JPH07201660A - Solid electrolytic chip capacitor - Google Patents

Abstract

PURPOSE:To increase the volume to be occupied by a capacitor element in a solid electrolytic chip capacitor. CONSTITUTION:A cathode lead terminal 5 to be connected with the cathode layer 3 of a capacitor element 1 through a conductive adhesive has an L-shaped structure to be connected with the cathode layer 3 only on the side face. Alternatively, the cathode lead terminal 5 has a C-shaped structure to be connected with the cathode layer 3 only on the side face and the cathode layer 3 is fitted therein.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip type solid electrolytic capacitor, and more particularly to a cathode lead terminal 5 connected to a cathode layer 3.
Concerning the structure of.

[0002]

2. Description of the Related Art A conventional chip type solid electrolytic capacitor is
As shown in FIG. 7, the cathode lead terminal 5 was connected on the upper side of the cathode layer 3 (see, for example, Japanese Utility Model Laid-Open No. 56-137443).
Issue).

Alternatively, as shown in FIG. 8, a bending pool portion 8 is formed between the cathode lead terminal 5 and the side surface of the capacitor element 1.
And the cathode lead terminal 5 is connected to the lower side from the side surface of the capacitor element 1 via the conductive adhesive 7 (for example, Japanese Utility Model Laid-Open No. 62-104434).

Alternatively, as shown in FIG. 9, a cathode lead terminal 5 having a U-shaped connecting portion which is fitted from the upper side of the capacitor element 1 is connected (for example, Japanese Patent Laid-Open No. 56-14061).
No. 9).

Alternatively, as shown in FIG. 10, the connection portion with the cathode layer 3 has a U-shaped side surface and has a cathode lead terminal 5 having a structure in which the upper and lower surfaces of the cathode layer 3 are fitted (see, for example, Japanese Unexamined Patent Application Publication No. Hei 10 (1999) -242242). 3-
73510 publication).

[0006]

In each of the conventional chip type solid electrolytic capacitors, the cathode lead terminal 5 and the conductive adhesive 7 are thick because the upper side or the lower side of the capacitor element 1 is connected to the cathode lead terminal 5. Only capacitor element 1
Had to be thin.

As a result, the volume ratio of the capacitor element 1 to the volume of the chip-type solid electrolytic capacitor is low, and it is difficult to obtain a larger capacitance from the chip-type solid electrolytic capacitor having a constant volume.

[0008]

A chip type solid electrolytic capacitor of the present invention comprises a capacitor element 1 having a cathode layer 3 and an anode lead 2, an anode lead terminal 4 connected to the anode lead 2 by welding, and the cathode. Layer 3 and conductive adhesive 7
In the chip type solid electrolytic capacitor consisting of the cathode lead terminal 5 connected by the above and the resin 6 which covers the positive and negative electrode lead terminals 4 and 5 leaving the exposed portions, the connection portion with the cathode layer 3 is only the side surface. And has a cathode lead terminal 5 having an L-shaped structure.

Alternatively, the chip-type solid electrolytic capacitor of the present invention is characterized in that the connecting portion with the cathode layer 3 is U-shaped only on the side surface and has the cathode lead terminal 5 into which the side surface of the cathode layer 3 is fitted. .

[0010]

The present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view of a chip type solid electrolytic capacitor of one embodiment of the present invention, FIG. 2 is a sectional view thereof, and FIG. 3 is a perspective view of a connecting portion of a cathode lead terminal 5 with a cathode layer 3. It is a figure.

The cathode lead terminal 5 is bent in advance so as to have an L-shape, and the conductive adhesive 7 is provided inside the L-shape.
And was connected to the cathode layer 3 of the capacitor element 1. The anode lead 2 was connected to one end of the anode lead terminal 4 by welding. In this state, the conductive adhesive 7 is heated by heating.
After curing, the anode lead terminal 4 and the cathode lead terminal 5
Then, the exposed portions of the anode lead terminal 4 and the cathode lead terminal 5 were bent along the outer peripheral surface of the resin 7 to form a chip type solid electrolytic capacitor.

In a conventional chip-type solid electrolytic capacitor having a cathode lead terminal 5 connected from the side surface to the upper surface of the cathode layer 3 as shown in FIG. 7, the capacitor element 1 has a width of 3.8 mm and a thickness of 1. Although the size was 5 mm and the length was 4.0 mm, the chip-type solid electrolytic capacitor of the same shape of the present invention does not have the cathode lead terminal 5 on the upper surface of the cathode layer 3, so that the thickness of the capacitor element 1 can be increased. , The capacitor element 1 has a width of 3.4 mm, a thickness of 1.9 mm, and a length of 4.0.
The dimensions are mm. As a result, the volume of the capacitor element 1 can be increased from 22.8 mm ³ to 25.8 mm ³ by 13%.

FIG. 4 is a perspective view of a chip type solid electrolytic capacitor of another embodiment of the present invention, FIG. 5 is a sectional view thereof, and FIG. 6 shows a connecting portion of the cathode lead terminal 5 with the cathode layer 3. It is a perspective view.

The cathode lead terminal 5 is preliminarily bent so as to have a U-shape, and has a structure in which the side surface of the cathode layer 3 is fitted, and the capacitor element 1 of the chip-shaped solid electrolytic capacitor having the same shape according to the present invention. Is 3.2 mm wide and 1.9 m thick
The length is m and the length is 4 mm. As a result, the volume of the capacitor element 1 can be increased from 22.8 mm ³ to 24.3 mm ³ by 6%. Further, in this embodiment, since the cathode layer 3 is fitted, there is an advantage that the connection strength between the cathode layer 3 and the cathode lead terminal 5 is improved.

[0016]

As described above, according to the present invention, since the cathode lead terminal 5 is connected only to the side surface of the cathode layer 3 and has the L-shaped or U-shaped structure, the volume of the chip type solid electrolytic capacitor having a certain shape is increased. It is possible to increase the volume of the capacitor element 1 occupying the area, and as a result, it is possible to increase the electrostatic capacity of the chip type solid electrolytic capacitor having a certain shape.

[Brief description of drawings]

FIG. 1 is a perspective view of a chip-type solid electrolytic capacitor according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of the chip type solid capacitor shown in FIG.

3 is a perspective view of a connection portion of the cathode lead terminal 5 shown in FIG. 1 with the cathode layer 3. FIG.

FIG. 4 is a perspective view of a chip type solid electrolytic capacitor of another embodiment of the present invention.

5 is a cross-sectional view of the chip type solid electrolytic capacitor shown in FIG.

6 is a perspective view of a connection portion of the cathode lead terminal 5 shown in FIG. 4 with the cathode layer 3. FIG.

FIG. 7 is a sectional view of a conventional chip type solid electrolytic capacitor.

FIG. 8 is a cross-sectional view of a conventional chip type solid electrolytic capacitor and a perspective view of a cathode lead terminal.

FIG. 9 is a perspective view and a sectional view of a conventional chip type solid electrolytic capacitor.

FIG. 10 is a perspective view and a sectional view of a conventional chip type solid electrolytic capacitor.

[Explanation of symbols]

 1 Capacitor element 2 Anode lead 3 Cathode layer 4 Anode lead terminal 5 Cathode lead terminal 6 Resin 7 Conductive adhesive 8 Bending pool part 9 Rising part

Claims (2)

[Claims] 1. A capacitor element having a cathode layer and an anode lead, an anode lead terminal connected to the anode lead by welding, a cathode lead terminal connected to the cathode layer with a conductive adhesive, and the positive / negative electrode. A chip-type solid electrolytic capacitor made of a resin that covers the exposed portion of the cathode lead terminal and leaves the exposed portion of the cathode lead terminal, characterized in that the connection portion with the cathode layer has an L-shaped cathode lead terminal only on the side surface. Chip type solid electrolytic capacitor. 2. The chip-type solid electrolytic capacitor according to claim 1, wherein the connection portion with the cathode layer has a U-shape only on the side surface and has a cathode lead terminal that fits the side surface of the cathode layer.