JP2020107863A - Film formation device and production method of article - Google Patents

Abstract

To provide a technique useful to decrease the production cost and footprint of a film formation device.SOLUTION: A film formation device is arranged to form a film composed of a cured product of a curable composition by putting a mold into contact with the curable composition on a substrate to harden the curable composition. The film formation device comprises: a mold-holding part for holding the mold, which has a window to allow an energy for curing the curable composition to pass therethrough; a drive mechanism for changing the relative position of the substrate and the mold-holding part; and an exposure part for exposing the curable composition between the substrate and the mold to the energy through the window and the mold. In a state in which the mold is put in contact with the curable composition and the mold holding by the mold-holding part is disabled, the exposure part performs a process to expose the curable composition to the energy through the window and the mold. In the process, the drive mechanism changes the relative position so that a region to form the film is scanned with the energy to cure the curable composition.SELECTED DRAWING: Figure 3

Description

The present invention relates to a film forming apparatus and an article manufacturing method.

A mold is contacted with the curable composition on the substrate, and the curable composition is cured by irradiating the curable composition with energy for curing, and a cured product of the curable composition and the mold are provided. There is a film forming device for separating Such a film forming apparatus can be used as an apparatus for forming a pattern on a substrate or an apparatus for forming a flattening film on a substrate.

Patent Document 1 describes a nanoimprint apparatus having a substrate placing station, a stamping station, a positioning station, a curing unit, a releasing station, and a transfer robot. In this nanoimprint apparatus, a substrate having a surface coated with a resin (composition) is placed on a moving table in a substrate placing station, and then a mold is placed on the substrate via the resin. .. After that, the moving table moves to the pressing station, and the mold is pressed against the resin on the substrate by the pressing mechanism. After that, the moving table is moved to the alignment station to align the substrate and the mold. After the alignment, the substrate and the mold are fixed so that the substrate and the mold are not displaced. After that, the moving table moves toward the releasing station, passes under the curing unit on the way, and the resin is cured by the ultraviolet rays. At the mold release station, the mold is separated from the substrate.

JP, 2010-40879, A

Since the device as described in Patent Document 1 has a plurality of stations, the manufacturing cost of the device and the footprint can be increased.

It is an object of the present invention to provide a technique advantageous for reducing the manufacturing cost and footprint of a film forming apparatus.

One aspect of the present invention relates to a film forming apparatus for forming a film made of a cured product of the curable composition by contacting a mold with the curable composition on a substrate to cure the curable composition. The film forming apparatus has a window that allows energy for curing the curable composition to pass therethrough, and a drive mechanism that changes the relative positions of the mold holding unit that holds the mold and the substrate and the mold holding unit. And an irradiation unit that irradiates the curable composition between the substrate and the mold with the energy through the window and the mold, and the mold contacts the curable composition, and In a state in which the holding of the mold by the mold holding unit is released, a process of irradiating the curable composition with the energy through the window and the mold by the irradiation unit is performed, and in the process, The relative position is changed by the driving mechanism so that the region where the film is to be formed is scanned by the energy and the curable composition is cured.

According to the present invention, a technique that is advantageous for reducing the manufacturing cost and the footprint of the film forming apparatus is provided.

The figure which shows the structure of the film forming apparatus of one Embodiment of this invention. The figure which illustrates a film formation process. The figure which shows operation|movement of a film forming apparatus typically. The flowchart which shows operation|movement of a film forming apparatus. The figure which shows operation|movement of a film forming apparatus typically.

Hereinafter, the present invention will be described through exemplary embodiments thereof with reference to the accompanying drawings.

FIG. 1 exemplarily shows the configuration of a film forming apparatus 100 according to an embodiment of the present invention. The film forming apparatus 100 forms a film of a cured product of the curable composition IM by bringing the mold 11 into contact with the curable composition IM on the substrate 1 to cure the curable composition IM. The film forming apparatus 100 can be used as, for example, a flattening apparatus for forming a film having a flat surface on the substrate 1. In this case, the surface of the mold 11 that contacts the curable composition IM is flat. The film forming apparatus 100 can be used as a pattern forming apparatus or an imprint apparatus for forming a pattern on the substrate 1. In this case, the surface of the mold 11 that comes into contact with the curable composition IM has a pattern to be transferred to the curable composition.

As the curable composition, a curable composition (which may be referred to as an uncured resin) that is cured by application of curing energy is used. Electromagnetic waves, heat, etc. may be used as the curing energy. The electromagnetic wave may be, for example, light having a wavelength of 10 nm or more and 1 mm or less, such as infrared rays, visible rays, or ultraviolet rays. The curable composition may be a composition that is cured by irradiation with light or by heating. Among these, the photocurable composition which is cured by irradiation with light contains at least a polymerizable compound and a photopolymerization initiator, and may further contain a non-polymerizable compound or a solvent, if necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant and a polymer component. The curable composition may be disposed on the substrate in the form of droplets, or in the form of islands or films formed by connecting a plurality of droplets. The viscosity (viscosity at 25° C.) of the curable composition may be, for example, 1 mPa·s or more and 100 mPa·s or less. As the material of the substrate, for example, glass, ceramics, metal, semiconductor, resin or the like can be used. If necessary, the surface of the substrate may be provided with a member made of a material different from that of the substrate. The substrate is, for example, a silicon wafer, a compound semiconductor wafer, or quartz glass.

In the present specification and the accompanying drawings, directions are shown in an XYZ coordinate system having a direction parallel to the surface of the substrate 1 as an XY plane. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are defined as X-direction, Y-direction, and Z-direction, respectively, and rotation around the X-axis, rotation around the Y-axis, and rotation around the Z-axis are θX and θY, respectively. , ΘZ. The control or driving regarding the X axis, the Y axis, and the Z axis means control or driving regarding the direction parallel to the X axis, the direction parallel to the Y axis, and the direction parallel to the Z axis, respectively. Further, control or driving regarding the θX axis, the θY axis, and the θZ axis respectively relates to rotation about an axis parallel to the X axis, rotation about an axis parallel to the Y axis, and rotation about an axis parallel to the Z axis. Control or drive. The position is information that can be specified based on the coordinates of the X axis, the Y axis, and the Z axis, and the posture is information that can be specified by the values of the θX axis, the θY axis, and the θZ axis. Positioning means controlling position and/or attitude. The alignment (positioning) controls the position and/or orientation of at least one of the substrate 1 and the mold 11 so that an alignment error (overlay error) between the shot region of the substrate 1 and the pattern region of the mold 11 is reduced. May be included. The alignment may include control for correcting or changing the shape of at least one of the shot area of the substrate 1 and the pattern area of the mold 11.

Hereinafter, an example in which the film forming apparatus 100 is configured as a flattening apparatus will be described, but the film forming apparatus 100 can also be configured as a pattern forming apparatus or an imprint apparatus as described above.

The film forming apparatus 100 may include a base surface plate 4, a support column 5, a top plate 6, a support column 10, and an alignment shelf 14. The alignment shelf 14 is supported by the top plate 6 via the columns 10, and the top plate 6 is supported by the base surface plate 4 via the columns 5. Further, the film forming apparatus 100 includes a drive mechanism 30, a dispenser 20, an off-axis alignment scope 21, a substrate transfer section 22, a mold transfer section 32, an alignment scope 23, an irradiation section 24, a cleaning section 33, an interface 34 and a control section 35. Can be prepared.

The drive mechanism 30 changes the relative position between the substrate 1 and the mold 11. Alternatively, the drive mechanism 30 changes the relative position between the substrate 1 (substrate holding unit 2) and the mold holding unit 12. The drive mechanism 30 may include a substrate drive mechanism 26 that drives the substrate 1 or the substrate holder 2, and a die drive mechanism 27 that drives the mold 11 or the die holder 12.

The substrate driving mechanism 26 may include a substrate holding unit 2 that holds the substrate 1, a substrate stage 3 that holds the substrate holding unit 2, and an actuator 31 (for example, a linear motor or an air cylinder) that drives the substrate stage 3. .. The actuator 31 can be configured to drive the substrate stage 3 with respect to the X axis and the Y axis, for example. The substrate stage 3 is supported by the base surface plate 4. The substrate stage 3 may have a mechanism that drives the substrate holding unit 2 about the θZ axis. The substrate drive mechanism 26 preferably drives the substrate 1 about three axes of the X-axis, the Y-axis, and the θZ-axis, preferably the X-axis, the Y-axis, the Z-axis, the θX-axis, the θY-axis, and the θZ-axis. Can be configured to drive about an axis.

The mold driving mechanism 27 may include a mold holding unit 12 that holds the mold 11, and a head 13 that incorporates an actuator that drives the mold holding unit 12. The die driving mechanism 27 preferably drives the die 11 about three axes of the Z axis, the θX axis, and the θY axis, preferably, the X axis, the Y axis, the Z axis, the θX axis, the θY axis, and the θZ axis. It can be configured to drive about an axis. The mold driving mechanism 27 may include a sensor (not shown) that measures the force pressing the mold 11 against the curable composition IM on the substrate 1.

The substrate transport unit 22 can take the substrate 1 from outside the film forming apparatus 100 into the film forming apparatus 100 and transport the substrate 1 to the substrate holding unit 2. The mold conveying unit 32 can take the mold 11 from the outside of the film forming apparatus 100 into the film forming apparatus 100 and convey it to the mold holding unit 12. The mold 11 may have, for example, a circular or square outer shape. The mold 11 has a contact surface CS that contacts the curable composition IM on the substrate 1, and the contact surface CS can be flat. The mold 11 may have the same size as the substrate 1 or a size larger than the substrate 1, for example.

The dispenser (supply unit) 20 can be supported by the alignment shelf 14. The dispenser 20 may have a discharge port for discharging the curable composition IM so that the uncured curable composition IM is arranged on the substrate 1. The dispenser 20 can discharge the curable composition IM in a minute volume of, for example, about 1 pL (picoliter) toward the substrate 1 by a discharge method such as a piezo jet method or a micro solenoid method. The dispenser 20 may have one or a plurality of discharge ports.

The irradiation unit 24 irradiates the curable composition IM with energy for curing the curable composition IM between the substrate 1 and the mold 11. The mold holding unit 12 has a window W through which the curing energy from the irradiation unit 24 passes. The window W may be an opening provided in the mold holding unit 12, or may be a transmissive member (a member that transmits energy for curing) provided in such an opening. Similarly, the head 13 may also have a window W through which the curing energy from the irradiation section 24 passes. The size of the window W is smaller than that of the substrate 1. Further, the size of the window W is smaller than the size of the region where the film made of the cured product of the curable composition IM is to be formed. The irradiation unit 24 may have a size smaller than the maximum size of the dispenser 20, for example.

The top plate 6 supports the guide bar 8. The guide bar 8 penetrates the alignment shelf 14 and is connected to the head 13. The alignment shelf 14 is supported by the top plate 6 via the columns 10. On the alignment shelf 14, for example, a height measurement system (not shown) for measuring the height (flatness) of the substrate 1 held by the substrate holder 2 can be arranged. The height measuring system can measure the height of the substrate 1 by, for example, an oblique incident image shift method.

The alignment scope 23 can be supported by the alignment shelf 14. The alignment scope 23 can include an optical system and an imaging system for observing the reference mark provided on the substrate stage 3 and the alignment mark provided on the mold 11. However, when the mold 11 is not provided with the alignment mark, the alignment scope 23 is not used. The alignment scope 23 can measure the relative positions of the reference mark provided on the substrate stage 3 and the alignment mark provided on the mold 11. The measurement result can be used for alignment to correct the positional deviation.

The off-axis alignment scope 21 can be supported by the alignment shelf 14. The off-axis alignment scope 21 can be used for a global alignment process that detects alignment marks provided in a plurality of shot areas of the substrate 1 and determines the positions of the plurality of shot areas. The positional relationship between the mold 11 and the substrate stage 3 is obtained by using the alignment scope 23, and the positional relationship between the substrate stage 3 and the substrate 1 is obtained by using the off-axis alignment scope 21. Relative alignment with the region can be performed.

The cleaning unit 33 can clean the mold 11 while the mold 11 is held by the mold holding unit 12. The cleaning unit 33 is used, for example, to remove the curable composition IM remaining on the mold 11, particularly the contact surface CS of the mold 11, after separating the cured curable composition IM and the mold 11 on the substrate 1. sell. The cleaning unit 33 may wipe off the curable composition IM attached to the mold 11, or remove the liquid organic material adhered to the mold 11 using UV irradiation, wet cleaning, dry plasma cleaning, or the like. Good.

The control unit 35 controls the drive mechanism 30, the dispenser 20, the off-axis alignment scope 21, the substrate transfer unit 22, the mold transfer unit 32, the alignment scope 23, the irradiation unit 24, the cleaning unit 33, and the interface 34. From another point of view, the control unit 35 controls the film forming process of forming a film made of a cured product of the curable composition IM on the substrate 1 using the mold 11. The control unit 35 is, for example, a PLD (abbreviation of Programmable Logic Device) such as an FPGA (abbreviation of Field Programmable Gate Array), or an abbreviation of ASIC (Application Specific Integrated Program) or a program that incorporates an ASIC (Application Integrated Circuit). Alternatively, it may be configured by a dedicated computer or a combination of all or a part thereof.

The film forming process will be described with reference to FIG. First, as schematically shown in FIG. 2A, the curable composition IM is placed on the substrate 1 by the dispenser 20, and then the substrate 1 is positioned under the mold 11 by the substrate driving mechanism 26. It The substrate 1 may have a pattern 1a on its surface. The curable composition IM may be placed on the substrate 1 by, for example, ejecting the curable composition IM from the dispenser 20 while moving the substrate 1 by the substrate driving mechanism 26.

Then, as schematically shown in FIG. 2B, the drive mechanism 30 causes the curable composition IM on the substrate 1 and the contact surface CS of the mold 11 to come into contact with each other. The relative position with respect to is changed or adjusted. In one example, the mold 11 is lowered by the mold driving mechanism 27 so that the curable composition IM on the substrate 1 and the contact surface CS of the mold 11 come into contact with each other. Here, the contact surface C of the mold 11 may be pressed against the curable composition IM on the substrate 1. The contact surface CS of the mold 11 can be deformed into a shape similar to the surface shape of the substrate 1.

Next, as schematically shown in FIG. 2C, the irradiation energy is applied to the curable composition IM through the window W and the mold 11 by the irradiation section 24, and the curable composition IM is cured. It Then, as schematically shown in FIG. 2D, the cured curable composition IM on the substrate 1 and the mold 11 are separated by the drive mechanism 30. In one example, the mold 11 is raised by the mold drive mechanism 27 so that the cured curable composition IM on the substrate 1 and the mold 11 are separated. As a result, a film made of the cured product of the curable composition IM remains on the substrate 1. The surface irregularities of this film are smaller than the surface irregularities of the substrate 1. Therefore, this film can function as a flattening film.

FIG. 3 schematically shows the operation of the film forming apparatus 100. FIG. 4 shows a flowchart showing the operation of the film forming apparatus 100. The operation shown in FIGS. 3 and 4 is controlled by the control unit 35. In the example shown in FIG. 3, the mold 11 has a circular outer shape, and its size is larger than that of the substrate 1.

First, in step S401, the substrate 1 on which the curable composition IM is placed by the dispenser 20 or an external device is positioned under the mold 11 by the substrate driving mechanism 26, as schematically shown in FIG. To be done.

Next, in step S402, as schematically shown in FIG. 3B, the substrate is moved by the drive mechanism 30 so that the curable composition IM on the substrate 1 and the contact surface CS of the mold 11 come into contact with each other. The relative position between 1 and the mold 11 is changed or adjusted. In one example, the mold 11 is lowered by the mold driving mechanism 27 so that the curable composition IM on the substrate 1 and the contact surface CS of the mold 11 come into contact with each other. Here, the contact surface C of the mold 11 may be pressed against the curable composition IM on the substrate 1. In this state, the space between the surface of the substrate 1 and the contact surface CS of the mold 11 is waited until the curable composition IM is sufficiently filled.

Next, in step S403, as shown schematically in FIG. 3C, the irradiation unit 24 irradiates a part of the curable composition IM with the curing energy through the window W and the mold 11. It Thereby, the part of the curable composition IM is cured, and the substrate 1 and the mold 11 are bonded by the part. The part may be located in the central portion of the substrate 1, for example. Step S403 is an optional step. In the subsequent steps S404 and S405, when the relative position between the substrate 1 and the mold 11 is maintained, for example, when the mold 11 is fixed by another method, Step S403 is unnecessary. Such fixing of the mold 11 can be realized, for example, by providing the substrate holding portion 2 with a member that restricts the movement of the mold 11. Alternatively, in steps S404 and S405, step S403 is unnecessary even when the relative position between substrate 1 and mold 11 can be changed.

Next, in step S404, the holding of the mold 11 by the mold holding unit 12 is released. Then, in step S405, as shown schematically in FIG. 3D, the substrate 1 (or the mold bonded to the substrate 1 is separated by the drive mechanism 30 from the mold 11 to the mold holding portion 12). 11) and the relative position of the mold holding part 12 is changed or adjusted. As a result, the combined body of the substrate 1 and the mold 11 can be moved relative to the mold holding portion 12.

Next, in step S406, as shown schematically in FIGS. 3(e) and 3(f), the drive mechanism 30 moves the combined body of the substrate 1 and the mold 11 relative to the mold holding portion 12. Meanwhile, the irradiation unit 24 performs a process of irradiating the curable composition IM with curing energy. Irradiation of the curable composition IM with curing energy is performed through the window W and the mold 11. This treatment is performed in a state in which the mold 11 (the contact surface CS thereof) contacts the curable composition IM and the holding of the mold 11 by the mold holding unit 12 is released. Further, in this process, the drive mechanism 30 drives the substrate 1 so that the region where the film made of the cured product of the curable composition IM is to be formed is scanned with the curing energy and the curable composition IM is cured in the entire region. The relative position between the mold holding unit 12 and the mold holding unit 12 can be changed. Here, the portion of the curable composition IM that has been irradiated with energy in step S403 can be irradiated with energy in step S406 in consideration of it. More specifically, regarding the portion of the curable composition IM that has been irradiated with energy in step S403, step S406 is performed so that the total of the irradiation amount in step S403 and the irradiation amount in step S406 becomes the target irradiation amount. Irradiation of energy in can be done.

Next, in step S407, as shown schematically in FIG. 3G, the substrate 1 (the mold 11) and the mold holding unit 12 are moved by the drive mechanism 30 so that the mold 11 and the mold holding unit 12 come into contact with each other. The relative position of is changed or adjusted, and the die 11 is held by the die holder 12.

Next, in step S408, as schematically shown in FIG. 3H, the driving mechanism 30 separates the film made of the cured product of the curable composition IM on the substrate 1 and the mold 11. In one example, the mold 11 is moved up by the mold driving mechanism 27 so that the film made of the cured product of the curable composition IM on the substrate 1 and the mold 11 are separated. As a result, a film made of the cured product of the curable composition IM remains on the substrate 1.

As described above, in the film forming apparatus 100 of the present embodiment, the window W is irradiated by the irradiation unit 24 in a state where the mold 11 is in contact with the curable composition IM and the holding of the mold 11 by the mold holding unit 12 is released. The curable composition IM is irradiated with curing energy through the mold 11. With such a configuration, the curing of the curable raw composition IM in the entire region where the film is to be formed can be completed under the mold holding unit 12. Therefore, the present embodiment is advantageous in reducing the manufacturing cost and footprint of the film forming apparatus 100.

FIG. 5 schematically shows the film forming process when the size of the mold 11 is the same as the size of the substrate 1. The film forming process shown in FIG. 5 is the same as the film forming process shown in FIG. 3 except that the dimensions of the mold 11 are different.

In the film forming process shown in FIG. 3, the size of the mold 11 may be larger than the size of the substrate 1, for example, the size of the substrate 1 may be 300 mm in diameter and the size of the mold 11 may be 450 mm. In this case, it may be necessary to newly prepare peripheral equipment for handling the mold 11 (for example, a washing machine, a transfer machine, a carrier (FOUP, etc.), a transportation system). On the other hand, as illustrated in FIG. 5, when the size of the mold 11 is the same as the size of the substrate 1, peripheral equipment for handling the substrate 1 can be diverted to handle the mold 11. ..

Hereinafter, an article manufacturing method for manufacturing an article using the above film forming apparatus 100 will be described as an example. The article manufacturing method includes a film forming step of forming a film on the substrate 1 by the film forming apparatus 100, and a processing step of processing the substrate 1 on which the film is formed. Produce an article. The processing steps include, for example, a step of forming a photoresist film on the film, a step of forming a latent image on the photoresist film using an exposure device, and a step of developing the latent image to form a photoresist pattern. And a step of performing. The processing step may further include processing (eg, etching, ion implanting) the substrate 1 using the photoresist pattern.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the gist thereof.

1: substrate, 11: mold, 12: mold holding unit, 24: irradiation unit, 30: drive mechanism

Claims (10)

A film forming apparatus for forming a film made of a cured product of the curable composition by contacting a mold with the curable composition on a substrate to cure the curable composition,
A mold holding part having a window for passing energy for curing the curable composition, and holding the mold,
A drive mechanism that changes the relative position of the substrate and the mold holding unit;
An irradiation unit that irradiates the curable composition between the substrate and the mold with the energy through the window and the mold,
In a state where the mold is in contact with the curable composition, and the holding of the mold by the mold holding unit is released, the irradiation unit applies the curable composition to the curable composition through the window and the mold. The process of irradiating energy is performed,
In the process, the relative position is changed by the driving mechanism so that the region where the film is to be formed is scanned by the energy and the curable composition is cured.
A film forming apparatus characterized by the above. Before the treatment, the mold is held by the mold holding unit, and the energy is applied to a part of the curable composition by the irradiation unit in a state where the curable composition and the mold are in contact with each other. Will be
The film forming apparatus according to claim 1, wherein: The part of the curable composition is located in the central portion of the substrate,
The film forming apparatus according to claim 2, wherein. After the treatment, the mold is held by the mold holding unit, and the drive mechanism separates the film formed of the cured product of the curable composition from the mold.
The film forming apparatus according to any one of claims 1 to 3, characterized in that. In the processing, the relative position is changed by the drive mechanism in a state where the mold and the mold holding section are separated from each other,
The film forming apparatus according to any one of claims 1 to 4, characterized in that. The window size is smaller than the substrate,
The film forming apparatus according to any one of claims 1 to 5, wherein The size of the window is smaller than the area where the film is to be formed,
The film forming apparatus according to any one of claims 1 to 5, wherein The surface of the mold that contacts the curable composition is flat.
The film forming apparatus according to any one of claims 1 to 7, characterized in that. The surface of the mold that contacts the curable composition has a pattern,
The film forming apparatus according to any one of claims 1 to 7, characterized in that. Forming a film on a substrate by the film forming apparatus according to claim 1.
Processing the substrate having the film formed thereon,
An article manufacturing method comprising manufacturing an article from the substrate.

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