JPH0466391B2 - - Google Patents

Info

Publication number
JPH0466391B2
JPH0466391B2 JP61252014A JP25201486A JPH0466391B2 JP H0466391 B2 JPH0466391 B2 JP H0466391B2 JP 61252014 A JP61252014 A JP 61252014A JP 25201486 A JP25201486 A JP 25201486A JP H0466391 B2 JPH0466391 B2 JP H0466391B2
Authority
JP
Japan
Prior art keywords
chip
circuit board
refrigerant
top surface
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61252014A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63107157A (ja
Inventor
Kishio Yokochi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP61252014A priority Critical patent/JPS63107157A/ja
Publication of JPS63107157A publication Critical patent/JPS63107157A/ja
Publication of JPH0466391B2 publication Critical patent/JPH0466391B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP61252014A 1986-10-24 1986-10-24 冷却回路基板 Granted JPS63107157A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61252014A JPS63107157A (ja) 1986-10-24 1986-10-24 冷却回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61252014A JPS63107157A (ja) 1986-10-24 1986-10-24 冷却回路基板

Publications (2)

Publication Number Publication Date
JPS63107157A JPS63107157A (ja) 1988-05-12
JPH0466391B2 true JPH0466391B2 (enrdf_load_stackoverflow) 1992-10-23

Family

ID=17231373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61252014A Granted JPS63107157A (ja) 1986-10-24 1986-10-24 冷却回路基板

Country Status (1)

Country Link
JP (1) JPS63107157A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS63107157A (ja) 1988-05-12

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