JPS63107157A - 冷却回路基板 - Google Patents

冷却回路基板

Info

Publication number
JPS63107157A
JPS63107157A JP61252014A JP25201486A JPS63107157A JP S63107157 A JPS63107157 A JP S63107157A JP 61252014 A JP61252014 A JP 61252014A JP 25201486 A JP25201486 A JP 25201486A JP S63107157 A JPS63107157 A JP S63107157A
Authority
JP
Japan
Prior art keywords
circuit board
chip
refrigerant
flow path
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61252014A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0466391B2 (enrdf_load_stackoverflow
Inventor
Kishio Yokouchi
貴志男 横内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP61252014A priority Critical patent/JPS63107157A/ja
Publication of JPS63107157A publication Critical patent/JPS63107157A/ja
Publication of JPH0466391B2 publication Critical patent/JPH0466391B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP61252014A 1986-10-24 1986-10-24 冷却回路基板 Granted JPS63107157A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61252014A JPS63107157A (ja) 1986-10-24 1986-10-24 冷却回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61252014A JPS63107157A (ja) 1986-10-24 1986-10-24 冷却回路基板

Publications (2)

Publication Number Publication Date
JPS63107157A true JPS63107157A (ja) 1988-05-12
JPH0466391B2 JPH0466391B2 (enrdf_load_stackoverflow) 1992-10-23

Family

ID=17231373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61252014A Granted JPS63107157A (ja) 1986-10-24 1986-10-24 冷却回路基板

Country Status (1)

Country Link
JP (1) JPS63107157A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0466391B2 (enrdf_load_stackoverflow) 1992-10-23

Similar Documents

Publication Publication Date Title
US7511957B2 (en) Methods for fabricating a cooled electronic module employing a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled
US6317326B1 (en) Integrated circuit device package and heat dissipation device
US7078803B2 (en) Integrated circuit heat dissipation system
US7196411B2 (en) Heat dissipation for chip-on-chip IC packages
US6118177A (en) Heatspreader for a flip chip device, and method for connecting the heatspreader
US7306973B2 (en) Method for making a semiconductor multipackage module including a processor and memory package assemblies
JPH07170098A (ja) 電子部品の実装構造および実装方法
US11955404B2 (en) Electronic package and heat dissipation structure thereof, comprising bonding pillars
US4964019A (en) Multilayer bonding and cooling of integrated circuit devices
KR960000222B1 (ko) 히트-싱크를 갖춘 반도체 패키지
US8633597B2 (en) Thermal vias in an integrated circuit package with an embedded die
JPS63107157A (ja) 冷却回路基板
US12027446B2 (en) Method for forming a semiconductor component with a cooling structure
US20230307316A1 (en) Semiconductor package with vapor chamber lid
JP2658309B2 (ja) 噴流冷却半導体装置
US10861768B2 (en) IGBT module with improved heat dissipation structure
US7327025B2 (en) Heat spreader for thermally enhanced semiconductor package
JPH0281463A (ja) 半導体装置の冷却実装構造
JP2000174186A (ja) 半導体装置およびその実装方法
JPH06349984A (ja) 半導体集積回路装置および冷却方法
JPS6267829A (ja) フリップチップの実装構造
US20240304517A1 (en) Thermally enhanced package with high k mold compound on die top
CN219780113U (zh) 一种集成散热器的滤波器封装结构
JPH02288255A (ja) 半導体装置
JPH03178154A (ja) 半導体集積回路装置