JPS6219074B2 - - Google Patents

Info

Publication number
JPS6219074B2
JPS6219074B2 JP56173959A JP17395981A JPS6219074B2 JP S6219074 B2 JPS6219074 B2 JP S6219074B2 JP 56173959 A JP56173959 A JP 56173959A JP 17395981 A JP17395981 A JP 17395981A JP S6219074 B2 JPS6219074 B2 JP S6219074B2
Authority
JP
Japan
Prior art keywords
semiconductor
refrigerant
chip
semiconductor device
filled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56173959A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5875860A (ja
Inventor
Kishio Yokochi
Koichi Niwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56173959A priority Critical patent/JPS5875860A/ja
Publication of JPS5875860A publication Critical patent/JPS5875860A/ja
Publication of JPS6219074B2 publication Critical patent/JPS6219074B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP56173959A 1981-10-30 1981-10-30 冷媒封入型半導体装置 Granted JPS5875860A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56173959A JPS5875860A (ja) 1981-10-30 1981-10-30 冷媒封入型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56173959A JPS5875860A (ja) 1981-10-30 1981-10-30 冷媒封入型半導体装置

Publications (2)

Publication Number Publication Date
JPS5875860A JPS5875860A (ja) 1983-05-07
JPS6219074B2 true JPS6219074B2 (enrdf_load_stackoverflow) 1987-04-25

Family

ID=15970215

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56173959A Granted JPS5875860A (ja) 1981-10-30 1981-10-30 冷媒封入型半導体装置

Country Status (1)

Country Link
JP (1) JPS5875860A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58114445A (ja) * 1981-12-28 1983-07-07 Fujitsu Ltd 液冷モジユ−ル
JPS60254757A (ja) * 1984-05-31 1985-12-16 Toshiba Corp 高密度実装回路部品
JPS60254641A (ja) * 1984-05-31 1985-12-16 Fujitsu Ltd 液体封入型パツケ−ジ
US6771500B1 (en) * 2003-03-27 2004-08-03 Stmicroelectronics, Inc. System and method for direct convective cooling of an exposed integrated circuit die surface

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5147576A (ja) * 1974-10-23 1976-04-23 Hitachi Ltd Kannaikyuchakushikikatsuseitankyuchakusochi

Also Published As

Publication number Publication date
JPS5875860A (ja) 1983-05-07

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