JPH03131477A - Diamond wheel device for polishing stone material - Google Patents
Diamond wheel device for polishing stone materialInfo
- Publication number
- JPH03131477A JPH03131477A JP26372889A JP26372889A JPH03131477A JP H03131477 A JPH03131477 A JP H03131477A JP 26372889 A JP26372889 A JP 26372889A JP 26372889 A JP26372889 A JP 26372889A JP H03131477 A JPH03131477 A JP H03131477A
- Authority
- JP
- Japan
- Prior art keywords
- diamond
- water
- holes
- supplied
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 79
- 239000010432 diamond Substances 0.000 title claims abstract description 79
- 238000005498 polishing Methods 0.000 title claims description 34
- 239000004575 stone Substances 0.000 title claims description 19
- 239000000463 material Substances 0.000 title description 4
- 238000000227 grinding Methods 0.000 claims abstract description 47
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 45
- 239000007788 liquid Substances 0.000 claims abstract description 14
- 239000006061 abrasive grain Substances 0.000 claims description 18
- 239000011230 binding agent Substances 0.000 claims description 6
- 230000020169 heat generation Effects 0.000 abstract description 2
- 239000002245 particle Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000007517 polishing process Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000013505 freshwater Substances 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【発明の詳細な説明】
(イ)産業上の利用分野
本発明は、石材研磨用ダイヤモンド砥石装置に係り、詳
しくはダイヤモンド砥石に液体を供給する構造に関する
。DETAILED DESCRIPTION OF THE INVENTION (A) Field of Industrial Application The present invention relates to a diamond grindstone device for polishing stone materials, and more particularly to a structure for supplying liquid to a diamond grindstone.
(ロ)従来の技術
従来、石材研磨用ダイヤモンド砥石装置は、円盤状の基
台下面に、ダイヤモンド砥粒な結合剤中に点在してなる
ダイヤモンド砥石を固着し、かつ前記基台の中央部に水
供給用の貫通孔を形成して構成されている。(B) Conventional technology Conventionally, a diamond grinding wheel device for stone polishing has a diamond grinding wheel dotted in a binder such as diamond abrasive grains fixed to the lower surface of a disc-shaped base, and the center part of the base is fixed to the lower surface of a disc-shaped base. It is constructed by forming a through hole for water supply.
そして、該ダイヤモンド砥石装置は、モータ等にて回転
駆動されると共に、中央貫通孔から水が供給され、該水
により研磨面を洗い流しながらダイヤモンド砥石にて研
磨される。The diamond grindstone device is rotationally driven by a motor or the like, and water is supplied from a central through hole, and the diamond grindstone performs polishing while washing the polishing surface with the water.
これにより、墓石等の石材を研磨加工するには、粒径の
大きい(粒度の小さい)ダイヤモンド砥石から順次粒径
の小さい(粒度の大きい)砥石を用いて、石材表面の粗
さを順次高度に仕上げていく。As a result, when polishing stones such as tombstones, the roughness of the surface of the stone is gradually increased by using diamond grinding wheels with large grain sizes (small grain sizes) and then using grinding stones with small grain sizes (large grain sizes). I'll finish it.
(ハ)発明が解決しようとする課題
ところで、ダイヤモンド砥石は、放射状に配置されてお
り、半径に比例して周速が速くなる関係上、外径側に位
置する程その仕事量が大きくなる。しかし、該ダイヤモ
ンド砥石による研磨仕事中に、冷却作用、浸透及び洗浄
作用等のため供給される水は基台中央部のみから流下さ
れるため、仕事量の小さい内径部分に対しては清浄な水
が常に供給されるが、仕事量の大きい外径部分に対して
は、内径部分にて使用された水が遠心力により飛散され
るだけで、水の供給量及びその清浄度において充分でな
い。(C) Problems to be Solved by the Invention By the way, diamond grindstones are arranged radially, and the circumferential speed increases in proportion to the radius, so that the closer to the outer diameter side the diamond grindstones are located, the greater the amount of work done by the diamond grindstones. However, during polishing work using the diamond grindstone, the water supplied for cooling, penetrating, and cleaning purposes flows down only from the center of the base. However, water used in the inner diameter portion is simply scattered by centrifugal force to the outer diameter portion where the amount of work is large, and the amount of water supplied and its cleanliness are not sufficient.
この結果、ダイヤモンド砥石の外径部は、水による冷却
が充分でなく、結合剤が軟化してダイヤモンド砥粒が脱
落しやすくなり、また砥粒と研磨面との間に浸透する水
の量が少ないと共に脱落砥粒及び研磨層等がその中に混
在し、充分な洗浄作用ができずに目づまり等を生じやす
くなり、研磨能率を低下してしまう。As a result, the outer diameter of the diamond grinding wheel is not sufficiently cooled by water, the binder softens and the diamond abrasive grains easily fall off, and the amount of water that permeates between the abrasive grains and the polishing surface increases. If the amount is small, fallen abrasive grains, polishing layers, etc. will be mixed therein, and sufficient cleaning action will not be possible, resulting in clogging, etc., which will reduce polishing efficiency.
特に、粒径の小さなダイヤモンド砥石を用いる場合、上
述した高温化及び洗浄不良による不具合が顕著に表われ
、研磨不能になることがある。In particular, when a diamond grindstone with a small particle size is used, the above-mentioned problems due to high temperature and poor cleaning become noticeable, and polishing may become impossible.
そこで、本発明は、仕事量の大きい外径側に位置するダ
イヤモンド砥石にも直接液体を供給し、もフて上述課題
を解決したダイヤモンド砥石装置を提供することを目的
とするものである。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a diamond grinding wheel device which can also directly supply liquid to the diamond grinding wheel located on the outer diameter side where the amount of work is large, thereby solving the above-mentioned problems.
(ニ)課題を解決するための手段
本発明は、上述事情に鑑みなされたものであって、例え
ば第1図、第2図、第6図及び第7図に示すように、ダ
イヤモンド砥粒を結合剤中に点在してなるダイヤモンド
砥石(1)を、円盤状の基台(2)下面に固定してなる
石材研磨用ダイヤモンド砥石装置(3)において、前記
基台(2)上面にケース部材(5)を固定して水溜め空
間(6)を形成すると共に、該基台(2)に、異なる半
径上に多数の貫通孔(71)、(72・・・)(73・
・・)、・・・を形成して、前記水溜め空間(6)に供
給された液体を前記貫通孔(7・・・)を通って前記ダ
イヤモンド砥石(1)の異なる半径上に導いてなる、こ
とを特徴とする。(d) Means for Solving the Problems The present invention has been made in view of the above circumstances, and as shown in FIGS. 1, 2, 6 and 7, for example, diamond abrasive grains are used. In a diamond grinding stone device (3) for stone polishing, in which diamond grinding wheels (1) dotted in a binder are fixed to the lower surface of a disc-shaped base (2), a case is attached to the upper surface of the base (2). The member (5) is fixed to form a water reservoir space (6), and the base (2) is provided with a large number of through holes (71), (72...) (73...) on different radii.
...), ... to guide the liquid supplied to the water reservoir space (6) through the through hole (7...) onto different radii of the diamond grinding wheel (1). It is characterized by becoming.
(ホ)作用
以上構成に基づき、ダイヤモンド砥石装置(3)はモー
タ゛等にて回転されると共に、水溜め空間(6)に液体
(水)が供給され、更に該液体は異なる半径上に位置す
る多数の貫通孔(7)、(7□)、(73)・・・から
ダイヤそンド砥石(1)に供給される。これにより、ダ
イヤモンド砥石(1)は、内径側部分が中央部貫通孔(
7)から供給される液体(水)により常に洗い流されて
冷却されることは勿論、外径側部分はその仕事量に応じ
た多量のかつ清浄な液体(水)が円周上の貫通孔(7□
)、(73)・・・を通って常に供給され、仕事量に応
じて発熱量及び研削量も大きいのにかかわらず、研磨面
及び砥石(1)を確実に冷却すると共に、研磨層等を確
実に洗い流す。(E) Function Based on the above configuration, the diamond grinding wheel device (3) is rotated by a motor etc., liquid (water) is supplied to the water reservoir space (6), and the liquid is located on different radii. It is supplied to the diamond grindstone (1) through a large number of through holes (7), (7□), (73), . . . . As a result, the inner diameter side of the diamond grinding wheel (1) has a central through hole (
Of course, the outer diameter side part is constantly flushed and cooled by the liquid (water) supplied from the through hole ( 7□
), (73)..., and although the heat generation and grinding amount are large depending on the amount of work, it reliably cools the polishing surface and the grinding wheel (1), and also cools the polishing layer etc. Make sure to wash it off.
なお、上記カッコ内の符号は、図面と対照するものであ
るが、何等構成を限定するものではない。Note that the reference numerals in parentheses above are used to contrast with the drawings, but do not limit the structure in any way.
(へ)実施例
以下、図面に沿って本発明による実施例について説明す
る。(F) Embodiments Hereinafter, embodiments of the present invention will be described with reference to the drawings.
石材研磨用ダイヤモンド砥石装置3は、第1図及び第2
図に示すように、平面視円盤状からなる基台2を有して
おり、該基台2は中心部及び半径の異なる円周上に多数
の貫通孔7□、72・・・7、・・・が形成されている
。また、該基台2の下面には接合部9及びダイヤモンド
砥石1からなる多数のユニット12.13が固着されて
おり、また該基台2の上面には盆状のケース部材5が固
着されている。更に、該ケース部材5の上面中央部には
連結部材15が固定されており、該連結部材15はその
ボス部側面に上方に開口する切欠き溝15aが形成され
ている。また、回転駆動軸16はその中央に水供給用の
孔17が形成されていると共に、その下端部に前記切欠
き溝15aに係合して一体に連結するピン19.19が
植設されており、かつ図示しない上部にはモータからの
回転が伝達されるプーリが固定されていると共に水供給
用ホースが連結されている。The diamond grindstone device 3 for stone polishing is shown in FIGS. 1 and 2.
As shown in the figure, the base 2 has a disk shape in plan view, and the base 2 has a large number of through holes 7□, 72...7, . ... is formed. Further, a large number of units 12.13 each consisting of a joint 9 and a diamond whetstone 1 are fixed to the lower surface of the base 2, and a tray-shaped case member 5 is fixed to the upper surface of the base 2. There is. Further, a connecting member 15 is fixed to the center of the upper surface of the case member 5, and a notch groove 15a opening upward is formed in the side surface of the boss portion of the connecting member 15. Further, the rotary drive shaft 16 has a hole 17 for water supply formed in its center, and a pin 19.19 is implanted at the lower end thereof to engage with the notch groove 15a and connect them together. A pulley to which rotation from the motor is transmitted is fixed to the upper part (not shown), and a water supply hose is connected thereto.
また、ケース部材5はその中央部に連通孔2゜が形成さ
れていると共に、基台2の上面との間で水溜め空間6を
形成しており、前記回転駆動軸16の中央孔17に供給
された水は連通孔2oを通って水溜め空間6に導かれ、
そして基台2に形成された多数の貫通孔71 、7 m
・・・、73・・・からダイヤモンド砥石ユニット12
.13方向に流下する。In addition, the case member 5 has a communication hole 2° formed in its center, and also forms a water reservoir space 6 with the upper surface of the base 2. The supplied water is led to the water reservoir space 6 through the communication hole 2o,
A large number of through holes 71, 7 m formed in the base 2
..., 73... to diamond grinding wheel unit 12
.. It flows down in 13 directions.
一方、ダイヤモンド砥石ユニット12.13は短辺が円
弧からなる2種類の長方形状からなり、基台6の下面に
、短尺側ユニット13を内径側にかつ長尺側ユニット1
2を外径側に位置して放射状に設置されている。そして
、砥石ユニット12(13)は、第4図に詳ホするよう
に、合成樹脂からなる接合部9が基台2下面に固着され
、かつ該接合部9の他側面にダイヤモンド砥石1が固着
されてなる。該ダイヤモンド砥石1は、フェノール樹脂
等の合成樹脂からなる結合剤20中に、所定粒径からな
るダイヤモンド砥粒21を所定集中度で点在すると共に
、Al2203等のフィラー材を混入してなる。On the other hand, the diamond grinding wheel units 12 and 13 have two types of rectangular shapes with short sides having circular arcs.
2 are located on the outer diameter side and are installed radially. As shown in detail in FIG. 4, the grindstone unit 12 (13) has a joint 9 made of synthetic resin fixed to the lower surface of the base 2, and a diamond grindstone 1 fixed to the other side of the joint 9. It will be done. The diamond grinding wheel 1 is made of a binder 20 made of a synthetic resin such as a phenol resin, in which diamond abrasive grains 21 having a predetermined particle size are scattered at a predetermined concentration, and a filler material such as Al2203 is mixed therein.
本実施例は以上のような構成からなるので、ダイヤモン
ド砥石装rIt3は、モータ等により回転駆動軸16が
回転されると共にその中央孔17にホースから水が供給
され、この状態でダイヤモンド砥石先端部Cを墓石等の
石材22の研磨面Aに接触する。これにより、ダイヤモ
ンド砥石1は、水溜め空間6内の水が中央孔7、及び多
数の円周上孔73・・・、7.・・・から供給されてい
る状態で石材22の研磨面Aに対して所定周速度で回転
し、そのダイヤモンド砥粒21による微小切り刃により
研磨面Aを微少量研削して、石材1の表面を研磨する。Since the present embodiment has the above-described configuration, the diamond grinding wheel device rIt3 has its rotary drive shaft 16 rotated by a motor or the like, and water is supplied from the hose to its central hole 17, and in this state, the tip of the diamond grinding wheel is rotated. C is brought into contact with the polished surface A of a stone 22 such as a tombstone. As a result, the diamond grindstone 1 allows water in the water reservoir space 6 to flow through the central hole 7 and a large number of circumferential upper holes 73 . . . , 7 . ... rotates at a predetermined circumferential speed with respect to the polished surface A of the stone 22, and grinds the polished surface A by a minute amount with the micro-cutting blade made of the diamond abrasive grains 21, thereby grinding the surface of the stone 1. Polish.
この際、ダイヤモンド砥石1は、基台2の中心からの距
離に比例して周速が速くなり、従つて外径側に位置する
程その仕事量が大きくなるが、水が中央孔71だけでは
なく、異なる円周上にある多数の孔7.・・・、7.・
・・からも供給され、仕事量の大きい外径側に位置する
ダイヤモンド砥石1は、新しい水が常に多量に供給され
、研磨粉を素早く洗い流すと共に、砥石1及び石材22
を確実に冷却する。At this time, the circumferential speed of the diamond grinding wheel 1 increases in proportion to the distance from the center of the base 2, and therefore the amount of work increases as it is located on the outer diameter side. 7. Multiple holes on different circumferences without any problems. ..., 7.・
The diamond grinding wheel 1, located on the outer diameter side where the work is large, is always supplied with a large amount of fresh water to quickly wash away the polishing powder, and the diamond grinding wheel 1 and the stone 22 are also supplied with fresh water.
to ensure cooling.
ついで、第3図(a) 、 (b)に沿って、一部変更
した実施例について説明する。Next, a partially modified embodiment will be described with reference to FIGS. 3(a) and 3(b).
本実施例によるダイヤモンド砥石1は、結合剤20中に
捲めて粒径の小さなダイヤモンド粉末例えば30[μm
]以下望ましくは8[μm]以下のダイヤモンド砥粒3
を比較的高い集中度で点在すると共にAβtO3等のフ
ィラー材を混入してなり、かつ多数の溝27により比較
的低い高さの突条形状に形成されて、その研磨面Aと接
触する部分Cが、2.5[mm]より薄い幅B、望まし
くは2.0[mm]より薄い幅からなる、薄幅平行形状
となっている。そして、該薄幅平行形状のダイヤモンド
砥石1は、接合部9に接着してユニット12(又は13
)を構成し、第1図に示すように基台2の下面に放射状
に固定される。The diamond grinding wheel 1 according to this embodiment is made by rolling diamond powder with a small particle size, for example, 30 [μm] in a binder 20.
] or less, preferably 8 [μm] or less diamond abrasive grains 3
are scattered at a relatively high concentration, and a filler material such as AβtO3 is mixed therein, and is formed into a protrusion shape with a relatively low height by a large number of grooves 27, and is in contact with the polished surface A. C has a thin parallel shape with a width B smaller than 2.5 [mm], preferably smaller than 2.0 [mm]. The thin parallel diamond grinding wheel 1 is attached to the unit 12 (or 13) by adhering to the joint 9.
) and are fixed radially to the lower surface of the base 2 as shown in FIG.
本実施例は以上のような構成からなるので、前記実施例
と同様に、中央孔71 +多数の円周上孔72・・・、
7.・・・より水が流下された状態でダイヤモンド砥石
1が回転し、その微小砥粒21にて石材研磨面Aを鏡面
に仕上げる。Since this embodiment has the above-mentioned configuration, similarly to the previous embodiment, a central hole 71 + a large number of circumferential upper holes 72 . . .
7. ...The diamond whetstone 1 rotates with more water flowing down, and the polished surface A of the stone is finished into a mirror surface with the fine abrasive grains 21.
この際、第1図に示すような研磨面Aとの接触部が広い
ダイヤモンド砥石1の場合、極めて微小なダイヤモンド
砥粒21に起因してその切り刃及びチップポケットも微
小である関係上、第4図(b)に示すように、石材1の
研磨面Aと砥石2との間に水の1wが介在し、該水1w
がダイヤモンド砥粒21による切り刃と研削面Aとの間
に研削に充分な接触圧力を生ずることを阻害し、これに
よりダイヤモンド砥石1による研磨を困難にする。特に
、研磨面Aに供給される水が汚れており、研磨屑又は肌
落砥粒23が混在すると、ダイヤモンド砥粒21による
切り刃が研磨面Aに届かずに、研磨加工を全く不可能に
してしまう。At this time, in the case of a diamond whetstone 1 that has a wide contact area with the polishing surface A as shown in FIG. As shown in FIG. 4(b), 1w of water is interposed between the polished surface A of the stone 1 and the grindstone 2, and the water 1w
This prevents generation of sufficient contact pressure for grinding between the cutting edge by the diamond abrasive grains 21 and the grinding surface A, thereby making polishing by the diamond grindstone 1 difficult. In particular, if the water supplied to the polishing surface A is dirty and contains polishing debris or abrasive grains 23, the cutting edge formed by the diamond abrasive grains 21 will not reach the polishing surface A, making polishing completely impossible. It ends up.
本実施例にあっては、第4図(a)に示すように、ダイ
ヤモンド砥石1の接触部Cは、極めて幅狭の形状からな
るので、水Wが研磨面Aとの間に介在しても、接触面積
が極めて小さい関係上、研磨面Aとの間に大きな接触圧
を確保することかでき、粒径の極小なダイヤモンド砥粒
21であっても、その微小な切り刃及びチップポケット
により研磨面Aを鏡面状に仕上げることができる。また
この際、異なる半径上にある多数の貫通孔72・・・、
73・・・から常に清浄な水が研磨面Aに供給され、研
磨屑及°び脱落砥粒23は洗い流され、特に、第3図に
示すように、ダイヤモンド砥石1が半径方向に延びる平
行突条形状からなると、その内径側に位置する貫通孔7
□・・・からの水が装置1の回転に基づく遠心力により
平行溝27に沿ワて放射状に流れ、孔73・・・からの
水と相俟って研磨屑等を素早く洗い流す。In this embodiment, as shown in FIG. 4(a), the contact portion C of the diamond grinding wheel 1 has an extremely narrow shape, so water W is interposed between it and the polishing surface A. Also, because the contact area is extremely small, it is possible to secure a large contact pressure with the polishing surface A, and even with the extremely small diamond abrasive grains 21, the fine cutting edges and chip pockets Polished surface A can be finished to a mirror finish. Also, at this time, a large number of through holes 72 on different radii...
Clean water is always supplied to the polishing surface A from 73..., and the polishing debris and fallen abrasive grains 23 are washed away. In particular, as shown in FIG. If it has a strip shape, the through hole 7 located on the inner diameter side
The water from □ flows radially along the parallel grooves 27 due to the centrifugal force caused by the rotation of the device 1, and together with the water from the holes 73, polishing debris etc. are quickly washed away.
ついで、第5図、第6図及び第7図に沿って一部変更し
た実施例について説明する。Next, an embodiment partially modified from FIGS. 5, 6, and 7 will be described.
第3図に示すようにダイヤモンド砥石1が平行突条形状
であると、幅Bが極めて狭い関係上、使用状況によつて
は砥石1が割れる虞れがあるが、第5図に示す実施例は
、それを改善するものである。即ち、ダイヤモンド砥石
1は、放射方向に延びる多数の平行突条30・・・の外
に、所定間隔で平行突条30・・・を横方向に連結する
横リブ31及び縁部32を備えた格子状形状からなり、
強度上強い構造になっている。If the diamond grinding wheel 1 has a parallel protruding shape as shown in FIG. 3, the width B is extremely narrow, so there is a risk that the grinding wheel 1 will break depending on the usage conditions. However, the embodiment shown in FIG. is an improvement on that. That is, the diamond grindstone 1 includes, in addition to a large number of parallel protrusions 30 extending in the radial direction, horizontal ribs 31 and edges 32 that laterally connect the parallel protrusions 30 at predetermined intervals. Consisting of a grid-like shape,
It has a strong structure.
また、第6図に示す実施例は、ダイヤモンド砥石2が、
放射状突条33・・・及び円周状突条35・・・を組合
せてなる網目形状からなる。そして、円周状突条35に
は多数の切れ目36・・・が形成されており、また基台
2には中央部に貫通孔71が形成されていると共に、異
なる半径上における放射状突条33及び円周状突条35
にて囲まれる空部37・・・にそれぞれ貫通小孔72・
−* + 73・・・ 7゜aha 、 7 !l・・
・が形成されている。Further, in the embodiment shown in FIG. 6, the diamond grindstone 2 is
It has a mesh shape formed by combining radial protrusions 33 and circumferential protrusions 35. A large number of cuts 36 are formed in the circumferential protrusion 35, and a through hole 71 is formed in the center of the base 2, and the radial protrusion 33 is formed on different radii. and circumferential protrusion 35
A small through hole 72 is formed in the hollow part 37 surrounded by
-* + 73... 7゜aha, 7! l...
・is formed.
従って、本実施例は、幅狭(2,5++ua以下)の多
数の突条33,35が基台2の裏面全面に形成され、該
全面に亘る突条33,35に均等にかつ大きな接触圧を
作用し、かつ中心孔71及び全面に亘る小孔7□+ 7
317417 s・・・から基台2全面に略々均等に水
が供給され、更に該水は切れ目36・・・に沿って素早
く排出される。これにより、突条33,35は、互に連
結された強度上有利な構造になっていると共に、研磨面
との間に大きな接触圧を作用して研磨加工を行え、かつ
ダイヤモンド砥石1の仕事量に応じて外径方向に行くに
従って大量の水を供給し、かつ切れ口36に沿ヮて研磨
粉を連続して素早く排出し得る。Therefore, in this embodiment, a large number of narrow (2.5++ ua or less) protrusions 33, 35 are formed on the entire back surface of the base 2, and a large contact pressure is applied evenly to the protrusions 33, 35 over the entire surface. and the center hole 71 and the small hole 7□+7 covering the entire surface.
Water is supplied almost evenly over the entire surface of the base 2 from 317417s..., and the water is quickly discharged along the cuts 36... As a result, the protrusions 33 and 35 are connected to each other and have an advantageous structure in terms of strength, and the polishing process can be performed by applying a large contact pressure to the polishing surface, and the diamond grinding wheel 1 can perform the polishing process. A large amount of water can be supplied in the outer diameter direction according to the amount, and the polishing powder can be continuously and quickly discharged along the cut 36.
また、第7図に示す実施例は、ダイヤモンド砥石ユニッ
ト40.41が円盤状に構成されており、該円盤状ユニ
ット40.41の縁部に所定幅からなる円環状のダイヤ
モンド砥石1が固着されている。そして、大径側ユニッ
ト40が外径側に、かつ内径側ユニット41が内径側に
位置して、多数のユニットが基台2の下面に固定されて
いる。また、該基台2には中央貫通孔7.の外、各ユニ
ット40.41の内周部にそれぞれ貫通するように、異
なる円周上に多数の貫通孔7.・・・73・・・が形成
されている。Further, in the embodiment shown in FIG. 7, a diamond grinding wheel unit 40.41 is configured in a disk shape, and an annular diamond grinding wheel 1 having a predetermined width is fixed to the edge of the disk shaped unit 40.41. ing. A large number of units are fixed to the lower surface of the base 2, with the large diameter unit 40 located on the outer diameter side and the inner diameter unit 41 located on the inner diameter side. The base 2 also has a central through hole 7. In addition, a large number of through holes 7. are formed on different circumferences so as to penetrate through the inner circumference of each unit 40, 41, respectively. ...73... is formed.
従って、本実施例も前述実施例と同様に、各ユニット4
0・・・、41・・・に直接清浄な水が供給された状態
で、ダイヤモンド砥石1により研磨加工が行われる。Therefore, in this embodiment as well, each unit 4
0..., 41... are directly supplied with clean water, and the diamond grindstone 1 performs the polishing process.
なお、上述実施例は、レジンボンドのダイヤモンド砥石
について説明したが、メタルボンド等の他のダイヤモン
ド砥石にも同様に適用し得ることは勿論であり、また砥
石の形状は上述した実施例に限らず、他の形状の砥石に
も同様に適用できる。In addition, although the above-mentioned example explained a diamond whetstone of resin bond, it is of course applicable to other diamond whetstones such as metal bond, and the shape of the whetstone is not limited to the above-mentioned example. , can be similarly applied to grindstones of other shapes.
(ト)発明の詳細
な説明したように、本発明によると、基台(2)の上面
にケース部材(5)を固定して水溜め空間(6)を設け
ると共に基台(2)の異なる半径上に多数の貫通孔(7
1)、(72)、(7、)・・・を形成しただけの極め
て簡単で安価な構成でありながら、ダイヤモンド砥石(
1)の異なる半径上に液体をそれぞれ供給するので、外
径側に位置するダイヤモンド砥石(1)にも清浄な水を
直接供給することができ、ダイヤモンド砥石の内径側部
分は勿論、仕事量の大きい外径側部分も確実に冷却する
と共に、研削屑及び脱落砥粒等を確実に洗い流すことが
でき、研削熱による石材の変質及び脱落砥粒の増加等を
防止できると共に、目づまり等を防止して、研磨加工の
能率を向上することができる。(g) As described in detail, according to the present invention, the case member (5) is fixed to the upper surface of the base (2) to provide the water reservoir space (6), and the base (2) has different Numerous through holes (7
1), (72), (7,),...
Since the liquid is supplied to different radii of (1), clean water can be directly supplied to the diamond grinding wheel (1) located on the outer diameter side, and it is possible to directly supply clean water to the diamond grinding wheel (1) located on the outer diameter side. In addition to reliably cooling the large outer diameter side, it also reliably washes away grinding debris and fallen abrasive grains, preventing deterioration of the stone and increase in fallen abrasive grains due to grinding heat, as well as preventing clogging, etc. As a result, the efficiency of polishing can be improved.
特に、粒径の小さなダイヤモンド砥石(1)を用いる場
合、常に清浄な液体を連続して供給して、すべてのダイ
ヤモンド砥石研磨面における研削屑及び脱落砥粒を洗い
流して、微小な切り刃及びチップポケットであってもそ
れが常に確実に機能し得る状態に保持することができ、
鏡面仕上げ等の精度の高い研磨加工をもダイヤモンド砥
石にて行い得るようにすることができる。In particular, when using a diamond grinding wheel (1) with a small particle size, always supply clean liquid continuously to wash away grinding debris and fallen abrasive grains from all the polishing surfaces of the diamond grinding wheel, and remove minute cutting edges and chips. Even if it is in a pocket, it can be kept in a state where it can function reliably at all times,
Highly accurate polishing such as mirror finishing can also be performed using a diamond grindstone.
第1図は本発明の実施例に係るダイヤモンド砥石装置を
示す底面図、第2図は第1図■−■線による断面図であ
る。また、第3図は他の実施例を示す図で、(a)はダ
イヤモンド砥石ユニットを示す底面図、(b)はその横
断面図である。そして、第4図は砥石の作用状態を示す
図で、(a)は本発明に係る断面図、(b)は従来例に
係る断面図である。また、第5図は第3図に示す実施例
を一部変更した実施例を示す底面図である。そして、第
6図及び第7図はそれぞれ異なる実施例を示すダイヤモ
ンド砥石装置を示す底面図である。
1・・・ダイヤモンド砥石 2・・・基台3・・・
ダイヤモンド砥石装置
5・・・ケース部材
6・・・水溜め空間
6・・・貫通孔FIG. 1 is a bottom view showing a diamond grindstone device according to an embodiment of the present invention, and FIG. 2 is a sectional view taken along the line 1--2 in FIG. Moreover, FIG. 3 is a figure which shows another Example, (a) is a bottom view which shows a diamond grindstone unit, (b) is its cross-sectional view. FIG. 4 is a diagram showing the operating state of the grindstone, in which (a) is a cross-sectional view according to the present invention, and (b) is a cross-sectional view according to a conventional example. Moreover, FIG. 5 is a bottom view showing an embodiment that is a partially modified version of the embodiment shown in FIG. 6 and 7 are bottom views showing diamond grindstone devices showing different embodiments, respectively. 1...Diamond whetstone 2...Base 3...
Diamond grindstone device 5...Case member 6...Water reservoir space 6...Through hole
Claims (1)
モンド砥石を、円盤状の基台下面に固定してなる石材研
磨用ダイヤモンド砥石装置において、 前記基台上面にケース部材を固定して水溜め空間を形成
すると共に、該基台に、異なる半径上に多数の貫通孔を
形成して、前記水溜め空間に供給された液体を前記貫通
孔を通って前記ダイヤモンド砥石の異なる半径上に導い
てなる、 石材研磨用ダイヤモンド砥石装置。[Claims] 1. A diamond grinding stone device for stone polishing, in which a diamond grinding wheel having diamond abrasive grains scattered in a binder is fixed to the lower surface of a disc-shaped base, comprising: a case on the upper surface of the base; A water reservoir space is formed by fixing the member, and a large number of through holes are formed on the base at different radii, and the liquid supplied to the water reservoir space is passed through the through holes to the diamond grinding wheel. A diamond grinding wheel device for stone polishing that is guided on different radii.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26372889A JPH03131477A (en) | 1989-10-09 | 1989-10-09 | Diamond wheel device for polishing stone material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26372889A JPH03131477A (en) | 1989-10-09 | 1989-10-09 | Diamond wheel device for polishing stone material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03131477A true JPH03131477A (en) | 1991-06-05 |
Family
ID=17393479
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26372889A Pending JPH03131477A (en) | 1989-10-09 | 1989-10-09 | Diamond wheel device for polishing stone material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03131477A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07276245A (en) * | 1994-04-07 | 1995-10-24 | Shingo Ogyu | Stone polishing machine |
JPH08118239A (en) * | 1994-10-24 | 1996-05-14 | Osaka Diamond Ind Co Ltd | Grinding wheel for polishing or grinding stone |
US6110030A (en) * | 1998-03-23 | 2000-08-29 | Hashimoto; Hiroshi | Ultra fine groove chip and ultra fine groove tool |
JP2018199197A (en) * | 2017-05-29 | 2018-12-20 | 株式会社アライドマテリアル | Super abrasive grain wheel |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5541272B2 (en) * | 1973-03-14 | 1980-10-23 |
-
1989
- 1989-10-09 JP JP26372889A patent/JPH03131477A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5541272B2 (en) * | 1973-03-14 | 1980-10-23 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07276245A (en) * | 1994-04-07 | 1995-10-24 | Shingo Ogyu | Stone polishing machine |
JPH08118239A (en) * | 1994-10-24 | 1996-05-14 | Osaka Diamond Ind Co Ltd | Grinding wheel for polishing or grinding stone |
US6110030A (en) * | 1998-03-23 | 2000-08-29 | Hashimoto; Hiroshi | Ultra fine groove chip and ultra fine groove tool |
JP2018199197A (en) * | 2017-05-29 | 2018-12-20 | 株式会社アライドマテリアル | Super abrasive grain wheel |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5486131A (en) | Device for conditioning polishing pads | |
US7066795B2 (en) | Polishing pad conditioner with shaped abrasive patterns and channels | |
JP2001191246A (en) | Surface polishing device and surface polishing method | |
CN101291777A (en) | Apertured conditioning brush for chemical mechanical planarization systems | |
JPH03131477A (en) | Diamond wheel device for polishing stone material | |
JP4340184B2 (en) | Whetstone | |
CN106217259B (en) | Method for dressing elastic grinding wheel | |
JP2004517740A (en) | Backup plate assembly for grinding system | |
JPH03131478A (en) | Diamond wheel for polishing stone material | |
JPS6153193B2 (en) | ||
JPH11207636A (en) | Cup-like grinding wheel | |
JP3968924B2 (en) | Single layer whetstone and method for manufacturing the same | |
JPH0615572A (en) | Grinding wheel | |
JPH04269175A (en) | Polishing disk and manufacture thereof | |
JP2006205330A (en) | Grinding wheel | |
JPH065863U (en) | Diamond grinding wheel equipment for stone polishing | |
JPH06262529A (en) | Diamond-bonded grinding wheel for stone grinding | |
JP3317910B2 (en) | Grinding equipment in grinder | |
JP3011168B2 (en) | Semiconductor substrate polishing equipment | |
KR101009593B1 (en) | Diamond conditioner | |
JPS5817726Y2 (en) | Grindstone for stone surface polishing | |
JP4629900B2 (en) | Grinding wheel dressing method | |
JPH0513494Y2 (en) | ||
JP3029992U (en) | Whetstone for polishing blades | |
JPS5856767A (en) | Correction method for super grinding wheel and device for the same |