JPH07173373A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPH07173373A JPH07173373A JP31870393A JP31870393A JPH07173373A JP H07173373 A JPH07173373 A JP H07173373A JP 31870393 A JP31870393 A JP 31870393A JP 31870393 A JP31870393 A JP 31870393A JP H07173373 A JPH07173373 A JP H07173373A
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- Japan
- Prior art keywords
- epoxy resin
- bismuth
- weight
- parts
- resin composition
- Prior art date
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- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、耐湿性に優れるエポキ
シ樹脂組成物の製造方法に関するものである。FIELD OF THE INVENTION The present invention relates to a method for producing an epoxy resin composition having excellent moisture resistance.
【０００２】[0002]
【従来の技術】近年、ＩＣ，ＬＳＩなどの半導体の封止
にはエポキシ樹脂の低圧封入法が一般に用いられてい
る。しかし、エポキシ樹脂はエピクロルヒドリンから合
成するため塩素を樹脂中に含有している。また難燃剤と
しては、通常酸化アンチモンとブロム化エポキシ樹脂が
使用されており、熱分解によりブロムイオンが遊離し易
い。この遊離したハロゲンが信頼性を損なうことはよく
知られており、信頼性向上のための方策が強く求められ
てきた。信頼性向上の対策としては、エポキシ樹脂の製
造方法及び精製により耐湿性に関してはかなり問題のな
いレベルにまで到達しつつあるが、アルミ配線パターン
の細線化に伴い信頼性の向上は、更に厳しい要求がなさ
れており、何らかの対策が必要となっている。又ブロム
化エポキシ樹脂から熱分解により発生するブロムイオン
は１７５℃のような高温で放置する高温保管特性テスト
においては不良を発生させる原因になっており、これも
対策が必要となってきている。単にブロム化エポキシ樹
脂にビスマス系無機イオン交換体又はＭｇｘＡｌｙ（Ｏ
Ｈ）ｚ（ＣＯ3)ｎ・ＸＨ2Ｏ〔式中、ｘ，ｙ，ｚ，ｎ，
Ｘは０．１以上の正数を表す〕で示される化合物を予め
溶融混合する方法もあるが、耐湿性及び高温保管特性を
兼ね備えた信頼性を有するものはできていないのが現状
である。2. Description of the Related Art In recent years, a low-pressure encapsulation method of epoxy resin has been generally used for sealing semiconductors such as IC and LSI. However, since the epoxy resin is synthesized from epichlorohydrin, it contains chlorine in the resin. Further, as the flame retardant, antimony oxide and brominated epoxy resin are usually used, and bromine ions are easily liberated by thermal decomposition. It is well known that the liberated halogen impairs the reliability, and a measure for improving the reliability has been strongly demanded. As a measure to improve reliability, we are reaching a level where there is no problem with respect to moisture resistance by the manufacturing method and purification of epoxy resin, but with the thinning of the aluminum wiring pattern, further improvement in reliability is a stricter requirement. Has been done and some measures are needed. Brom ions generated by thermal decomposition from the brominated epoxy resin cause defects in a high temperature storage characteristic test in which the brominated epoxy resin is left at a high temperature such as 175 ° C., and this also requires countermeasures. Simply using brominated epoxy resin and bismuth-based inorganic ion exchanger or MgxAly (O
H) z (CO 3 ) n · XH 2 O [in the formula, x, y, z, n,
X represents a positive number of 0.1 or more], but there is also a method of previously melt-mixing the compound, but in the present situation, it is not possible to obtain a compound having both moisture resistance and high-temperature storage characteristics and reliability.
【０００３】[0003]
【発明が解決しようとする課題】本発明者は、エポキシ
樹脂とビスマス系無機イオン交換体及びＭｇｘＡｌｙ
（ＯＨ）ｚ（ＣＯ3)ｎ・ＸＨ2Ｏ〔式中、ｘ，ｙ，ｚ，
ｎ，Ｘは０．１以上の正数を表す〕で示される化合物を
予め溶融混合することに着目し検討した結果、該溶融混
合物を用いてなるエポキシ樹脂組成物が、耐湿信頼性に
優れていると同時に高温保管特性にも優れていることを
見いだし、本発明を完成するに至ったものである。DISCLOSURE OF THE INVENTION The present inventors have found that an epoxy resin, a bismuth-based inorganic ion exchanger, and MgxAly.
(OH) z (CO 3 ) n · XH 2 O [wherein x, y, z,
n and X represent a positive number of 0.1 or more]. As a result of studying in advance that the compound represented by the formula (1) is melt-mixed, the epoxy resin composition using the melt-mixed product has excellent moisture resistance reliability. At the same time, they have found that they are also excellent in high-temperature storage characteristics, and have completed the present invention.
【０００４】[0004]
【課題を解決するための手段】本発明は、（Ａ）エポキ
シ樹脂１００重量部と、ビスマス系無機イオン交換体
０．５〜１０重量部及びＭｇｘＡｌｙ（ＯＨ）ｚ（ＣＯ
3）ｎ・ＸＨ2Ｏ〔式中、ｘ，ｙ，ｚ，ｎ，Ｘは０．１以
上の正数を表す〕で示される化合物０．５〜１０重量部
を予め溶融混合してなる溶融混合物、（Ｂ）硬化剤及び
（Ｃ）無機充填材を必須とするエポキシ樹脂組成物であ
る。According to the present invention, 100 parts by weight of (A) epoxy resin, 0.5 to 10 parts by weight of bismuth-based inorganic ion exchanger and MgxAly (OH) z (CO) are used.
3 ) Melt obtained by previously mixing and mixing 0.5 to 10 parts by weight of a compound represented by n · XH 2 O [wherein x, y, z, n, and X are positive numbers of 0.1 or more]. It is an epoxy resin composition in which a mixture, (B) a curing agent, and (C) an inorganic filler are essential.
【０００５】本発明に用いるエポキシ樹脂は、分子中に
エポキシ基を有するものならば、特に限定するものでは
ないが、よく用いられるものとしては、オルソクレゾー
ルノボラック型エポキシ樹脂、フェノールノボラック型
エポキシ樹脂、ビスフェノール型エポキシ樹脂、ナフタ
レン型エポキシ樹脂、トリフェノールメタン型エポキシ
樹脂、トリアジン核含有エポキシ樹脂、ビフェニル型二
官能エポキシ樹脂及びこれらの変性樹脂等の他、更にブ
ロム化エポキシ樹脂としては、ブロム化フェノールノボ
ラック型エポキシ樹脂、ブロム化ビスフェノール型エポ
キシ樹脂等が挙げられる。本発明では、ブロム化エポキ
シ樹脂と他のエポキシ樹脂を混合して用いる。樹脂組成
物の耐湿性向上のためには、不純物としてのＣＩイオ
ン、Ｎａイオン等の不純物イオンが極力少ないことが望
ましく、又、硬化性のためにはエポキシ当量が１５０〜
３００が望ましい。硬化剤は、分子中にフェノール性水
酸基を有するものならば、特に限定するものではない
が、よく用いられる樹脂としては、フェノールノボラッ
ク樹脂、パラキシリレン変性フェノール樹脂、トリフェ
ノールメタン樹脂及びこれらの変性樹脂が挙げられる。
樹脂組成物の硬化性のため、水酸基当量は８０〜２５０
程度が望ましい。The epoxy resin used in the present invention is not particularly limited as long as it has an epoxy group in the molecule, but common ones are orthocresol novolac type epoxy resin, phenol novolac type epoxy resin, In addition to bisphenol type epoxy resin, naphthalene type epoxy resin, triphenol methane type epoxy resin, triazine nucleus-containing epoxy resin, biphenyl type bifunctional epoxy resin and modified resins thereof, brominated phenol novolac is further used as a brominated epoxy resin. Type epoxy resin, brominated bisphenol type epoxy resin and the like. In the present invention, a brominated epoxy resin and another epoxy resin are mixed and used. In order to improve the moisture resistance of the resin composition, it is desirable that impurity ions such as CI ions and Na ions as impurities are as small as possible, and the epoxy equivalent is 150 to 150 for curing.
300 is desirable. The curing agent is not particularly limited as long as it has a phenolic hydroxyl group in the molecule, but as the resin often used, phenol novolac resin, paraxylylene modified phenol resin, triphenol methane resin and these modified resins are used. Can be mentioned.
Due to the curability of the resin composition, the hydroxyl equivalent is 80-250.
The degree is desirable.
【０００６】無機充填材として、溶融シリカ粉末、球状
シリカ粉末、結晶シリカ粉末、アルミナ等を使用でき
る。硬化促進剤は、エポキシ基と水酸基の反応を促進す
るものであればよく、一般に封止樹脂に使用されている
ものを利用できる。例えば、１，８−ジアザビシクロウ
ンデセン、トリフェニルホスフィン、ベンジルジメチル
アミン、２−メチルイミダゾール等が単独または混合し
て用いられる。As the inorganic filler, fused silica powder, spherical silica powder, crystalline silica powder, alumina and the like can be used. Any curing accelerator may be used as long as it accelerates the reaction between the epoxy group and the hydroxyl group, and those generally used for sealing resins can be used. For example, 1,8-diazabicycloundecene, triphenylphosphine, benzyldimethylamine, 2-methylimidazole and the like are used alone or in combination.
【０００７】本発明に用いる溶融混合物は、樹脂成分と
してブロム化エポキシ樹脂と、他のエポキシ樹脂必須成
分とし、予めビスマス系無機イオン交換体及びＭｇｘＡ
ｌｙ（ＯＨ）ｚ（ＣＯ3)ｎ・ＸＨ2Ｏ〔式中、ｘ，ｙ，
ｚ，ｎ，Ｘは０．１以上の正数を表す〕で示される化合
物と溶融混合したものであり、ビスマス系無機イオン交
換体とＭｇｘＡｌｙ（ＯＨ）ｚ（ＣＯ3)ｎ・ＸＨ2Ｏを
併用することにより、初めて耐湿性及び高温保管特性に
優れたものが得られる。本発明で用いるビスマス系無機
イオン交換体には、ビスマスの含水化物、水酸化物等が
ある。ビスマス系無機イオン交換体は、エポキシ樹脂１
００重量部に対し、０．５〜１０重量部添加するが０．
５部未満だとイオン交換能力が不充分であり、１０重量
部を越えるとＰＣＴ等の信頼性が低下し好ましくない。
又、本発明で用いるＭｇｘＡｌｙ（ＯＨ）ｚ（ＣＯ3)ｎ
・ＸＨ2Ｏ〔式中、ｘ，ｙ，ｚ，ｎ，Ｘは０．１以上の
正数を表す〕で示される化合物は、エポキシ樹脂１００
重量部に対し、０．５〜１０重量部添加するが０．５未
満だとイオン交換能力が不充分であり、１０重量部を越
えるとＰＣＴ等の信頼性が低下し好ましくない。The molten mixture used in the present invention contains a brominated epoxy resin as a resin component and other epoxy resin essential components, and is preliminarily prepared with a bismuth inorganic ion exchanger and MgxA.
ly (OH) z (CO 3 ) n · XH 2 O [in the formula, x, y,
z, n, X represents a positive number of 0.1 or more] and is melt-mixed with a bismuth-based inorganic ion exchanger and MgxAly (OH) z (CO 3 ) n · XH 2 O. Only when used in combination is it possible to obtain excellent moisture resistance and high-temperature storage characteristics. Examples of the bismuth-based inorganic ion exchanger used in the present invention include bismuth hydrates and hydroxides. Bismuth-based inorganic ion exchanger is epoxy resin 1
0.5 to 10 parts by weight is added to 0.00 part by weight,
If it is less than 5 parts, the ion exchange capacity is insufficient, and if it exceeds 10 parts by weight, the reliability of PCT and the like is deteriorated, which is not preferable.
In addition, MgxAly (OH) z (CO 3 ) n used in the present invention
The compound represented by XH 2 O [wherein x, y, z, n, and X are positive numbers of 0.1 or more] is an epoxy resin 100.
0.5 to 10 parts by weight is added to parts by weight, but if it is less than 0.5, the ion exchange capacity is insufficient, and if it exceeds 10 parts by weight, the reliability of PCT and the like decreases, which is not preferable.
【０００８】本発明で用いる溶融混合物は、ブロム化エ
ポキシ樹脂と他のエポキシ樹脂を、その軟化点以上に加
熱溶融し、所定量のビスマス系無機イオン交換体及びＭ
ｇｘＡｌｙ（ＯＨ）ｚ（ＣＯ3)ｎ・ＸＨ2Ｏで示される
化合物を添加し、均一に混合したものである。各成分が
均一に混合される条件ならば、特に限定しないが、通常
加熱温度８０〜２００℃、混合時間は３０分〜５時間で
ある。均一に混合されないと、ビスマス系無機イオン交
換体及びＭｇｘＡｌｙ（ＯＨ）ｚ（ＣＯ3)ｎ・ＸＨ2Ｏ
で示される化合物のＰＣＴ等の信頼性に充分な効果を発
揮できない。The molten mixture used in the present invention is obtained by heating and melting a brominated epoxy resin and another epoxy resin to a temperature above its softening point to give a predetermined amount of bismuth-based inorganic ion exchanger and M.
A compound represented by gxAly (OH) z (CO 3 ) n · XH 2 O was added and uniformly mixed. The conditions are not particularly limited as long as the components are uniformly mixed, but the heating temperature is usually 80 to 200 ° C., and the mixing time is 30 minutes to 5 hours. If they are not mixed uniformly, the bismuth-based inorganic ion exchanger and MgxAly (OH) z (CO 3 ) n.XH 2 O
It is not possible to exert a sufficient effect on the reliability of the compound represented by in PCT and the like.
【０００９】本発明の必須成分以外に、必要に応じて更
にエポキシ樹脂、硬化促進剤、シランカップリング剤、
三酸化アンチモン、ヘキサブロモベンゼン等の難燃剤、
カーボンブラック等の着色剤、天然ワックス、合成ワッ
クス等の離型剤及びシリコーンオイル、ゴム等の低応力
添加剤等の種々の添加剤を適宜添加して、混練しても差
し支えない。In addition to the essential components of the present invention, if necessary, an epoxy resin, a curing accelerator, a silane coupling agent,
Flame retardants such as antimony trioxide and hexabromobenzene,
Coloring agents such as carbon black, releasing agents such as natural wax and synthetic wax, and various additives such as low-stress additives such as silicone oil and rubber may be appropriately added and kneaded.
【００１０】溶融混合物の製造例 エポキシ樹脂（住友化学工業（株）製 ＥＳＣＮ−１９
５Ｌ 軟化点６５℃、エポキシ当量２００）９０重量
部、ブロム化エポキシ樹脂（日本化薬（株）製ＢＲＥＮ
軟化点８５℃、エポキシ当量２７５）１０重量部を加
熱溶融し、次にビスマス化合物（東亜合成化学（株）製
ＨＫ−５００）１重量部、Ｍｇ3.5Ａｌ2(ＯＨ)13ＣＯ
3・３．５Ｈ2Ｏ（協和化学工業（株）製）５重量部を１
５０℃で、２時間溶融混合した。この溶融混合物を冷却
し、ハンマーミルで粉砕した。これを溶融混合物とす
る。 溶融混合物の製造例〜 製造例と同一の原料を用いて、下記配合で製造例と
同様にして、溶融混合物を得た。 溶融混合物 エポキシ樹脂 ９０ ９０ ９０ ブロム化エポキシ樹脂 １０ １０ １０ ビスマス化合物 ５ ０ ５ Mg3.5Al2(OH)13CO3・3.5H2O １ ５ ０Production Example of Melt Mixture Epoxy resin (ESCN-19 manufactured by Sumitomo Chemical Co., Ltd.)
5 L softening point 65 ° C., epoxy equivalent 200) 90 parts by weight, brominated epoxy resin (BEN made by Nippon Kayaku Co., Ltd.)
Softening point 85 ° C, 10 parts by weight of epoxy equivalent 275) are melted by heating, and then 1 part by weight of bismuth compound (HK-500 manufactured by Toagosei Kagaku Co., Ltd.), Mg 3.5 Al 2 (OH) 13 CO.
3 · 3.5 H 2 O (manufactured by Kyowa Chemical Industry Co., Ltd.) 5 parts by weight 1
Melt-mixed at 50 ° C. for 2 hours. The molten mixture was cooled and ground with a hammer mill. This is the molten mixture. Production Example of Melt Mixture-Using the same raw materials as in the production example, the following formulation was used to obtain a melt mixture in the same manner as in the production example. Melt mixture Epoxy resin 90 90 90 Brominated epoxy resin 10 10 10 Bismuth compound 50 5 Mg 3.5 Al 2 (OH) 13 CO 3 · 3.5H 2 O 1 50
【００１１】以下、低圧封入型半導体封止用エポキシ樹
脂組成物について、実施例を用いて説明する。配合量は
全て重量部である。The low-pressure encapsulation type epoxy resin composition for semiconductor encapsulation will be described below with reference to examples. All compounding amounts are parts by weight.
【実施例】実施例、比較例で用いた原料は以下の通りで
ある。 エポキシ樹脂 住友化学工業（株） ＥＳＣＮ−１９５Ｌ（軟化 点６５℃、エポキシ当量２００） 硬化剤 住友ベークライト（株） フェノールノボラック（軟 化点１０５℃、水酸基当量１０４） 硬化促進剤 住友化学工業（株） スミキュアーＤ ブロム化エポキシ樹脂 日本化薬（株） ＢＲＥＮ（軟化点８５℃、 エポキシ当量２７５） 三酸化アンチモン 住友金属鉱山（株） 無機充填材 龍森（株） ＲＤ−８ 表面処理剤 日本ユニカー（株） Ａ−１８６ 顔料 三菱化成（株） カーボンブラック 離型剤 野田ワックス（株） ビスマス化合物 東亜合成化学（株） ＨＫ−５００ Ａｌ−Ｍｇ化合物 協和化学工業（株） Ｍｇ3.5Ａｌ2(ＯＨ)13ＣＯ3・３．５Ｈ2ＯEXAMPLES The raw materials used in Examples and Comparative Examples are as follows. Epoxy resin Sumitomo Chemical Co., Ltd. ESCN-195L (softening point 65 ° C, epoxy equivalent 200) Curing agent Sumitomo Bakelite Co., Ltd. Phenol novolac (softening point 105 ° C, hydroxyl equivalent 104) Curing accelerator Sumitomo Chemical Co., Ltd. Sumicure D Brominated epoxy resin Nippon Kayaku Co., Ltd. BREN (softening point 85 ° C, epoxy equivalent 275) Antimony trioxide Sumitomo Metal Mining Co., Ltd. Inorganic filler Tatsumori Co., Ltd. RD-8 Surface treatment agent Nippon Unicar Co., Ltd. ) A-186 Pigment Mitsubishi Kasei Co., Ltd. Carbon black Release agent Noda Wax Co., Ltd. Bismuth compound Toagosei Co., Ltd. HK-500 Al-Mg compound Kyowa Chemical Industry Co., Ltd. Mg 3.5 Al 2 (OH) 13 CO 3 · 3.5H 2 O
【００１２】実施例１ 溶融混合物と硬化剤、硬化促進剤、無機充填材、三酸
化アンチモン、表面処理剤、顔料、離型剤を表１の割合
で配合し、ヘンシェルミキサーにて混合した後、１００
℃の加熱ロールで３分間混練し、エポキシ樹脂組成物を
得た。評価結果を表１に示す。 耐湿性：１２５℃、２．３気圧のＰＣＴで５００時間ま
で試験し、ＩＣ（１６ｐＤＩＰ）のオープン不良を測定
した。 高温保管特性：１８５℃で５００時間まで試験し、ＩＣ
（１６ｐＤＩＰ）の配線の電気抵抗の変化を調べ、１Ω
以上（初期０．７Ω）を不良とした。 実施例２ 表１の配合に従い、実施例１と同様にして、エポキシ樹
脂組成物を得、同様に評価した。評価結果を表１に示
す。 比較例１、２ 表１の配合に従い、実施例１と同様にして、エポキシ樹
脂組成物を得、同様に評価した。評価結果を表１に示
す。ビスマス系無機イオン交換体、又はＭｇ3.5Ａｌ
2(ＯＨ)13ＣＯ3・３．５Ｈ2Ｏのいずれかが溶融されて
いないと、耐湿性及び高温保管特性で不良が発生し、望
ましくない。 比較例３ エポキシ樹脂にビスマス系無機イオン交換体及びＭｇ
3.5Ａｌ2(ＯＨ)13ＣＯ3・３．５Ｈ2Ｏを予め溶融混合せ
ずに、単に混合したものは耐湿性、高温保管特性ともに
不充分となる。 比較例４ ビスマス系無機イオン交換体及びＭｇ3.5Ａｌ2(ＯＨ)13
ＣＯ3・３．５Ｈ2Ｏのいずれも配合しない場合は比較例
２よりも更に耐湿性、高温保管特性ともに低下し、イオ
ン補足剤の信頼性に及ぼす効果が確認できる。Example 1 A melt mixture, a curing agent, a curing accelerator, an inorganic filler, antimony trioxide, a surface treatment agent, a pigment and a release agent were mixed in the proportions shown in Table 1 and mixed in a Henschel mixer. 100
The mixture was kneaded with a heating roll at ℃ for 3 minutes to obtain an epoxy resin composition. The evaluation results are shown in Table 1. Moisture resistance: Tested with PCT at 125 ° C. and 2.3 atm for up to 500 hours to measure open defects of IC (16 pDIP). High temperature storage characteristics: tested at 185 ℃ for up to 500 hours, IC
Check the change in the electrical resistance of the (16 pDIP) wiring, and
The above (initial 0.7 Ω) was regarded as a defect. Example 2 According to the formulation of Table 1, an epoxy resin composition was obtained in the same manner as in Example 1 and evaluated in the same manner. The evaluation results are shown in Table 1. Comparative Examples 1 and 2 According to the formulations shown in Table 1, an epoxy resin composition was obtained and evaluated in the same manner as in Example 1. The evaluation results are shown in Table 1. Bismuth type inorganic ion exchanger, or Mg 3.5 Al
If any of 2 (OH) 13 CO 3 .3.5H 2 O is not melted, defects in moisture resistance and high-temperature storage characteristics occur, which is not desirable. Comparative Example 3 Epoxy resin and bismuth-based inorganic ion exchanger and Mg
If 3.5 Al 2 (OH) 13 CO 3 .3.5H 2 O is not melt-mixed in advance but simply mixed, both the moisture resistance and the high temperature storage characteristics are insufficient. Comparative Example 4 Bismuth-based inorganic ion exchanger and Mg 3.5 Al 2 (OH) 13
When neither CO 3 nor 3.5H 2 O was added, both the moisture resistance and the high temperature storage characteristics were lower than in Comparative Example 2, and the effect on the reliability of the ion scavenger can be confirmed.
【００１３】[0013]
【表１】 [Table 1]
【００１４】[0014]
【発明の効果】本発明に従うと、エポキシ樹脂及びブロ
ム化エポキシ樹脂から発生する遊離ハロゲンを効果的に
捕らえ、不活性化できる。即ち、耐湿性及び高温保管特
性に極めて優れたエポキシ樹脂を得ることができる。Ｉ
Ｃ，ＬＳＩの高信頼性要求に応じたものとして広範囲な
用途に適用できるエポキシ樹脂封止材料を供給できるこ
とになり、その効果は大きく工業的に有用である。According to the present invention, the free halogen generated from the epoxy resin and the brominated epoxy resin can be effectively trapped and inactivated. That is, it is possible to obtain an epoxy resin having excellent moisture resistance and high-temperature storage characteristics. I
It is possible to supply an epoxy resin encapsulating material that can be applied to a wide range of applications as a material that meets the high reliability requirements of C and LSI, and the effect is large and industrially useful.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 23/31 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI technical display location H01L 23/31
Claims (1)
スマス系無機イオン交換体０．５〜１０重量部及びＭｇ
ｘＡｌｙ（ＯＨ）ｚ（ＣＯ3）ｎ・ＸＨ2Ｏ〔式中、ｘ，
ｙ，ｚ，ｎ，Ｘは０．１以上の正数を表す〕で示される
化合物０．５〜１０重量部を予め溶融混合してなる溶融
混合物、（Ｂ）硬化剤及び（Ｃ）無機充填材を必須とす
ることを特徴とするエポキシ樹脂組成物。1. (A) 100 parts by weight of an epoxy resin, 0.5 to 10 parts by weight of a bismuth-based inorganic ion exchanger, and Mg
xAly (OH) z (CO 3 ) n · XH 2 O [in the formula, x,
y, z, n, X represents a positive number of 0.1 or more], a melt mixture obtained by previously mixing 0.5 to 10 parts by weight of a compound represented by the formula: (B) a curing agent and (C) an inorganic filler. An epoxy resin composition, characterized in that a material is essential.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31870393A JPH07173373A (en) | 1993-12-17 | 1993-12-17 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31870393A JPH07173373A (en) | 1993-12-17 | 1993-12-17 | Epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07173373A true JPH07173373A (en) | 1995-07-11 |
Family
ID=18102059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31870393A Pending JPH07173373A (en) | 1993-12-17 | 1993-12-17 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07173373A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10152599A (en) * | 1996-11-21 | 1998-06-09 | Sumitomo Bakelite Co Ltd | Epoxy resin composition |
-
1993
- 1993-12-17 JP JP31870393A patent/JPH07173373A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10152599A (en) * | 1996-11-21 | 1998-06-09 | Sumitomo Bakelite Co Ltd | Epoxy resin composition |
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