JPH07180093A - Barrel plating method - Google Patents

Barrel plating method

Info

Publication number
JPH07180093A
JPH07180093A JP34620193A JP34620193A JPH07180093A JP H07180093 A JPH07180093 A JP H07180093A JP 34620193 A JP34620193 A JP 34620193A JP 34620193 A JP34620193 A JP 34620193A JP H07180093 A JPH07180093 A JP H07180093A
Authority
JP
Japan
Prior art keywords
barrel
plating
plated
plating liquid
plating solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP34620193A
Other languages
Japanese (ja)
Other versions
JP3023946B2 (en
Inventor
Masami Tabuchi
雅巳 田渕
Kashirou Uchimura
可志郎 内村
Sukeaki Maehara
祐昭 前原
Nobushige Moriwaki
伸重 森脇
Kazuhide Moriyoshi
一英 森吉
Kenichi Ito
健一 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP5346201A priority Critical patent/JP3023946B2/en
Publication of JPH07180093A publication Critical patent/JPH07180093A/en
Application granted granted Critical
Publication of JP3023946B2 publication Critical patent/JP3023946B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE:To improve the contact efficiency of objects to be plated and a plating liquid and to form plating films having a uniform thickness by carrying out operations to rotate a barrel housing the objects to be plated in the plating liquid, then to pull up the barrel, to rotate the barrel in air and to rotate the barrel again in the plating liquid. CONSTITUTION:The many objects 4 to be plated are housed in the barrel 1 consisting of a wire net or the like disposed with a negative electrode and are immersed into the plating liquid 3 in a plating tank 2 disposed with a positive electrode. Electroplating is executed by energizing the barrel and plating liquid, and bringing the objects 4 to be plated and the plating liquid 3 into contact with each other while rotating the barrel 1. The energization is stopped after the prescribed time and the barrel 1 is pulled up into the air and is rotated; thereafter, the barrel 1 is again immersed into the plating liquid 3 and the electroplating is executed by rotating the barrel 1 while energizing the barrel and plating liquid. Such operations are carried out at least once or over, by which the contact efficiency of the objects 4 to be plated and the plating liquid 3 and the plating films having the uniform thickness are formed on the objects 4 to be plated.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、メッキ方法に関し、
詳しくは、電子部品などの被メッキ物を収納したバレル
をメッキ液中で回転させ、被メッキ物とメッキ液を接触
させることにより被メッキ物にメッキを行うバレルメッ
キ方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating method,
More specifically, the present invention relates to a barrel plating method in which a barrel containing an object to be plated such as an electronic component is rotated in a plating solution and the object to be plated and the plating solution are brought into contact with each other to plate the object to be plated.

【0002】[0002]

【従来の技術】図3は、従来の電子部品のバレルメッキ
方法を示す図である。
2. Description of the Related Art FIG. 3 is a view showing a conventional barrel plating method for electronic parts.

【0003】すなわち、このバレルメッキ方法は、少な
くとも一部がメッキ液を通過させる金網などの材料から
なるバレル1内に、多数の被メッキ物(例えば、積層セ
ラミックコンデンサなどの電子部品)4を収納した後、
メッキ槽2内のメッキ液3に浸漬し、メッキ液3中でバ
レル1を回転させることにより被メッキ物4とメッキ液
3を接触させて、被メッキ物4に所定のメッキを施すも
のである。
That is, in this barrel plating method, a large number of objects to be plated (for example, electronic parts such as monolithic ceramic capacitors) 4 are housed in a barrel 1 at least a part of which is made of a material such as a wire mesh through which a plating solution passes. After doing
The object to be plated 4 is immersed in the plating solution 3 in the plating tank 2 and the barrel 1 is rotated in the plating solution 3 to bring the object to be plated 4 and the plating solution 3 into contact with each other to perform a predetermined plating on the object to be plated 4. .

【0004】[0004]

【発明が解決しようとする課題】ところが、上記従来の
バレルメッキ方法では、バレル1を回転させることによ
り、被メッキ物4とメッキ液3を接触させるようにして
いるが、被メッキ物4が小型になると、被メッキ物4と
メッキ液3とを十分に接触させることが困難になる。
However, in the above-mentioned conventional barrel plating method, the object 4 to be plated is brought into contact with the plating solution 3 by rotating the barrel 1, but the object 4 to be plated is small. Then, it becomes difficult to bring the object 4 to be plated and the plating solution 3 into sufficient contact with each other.

【0005】その結果、厚みの均一なメッキ被膜を形成
することが困難になり、メッキ被膜の厚みのばらつき
(CV)が、例えば、25%と大きくなるとともに、メ
ッキ被膜の厚みの分布が、例えば、図4及び図5に示す
ように、すそ引き分布(図4)あるいは二山分布(図
5)となり、メッキ被膜特性などに関し、所望の品質を
確保することができなくなる。
As a result, it becomes difficult to form a plated coating having a uniform thickness, the variation (CV) in the thickness of the plated coating increases to, for example, 25%, and the distribution of the thickness of the plated coating increases, for example. As shown in FIGS. 4 and 5, the tail distribution (FIG. 4) or the two-peak distribution (FIG. 5) is formed, and it becomes impossible to secure desired quality in terms of plating film characteristics and the like.

【0006】なお、上記の問題は、電解メッキの場合と
無電解メッキの場合とを問わずに発生する問題である。
The above problem is a problem that occurs regardless of whether electrolytic plating is used or electroless plating is used.

【0007】この発明は、上記問題点を解決するもので
あり、バレル内の被メッキ物とメッキ液の接触効率を向
上させて、厚みの均一なメッキ被膜を形成することが可
能なバレルメッキ方法を提供することを目的とする。
The present invention solves the above-mentioned problems, and improves the contact efficiency between the object to be plated in the barrel and the plating solution to form a plating film having a uniform thickness. The purpose is to provide.

【0008】[0008]

【課題を解決するための手段】上記目的を達成するため
に、この発明のバレルメッキ方法は、被メッキ物を収納
したバレルをメッキ液中で回転させ、被メッキ物とメッ
キ液を接触させることにより被メッキ物にメッキを行う
バレルメッキ方法において、メッキ液中でバレルを回転
させて行うメッキ工程の途中で、バレルをメッキ液中か
ら引き上げて回転させた後、再びメッキ液に浸漬して回
転させる引上げ・回転操作を少なくとも1回以上行うこ
とを特徴とする。
To achieve the above object, the barrel plating method of the present invention comprises rotating a barrel containing an object to be plated in a plating solution and bringing the object to be plated into contact with the plating solution. In the barrel plating method of plating the object to be plated with, during the plating process performed by rotating the barrel in the plating solution, the barrel is pulled up from the plating solution and rotated, and then immersed in the plating solution again and rotated. The pulling / rotating operation is performed at least once.

【0009】[0009]

【作用】メッキ液中でバレルを回転させて行うメッキ工
程の途中で、バレルをメッキ液中から引き上げて回転さ
せた後、再びメッキ液に浸漬して回転させる引上げ・回
転操作を行うことにより、メッキ液がバレル内から落下
するとともに、メッキ液から引き上げられた状態でバレ
ルが回転することにより、さらに液切れがよくなり、再
度バレルを浸漬することによりメッキ液の更新が行われ
るとともに、メッキ液から引き上げられた状態でバレル
が回転することにより、バレル内での被メッキ物の転動
状態(攪拌状態)が変化し、被メッキ物が十分に転動す
るため、再度バレルをメッキ液に浸漬して回転させる際
に、例えば、引上げ・回転操作を行う前にはメッキ液と
接触していなかった部分がメッキ液に接触するようにな
るなど、被メッキ物とメッキ液との接触効率が向上し、
厚みの均一なメッキ被膜を形成することが可能になる。
[Function] During the plating process performed by rotating the barrel in the plating solution, the barrel is pulled up from the plating solution and rotated, and then the barrel is immersed in the plating solution again and rotated to perform pulling and rotating operations. As the plating liquid falls from the barrel and the barrel rotates while being pulled up from the plating liquid, the liquid runs out better, and the plating liquid is renewed by immersing the barrel again. By rotating the barrel in the state of being pulled up from above, the rolling state (stirring state) of the object to be plated in the barrel changes and the object to be plated sufficiently rolls, so the barrel is immersed in the plating solution again. When it is rotated, for example, the parts that were not in contact with the plating solution before the pulling / rotating operation come into contact with the plating solution. And it improves the contact efficiency with the plating liquid,
It becomes possible to form a plating film having a uniform thickness.

【0010】[0010]

【実施例】以下、この発明の実施例を図に基づいて説明
する。図1は、この発明のバレルメッキ方法を示す図で
ある。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing a barrel plating method of the present invention.

【0011】この実施例では、内部に(−)の電極(図
示せず)が配設された、少なくとも一部がメッキ液を通
過させる金網などの材料からなるバレル1内に、被メッ
キ物である多数の被メッキ物(この実施例では積層セラ
ミックコンデンサ)4と、多数の接触媒体(例えば、S
USなどの導電金属からなる小球)(図示せず)を収納
した後、バレル1を(+)の電極(図示せず)が配設さ
れたメッキ槽2内のメッキ液3に浸漬し、メッキ液3中
でバレル1を回転させることにより、被メッキ物4とメ
ッキ液3を接触させ、被メッキ物4の所定の位置(この
実施例では、積層セラミックコンデンサの外部電極の表
面)にメッキを施した。以下、この実施例のメッキ工程
について説明する。
In this embodiment, an object to be plated is placed in a barrel 1 made of a material such as a wire mesh, through which a plating solution passes, in which a (-) electrode (not shown) is provided. A large number of objects to be plated (multilayer ceramic capacitors in this embodiment) 4 and a large number of contact media (for example, S
After accommodating a small ball (not shown) made of a conductive metal such as US, the barrel 1 is dipped in a plating solution 3 in a plating tank 2 in which a (+) electrode (not shown) is arranged, By rotating the barrel 1 in the plating solution 3, the plating object 4 and the plating solution 3 are brought into contact with each other, and plating is performed on a predetermined position of the plating object 4 (in this embodiment, the surface of the external electrode of the multilayer ceramic capacitor). Was applied. Hereinafter, the plating process of this embodiment will be described.

【0012】まず、被メッキ物4と接触媒体が収納さ
れたバレル1をメッキ液3中に浸漬し、(+)と(−)
の電極間に通電しながら、例えば、6回/分程度の回転
速度でバレル1を回転させることにより電解メッキを行
う。 約10分間バレル1を回転させた後、通電を停止し
て、バレル1をメッキ液3中から引き上げ、空中で、例
えば、3回/分程度の回転速度で1分間回転させる。 それから、再びバレル1をメッキ液3に浸漬し、電極
に通電しながら、6回/分程度の回転速度で回転させる
ことにより電解メッキを行う。 以後、上記,の操作(引上げ・回転操作)を繰り返
して行うことにより、被メッキ物4に所定のメッキ被膜
を形成する。
First, the barrel 1 containing the object to be plated 4 and the contact medium is dipped in the plating solution 3 to obtain (+) and (-).
Electroplating is performed by rotating the barrel 1 at a rotation speed of, for example, about 6 times / minute while energizing between the electrodes. After rotating the barrel 1 for about 10 minutes, the energization is stopped, the barrel 1 is pulled out of the plating solution 3, and is rotated in the air at a rotation speed of, for example, about 3 times / minute for 1 minute. Then, the barrel 1 is immersed in the plating solution 3 again, and while the electrodes are energized, the barrel 1 is rotated at a rotation speed of about 6 times / minute to perform electrolytic plating. Thereafter, the above-mentioned operations (pulling / rotating operation) are repeated to form a predetermined plating film on the object 4 to be plated.

【0013】上記実施例の方法により、,の操作
(引上げ・回転操作)を4回行い、寸法が、1.6mm×
0.8mm×0.8mmの積層セラミックコンデンサの外部
電極(図示せず)にメッキを施したところ、所定の厚み
のメッキ被膜が形成されていない不良品の発生率を、従
来のバレルメッキ方法による場合の1/10以下に低減
することができた。
According to the method of the above embodiment, the operation of (, pulling / rotating operation) was performed 4 times and the size was 1.6 mm ×
When the external electrodes (not shown) of a 0.8 mm x 0.8 mm monolithic ceramic capacitor were plated, the rate of occurrence of defective products that did not have a plating film of a specified thickness was measured by the conventional barrel plating method. It could be reduced to 1/10 or less of the case.

【0014】また、メッキ被膜の厚みのばらつき(C
V)が15%以下に減少するとともに、厚みの分布曲線
が図2に示すように、従来のバレルメッキ方法の場合に
みられたすそ引き分布(図4)や二山分布(図5)のな
い正規分布曲線になることが確認された。
Further, the variation in the thickness of the plating film (C
V) is reduced to 15% or less, and the distribution curve of the thickness shows the tail distribution (FIG. 4) and the double peak distribution (FIG. 5) observed in the conventional barrel plating method as shown in FIG. It was confirmed that there was no normal distribution curve.

【0015】また、上記実施例では、バレルをメッキ液
中から引き上げる間隔を10分間とした場合について説
明したが、この発明のバレルメッキ方法においては、バ
レルをメッキ液中から引き上げる間隔はこれに限定され
るものではない。したがって、バレルをメッキ液中から
引き上げる間隔を10分未満、あるいは10分を越える
時間とすることも可能であるが、通常は、総メッキ時間
の1/3〜1/10の間隔とすることが好ましい。
Further, in the above embodiment, the case where the interval for pulling up the barrel from the plating solution was set to 10 minutes was explained, but in the barrel plating method of the present invention, the interval for pulling up the barrel from the plating solution is limited to this. It is not something that will be done. Therefore, the interval for pulling up the barrel from the plating solution can be set to less than 10 minutes or more than 10 minutes, but usually it is set to 1/3 to 1/10 of the total plating time. preferable.

【0016】また、上記実施例では、メッキ液中から引
き上げたバレルを空中で1分間回転させた場合について
説明したが、この発明のバレルメッキ方法においては、
メッキ液中から引き上げたバレルを空中で回転させる時
間は、通常、総メッキ時間の1/10〜1/50の範囲
とすることが好ましい。但し、これに限定されるもので
はなく、この範囲外とすることも可能である。
In the above embodiment, the case where the barrel pulled up from the plating solution is rotated in the air for 1 minute has been described, but in the barrel plating method of the present invention,
The time for rotating the barrel pulled out from the plating solution in the air is usually preferably in the range of 1/10 to 1/50 of the total plating time. However, the present invention is not limited to this, and it may be set outside this range.

【0017】さらに、上記実施例では、メッキ液中、及
び空中におけるバレルの回転速度をそれぞれ、6回/
分、及び3回/分とした場合について説明したが、バレ
ルの回転速度は、通常、メッキ液中では、3〜10回/
分、空中では、1〜5回/分の範囲が好ましい。但し、
これに限定されるものではなく、この範囲外とすること
も可能であり、メッキ液中及び空中の各回転速度を毎回
すべて同じとする必要もない。
Further, in the above embodiment, the rotation speed of the barrel in the plating solution and that in the air are 6 times /
However, the barrel rotation speed is usually 3 to 10 times / minute in the plating solution.
In the minute and air, the range of 1 to 5 times / minute is preferable. However,
The present invention is not limited to this, and it is possible to set it outside this range, and it is not necessary to make the respective rotation speeds in the plating solution and the air all the same every time.

【0018】また、上記実施例においては、一回のメッ
キ処理の間に行う引上げ・回転操作の回数を4回とした
場合について説明したが、通常、2〜10回とすること
が好ましい。但し、これに限定されるものではなく、こ
の範囲外とすることも可能である。
In the above embodiment, the case where the number of pulling / rotating operations performed during one plating treatment was set to 4 times was described, but it is usually preferable to set it to 2 to 10 times. However, the present invention is not limited to this, and it may be set outside this range.

【0019】さらに、一回のメッキ処理時間(全工程時
間)についても特に制約はないが、通常、10〜100
分とすることが好ましい。
Further, there is no particular limitation on the time of one plating treatment (total process time), but it is usually 10 to 100.
It is preferable to set it as minutes.

【0020】上記実施例では、積層セラミックコンデン
サにメッキを施す場合について説明したが、この発明の
バレルメッキ方法によりメッキを行うことが可能な被メ
ッキ物は、これに限られるものではなく、セラミックフ
ィルター、半導体素子、圧電素子、共振子、正特性ある
いは負特性のサーミスタ素子など、種々の電子部品にメ
ッキを施す場合に適用することが可能である。
In the above embodiment, the case where the laminated ceramic capacitor is plated has been described, but the object to be plated by the barrel plating method of the present invention is not limited to this, and the ceramic filter is not limited to this. It can be applied when plating various electronic components such as semiconductor elements, piezoelectric elements, resonators, and thermistor elements having positive or negative characteristics.

【0021】また、上記実施例では、電解メッキを行う
場合について説明したが、この発明のバレルメッキ方法
は、電解メッキの場合に限らず、無電解メッキの場合に
も適用することが可能であり、その場合も上記実施例と
同様の効果を得ることができる。
Further, in the above embodiment, the case where the electrolytic plating is performed has been described, but the barrel plating method of the present invention can be applied not only to the case of electrolytic plating but also to the case of electroless plating. In that case, the same effect as that of the above embodiment can be obtained.

【0022】この発明のバレルメッキ方法は、さらにそ
の他の点においても上記実施例に限定されるものではな
く、メッキすべき金属の種類、メッキ液の組成や温度な
どのメッキ条件、バレルの具体的形状などに関し、発明
の要旨の範囲内において、種々の応用、変形を加えるこ
とが可能である。
The barrel plating method of the present invention is not limited to the above-mentioned embodiments in other points as well, and the type of metal to be plated, the plating conditions such as the composition and temperature of the plating solution, and the specific barrel. With regard to the shape and the like, various applications and modifications can be made within the scope of the invention.

【0023】[0023]

【発明の効果】上述のように、この発明のバレルメッキ
方法は、メッキ液中でバレルを回転させて行うメッキ工
程の途中で、バレルをメッキ液中から引き上げて回転さ
せた後、再びメッキ液に浸漬して回転させる引上げ・回
転操作を少なくとも1回以上行うようにしているので、
バレル内の被メッキ物とメッキ液の接触効率を向上させ
て、厚みの均一なメッキ被膜を確実に形成することが可
能になる。
As described above, according to the barrel plating method of the present invention, the barrel is pulled up from the plating solution and rotated during the plating process performed by rotating the barrel in the plating solution, and then the plating solution is again prepared. Since the pulling / rotating operation of immersing in and rotating it at least once is performed,
It is possible to improve the contact efficiency between the object to be plated in the barrel and the plating solution, and to reliably form a plating film having a uniform thickness.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明の一実施例にかかるバレルメッキ方法
を示す図である。
FIG. 1 is a diagram showing a barrel plating method according to an embodiment of the present invention.

【図2】この発明の一実施例にかかるバレルメッキ方法
により形成したメッキ被膜の厚みの分布曲線を示す図で
ある。
FIG. 2 is a diagram showing a distribution curve of the thickness of the plating film formed by the barrel plating method according to the embodiment of the present invention.

【図3】従来のバレルメッキ方法を示す図である。FIG. 3 is a diagram showing a conventional barrel plating method.

【図4】従来のバレルメッキ方法により形成したメッキ
被膜の厚みの分布曲線を示す図である。
FIG. 4 is a diagram showing a distribution curve of the thickness of a plating film formed by a conventional barrel plating method.

【図5】従来のバレルメッキ方法により形成したメッキ
被膜の厚みの分布曲線を示す図である。
FIG. 5 is a diagram showing a distribution curve of the thickness of a plating film formed by a conventional barrel plating method.

【符号の説明】[Explanation of symbols]

1 バレル 2 メッキ槽 3 メッキ液 4 被メッキ物(積層セラミックコンデン
サ)
1 barrel 2 plating tank 3 plating solution 4 object to be plated (multilayer ceramic capacitor)

───────────────────────────────────────────────────── フロントページの続き (72)発明者 森脇 伸重 京都府長岡京市天神二丁目26番10号 株式 会社村田製作所内 (72)発明者 森吉 一英 京都府長岡京市天神二丁目26番10号 株式 会社村田製作所内 (72)発明者 伊藤 健一 京都府長岡京市天神二丁目26番10号 株式 会社村田製作所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Nobushige Moriwaki, Inventor No. 26-10 Tenjin, Nagaokakyo, Kyoto Prefecture Murata Manufacturing Co., Ltd. (72) Inventor, Kazuhide Moriyoshi No. 26-10 Tenjin, Nagaokakyo, Kyoto Prefecture Murata Manufacturing Co., Ltd. (72) Inventor Kenichi Ito 2 26-10 Tenjin, Nagaokakyo City, Kyoto Prefecture Murata Manufacturing Co., Ltd.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 被メッキ物を収納したバレルをメッキ液
中で回転させ、被メッキ物とメッキ液を接触させること
により被メッキ物にメッキを行うバレルメッキ方法にお
いて、 メッキ液中でバレルを回転させて行うメッキ工程の途中
で、バレルをメッキ液中から引き上げて回転させた後、
再びメッキ液に浸漬して回転させる引上げ・回転操作を
少なくとも1回以上行うことを特徴とするバレルメッキ
方法。
1. A barrel plating method in which a barrel containing an object to be plated is rotated in a plating solution and the object to be plated is brought into contact with the plating solution to rotate the barrel in the plating solution. In the middle of the plating process performed by pulling the barrel out of the plating solution and rotating it,
A barrel plating method characterized in that the pulling / rotating operation of immersing in a plating solution again and rotating is performed at least once.
JP5346201A 1993-12-21 1993-12-21 Barrel plating method Expired - Lifetime JP3023946B2 (en)

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JP5346201A JP3023946B2 (en) 1993-12-21 1993-12-21 Barrel plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5346201A JP3023946B2 (en) 1993-12-21 1993-12-21 Barrel plating method

Publications (2)

Publication Number Publication Date
JPH07180093A true JPH07180093A (en) 1995-07-18
JP3023946B2 JP3023946B2 (en) 2000-03-21

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Family Applications (1)

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JP3023946B2 (en) 2000-03-21

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