JPH0719714Y2 - Polishing equipment - Google Patents

Description

[Detailed description of the device]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing device, and more particularly to a polishing device for stone materials.

[0002]

2. Description of the Related Art FIG. 2 is a view showing a conventional polishing apparatus, particularly a stone polishing apparatus (hereinafter referred to as a first conventional example). FIG. 2A is a plan view thereof and FIG. FIG.
4A and 4B are views showing another conventional stone polishing wheel (hereinafter referred to as a second conventional example). FIG. 4A is a plan view thereof and FIG. 4B is a sectional view thereof.

In FIG. 2, reference numeral 1 denotes a polishing diamond tip (hereinafter referred to as a polishing tip), which is composed of a sintered body obtained by mixing metal powder and diamond, molding the mixture into a rectangular shape with a die, and then sintering the mixture.

Reference numeral 2 denotes a rectangular base on which the polishing tip 1 is brazed with silver on a circular metal substrate 4. The metal substrate 4 has a water supply hole 5 and a drain hole 3 for reducing the weight of the substrate 4 in the central portion. The polishing tip 1 is attached to the water supply hole 5 side at intervals of 90 degrees.
Four pieces are fixed radially on the base 2 at intervals of 45 degrees on the peripheral side.

Since the conventional grindstone device has such a structure, when it is used, it is set in a grindstone rotation driving device (not shown), and the water supply hole 5 is used as usual.
Water is supplied from the ground and the polishing tip surface is manually or automatically applied to the stone material to be polished to polish it.

Next, another conventional stone polishing apparatus (hereinafter referred to as a second conventional example) will be described with reference to FIG.

In this stone polishing apparatus, twelve polishing chips 1 are fixed on a table 2 in the same positional relationship as in the first conventional example, and three chips are divided into four blocks at 90 degree intervals as one unit. The foaming resin 6 is filled flush with the periphery of the polishing tip 1 belonging to each block, and a groove extending radially from the water supply hole 5 formed between the filled foaming resin 6 is provided with a water channel 7.
It has a structure. The method of use is the same as the first conventional example.

[0008]

However, in the first conventional example, since the substrate is heavy because it is made of metal, the workability in transportation and mounting is poor. In addition, a metal-specific resonance sound is generated during polishing, which causes noise and deteriorates the working environment. Further, since the polishing tips are projected and the distance between them is wide, the chips directly contact the corner portion of the stone material to be polished and the corner portion is chipped, and the corner portion of the polishing chip is also chipped. Also,
Not only is the gap between the polishing tips 1 too wide and the cooling water splatters to make the work difficult, but also the splattering immediately causes the cooling effect of the cooling water on the polishing tips 1 to be weakened.

On the other hand, in the second conventional example, since water channels are provided, excessive scattering of cooling water is prevented, and since the polishing tip 1 is filled with foaming resin, the corners of the stone material to be ground are cut. Loss can be prevented. However, the fact that the polishing tip 1 is filled with the foaming resin reduces the cooling effect of the cooling tip 1 on the tip 1.

The present invention has been made in order to solve the above-mentioned conventional problems, and it is possible to prevent chipping of a corner portion of a stone material to be ground and chipping of a polishing tip, and a grinding stone for polishing with cooling water. It is an object of the present invention to provide a light-weight and easy-to-handle polishing apparatus that can improve the cooling effect of the above, can perform the polishing operation quietly.

[0011]

The polishing apparatus provided by the present invention is made of a light material such as a synthetic resin and has a substrate having a water supply hole in the center, and a radial spread centered on the water supply hole on the substrate. A plurality of grinding wheels arranged at intervals, a reinforcing frame surrounding each grinding wheel, and a water supply / drainage frame formed in a concentric shape by providing a discontinuous portion on the substrate, and The continuous portion is used as a water supply / drainage channel, and the surfaces of the polishing grindstone, the reinforcing frame and the water supply / drainage frame are formed flush with each other.

[0012]

(1) The water supply / drainage frame according to the present invention is annularly arranged so as to dam between the polishing grindstones arranged at wide intervals, and the discontinuity portion serves as the water supply / drainage channel, so that the cooling water is The water is discharged from the water supply / drainage channel while staying between the corner water supply / drainage frame and the reinforcement frame and being blocked by these.

Therefore, the polishing grindstone is effectively cooled by the cooling water. Further, the cooling water does not excessively scatter due to the rotation of the polishing device.

(2) Since the water supply / drainage frame in this invention is arranged as described above and is flush with the polishing grindstone and its reinforcing frame, the entire polishing surface is one flat surface.

For this reason, there is no possibility that the reinforcing frame or the water supply / drainage frame will hit the corners of the stone material to be ground and be chipped, or vice versa.

(3) Since the substrate in this invention is made of a light material such as synthetic resin, it is easy to carry and the workability in mounting is improved.

Further, for the same reason, the working environment is improved during the polishing work because it does not emit a resonance sound unlike the conventional metal substrate.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows a polishing apparatus of the embodiment, FIG. 1 (a) is a front view and FIG. 1 (b) is a sectional view. In the figure, the same reference numerals as those of the conventional example indicate the same or corresponding parts.

In FIG. 1, reference numeral 14 is a substrate made of a light material such as synthetic resin. Reference numeral 5 is a water supply hole formed in the center of the substrate 4. 1a and 1b are stones for polishing stones,
That is, it is a plurality of polishing chips radially arranged from the central portion of the substrate 14 in the same positional relationship as in the conventional example. The material of the polishing tips 1a and 1b is the same as that of the conventional example. The polishing tip 1a is arranged inside,
The polishing tip 1b is arranged outside.

Reference numeral 7 is a water supply / drainage channel, and 10 is polishing tips 1a, 1
It is a reinforcing frame of b, surrounding each polishing tip 1a, 1b,
It is to reinforce. Reference numerals 11a, 11b, and 11c denote water supply / drainage frames, and three water supply / drainage frames are provided concentrically on the substrate 14 with the water supply hole 5 as a center. Each water supply / drainage frame is a reinforcement frame 10.
It is connected to and is partially discontinuous. This portion forms the water supply / drainage channel 7. Arrows indicate the direction of water flow in the channel. The polishing chips 1a and 1b, the reinforcing frame 10, and the water supply / drainage frames 11a to 11c are flush with each other.
That is, they form the same plane.

When the above-mentioned grindstone device is used, this is set in a grindstone rotation driving device (not shown), and while the water is supplied from the water supply hole 5, the polishing chips 1a, 1b side is used as the stone material to be polished. Apply and rotate. At this time, the cooling water flows through the water supply / drainage channel 7 in the direction of the arrow, and the polishing tip 1a,
1b, each of them is cooled, and at the same time, the chips on the substrate 14 are washed away and discharged to the outside.

As described above, according to the embodiment, the water supply / drainage frames 11a-1a are provided between the reinforcing frames 10 of the polishing tips 1a, 1b.
Since 1c is formed in an annular shape by providing a discontinuous portion serving as the water supply / drainage channel 7, the cooling water is discharged from the water supply / drainage channel 7 while accumulating between the water supply / drainage frames 11a to 11c and the reinforcing frame 10. Therefore, the polishing tips 1a and 1b are effectively cooled. Further, for the same reason, the cooling water is the above-mentioned each frame 11a-
Blocked by 11c and 10. Therefore, the rotation of the polishing device prevents the cooling water from being excessively scattered.

The polishing chips 1a and 1b and the reinforcing frame 10 are also provided.
Since the water supply / drainage frames 11a to 11c form the same plane, there is no fear that the reinforcing frame 10 or the water supply / drainage frames 11a to 11c will hit the corners of the stone material to be ground, and conversely, the corners will be chipped. Disappear.

Further, since the substrate 14 is made of a light material such as a synthetic resin, it is not only easy to carry, but also the workability at the time of attachment to the drive device is improved. Further, for the same reason, the working environment is improved during the polishing work because it does not emit a resonance sound unlike the conventional metal substrate.

[0026]

As described above, according to the present invention, since it has the above-mentioned structure, the following effects can be obtained.

(1) It is possible to prevent chipping of the corners of the stone material to be ground and chipping of the polishing grindstone.

(2) The cooling effect of the polishing grindstone by the cooling water can be improved.

(3) The polishing operation can be performed quietly.

(4) Light and easy to handle.

[Brief description of drawings]

FIG. 1 is a plan view of an embodiment of the present invention.

FIG. 2 is a plan view of a first conventional example.

FIG. 3 is a plan view of a second conventional example.

[Explanation of symbols]

 1, 1a, 1b Polishing tip 5 Water supply hole 7 Water supply / drainage channel 10 Reinforcement frame 14 Substrate 11a, 11b, 11c Water supply / drainage frame In the drawings, the same reference numerals indicate the same or corresponding parts.

Claims (1)

[Scope of utility model registration request] 1. A substrate made of a light material such as a synthetic resin and having a water supply hole in the central portion, a plurality of polishing grindstones radially arranged around the water supply hole on the substrate at wide intervals, A reinforcing frame surrounding the grinding wheel and a water supply / drainage frame formed in a concentric shape by providing a discontinuous portion on the substrate, and the discontinuous part of the water supply / drainage frame serving as a water supply / drainage channel, and reinforced with the grinding wheel. A polishing device in which the surfaces of the frame and the water supply / drainage frame are formed flush with each other.