JPH0641804Y2 - Diamond polishing machine - Google Patents
Diamond polishing machineInfo
- Publication number
- JPH0641804Y2 JPH0641804Y2 JP4141588U JP4141588U JPH0641804Y2 JP H0641804 Y2 JPH0641804 Y2 JP H0641804Y2 JP 4141588 U JP4141588 U JP 4141588U JP 4141588 U JP4141588 U JP 4141588U JP H0641804 Y2 JPH0641804 Y2 JP H0641804Y2
- Authority
- JP
- Japan
- Prior art keywords
- diamond
- polishing
- polishing machine
- chips
- foam material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案はダイアモンド研摩盤に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a diamond polishing machine.
従来、石材や陶磁器等の研摩に使用するダイアモンド研
摩盤として、平円板の下面にダイアモンドチップを複数
個周方向に配列固植し、これらダイアモンドチップ間は
空隙部とし研摩水の排出部としたものがある。Conventionally, as a diamond polishing machine used for polishing stone materials, ceramics, etc., a plurality of diamond chips are arrayed and planted in the circumferential direction on the lower surface of a flat disk, and a gap is formed between these diamond chips to serve as a polishing water discharge part. There is something.
〔本考案が解決しようとする課題〕 前記従来の如くダイアモンドチップ間に空隙を形成した
ものにおいては、研摩水が研摩面に留まるとなく直ちに
空隙部より排出されるため、水の使用量が多くなり、研
摩時間が長く、かつ仕上がり面も充分でない問題があっ
た。[Problems to be solved by the present invention] In the case where the voids are formed between the diamond chips as in the conventional case, the polishing water is immediately discharged from the voids without staying on the polishing surface, so that a large amount of water is used. There was a problem that the polishing time was long and the finished surface was not sufficient.
そこで本考案は、前記の課題を解決するダイアモンド研
摩盤を提案することを目的とするものである。Then, this invention aims at proposing the diamond polishing machine which solves the said subject.
本考案は前記の課題を解決するために、基盤の下面に複
数個のダイアモンドチップを突出的に設けたものにおい
て、該ダイアモンドチップ間に含水性の発泡材を、その
下面をダイアモンドチップの下面と同一面にして固設し
たことを特徴とするものである。In order to solve the above problems, the present invention provides a plurality of diamond chips projectingly provided on a lower surface of a substrate, wherein a water-containing foam material is provided between the diamond chips, and the lower surface is a lower surface of the diamond chips. It is characterized by being fixed on the same surface.
図面に示す本考案の実施例において、１は円形の金属基
盤で、その下面にダイアモンドチップ２が突出的に固植
されている。また該ダイアモンドチップ２は複数個周方
向に適宜間隔を有して配置されている。尚、該ダイアモ
ンドチップ２は、その長手方向が図示の如く放射方向に
向けて設けてもよく、また周方向に向けてもよい。３は
エポキシ樹脂、マグネシヤ・セメント、セラミックス等
を原料として発泡させた含水性の発泡材で、前記ダイア
モンドチップ２の部分を除く全面に亘って基盤の下面に
埋込み的に固着されていると共にその下面はダイアモン
ドチップ２の下面と同一面に形成されている。尚基盤は
適宜手段によって、回転駆動装置に固着されるようにな
っている。In the embodiment of the present invention shown in the drawings, reference numeral 1 is a circular metal base, on the lower surface of which a diamond chip 2 is projectively fixed. A plurality of the diamond chips 2 are arranged at appropriate intervals in the circumferential direction. The diamond tip 2 may be provided with its longitudinal direction oriented in the radial direction as shown, or may be oriented in the circumferential direction. Reference numeral 3 is a water-containing foam material made of foaming epoxy resin, magnesia cement, ceramics or the like as a raw material, which is embedded and fixed to the lower surface of the substrate over the entire surface except the portion of the diamond chip 2 and its lower surface. Are formed on the same surface as the lower surface of the diamond chip 2. The base is fixed to the rotary drive device by appropriate means.
尚、前記発泡材３は、前記の如く全面に設けることな
く、ダイアモンドチップ２間において部分的に設けても
よい。The foam material 3 may be partially provided between the diamond chips 2 instead of being provided on the entire surface as described above.
以上のような構造であるから、被研摩材上に本考案のダ
イアモンド研摩盤を載置してこれを、研摩水を注水しな
がら回転研摩作動させることにより、その注水された研
摩水の一部は、ダイアモンドチップ間に設けられた発泡
材に吸水保持される。そのため、その保持された研摩水
が研摩面に付着されるので、新たに補給する研摩水は少
量でよく、前記従来の如く、ダイアモンドチップ間の空
隙部より直ちに排出されるものに比べて研摩水の使用量
が極めて少量となり（約1/10）、製造費の低減を図り得
る。また、研摩の際に生ずる砥くそが発泡材の表面に付
着保持されるため、その微粒な砥くそによって研摩面の
仕上がりが極めて良くなり、研摩面の光沢が良くなる上
に、研摩時間も前記従来のものに比べて約1/3と短くな
り、作業の能率化、製造費の低廉化が図り得る。Due to the above-mentioned structure, the diamond polishing machine of the present invention is placed on the material to be polished, and a rotary polishing operation is performed while pouring the polishing water. Is absorbed and held by the foam material provided between the diamond chips. Therefore, since the retained polishing water adheres to the polishing surface, a small amount of polishing water needs to be newly supplied, and compared with the conventional one that is immediately discharged from the gap between the diamond chips. The amount used is very small (about 1/10), and the manufacturing cost can be reduced. In addition, since abrasive grits generated during polishing are adhered to and retained on the surface of the foam material, the fine abrasive grits make the polished surface extremely good in finish and improve the gloss of the polished surface. Compared with the conventional one, it is about 1/3 shorter, which can improve work efficiency and reduce manufacturing costs.
図面は本考案の実施例を示すもので、第１図は発泡材を
一部除去した底面図、第２図は第１図におけるＡ−Ａ線
断面図である。 １……基盤、２……ダイアモンドチップ、 ３……発泡材The drawings show an embodiment of the present invention. FIG. 1 is a bottom view in which a foam material is partially removed, and FIG. 2 is a sectional view taken along the line AA in FIG. 1 ... Base, 2 ... Diamond chip, 3 ... Foam material
Claims (1)
を突出的に設けたものにおいて、該ダイアモンドチップ
間に含水性の発泡材を、その下面をダイアモンドチップ
の下面と同一面にして固設したことを特徴とするダイア
モンド研摩盤。1. A substrate having a plurality of diamond chips projectingly provided on a lower surface thereof, wherein a water-containing foam material is fixed between the diamond chips such that the lower surface is flush with the lower surface of the diamond chips. A diamond polishing machine characterized by that.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4141588U JPH0641804Y2 (en) | 1988-03-29 | 1988-03-29 | Diamond polishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4141588U JPH0641804Y2 (en) | 1988-03-29 | 1988-03-29 | Diamond polishing machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01148269U JPH01148269U (en) | 1989-10-13 |
| JPH0641804Y2 true JPH0641804Y2 (en) | 1994-11-02 |
Family
ID=31267850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4141588U Expired - Lifetime JPH0641804Y2 (en) | 1988-03-29 | 1988-03-29 | Diamond polishing machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0641804Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0715728Y2 (en) * | 1992-12-08 | 1995-04-12 | 乾研磨布紙製作株式会社 | Grinding body for grinder |
| JP5580130B2 (en) * | 2010-07-20 | 2014-08-27 | Ｈｏｙａ株式会社 | Manufacturing method of grinding pad and glass substrate for magnetic disk |
-
1988
- 1988-03-29 JP JP4141588U patent/JPH0641804Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01148269U (en) | 1989-10-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6454644B1 (en) | Polisher and method for manufacturing same and polishing tool | |
| US5453106A (en) | Oriented particles in hard surfaces | |
| US6273805B1 (en) | Grindstone and method of manufacturing the same | |
| US6428405B1 (en) | Abrasive pad and polishing method | |
| JPH0641804Y2 (en) | Diamond polishing machine | |
| JP2003053665A (en) | Dresser | |
| JP2009178785A (en) | Method and apparatus of polishing crystal wafer | |
| JPH0719714Y2 (en) | Polishing equipment | |
| JPH078137Y2 (en) | Grooving whetstone | |
| JPH0479053U (en) | ||
| KR970023800A (en) | Dressing method and apparatus of polishing cloth | |
| JPH11277445A (en) | Grinding wheel for polishing substrate and polishing device | |
| JP2001025974A (en) | Grinding wheel | |
| JPH0511967Y2 (en) | ||
| JPS5941010Y2 (en) | rotating whetstone | |
| JPH0911136A (en) | Wet polishing grinding wheel | |
| JPS60134555U (en) | Base plate for cutting hard and brittle materials, etc. | |
| JPS61226272A (en) | Grindstone for wafer grinding | |
| JPH0752043A (en) | Angular grinding wheel forming rotary dresser | |
| JPH02160474A (en) | Grindstone | |
| JPH11165254A (en) | Super abrasive grain lapping surface plate | |
| JPS6039454U (en) | rotary dresser | |
| JPS6394657U (en) | ||
| JPH0675655U (en) | Polishing machine | |
| JPS6364464U (en) |