JP2002016398A - Method and apparatus for assembling electronic component on circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and apparatus for assembling an electronic component to a circuit board where all lead terminals are accurately and automatically assembled to a lead terminal insert of the circuit board. SOLUTION: A guide plate 12 comprising a through hole 12a for guiding tips of a plurality of lead terminals 11 to a specified position is preliminarily attached to the plurality of lead terminals 11 (figure 7 (b)). Related to assembling of an electronic component 10 to a circuit board 13, a plate holding part 4 holding the guide plate 12 moves to the tip side of the plurality of lead terminals 11 so that the through hole 12a of the guide plate 12 guides the tips of the plurality of lead terminals 11 to a specified position (figure 7 (c)), with the tips of the plurality of lead terminals 11 corrected in position for inserting into a lead terminal insert part 13a. Positioned between a positioning pin 8 and positioning hole parts 12b and 13b, the tips of the plurality of lead terminals 11 are inserted in the lead terminal insert part 13a (figure 7 (d)).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for assembling an electronic component having a plurality of lead terminals on a circuit board.

[0002]

2. Description of the Related Art As a circuit configuration generally used for various electronic devices, a circuit is configured by assembling electronic components on a circuit board. The mounting of an electronic component having a plurality of lead terminals on the circuit board is performed in advance. A machine is used to automate the insertion and assembly of a plurality of lead terminals of an electronic component which are arranged to be insertable into a lead terminal insertion portion of a circuit board, into the lead terminal insertion portion of the circuit board.

[0003]

The electronic circuit component 2 shown in FIG.
The lead terminal of the electronic component 10 shown in FIG. 0 requires a certain length for soldering or the like. Further, the arrangement intervals of the lead terminals are narrowed for the purpose of high integration, and the thin terminals are easily deformed even with a small external force.

For this reason, when assembling the electronic component 10 to the circuit board 13 or the like, the leading end position of the lead terminal may be deviated from the original position due to variations in the molding size of the lead terminal or the mounting position of the lead terminal. Was. Then, even if the electronic component is to be mounted by an automatic mounting machine while the tip of the lead terminal is displaced from the original position, there is a problem that the lead terminal is not inserted into the lead terminal insertion portion of the circuit board. Furthermore, when the electronic component is pushed into the circuit board without inserting the lead terminal into the lead terminal insertion portion, there is a problem that the lead terminal buckles. Due to such a problem, it was not possible to avoid defects in the automatic assembly machine.

[0005] In particular, as shown in FIG.
In the case where another electronic component is already mounted on 3 and an electronic component 10 having a plurality of lead terminals is to be installed in a limited space, the assembling jig is operated so as not to deform the plurality of lead terminals. However, it is difficult to accurately move the circuit board 10 to the lead terminal insertion portion and automatically assemble it.

SUMMARY OF THE INVENTION In view of the above, it is an object of the present invention to assemble an electronic component onto a circuit board by automatically assembling all the lead terminals of an electronic component having a plurality of lead terminals accurately into a lead terminal insertion portion of the circuit board. An object of the present invention is to provide a mounting method and a device therefor.

[0007]

According to a first aspect of the present invention, there is provided a method for assembling an electronic component on a circuit board, comprising the steps of: attaching an electronic component having a plurality of lead terminals to the circuit board; When assembling, the length of the plurality of lead terminals protruding from the through holes of the guide plate is reduced by shortening the guide plate having through holes that guide the tips of the plurality of lead terminals pre-mounted to the plurality of lead terminals to a predetermined position. Thus, the positional relationship between the guide plate and the electronic component was adjusted, and while maintaining this state, a plurality of lead terminals were inserted into the lead terminal insertion portion of the circuit board.

Accordingly, even if the leading end position of the lead terminal is deviated from the original position, the positional relationship between the guide plate and the electronic component is reduced so that the length of the plurality of lead terminals protruding from the through hole of the guide plate is shortened. By adjusting the position, the guide plate having a through hole for guiding the tips of the plurality of lead terminals to predetermined positions can correct the positions of the tips of the plurality of lead terminals so that they can be inserted into the lead terminal insertion portion of the circuit board. Can be. Then, the plurality of lead terminals whose positions have been corrected can be accurately inserted into the lead terminal insertion portion of the circuit board, and an electronic component assembly on the circuit board can be mounted on the circuit board. Can provide a mounting method.

According to the method for assembling electronic components on a circuit board according to the second aspect of the present invention, when inserting a plurality of lead terminals into the lead terminal insertion portions of the circuit board, the through holes in the guide plate have a plurality of lead terminals. From the state in which the tip of the plurality of lead terminals is corrected to a position where the tip of the plurality of lead terminals can be inserted into the lead terminal insertion portion by guiding the tip of the lead terminal to a predetermined position, a plurality of lead terminals can be inserted into the lead terminal insertion portion. The guide plate and the circuit board are positioned by positioning means.

Thus, a method of assembling an electronic component to a circuit board can be provided in which a plurality of lead terminals and a lead terminal insertion portion are positioned and a plurality of lead terminals can be inserted into the lead terminal insertion portion. .

According to a third aspect of the present invention, there is provided an apparatus for assembling an electronic component to a circuit board, wherein the board holding portion holds the circuit board, and the electronic component holds the electronic component and is movable in a direction facing the circuit board. A component holding portion, a plurality of lead terminals are inserted, and a guide plate having a through hole for guiding the tips of the plurality of lead terminals to predetermined positions is pre-mounted on the plurality of lead terminals, and the guide plate is held. A plate holding portion movable in a direction facing the circuit board, and positioning means for positioning the guide plate and the circuit board are provided.

When assembling an electronic component having a plurality of lead terminals to a circuit board using the electronic component assembling apparatus described above, the electronic component holding unit and the plate holding unit are operated to operate the guide plate. Positioning means for adjusting the positional relationship between the guide plate and the electronic component so that the length of the plurality of lead terminals protruding from the through hole is shortened, and positioning the guide plate and the circuit board while maintaining the positional relationship. In this configuration, a plurality of lead terminals are inserted into the lead terminal insertion portion of the circuit board.

Accordingly, even if the leading end position of the lead terminal is deviated from the original position, the electronic component holding portion and the plate holding portion are so arranged that the length of the plurality of lead terminals protruding from the through hole of the guide plate is shortened. By actuating and adjusting the positional relationship between the guide plate and the electronic components,
A guide plate having a through hole for guiding the tips of the plurality of lead terminals to a predetermined position can correct the positions of the tips of the plurality of lead terminals so that they can be inserted into the lead terminal insertion portion of the circuit board.

Then, the electronic component having the plurality of lead terminals whose positions have been corrected and the lead terminal insertion portion of the circuit board are positioned by the positioning means, and the plurality of lead terminals are accurately inserted into the lead terminal insertion portion. An electronic component assembling apparatus for a circuit board, which can assemble an electronic component having the above lead terminal onto the circuit board, can be provided.

According to the apparatus for assembling electronic components on a circuit board according to a fourth aspect of the present invention, the push-down mechanism for interlocking with the plate holding unit and pressing the guide plate toward the tips of the plurality of lead terminals is provided. Equipped.

For example, in the case of an electronic component having many lead terminals in a horizontal row, the guide plate is long. When the plate holding portion holding the long guide plate moves to the tip side of the plurality of lead terminals, the guide plate is bent due to the contact resistance between the through hole and the lead terminal, and in some cases, the entire guide plate becomes parallel. As a result, it may not be possible to smoothly move to the tip side of the plurality of lead terminals, and it may not be possible to correct the positions of all the lead terminals.

In order to prevent the above-mentioned situation, a pressing mechanism interlocking with the plate holding unit presses the guide plate toward the distal ends of the plurality of lead terminals to smoothly move the guide plates to the distal ends of the plurality of lead terminals. And a device for assembling electronic components to a circuit board.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method and an apparatus for assembling an electronic component to a circuit board according to an embodiment of the present invention will be described in detail with reference to the drawings.

The present invention is suitable for, for example, a case where another electronic component is already mounted on a circuit board and an electronic component having a plurality of lead terminals is mounted in a limited space. In contrast, the present invention relates to a method and an apparatus for assembling an electronic component to a circuit board in which all lead terminals of an electronic component having a plurality of lead terminals are automatically and accurately assembled to a lead terminal insertion portion of the circuit board.

FIG. 2 is a perspective view of an electronic circuit component showing a state where the electronic component is mounted on a circuit board using the electronic component mounting apparatus of the present invention. As shown in FIG.
FIG. 1 shows an electronic component assembling apparatus capable of accurately and automatically assembling an electronic component 10 having a plurality of lead terminals even in a limited space. Shown in

FIG. 1 is an overall configuration diagram showing an apparatus for assembling electronic components to a circuit board according to the present invention.

As shown in FIG. 1, an electronic component assembling apparatus 1
Is configured to hold the circuit board 13 at a predetermined position,
Electronic component 10 and multiple lead terminals 1 of electronic component 10
1 and a part for assembling the guide plate 12 for correcting the position with the circuit board 13.

The portion for holding the circuit board 13 at a predetermined position includes a board holding portion 3 for grasping and holding the circuit board 13 at a predetermined position, and the positioning hole 13 of the circuit board 13 shown in FIG.
Positioning means formed by inserting b into positioning pins 8 provided on the support base 6, and a substantially central position of the circuit board 13 on the support base 6 for the purpose of preventing the circuit board 13 from bending when the electronic component 10 is assembled. And a substrate supporting portion 9 disposed on the substrate.

The part for assembling the electronic component 10 and the guide plate 12 for correcting the positions of the plurality of lead terminals 11 of the electronic component 10 to the circuit board 13 is to hold the electronic component 10 from both sides and to hold the electronic component 10. The electronic component holding portion 5 is capable of reciprocating in a direction (vertical direction in FIG. 1) opposite to the electronic component holding device. A plate holding portion 4 capable of reciprocating in opposite directions, positioning means formed by inserting a positioning hole 12b of the guide plate 12 shown in FIG. 4 is a push-down rod which is a reciprocally movable push-down mechanism that pushes the guide plate 12 toward the tip end of the lead terminal 11. Constituted by the. The above-described electronic component holding unit 5, plate holding unit 4, and push-down mechanism unit 7 are supported and driven by the drive unit 2.

In this embodiment, two push-down rods 7 are used as the push-down mechanism. However, depending on the length and flexibility of the guide plate 12 and the form of contact of the push-down mechanism with the guide plate 12, The shape and the number of the pressing mechanism are variously selected.

Here, details of the electronic component 10 to be mounted on the circuit board 13 using the electronic component mounting apparatus 1 of the present invention and the guide plate 12 for correcting the position of the lead terminal 11 will be described.
This will be described with reference to FIGS. FIG. 3 shows an electronic component assembling apparatus 1 according to the present invention, in which an electronic component 10 is mounted on a circuit board 13.
FIG. 9 is a side view of the circuit board 13 showing a state where the circuit board is assembled. FIG. 4 is a partially enlarged view of a portion A in FIG. FIG. 5 shows an electronic component 10 to be assembled using the electronic component assembling apparatus 1 of the present invention.
FIG. 4 is a detailed view showing a state in which the guide plate 12 is pre-mounted on the vehicle. FIG. 6 is a front view showing the guide plate 12.

As shown in FIGS. 3, 4 and 5, the electronic component 10 is mounted on the circuit board 13 in a highly integrated manner so that the electronic circuit component 20 can be miniaturized.
As shown in FIG.
It is provided directly below. Further, the lead terminals 11 need a certain length for soldering and the like, and the arrangement intervals of the lead terminals 11 are narrowed for the purpose of high integration, and the lead terminals 11 are easily deformed even with a small external force. It is a thin shape. In such a lead terminal 11, an external force is applied to the lead terminal when the electronic component 10 is mounted on the circuit board 13 or the like, and the leading end position of the lead terminal is originally changed due to variations in the molding dimensions of the lead terminal and the mounting position of the lead terminal. In some cases.

Then, the electronic component 10 having a plurality of thin lead terminals 11 which are easily deformed by a small external force is automatically assembled into the limited space of the circuit board 13 using the electronic component assembling apparatus 1 of the present invention. Lead terminals 11
A guide plate 12 for correcting the position of the tip is provided.

By providing the guide plate 12, the accuracy of the positional tolerance between the lead terminal insertion portion 13 a of the circuit board 13 and the lead terminal 11 of the electronic component 10 is improved, and the electronic component 10 having a plurality of lead terminals 11 is provided. All lead terminals 11
Is accurately guided to the lead terminal insertion portion 13a of the circuit board 13. This guiding process by the guide plate 12 will be described later in the description of the assembling process by the electronic component assembling apparatus 1.

In the guide plate 12 shown in FIG. 6, the tip of the lead terminal 11 is connected to the lead terminal insertion portion 13a of the circuit board 13.
A through-hole 12a corresponding to the position tolerance that can be accurately guided and the number of lead terminals 11 is provided.

The guide plate 12 is provided with a positioning hole 12b. The positioning hole 12b is positioned by inserting the positioning hole 12b and the positioning hole 13b of the circuit board 13 shown in FIG. Can be inserted into the lead terminal insertion portion 13a.

Next, a process of assembling the electronic component 10 to the circuit board 13 by the electronic component assembling apparatus 1 according to one embodiment of the present invention will be described with reference to FIG. FIG. 7 shows an electronic component assembling apparatus according to the present invention.
It is a process explanatory view showing a process of assembling the device.

FIG. 7A shows that the circuit board 13 is held by the board holding section 3 and then the positioning hole 1 of the circuit board 13 is held.
3b shows a state in which 3b is inserted into the positioning pin 8 on the support 6; At this time, the board supporting portion 9 supports the circuit board 13 so that the circuit board 13 is substantially flat.

Next, the step of FIG. 7B will be described. First, after holding the electronic component 10 by the electronic component holding unit 5, the guide plate 12 is held by the plate holding unit 4, and then a plurality of lead terminals 11 of the electronic component 10 are inserted into the through holes 12 a provided in the guide plate 12. To make
Using a lead terminal straightening device (not shown), lead terminals 1
The tip position of the lead terminal 11 is corrected from being deviated from the original position due to the molding method 1 or the variation in the mounting position of the lead terminal 11. At the time of the step of correcting the tip position of the lead terminal 11, since there is a work space around, a work space for a lead terminal correction device (not shown) can be secured.

Next, the electronic component holding portion 5 is moved downward in FIG. 7B so that the electronic component holding portion 5 and the plate holding portion 4 are close to each other, and the guide plate 12 is spared to the lead terminal 11. Installing. At this time, the guide plate 12
The guide plate 12 is inserted deeply into the lead terminal 11 and is stably mounted on the electronic component 10 side.

Here, as a method of bringing the both close to each other, the plate holding portion 4 side may be moved upward in FIG. 7B.

Then, the positioning hole 12b of the guide plate 12 is inserted into the positioning pin 8 provided on the support base 6 while maintaining the positional relationship in which the guide plate 12 is preliminarily mounted on the lead terminal 11 as described above. As described above, the electronic component holding unit 5 and the plate holding unit 4 are linked to each other to
In the direction opposite to.

At the time of the step of FIG. 7B, since all the lead terminals 11 of the electronic component 10 are hardly deformed by an external force, the insertion of all the lead terminals 11 into the through holes 12a of the guide plate 12 It can be done reliably.

Next, the step of FIG. 7C will be described. In this step, the guide plate 12 is moved from the state shown in FIG. 7B so that the length of each lead terminal 11 protruding downward from the through hole 12 a of the guide plate 12 is reduced.
The positional relationship between the electronic component 10 and the guide plate 12 is adjusted so as to be as short as about 3 in thickness. FIG. 7C shows a state after the adjustment.

In order to move the guide plate 12 toward the leading end of the lead terminal 11, the electronic component holding section 5 may be moved upward in FIG. 7 (c). Alternatively, the plate holding section 4 and the push-down rod 7 may be pushed down to the tip end side of the lead terminal 11 in conjunction with each other. This push-down rod 7
The entire guide plate is in contact with the upper surface of the substantially central portion of the guide plate 12, so that the entire guide plate can be smoothly moved to the leading end side of the lead terminal 11 in parallel.

By moving the guide plate 12 toward the leading end of the lead terminal 11 in this manner, the lead terminal 11
Even if the tip position of the lead terminal is deviated from the original position, the through hole 12a of the guide plate 12 guides the tip of the lead terminal 11 to a predetermined position and positions the tip of the lead terminal 11 at a position where it can be inserted into the lead terminal insertion portion 13a. to correct.

The length of each lead terminal 11 protruding downward from the through hole 12a of the guide plate 12 is as short as the thickness of the circuit board 13, so that the lead terminal 11 is inserted into the lead terminal insertion portion 13a. Sometimes, the tip of each lead terminal 11 is hardly deformed.

Next, the step of FIG. 7D will be described. FIG.
While maintaining the state in which the guide plate 12 is moved to the leading end side of the lead terminal 11 in (c), the positioning holes 8b of the guide plate 12 and the positioning holes 13b of the circuit board 13 are positioned by the positioning pins 8 so that the electronic components are positioned. The component holding part 5 and the plate holding part 4 are moved in the direction of the circuit board 13 in conjunction with each other, and the leading end of the lead terminal 11 is inserted into the lead terminal insertion part 13a.
Insert Then, after the tip of the lead terminal 11 is inserted into the lead terminal insertion portion 13a, only the electronic component holding portion 5 is further moved to the circuit board 13 side to insert the tip of the lead terminal 11 to a position where soldering is possible.

A lead terminal detector 14 is provided on the lower side of the circuit board 13 so that it is possible to inspect whether the leading ends of all the lead terminals 11 are automatically assembled to the lead terminal insertion section 13a of the circuit board 13 accurately. .

[Brief description of the drawings]

FIG. 1 is an overall configuration diagram showing an apparatus for assembling electronic components to a circuit board according to the present invention.

FIG. 2 is a perspective view of the electronic circuit component showing a state where the electronic component is mounted on a circuit board using the electronic component mounting apparatus of the present invention.

FIG. 3 is a side view of the circuit board showing a state where the electronic component is mounted on the circuit board using the electronic component mounting apparatus of the present invention.

FIG. 4 is a partially enlarged view of a portion A in FIG. 3;

FIG. 5 is a detailed view showing a state in which a guide plate 12 is preliminarily mounted on an electronic component 10 to be assembled using the electronic component assembling apparatus of the present invention. (A) It is a front sectional view. FIG. 5B is a side view of FIG.

FIG. 6 is a front view showing a guide plate.

FIG. 7 is a process explanatory view showing a process of assembling an electronic component to a circuit board using the electronic component assembling apparatus of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 electronic component assembling device 3 substrate holding unit 4 plate holding unit 5 electronic component holding unit 7 push-down rod (press-down mechanism) 8 positioning pin (positioning means) 10 electronic component 11 lead terminal 12 guide plate 12a through hole 12b positioning hole (Positioning means) 13 Circuit board 13a Lead terminal insertion portion 13b Positioning hole (positioning means)

Claims (4)

[Claims] 1. A method of assembling an electronic component having a plurality of lead terminals to a circuit board, wherein the plurality of lead terminals are inserted, and a through hole for guiding the tips of the plurality of lead terminals to a predetermined position is provided. When the electronic component is mounted on the circuit board, the length of the plurality of lead terminals protruding from the through hole of the guide plate is reduced. Adjusting the positional relationship between the guide plate and the electronic component, and inserting the plurality of lead terminals into the lead terminal insertion portion of the circuit board while maintaining the positional relationship. Electronic component assembling method. 2. The method according to claim 2, wherein the guide plate and the circuit board are positioned by positioning means when the plurality of lead terminals are inserted into the lead terminal insertion portion of the circuit board. The method for assembling an electronic component to a circuit board according to claim 1, wherein the terminal insertion portion is positioned. 3. An apparatus for assembling an electronic component having a plurality of lead terminals to a circuit board, comprising: a board holding section for holding the circuit board; and a direction for holding the electronic component and facing the circuit board. A movable electronic component holding portion, and a guide plate having a through hole into which the plurality of lead terminals are inserted and which guides the tips of the plurality of lead terminals to a predetermined position is preliminarily mounted on the plurality of lead terminals. A plate holding unit that holds the guide plate and is movable in a direction facing the circuit board; and a positioning unit that positions the guide plate and the circuit board, and assembles the electronic component on the circuit board. When attaching, the electronic component holding unit and the plate holding unit are operated, and the length of the plurality of lead terminals protruding from the through hole of the guide plate is set. The plurality of lead terminals are inserted into the lead terminal insertion portion of the circuit board while adjusting the positional relationship between the guide plate and the electronic component so as to shorten the length, and maintaining the positional relationship. A device for assembling an electronic component to a circuit board. 4. The circuit board according to claim 3, further comprising: a push-down mechanism that is interlocked with the plate holding unit and that presses the guide plate toward the tip ends of the plurality of lead terminals. Electronic parts assembly equipment.