JPH0719158Y2 - 半導体装置の冷却構造 - Google Patents

半導体装置の冷却構造

Info

Publication number
JPH0719158Y2
JPH0719158Y2 JP9442188U JP9442188U JPH0719158Y2 JP H0719158 Y2 JPH0719158 Y2 JP H0719158Y2 JP 9442188 U JP9442188 U JP 9442188U JP 9442188 U JP9442188 U JP 9442188U JP H0719158 Y2 JPH0719158 Y2 JP H0719158Y2
Authority
JP
Japan
Prior art keywords
semiconductor
cooling
support
semiconductor chips
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP9442188U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0215741U (enrdf_load_stackoverflow
Inventor
貴志男 横内
光隆 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP9442188U priority Critical patent/JPH0719158Y2/ja
Publication of JPH0215741U publication Critical patent/JPH0215741U/ja
Application granted granted Critical
Publication of JPH0719158Y2 publication Critical patent/JPH0719158Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP9442188U 1988-07-15 1988-07-15 半導体装置の冷却構造 Expired - Lifetime JPH0719158Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9442188U JPH0719158Y2 (ja) 1988-07-15 1988-07-15 半導体装置の冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9442188U JPH0719158Y2 (ja) 1988-07-15 1988-07-15 半導体装置の冷却構造

Publications (2)

Publication Number Publication Date
JPH0215741U JPH0215741U (enrdf_load_stackoverflow) 1990-01-31
JPH0719158Y2 true JPH0719158Y2 (ja) 1995-05-01

Family

ID=31318944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9442188U Expired - Lifetime JPH0719158Y2 (ja) 1988-07-15 1988-07-15 半導体装置の冷却構造

Country Status (1)

Country Link
JP (1) JPH0719158Y2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0215741U (enrdf_load_stackoverflow) 1990-01-31

Similar Documents

Publication Publication Date Title
US9687943B2 (en) Heat sink structure with a vapor-permeable membrane for two-phase cooling
US7184269B2 (en) Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly
US9078379B2 (en) Flow boiling heat sink with vapor venting and condensing
US7233494B2 (en) Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins
JP5681710B2 (ja) 冷却装置およびその製造方法
US7806168B2 (en) Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange
US9848509B2 (en) Heat sink module
US7110260B2 (en) Method and apparatus for cooling heat-generating structure
US9201474B2 (en) Valve controlled, node-level vapor condensation for two-phase heat sink(s)
US7277283B2 (en) Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated coolant inlet and outlet manifold
US20160209120A1 (en) Boiling heat transfer device
US20060011326A1 (en) Heat-exchanger device and cooling system
JPH07504538A (ja) フェースダウンボンディングチップのマイクロチャネル冷却
CN112492853B (zh) 一种基于池沸腾散热的液体腔散热装置
JPH0719158Y2 (ja) 半導体装置の冷却構造
CN110779364A (zh) 一种新型吹胀式铝均温板
JPH02214147A (ja) 冷却装置
JPH0534113Y2 (enrdf_load_stackoverflow)
JPH0258296A (ja) 冷却装置
JP2550162B2 (ja) 沸騰冷却装置
JPH04233798A (ja) 回路基板冷却装置
CN118299350A (zh) 一种基于梯度多孔疏水膜的微通道散热器及使用方法
JPH0466391B2 (enrdf_load_stackoverflow)
JPH03173461A (ja) 沸騰冷却装置
JPH025451A (ja) 集積回路の冷却構造