JPH07176652A - Ic fixing jig - Google Patents
Ic fixing jigInfo
- Publication number
- JPH07176652A JPH07176652A JP32054093A JP32054093A JPH07176652A JP H07176652 A JPH07176652 A JP H07176652A JP 32054093 A JP32054093 A JP 32054093A JP 32054093 A JP32054093 A JP 32054093A JP H07176652 A JPH07176652 A JP H07176652A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- measured
- socket
- contact
- contact pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＳＳＯＰ（Ｓｈｒｉｎ
ｋ Ｓｍａｌｌ Ｏｕｔｌｉｎｅ Ｐａｃｋａｇｅ）の
ＩＣ固定治具に関する。BACKGROUND OF THE INVENTION The present invention relates to SSOP (Shrin).
k Small Outline Package) IC fixing jig.
【０００２】[0002]
【従来の技術】従来、この種のＳＳＯＰのＩＣ固定治具
は、図３のように構成されている。被測定ＩＣ１を選別
する際に、測定基板７上に設けたＩＣソケット５を介し
て被測定ＩＣ１を選別測定機で測定していた。ＳＳＯＰ
のＩＣ固定治具は、被測定ＩＣ１を吸着ノズル６で前工
程から移動し、ＩＣソケット５のコンタクトピン３上に
被測定ＩＣ１のリード２を搭載し、被測定ＩＣ１から吸
着ノズル６を離し、セラミックのリード押さえ部９で固
定していた。この時、被測定ＩＣ１のリード２とＩＣソ
ケット５のコンタクトピン３間の接触抵抗を少なくする
ように、リード押さえ部９の押さえ加減を調整してい
た。この場合、被測定ＩＣ１を吸着ノズル６で前工程か
ら移動後ＩＣソケット５のコンタクトピン３に搭載する
ため、被測定ＩＣ１のリード２の中心がＩＣソケット５
のコンタクトピン３の中心と重なるように位置の調整を
行っていた。調整後、被測定ＩＣ１のコンタクト性は、
被測定ＩＣ１のリード２の形状のバラツキを考慮し数百
個の被測定ＩＣ１を使用して調整を行なっている。2. Description of the Related Art Conventionally, this type of SSOP IC fixing jig is constructed as shown in FIG. When selecting the IC 1 to be measured, the IC 1 to be measured was measured by the selecting and measuring machine via the IC socket 5 provided on the measurement substrate 7. SSOP
In the IC fixing jig, the IC 1 to be measured is moved from the previous step by the suction nozzle 6, the lead 2 of the IC 1 to be measured is mounted on the contact pin 3 of the IC socket 5, and the suction nozzle 6 is separated from the IC 1 to be measured. It was fixed by the ceramic lead retainer 9. At this time, the pressing amount of the lead pressing portion 9 was adjusted so as to reduce the contact resistance between the lead 2 of the IC 1 to be measured and the contact pin 3 of the IC socket 5. In this case, since the IC 1 to be measured is mounted on the contact pin 3 of the IC socket 5 after being moved from the previous process by the suction nozzle 6, the center of the lead 2 of the IC 1 to be measured is the IC socket 5.
The position was adjusted so as to overlap the center of the contact pin 3. After adjustment, the contact property of IC1 to be measured is
The adjustment is performed using several hundred IC1s to be measured in consideration of variations in the shape of the leads 2 of the IC1s to be measured.
【０００３】[0003]
【発明が解決しようとする課題】上述した従来のＳＳＯ
ＰのＩＣ固定治具では、ＩＣを固定する際以下の欠点を
有していた。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention
The IC fixing jig of P had the following drawbacks when fixing the IC.
【０００４】（１）リード押さえ部９の押さえが弱い場
合は、被測定ＩＣ１のリード２とＩＣソケット５のコン
タクトピン３との間で接触不良となった。(1) When the pressing force of the lead pressing portion 9 is weak, a contact failure occurs between the lead 2 of the IC 1 to be measured and the contact pin 3 of the IC socket 5.
【０００５】（２）リード押さえ部９の押さえが強い場
合は、被測定ＩＣ１のリード２がコンタクトピン３の上
を横方向に滑りＩＣソケット５のコンタクトピン３間に
挟み込まれ、ショートやリードピン２のねじれや曲がり
が生じる原因となった。(2) When the lead pressing portion 9 is strongly pressed, the lead 2 of the IC 1 to be measured slides laterally on the contact pin 3 and is sandwiched between the contact pins 3 of the IC socket 5, causing a short circuit or the lead pin 2. Twisting and bending of the machine occurred.
【０００６】（３）被測定ＩＣ１を吸着ノズル６で移動
した際に生じる位置ずれの場合は、被測定ＩＣ１のリー
ド２をコンタクトピン３に載せてリード押さえ部９で押
さえると、リード２がコンタクトピン３の上を横方向に
滑りＩＣソケット５のコンタクトピン３間にに挟み込ま
れ、ショートやリードピン２のねじれや曲がりが生じる
原因となった。(3) In the case of displacement caused when the IC 1 to be measured is moved by the suction nozzle 6, when the lead 2 of the IC 1 to be measured is placed on the contact pin 3 and pressed by the lead pressing portion 9, the lead 2 contacts. It slips laterally on the pin 3 and is sandwiched between the contact pins 3 of the IC socket 5, which causes a short circuit and a twist or bend of the lead pin 2.
【０００７】（４）被測定ＩＣ１を別品種にした場合
は、測定基板７及びＩＣソケット５の交換でＩＣソケッ
ト５の高さの精度の違いにより、被測定ＩＣ１のリード
２とＩＣソケット５のコンタクトピン３の位置がずれる
ことがあるので、再調整を行なう必要があり、作業性が
悪くなる。(4) When different types of IC1 to be measured are used, the leads 2 of the IC1 to be measured and the IC socket 5 are different due to the difference in height accuracy of the IC socket 5 when the measurement board 7 and the IC socket 5 are replaced. Since the position of the contact pin 3 may be displaced, it is necessary to readjust it, resulting in poor workability.
【０００８】そこで、本発明は、従来の技術の欠点を改
良し、被測定ＩＣのリードとＩＣソケットのコンタクト
ピンとの接触不良を低減し、また、被測定ＩＣのリード
がＩＣソケットのコンタクトピン間に挟み込まれる等の
支障を防止しようとするものである。Therefore, the present invention improves the drawbacks of the prior art, reduces the contact failure between the leads of the IC to be measured and the contact pins of the IC socket, and the leads of the IC to be measured are between the contact pins of the IC socket. It is intended to prevent obstacles such as being caught in.
【０００９】[0009]
【課題を解決するための手段】本発明のＩＣ固定治具
は、選別測定機の測定基板７上に設けたＩＣソケット５
と、被測定ＩＣ１を上下左右に移動を行う吸着ノズル６
と、ＩＣソケット５のコンタクトピン３と被測定ＩＣ１
のリード２を押さえるリード押さえ部４によって被測定
ＩＣ１を固定する場合において、前記リード押さえ部４
は被測定ＩＣ１のリード２を押さえ固定するときに生じ
る位置ずれによる接触不良を低減するため、リード押さ
え部４にＩＣソケット５のコンタクトピン３間隔で湾曲
部８を設け、特に被測定ＩＣ１のリード２をＩＣソケッ
ト５のコンタクトピン３間に挟み込むことを防止するも
のである。The IC fixing jig of the present invention is an IC socket 5 provided on a measurement substrate 7 of a sorting and measuring machine.
And the suction nozzle 6 that moves the IC 1 to be measured up, down, left and right.
And the contact pin 3 of the IC socket 5 and the IC to be measured 1
In the case where the IC to be measured 1 is fixed by the lead pressing portion 4 that presses the lead 2, the lead pressing portion 4 is
In order to reduce the contact failure due to the positional deviation that occurs when the lead 2 of the IC to be measured 1 is pressed and fixed, the lead pressing portion 4 is provided with the curved portions 8 at intervals between the contact pins 3 of the IC socket 5. This prevents the pin 2 from being sandwiched between the contact pins 3 of the IC socket 5.
【００１０】[0010]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。Embodiments of the present invention will now be described with reference to the drawings.
【００１１】図１は、本発明の１実施例を示す図であ
る。被測定ＩＣ１を選別検査する際は、測定基板７上に
設けたＩＣソケット５を介して被測定ＩＣ１をＤＣ選別
測定機で測定していた。ＳＳＯＰのＩＣ固定治具は、被
測定ＩＣ１を吸着ノズル６で前工程から移動し、ＩＣソ
ケット５のコンタクトピン３上に被測定ＩＣ１のリード
２を搭載し、被測定ＩＣ１から吸着ノズル６を離しセラ
ミックの湾曲部８を設けたリード押さえ部４で固定を行
なう。図２で示すように、ＩＣソケット５のコンタクト
ピン３の間隔とリード押さえ部４の湾曲部８の間隔が同
一寸法である。被測定ＩＣ１のリード２に対する湾曲部
８を設けたリード押さえ部４の押さえが強い時や、被測
定ＩＣ１がずれた場合、被測定ＩＣ１のリード２は、リ
ード押さえ部４の湾曲部８の中心にずれるためＩＣソケ
ット５のコンタクトピン３の中心と重なる。従って、被
測定ＩＣ１のリード２は、ＩＣソケット５のコンタクト
ピン３間に挟まれることがない。また、被測定ＩＣ１を
交換した場合は、測定基板７及びＩＣソケット５を交換
した場合においても、ＩＣソケット５のコンタクトピン
３の中心とリード押さえ部４の湾曲部８の中心を合わす
ことにより、被測定ＩＣ１のリードの曲がりやねじれを
防止できる。FIG. 1 is a diagram showing an embodiment of the present invention. When the IC1 to be measured is selected and inspected, the IC1 to be measured is measured by the DC selection measuring device via the IC socket 5 provided on the measurement substrate 7. The IC fixing jig of SSOP moves the IC 1 to be measured from the previous process by the suction nozzle 6, mounts the lead 2 of the IC 1 to be measured on the contact pin 3 of the IC socket 5, and separates the suction nozzle 6 from the IC 1 to be measured. Fixing is performed by the lead pressing portion 4 provided with the ceramic curved portion 8. As shown in FIG. 2, the distance between the contact pins 3 of the IC socket 5 and the distance between the curved portions 8 of the lead pressing portion 4 are the same. When the lead pressing portion 4 provided with the bending portion 8 against the lead 2 of the IC 1 to be measured is strongly pressed or when the IC 1 to be measured is displaced, the lead 2 of the IC 1 to be measured is located at the center of the bending portion 8 of the lead pressing portion 4. Since it shifts to, the center of the contact pin 3 of the IC socket 5 overlaps. Therefore, the lead 2 of the IC 1 to be measured is not sandwiched between the contact pins 3 of the IC socket 5. Further, when the IC 1 to be measured is replaced, even when the measurement board 7 and the IC socket 5 are replaced, the center of the contact pin 3 of the IC socket 5 and the center of the curved portion 8 of the lead pressing portion 4 are aligned, It is possible to prevent bending or twisting of the leads of the IC1 to be measured.
【００１２】[0012]
【発明の効果】以上説明したように本発明は、被測定Ｉ
Ｃ１を吸着ノズル６で前工程から移動後、本工程の選別
治具上のＩＣソケット５のコンタクトピン３の上に載
せ、被測定ＩＣ１を吸着ノズル６から離しリード押さえ
部４で押さえて固定する場合、被測定ＩＣ１のリード２
が滑ってリード２の位置ズレによる接触不良を低減し、
かつ、測定基板７及びＩＣソケット５を交換した後の調
整が簡単で、リード２のＩＣソケット５のコンタクトピ
ン３間への挟み込みやリード２の曲がりやねじれを防止
できる効果がある。INDUSTRIAL APPLICABILITY As described above, the present invention can measure I
After the C1 is moved from the previous step by the suction nozzle 6, it is placed on the contact pin 3 of the IC socket 5 on the sorting jig in this step, and the IC1 to be measured is separated from the suction nozzle 6 and held by the lead pressing portion 4 to be fixed. In this case, lead 2 of IC1 to be measured
Slips to reduce contact failure due to misalignment of the lead 2,
Moreover, the adjustment is easy after the measurement board 7 and the IC socket 5 are exchanged, and it is possible to prevent the lead 2 from being pinched between the contact pins 3 of the IC socket 5 and preventing the lead 2 from being bent or twisted.
【図面の簡単な説明】[Brief description of drawings]
【図１】本発明の１実施例の斜視図である。FIG. 1 is a perspective view of an embodiment of the present invention.
【図２】本発明の１実施例の側面図である。FIG. 2 is a side view of an embodiment of the present invention.
【図３】従来のＩＣ固定治具の側面図である。FIG. 3 is a side view of a conventional IC fixing jig.
１ 被測定ＩＣ ２ 被測定ＩＣのリード ３ ＩＣソケットのコンタクトピン ４ リード押さえ部 ５ ＩＣソケット ６ 吸着ノズル ７ 測定基板 ８ リード押さえ部の湾曲部 ９ リード押さえ部 1 IC to be Measured 2 Lead of IC to be Measured 3 Contact Pin of IC Socket 4 Lead Holding Section 5 IC Socket 6 Suction Nozzle 7 Measurement Board 8 Curved Section of Lead Holding Section 9 Lead Holding Section
Claims (1)
ケットと、被測定ＩＣを上下左右に移動を行う吸着ノズ
ルと、ＩＣソケットのコンタクトピン上に被測定ＩＣを
吸着ノズルで移動後、被測定ＩＣのリードを載せ、ＩＣ
ソケットのコンタクトピンと被測定ＩＣのリードを押さ
えるリード押さえ部とで構成されるＩＣ固定治具におい
て、リード押さえ部にＩＣソケットのコンタクトピン間
隔で形成された湾曲部を設けたことを特徴とするＩＣ固
定治具。1. An IC socket provided on a measurement substrate of a sorting and measuring machine, a suction nozzle for moving an IC to be measured vertically and horizontally, and an IC nozzle to be moved on a contact pin of the IC socket by the suction nozzle, Place the leads of the IC to be measured,
In an IC fixing jig composed of a contact pin of a socket and a lead pressing portion for pressing a lead of an IC to be measured, the lead pressing portion is provided with a curved portion formed at an interval between the contact pins of the IC socket. fixing jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32054093A JP2826797B2 (en) | 1993-12-20 | 1993-12-20 | IC fixing jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32054093A JP2826797B2 (en) | 1993-12-20 | 1993-12-20 | IC fixing jig |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07176652A true JPH07176652A (en) | 1995-07-14 |
| JP2826797B2 JP2826797B2 (en) | 1998-11-18 |
Family
ID=18122580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32054093A Expired - Fee Related JP2826797B2 (en) | 1993-12-20 | 1993-12-20 | IC fixing jig |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2826797B2 (en) |
-
1993
- 1993-12-20 JP JP32054093A patent/JP2826797B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2826797B2 (en) | 1998-11-18 |
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