JPH071838B2 - Parts feeder - Google Patents
Parts feederInfo
- Publication number
- JPH071838B2 JPH071838B2 JP60107362A JP10736285A JPH071838B2 JP H071838 B2 JPH071838 B2 JP H071838B2 JP 60107362 A JP60107362 A JP 60107362A JP 10736285 A JP10736285 A JP 10736285A JP H071838 B2 JPH071838 B2 JP H071838B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- assembly
- component assembly
- sensor
- supply device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Control Of Conveyors (AREA)
- Specific Conveyance Elements (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Automatic Assembly (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明はチップ型抵抗、チップ型積層コンデンサに代表
されるリードレスタイプの電子部品を、電子回路を構成
する基板上に装着する電子部品装着装置において主に利
用される部品供給装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting a leadless type electronic component typified by a chip resistor and a chip multilayer capacitor on a substrate that constitutes an electronic circuit. The present invention mainly relates to a component supply device.
従来の技術 電子部品装着装置においては、従来特開昭55-118698号
公報に示されるような部品供給装置が用いられている。2. Description of the Related Art In an electronic component mounting device, a component supply device as disclosed in Japanese Patent Laid-Open No. 55-118698 has been used.
この部品供給装置における部品集合体Ａは、第５図に示
すように、テープ本体ａに所定ピッチで１列に多数の部
品収容部ｂを形成し、ここに電子部品ｃを装入すると共
に、テープ本体ａの表裏面に貼着したシール用テープｄ
及び保持用テープｅで前記電子部品ｃを保持する構成と
なっている。又部品集合体Ａの側縁部には所定ピッチで
送り孔ｆが形成されている。As shown in FIG. 5, the component assembly A in this component supply device has a plurality of component accommodating portions b formed in a row at a predetermined pitch on a tape body a, and an electronic component c is loaded therein. Sealing tape d attached to the front and back of tape body a
Also, the electronic component c is held by the holding tape e. In addition, feed holes f are formed at a predetermined pitch on the side edges of the component assembly A.
電子部品装着装置において、前記部品集合体Ａは第６図
に示すように一方向に間欠的に送られる。ｇは前記送り
孔ｆに噛み合って部品集合体Ａを間欠動させる送り装
置、ｈは前記シール用テープｄを剥離する装置である。In the electronic component mounting apparatus, the component assembly A is intermittently fed in one direction as shown in FIG. Reference numeral g is a feeding device that meshes with the feed hole f to intermittently move the component assembly A, and h is a device that peels the sealing tape d.
部品収容部ｂに装入された電子部品ｃは、真空チャック
（ピックアップ手段）ｉによって吸着され、部品集合体
Ａから取り出された後、前記真空チャックｉによって基
板ｊ上の所定位置に装着される。The electronic component c loaded in the component accommodating portion b is adsorbed by the vacuum chuck (pickup means) i, taken out from the component assembly A, and then mounted at a predetermined position on the substrate j by the vacuum chuck i. .
ところで上記第５図及び第６図に示す従来例において
は、部品集合体Ａの終端部における複数の部品収容部ｂ
には電子部品ｃを収納せず、空白の状態としておき、電
子部品ｃが収納されていない状態を前記真空チャックｉ
の圧力変化を検出する差圧センサｋで検知し、これに基
き警報を発すると共に電子部品装着装置全体を停止させ
るように構成されている。作業者は前記警報によって所
定の部品集合体Ａの電子部品ｃが無くなったことを知
り、部品集合体Ａを取り替えた後、電子部品装着装置を
再始動させている。By the way, in the conventional example shown in FIG. 5 and FIG. 6, a plurality of component accommodating portions b at the terminal end of the component assembly A are provided.
The electronic component c is not stored in the device, but is left blank, and the electronic component c is not stored in the vacuum chuck i.
Is detected by the differential pressure sensor k for detecting the pressure change, and based on this, an alarm is issued and the entire electronic component mounting apparatus is stopped. The operator knows from the alarm that the electronic component c of the predetermined component assembly A is gone, replaces the component assembly A, and then restarts the electronic component mounting apparatus.
発明が解決しようとする問題点 従来例は上述のように、部品集合体Ａの電子部品ｃが無
くなってから、部品集合体Ａを取り替えていたのでロス
タイムが生じ、電子部品装着装置の非稼働時間T1が第４
図に示すように長くなるという問題点があった。Problems to be Solved by the Invention As described above, in the conventional example, since the component assembly A is replaced after the electronic component c of the component assembly A is lost, loss time occurs, and the non-operation time of the electronic component mounting apparatus is reduced. T 1 is 4th
As shown in the figure, there is a problem that it becomes long.
第４図に示す例では、複数回の部品切れ検出時間（この
とき同時に警報が発せられる。）、部品集合体準備時間
及び部品集合体交換時間の合計が非稼働時間T1となる
が、そのほとんどを部品集合体準備時間（２分〜10分）
が占めている。In the example shown in FIG. 4, the total of the component outage detection times (alarms are simultaneously issued at this time), the component assembly preparation time and the component assembly replacement time is the non-operation time T 1. Almost all parts assembly preparation time (2-10 minutes)
Is occupied.
問題点を解決するための手段 本発明は上記問題点を解決するため、一方向に間欠的に
送られる部品集合体に１列に一定間隔をあけて多数の部
品収容部を設け、これら部品収容部に部品を収容すると
共に、ピックアップ位置に送られた前記部品をピックア
ップ手段でピックアップするように構成された部品供給
装置において、終端部に位置する所定数の部品収容部に
は部品を収容せず空白の状態とした部品集合体と、前記
ピックアップ位置の進行方向手前位置に設けられ、部品
収容部内の部品の有無を検出する非接触式センサと、前
記センサの信号を受けて部品集合体の終端部を報知する
信号を出すコントロール装置とを備えたことを特徴とす
る部品供給装置を提供するものである。Means for Solving the Problems In order to solve the above problems, the present invention provides a component assembly that is intermittently fed in one direction with a large number of component accommodating portions arranged at regular intervals in one row. In a component supply device configured to accommodate a component in a portion and to pick up the component sent to a pickup position by a pickup means, the component is not accommodated in a predetermined number of component accommodating portions located at the terminal end. A blank component assembly, a non-contact type sensor that is provided in front of the pickup position in the traveling direction and detects the presence or absence of a component in the component housing, and the end of the component assembly in response to a signal from the sensor. The present invention provides a component supply device including a control device that outputs a signal for informing a unit.
作用 本発明は上記構成を有する結果、部品収容部無いの部品
の有無を、ピックアップ位置の進行方向手前位置に配し
たセンサによって検出し、この検出信号をコントロール
装置に送信することによって、部品集合体の部品切れを
事前に報知することができる。As a result of having the above-described configuration, the present invention detects the presence or absence of a component that is not the component housing portion by a sensor arranged at the front position of the pickup position in the traveling direction, and transmits this detection signal to the control device, thereby the component assembly. It is possible to notify in advance of the shortage of parts.
従って部品集合体の部品が無くなる前に、新しい部品集
合体の準備を終了することができるので、第４図に示す
ように、装置停止後すぐに部品集合体の交換を行うこと
ができ、装置の非稼働時間T2を従来例のそれT1に比較し
て大幅に短縮することができる。Therefore, the preparation of a new component assembly can be completed before the components in the component assembly are exhausted, and as shown in FIG. 4, the component assembly can be replaced immediately after the device is stopped and the device can be replaced. The non-operation time T 2 of can be greatly shortened compared to that T 1 of the conventional example.
実施例 以下本発明の一実施例を図面を参照しながら説明する。Embodiment One embodiment of the present invention will be described below with reference to the drawings.
第１図及び第２図に示す本発明の第１実施例は電子部品
装着装置に実施されるものに関している。この第１実施
例において、部品集合体１は、テープ本体２に所定ピッ
チで１列に多数の部品収容部３を形成し、ここに電子部
品４を装入すると共に、テープ本体２の表裏面に貼着し
たシール用テープ５及び保持用テープ６で前記電子部品
４を保持する構成となっている。又部品集合体１の側縁
部には所定ピッチで送り孔７が形成されている。The first embodiment of the present invention shown in FIGS. 1 and 2 relates to an electronic component mounting apparatus. In the first embodiment, in the component assembly 1, a large number of component accommodating portions 3 are formed in a row on the tape body 2 at a predetermined pitch, and the electronic components 4 are loaded therein, and the front and back surfaces of the tape body 2 are arranged. The electronic component 4 is configured to be held by the sealing tape 5 and the holding tape 6 attached to the. Further, feed holes 7 are formed at a predetermined pitch on the side edge of the component assembly 1.
前記部品集合体１は第１図に示すように一方向に間欠的
に送られる。８は前記送り孔７に噛みあって部品集合体
１を間欠動させる送り装置、９は前記シール用テープ５
を剥離する装置である。The component assembly 1 is intermittently fed in one direction as shown in FIG. Reference numeral 8 is a feeding device that engages with the feed hole 7 to intermittently move the component assembly 1, and 9 is the sealing tape 5.
Is a device for peeling.
部品収容部３に装入された電子部品４は真空チャックか
らなるピックアップ手段10によって吸着され、部品集合
体１から取り出され後、前記ピックアップ手段10によっ
て基板11上の所定位置に装着される。The electronic component 4 loaded in the component housing portion 3 is adsorbed by the pickup means 10 composed of a vacuum chuck, taken out from the component assembly 1, and then mounted on the substrate 11 at a predetermined position by the pickup means 10.
前記電子部品４がピックアップ手段10によってピックア
ップされる位置Ｐの進行方向手前位置Ｑには、前記部品
収容部３内の電子部品４の有無を検出するセンサ12が配
されている。このセンサ12は、その検出信号を受けて部
品集合体１の終端部を報知する信号を出すコントロール
装置13に接続され、又このコントロール装置13はブザー
などの報知手段14に接続されている。前記センサ12とし
ては、反射型ファイバセンサを採用しているが、他の光
学式センサや電磁式センサなどを採用することも可能で
ある。A sensor 12 for detecting the presence / absence of the electronic component 4 in the component housing portion 3 is arranged at a position Q in front of the position P where the electronic component 4 is picked up by the pickup means 10. The sensor 12 is connected to a control device 13 which receives a detection signal thereof and outputs a signal for informing the end portion of the component assembly 1, and the control device 13 is connected to an informing means 14 such as a buzzer. Although the reflection type fiber sensor is adopted as the sensor 12, it is also possible to adopt another optical sensor or electromagnetic sensor.
前記部品集合体１は、その終端部に位置する所定数の部
品収容部３に電子部品４を収容せず空白の状態としたも
のを用いている。The component assembly 1 uses a blank state in which the electronic components 4 are not accommodated in a predetermined number of component accommodating portions 3 located at the terminal end thereof.
本実施例では、前記センサ12によって前記部品収容部３
内に電子部品４が装入されていないことが検出される
と、その信号がコントロール装置13に送られる。そして
部品収容部３内に電子部品４が無いことが所定回数前記
センサ12によって検出されたとき、これらの検出信号に
基いてコントロール装置13からブザーなどの報知手段14
にこれを作動させる信号が送信される結果、ブザーなど
の作動によって部品集合体１の部品切れを事前に報知で
きるようになっている。In the present embodiment, the sensor 12 is used for the component housing 3
When it is detected that the electronic component 4 is not inserted in the inside, the signal is sent to the control device 13. When the sensor 12 detects that the electronic component 4 does not exist in the component housing 3 a predetermined number of times, the control device 13 informs a notification means 14 such as a buzzer based on these detection signals.
As a result, a signal for activating the component assembly is transmitted, so that the component assembly 1 can be informed in advance by the operation of a buzzer or the like.
従って第４図に示すように報知手段14が作動する報知期
間中に、新しい部品集合体１を準備でき、装置の停止後
には即時に部品集合体１を交換できるので、装置の非稼
働時間T2は従来例に比較して大幅に短縮することができ
る。Therefore, as shown in FIG. 4, a new parts assembly 1 can be prepared during the notification period during which the notification means 14 operates, and the parts assembly 1 can be replaced immediately after the device is stopped. 2 can be significantly shortened compared to the conventional example.
本発明は上記実施例に示す外、種々の態様に構成するこ
とができる。例えば第３図に示す本発明の第２実施例の
ように、部品集合体１のテープ本体２に、一体的に有底
形状の部品収容部３が形成された部品供給装置に本発明
を適用することも可能である。又上記実施例は電子部品
４を供給する部品供給装置に係るものであるが、電子部
品以外の部品を供給する部品供給装置に本発明を適用す
ることも可能である。The present invention can be configured in various modes other than those shown in the above embodiments. For example, as in the second embodiment of the present invention shown in FIG. 3, the present invention is applied to a component supply device in which a tape body 2 of a component assembly 1 is integrally formed with a component housing 3 having a bottomed shape. It is also possible to do so. Further, although the above embodiment relates to the component supply device for supplying the electronic component 4, the present invention can be applied to the component supply device for supplying the component other than the electronic component.
発明の効果 本発明は上記構成を有するので、部品集合体の部品切れ
を事前に知ることができ、装置稼働中に新しい部品集合
体の準備を行うことができる結果、電子部品装着装置な
どの作業装置における非稼働時間を大幅に短縮でき、作
業装置の稼働効率を向上させることができるという効果
がある。EFFECTS OF THE INVENTION Since the present invention has the above-described configuration, it is possible to know in advance that a component assembly is out of parts, and a new component assembly can be prepared while the device is in operation. There is an effect that the non-operation time in the device can be significantly reduced and the operation efficiency of the work device can be improved.
又本発明は従来の部品集合体をそのまま使用でき、部品
集合体にマークや切欠きなどを形成する必要がないとい
う効果もある。Further, the present invention has an effect that the conventional component assembly can be used as it is, and it is not necessary to form a mark or a notch in the component assembly.
第１図は本発明の第１実施例の縦断側面図、第２図はそ
の部品集合体の斜視図、第３図は本発明の第２実施例に
用いる部品集合体の斜視図、第４図は本発明の作用と従
来例の作用とを比較して示すタイミング図、第５図は従
来例の部品集合体の斜視図、第６図は従来例を原理的に
示す縦断側面図である。 １……部品集合体 ３……部品収容部 ４……部品 10……ピックアップ手段 12……センサ 13……コントロール装置 14……報知装置 Ｐ……ピックアップ位置。1 is a vertical side view of the first embodiment of the present invention, FIG. 2 is a perspective view of the component assembly thereof, and FIG. 3 is a perspective view of the component assembly used in the second embodiment of the present invention. FIG. 5 is a timing chart showing the operation of the present invention in comparison with the operation of the conventional example, FIG. 5 is a perspective view of a component assembly of the conventional example, and FIG. 6 is a vertical sectional side view showing the conventional example in principle. . 1 ... parts assembly 3 ... parts housing 4 ... parts 10 ... pickup means 12 ... sensor 13 ... control device 14 ... informing device P ... pickup position.
Claims (2)
列に一定間隔をあけて多数の部品収容部を設け、これら
部品収容部に部品を収容すると共に、ピックアップ位置
に送られた前記部品をピックアップ手段でピックアップ
するように構成された部品供給装置において、終端部に
位置する所定数の部品収容部には部品を収容せず空白の
状態とした部品集合体と、前記ピックアップ位置の進行
方向手前位置に設けられ、部品収容部内の部品の有無を
検出する非接触式センサと、前記センサの信号を受けて
部品集合体の終端部を報知する信号を出すコントロール
装置とを備えたことを特徴とする部品供給装置。1. A component assembly that is intermittently fed in one direction.
In a component supply device configured to provide a large number of component accommodating portions at regular intervals in a row, accommodate components in these component accommodating portions, and pick up the component sent to a pickup position by a pickup means, A predetermined number of component accommodating portions located at the terminal end are provided with no component accommodating portion in a blank state, and are provided in front of the pickup position in the traveling direction to detect presence or absence of a component in the component accommodating portion A component supply device, comprising: a non-contact type sensor; and a control device that receives a signal from the sensor and outputs a signal for notifying the end portion of the component assembly.
無いことが所定回数センサによって検出されたとき、こ
れらの検出信号に基づいて報知装置にこれを作動させる
信号を出す特許請求の範囲第１項記載の部品供給装置。2. The control device outputs a signal for activating this to the notification device based on these detection signals when the sensor detects that there is no component in the component housing a predetermined number of times. The component supply device described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60107362A JPH071838B2 (en) | 1985-05-20 | 1985-05-20 | Parts feeder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60107362A JPH071838B2 (en) | 1985-05-20 | 1985-05-20 | Parts feeder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61264789A JPS61264789A (en) | 1986-11-22 |
| JPH071838B2 true JPH071838B2 (en) | 1995-01-11 |
Family
ID=14457152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60107362A Expired - Lifetime JPH071838B2 (en) | 1985-05-20 | 1985-05-20 | Parts feeder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH071838B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4810154A (en) * | 1988-02-23 | 1989-03-07 | Molex Incorporated | Component feeder apparatus and method for vision-controlled robotic placement system |
| JP2003081330A (en) * | 2001-09-12 | 2003-03-19 | Rohm Co Ltd | Packaging member for chip resistor |
| WO2017022098A1 (en) * | 2015-08-05 | 2017-02-09 | 富士機械製造株式会社 | Component mounting apparatus |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55118698A (en) * | 1979-03-05 | 1980-09-11 | Matsushita Electric Ind Co Ltd | Device for mounting electronic part |
| JPS59131068A (en) * | 1983-01-14 | 1984-07-27 | Mitsubishi Motors Corp | Automatic oil seal pressure inserting device |
-
1985
- 1985-05-20 JP JP60107362A patent/JPH071838B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61264789A (en) | 1986-11-22 |
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