallel with the substrate surface on the stage, and a drive for raising and lowering it and pressing it toward the stage side. Is provided, the flattening substrate can be pressed against the substrate on the stage by the driving unit. Therefore, the coating agent supplied between the substrate and the flattening substrate can be spread so that its surface becomes flat.

According to the second flattening film forming apparatus, since the flattening substrate as described above and the driving unit for moving the stage up and down and pressing the stage toward the flattening substrate are provided, the stage is driven by the driving unit. The upper substrate can be pressed against the flattening substrate side. Therefore, the coating agent supplied between the substrate and the flattening substrate can be spread so that its surface becomes flat.

According to the flattening film forming apparatus provided with the heater, the heater can accelerate the curing of the coating agent.

According to the flattening film forming apparatus provided with the light irradiator, it becomes possible to form a thin film using a photocurable coating agent.

According to the flattening film forming apparatus provided with the substrate pressing unit or the base pressing unit, or the flattening film forming apparatus forming the flattening substrate with a shape memory material, the substrate or the flattening substrate is applied in a flat state. Since the agent is pressed and spread, it is possible to prevent bubbles from entering between the flattening substrate and the coating agent. Therefore, it is possible to form the surface of the thin film on a flat surface having no depression due to bubbles.

According to the flattening film forming apparatus provided with the substrate rotating means or the stage rotating means, the coating agent can be easily spread from the central portion side of the substrate to the peripheral portion side between the substrate and the flattening substrate. It is possible to prevent bubbles from entering between the flattening substrate and the coating agent. For this reason, similarly to the above, the surface of the thin film can be formed to be a flat surface having no depression due to bubbles.

[Brief description of drawings]

FIG. 1 is a process drawing of an embodiment of the present invention.

FIG. 2 is an explanatory diagram of another method in the fourth step.

FIG. 3 is an explanatory diagram of a method for curing a coating agent.

FIG. 4 is a forming process diagram when a thermoplastic coating material is used.

FIG. 5 is a process drawing of a case where a photo-curable coating agent is used.

FIG. 6 is an explanatory diagram of a method for pressing a coating agent.

FIG. 7 is an explanatory diagram of a method of spreading a coating agent.

FIG. 8 is a schematic configuration diagram of a first embodiment of a planarizing film forming apparatus.

FIG. 9 is a schematic configuration diagram of a second embodiment of a flattening film forming apparatus.

FIG. 10 is a schematic configuration diagram of a flattening film forming apparatus provided with a heater.

FIG. 11 is a schematic configuration diagram of a flattening film forming apparatus provided with a light irradiator.

FIG. 12 is a schematic configuration diagram of a flattening film forming apparatus provided with a substrate pressing unit.

FIG. 13 is a schematic configuration diagram of a flattening film forming apparatus provided with a substrate pressing means.

FIG. 14 is a schematic configuration diagram of a flattening film forming apparatus in which a flattening substrate warps.

FIG. 15 is a schematic configuration diagram of a flattening film forming apparatus provided with a rotating means.

FIG. 16 is a schematic configuration diagram of a flattening film forming apparatus provided with rotating means.

FIG. 17 is an explanatory diagram of a problem of the global flattening method by the polishing technique.

FIG. 18 is an explanatory diagram of a problem of the spin coating method.

FIG. 19 is an explanatory diagram of a problem of a spin coating method using a dummy pattern.

[Explanation of symbols]

 1-9 Flattening film forming apparatus 11 Substrate 21 Flattening substrate 31-33 Coating agent 35 Thin film 41 Stage 51,53 Driving part 71,72 Heater 75 Light irradiator 81 Substrate pressing means 85 Substrate pressing means 91 Substrate rotating means 94 Stage Rotation Means L Ray

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical indication H01L 21/90 Q

Claims (16)

[Claims] 1. A first step of supplying a coating agent to one surface of a substrate, and a step of pressing the coating agent with the substrate and a flattening substrate having a flat surface facing parallel to the surface of the coating agent supplied. And a second step of spreading the spread coating agent on the surface of the substrate, and a third step of curing the spread coating agent to form a thin film of the cured coating agent on the substrate surface. 4. A method of forming a flattening film, which comprises a fourth step of separating. 2. The method of forming a flattening film according to claim 1, wherein after the first step to the third step, the flattening substrate is removed by etching in a fourth step. And a method for forming a planarization film. 3. The method of forming a flattening film according to claim 1, wherein after performing the first step and the second step, in the third step, the substrate side and the flattening substrate are formed. By heating the coating agent spread from one or both sides, the coating agent is cured to form a thin film of the cured coating agent on the surface of the substrate, and then the fourth step is performed. A method for forming a flattening film, which is characterized by being performed. 4. The method of forming a flattening film according to claim 1, wherein a thermoplastic coating agent is supplied to one surface of the substrate in the first step, and the substrate and the substrate are mixed in the second step. By spreading the coating agent in the plane of the substrate by pressing the coating agent with the flattening substrate and heating from one or both sides of the substrate side and the flattening substrate side, In step 3, the spread coating material is cooled to be hardened to form a thin film of the hardened coating material on the surface of the substrate, and then the fourth step is performed to form a flattening film. Method. 5. The method for forming a flattening film according to claim 1, wherein in the first step, a photocurable coating agent is supplied to one surface of the substrate, and then the second step is performed. After that, in the third step, a light beam for curing the coating agent is radiated through the flattening substrate to cure the spread coating agent and form a thin film of the cured coating agent on the surface of the substrate. And then performing the fourth step, the method for forming a planarizing film. 6. Any one of claims 1 to 5.
In the method for forming a planarizing film according to the item 1, in pressing the coating agent between the substrate and the planarizing substrate in the second step, one of the substrate and the planarizing substrate, or A method for forming a flattening film, which is characterized in that both are bent in a convex shape with respect to opposite sides. 7. Any one of claims 1 to 6
The method for forming a flattening film according to the item 1, wherein when the coating agent is pressed and spread by the substrate and the flattening substrate in the second step, one of the substrate and the flattening substrate is formed. A method for forming a flattening film, characterized in that the coating material is spread in the surface of the substrate while rotating one or both of them. 8. Any one of claims 1 to 7.
The method for forming a flattening film according to item 1, wherein at least the second step is performed in a vacuum atmosphere. 9. A stage on which a substrate is placed, a flattening substrate having a flat surface facing in parallel to the surface of the substrate placed on the stage, and the flattening substrate being raised and lowered to perform the flattening. A flattening film forming apparatus comprising: a drive unit that presses a substrate toward the stage. 10. A stage on which a substrate is placed, a flattening substrate having a flat surface facing in parallel to the surface of the substrate placed on the stage, and the stage is raised and lowered to flatten the stage. A flattening film forming apparatus, comprising: a drive unit that presses the flattened substrate side. 11. The flattening film forming apparatus according to claim 9 or 10, wherein a heater is provided on one or both of the flattening substrate and the stage. . 12. The flattening film forming apparatus according to claim 9 or 10, wherein the flattening substrate is formed of a translucent material, and the coating agent is provided on the opposite side of the stage to the flattening substrate. A flattening film forming apparatus, which is provided with a light irradiator that generates a light beam that cures. 13. The flattening film forming apparatus according to claim 9, wherein the substrate pressing means is provided at substantially the center of the stage on the substrate mounting surface side and is movable up and down. A flattening film forming apparatus characterized by the above. 14. Claims 9 to 11 and claim 1.
4. The flattening film forming apparatus as described in any one of 3, wherein the flattening substrate is provided with a substrate pressing unit that presses the flattening substrate toward the stage side and bends it in a convex shape. Flattening film forming apparatus. 15. Claims 9 to 11 and claim 1.
4. The flattening film forming apparatus according to any one of 3, wherein the flattening substrate stores a state in which a stage-side surface of the flattening substrate warps convexly and a state of becoming a flat surface. A flattening film forming apparatus, which is formed of a material. 16. The flattening film forming apparatus according to claim 9, wherein the flattening substrate is rotated by a substrate rotating unit and the stage is rotated by a stage. A flattening film forming apparatus, characterized in that either one or both of the moving means are provided.