JPH0719157Y2 - 浸漬冷却用半導体パッケージ - Google Patents

浸漬冷却用半導体パッケージ

Info

Publication number
JPH0719157Y2
JPH0719157Y2 JP1988115465U JP11546588U JPH0719157Y2 JP H0719157 Y2 JPH0719157 Y2 JP H0719157Y2 JP 1988115465 U JP1988115465 U JP 1988115465U JP 11546588 U JP11546588 U JP 11546588U JP H0719157 Y2 JPH0719157 Y2 JP H0719157Y2
Authority
JP
Japan
Prior art keywords
heat sink
semiconductor package
cooling
heat
cooling liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988115465U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0236047U (US06811534-20041102-M00003.png
Inventor
優宏 望月
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1988115465U priority Critical patent/JPH0719157Y2/ja
Publication of JPH0236047U publication Critical patent/JPH0236047U/ja
Application granted granted Critical
Publication of JPH0719157Y2 publication Critical patent/JPH0719157Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1988115465U 1988-08-31 1988-08-31 浸漬冷却用半導体パッケージ Expired - Lifetime JPH0719157Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988115465U JPH0719157Y2 (ja) 1988-08-31 1988-08-31 浸漬冷却用半導体パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988115465U JPH0719157Y2 (ja) 1988-08-31 1988-08-31 浸漬冷却用半導体パッケージ

Publications (2)

Publication Number Publication Date
JPH0236047U JPH0236047U (US06811534-20041102-M00003.png) 1990-03-08
JPH0719157Y2 true JPH0719157Y2 (ja) 1995-05-01

Family

ID=31357148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988115465U Expired - Lifetime JPH0719157Y2 (ja) 1988-08-31 1988-08-31 浸漬冷却用半導体パッケージ

Country Status (1)

Country Link
JP (1) JPH0719157Y2 (US06811534-20041102-M00003.png)

Also Published As

Publication number Publication date
JPH0236047U (US06811534-20041102-M00003.png) 1990-03-08

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