JP2002201340A - Epoxy resin composition and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing a semiconductor having excellent moldability, reliability of moisture resistance, solder resistance, flame retardance and high-temperature storage characteristics without containing a halogen flame retardant and an antimony compound. SOLUTION: This epoxy resin composition for sealing the semiconductor is characterized in that the composition consists essentially of (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler, (E) a phosphazene compound and (F) a red phosphorus flame retardant.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition for semiconductor encapsulation which does not contain a halogen-based flame retardant and an antimony compound and has excellent flame retardancy and high-temperature storage characteristics, and a semiconductor device.

[0002]

2. Description of the Related Art Conventionally, electronic components such as diodes, transistors, and integrated circuits are mainly sealed with an epoxy resin composition. These epoxy resin compositions usually contain a bromine atom-containing flame retardant and antimony compounds such as antimony trioxide, antimony tetroxide and antimony pentoxide in order to impart flame retardancy. However, with increasing awareness of environmental protection worldwide, there is an increasing demand for epoxy resin compositions having flame retardancy without using halogen-based flame retardants or antimony compounds. Further, when a semiconductor device sealed with an epoxy resin composition containing a halogen-based flame retardant and an antimony compound is stored at a high temperature, a thermally decomposed halide is liberated from these flame retardant components and the semiconductor element is bonded. Epoxy resin which is known to corrode the semiconductor device and impair the reliability of the semiconductor device, and can achieve a flame retardant grade of UL-94 V-0 without using a halogen-based flame retardant and an antimony compound as a flame retardant. A composition is required. As described above, the corrosion resistance of the bonding portion (bonding pad portion) of the semiconductor element after storing the semiconductor device at a high temperature (for example, 185 ° C.) is called a high-temperature storage characteristic, and the high-temperature storage characteristic is improved. Examples of the method include a method using diantimony pentoxide (Japanese Patent Application Laid-Open No. 55-146950) and a method of combining antimony oxide with an organic phosphine (Japanese Patent Application Laid-Open No.
No. 1-53321) has been proposed and the effect has been confirmed. However, some types of epoxy resin compositions are not satisfactory with respect to the recent high level of high-temperature storage characteristics required for semiconductor devices. Accordingly, Japanese Patent Application Laid-Open No. H10-259
By using a cyclic phosphazene compound as proposed in JP-A-292-292, sufficient flame retardancy could be achieved without using a bromine compound and an antimony compound. In this case, there was a problem that the humidity resistance reliability was lowered due to mold contamination, a decrease in strength, an increase in moisture absorption, and the like. For this reason, an epoxy resin composition that can obtain flame retardancy even when the amount of the cyclic phosphazene compound added is small is desired. Red phosphorus-based flame retardants have also been proposed, but when used alone, to obtain the same flame retardancy as a sealant using a bromine compound and an antimony compound, the curability, strength, and moisture resistance There are problems such as lowering. That is, there is a need for an epoxy resin composition that maintains flame retardancy, is excellent in moldability and high-temperature storage characteristics, and does not use a halogen-based flame retardant and an antimony compound.

[0003]

DISCLOSURE OF THE INVENTION The present invention relates to an epoxy resin composition for semiconductor encapsulation which does not contain a halogen-based flame retardant and an antimony compound and has excellent moldability, flame retardancy and high-temperature storage characteristics. To provide a semiconductor device in which a semiconductor element is sealed.

[0004]

Means for Solving the Problems The present invention provides [1] (A)
A semiconductor encapsulation comprising, as essential components, an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler, (E) a phosphazene compound, and (F) a red phosphorus-based flame retardant. The epoxy resin composition for stopping semiconductors, [2] the epoxy resin composition for semiconductor encapsulation according to [1], wherein the red phosphorus-based flame retardant is obtained by coating the surface of red phosphorus with an organic compound and / or an inorganic compound. [3] The epoxy resin composition for semiconductor encapsulation according to [1] or [2], wherein the red phosphorus-based flame retardant has a red phosphorus surface coated with a thermosetting resin and / or a metal hydroxide. object. [4] The red phosphorus-based flame retardant is obtained by coating the surface of red phosphorus with aluminum hydroxide and then further coating the surface with a phenol resin and / or an epoxy resin. [1], [2], or [3], wherein the content of the red phosphorus-based flame retardant is 60 to 95% by weight and the average particle size of the red phosphorus-based flame retardant is 0.1 to 70 μm and the maximum particle size is 200 μm or less. The epoxy resin composition for semiconductor encapsulation according to the item,
[5] The epoxy resin composition for semiconductor encapsulation according to [1], [2], [3], or [4], wherein the phosphazene compound is a cyclic phosphazene compound; The epoxy resin composition for semiconductor encapsulation according to item [5], which is a cyclic phosphazene compound represented by the formula (1):

Embedded image (In the formula, n is an integer of 3 to 7, and Rs are the same or different organic groups.) [7] At least n out of 2n Rs of the cyclic phosphazene compound represented by the general formula (1) [6] The epoxy resin composition for semiconductor encapsulation according to [6], which is a phenoxy group, and [8] a bromine atom and an antimony atom contained in the entire epoxy resin composition are each less than 0.1% by weight. [1], [2], [3], [4], [5],
[6] or a semiconductor element using the epoxy resin composition for semiconductor encapsulation according to [7] or [9] the epoxy resin composition for semiconductor encapsulation according to any one of [1] to [8]. Wherein the semiconductor device is sealed.

[0005]

BEST MODE FOR CARRYING OUT THE INVENTION The epoxy resin used in the present invention refers to all monomers, oligomers and polymers having two or more epoxy groups in one molecule, and their molecular weight and molecular structure are not particularly limited. For example, biphenyl type epoxy resin, bisphenol type epoxy resin,
Stilbene epoxy resin, phenol novolak epoxy resin, cresol novolak epoxy resin, triphenolmethane epoxy resin, alkyl-modified triphenolmethane epoxy resin, epoxy resin containing triazine nucleus, dicyclopentadiene-modified phenol epoxy resin, phenol aralkyl Type epoxy resin (having a phenylene skeleton, biphenylene skeleton and the like), a naphthol type epoxy resin and the like.
More than one kind may be used in combination.

The phenolic resin used in the present invention includes:
Monomers, oligomers and polymers generally having two or more phenolic hydroxyl groups in one molecule are not particularly limited in molecular weight and molecular structure. For example, phenol novolak resin, cresol novolak resin, dicyclopentadiene-modified phenol Resins, terpene-modified phenol resins, triphenol methane resins, phenol aralkyl resins (having a phenylene skeleton, biphenylene skeleton, etc.), naphthol resins and the like can be used alone or in combination of two or more. Particularly, a phenol novolak resin, a dicyclopentadiene-modified phenol resin, a phenol aralkyl resin, a terpene-modified phenol resin and the like are preferable. The amount of these compounds is 0.8 to 1.% in the ratio of the number of epoxy groups of all epoxy resins including the epoxy resin and phenol resin used for coating red phosphorus to the number of phenolic hydroxyl groups of all phenol resins.
3 is preferred.

As the curing accelerator used in the present invention, any one can be used as long as it promotes a curing reaction between an epoxy group and a phenolic hydroxyl group, and those generally used for a sealing material can be used. For example, 1,8-diazabicyclo (5,4,0) undecene-7, triphenylphosphine, 2-methylimidazole, tetraphenylphosphonium / tetraphenylborate and the like can be mentioned, and these can be used alone or in combination of two or more kinds. No problem.

As the inorganic filler used in the present invention, those generally used for a sealing material can be used. For example, fused silica, crystalline silica, talc, alumina, silicon nitride, aluminum hydroxide, and the like can be mentioned, and these may be used alone or in combination of two or more. Among these, the total amount of fused silica with high sphericity,
Alternatively, it is preferable to use partially crushed silica. The average particle size of the inorganic filler is preferably 5 to 30 μm, and the maximum particle size is preferably 74 μm or less. Further, by mixing particles having different particle sizes, the filling amount can be increased. As the inorganic filler, a material which has been surface-treated with a silane coupling agent or the like in advance may be used. As the content of the inorganic filler, from the balance between moldability and solder resistance, the total amount of the inorganic filler and the inorganic compound used for coating red phosphorus is 60 to 95% by weight in the total epoxy resin composition. preferable. If it is less than 60% by weight, the soldering resistance decreases with an increase in the moisture absorption rate, and if it exceeds 95% by weight, there is a possibility that problems such as wire sweep and pad shift may occur.

The phosphazene compound used in the present invention may be any compound having a phosphazene structure in the compound.
For example, a compound having a structure represented by the general formula (2) can be exemplified, and acts as a flame retardant.

Embedded image In the general formula (2), n is an integer of 3 to 1000, and R is, for example, generally an alkyl group, an alkenyl group, an alkoxy group, an aryl group, an aryloxy group, and the like. , A mercapto group, a hydroxy group, a fluoroalkyl group and the like, and may contain an N, S, O, F atom or the like. These phosphazene compounds may be used alone or in combination of two or more. The flame-retardant mechanism of the phosphazene compound has a carbonization promoting effect by phosphorus contained therein, that is, by forming a nonflammable carbonized layer on the surface of the cured product, thereby protecting the surface of the cured product,
And the effect of shutting off oxygen is obtained, and the nitrogen contained therein generates nitrogen gas during thermal decomposition and shuts off oxygen even in the gas phase. The phosphazene compound can impart high flame retardancy due to the flame retardant effect working in both the solid phase and the gas phase.

Preferred phosphazene compounds are cyclic phosphazene compounds in view of the fluidity of the epoxy resin composition of the present invention. Examples of the cyclic phosphazene compound include a cyclic phosphazene compound represented by the general formula (1). In the general formula (1), R represents an alkyl group, an alkenyl group, an alkoxy group, an aryl group, an aryloxy group, or the like. However, N, S, O, F atoms and the like may be contained as represented by an amino group, a mercapto group, a hydroxy group, a fluoroalkyl group and the like. These cyclic phosphazene compounds can be used alone or in combination.
It may be used in combination of more than one kind. Further, it is more preferable that the main component be a trimer 6-membered ring. General formula (1)
As the cyclic phosphazene compound represented by, specifically, for example, hexapropylcyclotriphosphazene,
Tetraethoxydipropoxycyclotriphosphazene,
Examples include hexaphenoxycyclotriphosphazene, hexaanilinocyclotriphosphazene, hexakis (3-mercaptopropyl) cyclotriphosphazene, and hexakis (heptafluoropropyloxy) cyclotriphosphazene. As R in the general formulas (2) and (1), an aryloxy group is preferable from the viewpoint of heat resistance and moisture resistance. From the viewpoint of compatibility with the epoxy resin and fluidity of the epoxy resin composition, More preferably, at least n of the 2n Rs are phenoxy groups.

Further, as an example of another cyclic phosphazene compound, a compound in which one cyclic phosphazene is bonded to another cyclic phosphazene via another organic group in order to enhance flame retardancy is also preferable. In this case, the cyclic phosphazenes may be of the same type or of different types. For example, a compound in which a part of R of one cyclic phosphazene represented by the general formula (1) is bonded to a part of R of another cyclic phosphazene via another organic group or R, These other organic groups may be not only single groups but also groups combined with other groups. For example, a compound having a phosphazene group at both terminals of an organic group may be used. As another organic group bonding these cyclic phosphazenes to each other, for example,
Hydrogen atoms are removed from organic groups such as 1,6-dioxyhexane by removing hydrogen atoms from hydroxyl groups of diol compounds, or hydrogen atoms from dihydroxy compounds such as bifunctional phenol compounds such as hydroquinone, 4,4'-biphenol and bisphenol F. Excluded groups and the like can be preferably used.

The amount of the phosphazene compound of the present invention is as follows:
The content is preferably 0.01 to 15% by weight, more preferably 0.1 to 10% by weight, based on the total epoxy resin composition. 0.
If it is less than 01% by weight, the flame retardancy is insufficient, and if it exceeds 15% by weight, the curability, heat resistance and strength are reduced, and the water absorption is undesirably increased.

As the red phosphorus-based flame retardant used in the present invention, red phosphorus alone is also included, and those generally used as a sealing material can be used. As the red phosphorus, fine particles made of red phosphorus obtained by directly spheroidizing yellow phosphorus or an aggregate thereof are particularly preferable, and it is not necessary to crush and use these. Further, as the red phosphorus-based flame retardant, one obtained by coating the surface of red phosphorus with an organic compound and / or an inorganic compound is preferable. When an organic compound and an inorganic compound are used in combination for coating, any of the organic compound layer and the inorganic compound layer coated on red phosphorus may be inside or outside, or a mixture of the organic compound and the inorganic compound. It may be used for coating.

The organic compound is not particularly limited, but includes, for example, a thermosetting resin, a coupling agent and the like, and a thermosetting resin is particularly preferable. Examples of the thermosetting resin include a phenol resin, an epoxy resin, a xylene-formaldehyde resin, a ketone-formaldehyde resin, a urea resin, a melamine resin, an aniline resin, an alkyd resin, an unsaturated polyester resin, and the like. Epoxy resins are preferred. These organic compounds may be used alone or in combination of two or more.

Examples of the inorganic compound include, but are not limited to, metal hydroxides, metal oxides such as titanium dioxide, alumina, zinc oxide and magnesium oxide, metal nitrides, magnesium carbonate, and aluminum silicate. ,
Examples thereof include metal compounds such as barium sulfate, calcium sulfate, calcium phosphate, apatite, talc, bentonite, and kaolin; silica, silicon nitride, and diatomaceous earth; and particularly preferred are metal hydroxides. The metal hydroxide is not particularly limited, for example, aluminum hydroxide,
Magnesium hydroxide, titanium hydroxide and the like. Aluminum has an effect of suppressing oxidation of red phosphorus, and suppresses elution of phosphate ions and phosphite ions from red phosphorus. From the viewpoint, aluminum hydroxide is preferred. These inorganic compounds may be used alone or in combination of two or more.

That is, as the red phosphorus-based flame retardant of the present invention, red phosphorus whose surface is coated with aluminum hydroxide and further coated with a phenol resin and / or an epoxy resin is more preferable. There is no restriction on the method of coating, but from the point of uniformity of coating, red phosphorus is coated by reducing aluminum sulfate, aluminum nitrate, and the like in the liquid phase to change to aluminum hydroxide, Further, a method of using an acid in a resole resin solution, coating with a formed phenol resin, and drying is most preferable. When red phosphorus is crushed into fine particles, the red phosphorus in the fractured surface has a very high activity and becomes unstable, and the moisture resistance tends to deteriorate. However, by coating with phenol resin and / or epoxy resin after coating with aluminum hydroxide in advance, deterioration of moisture resistance can be prevented. The epoxy resin used for coating contains at least an epoxy resin and a curing agent.
After the surface of red phosphorus is coated with aluminum hydroxide, the content of red phosphorus in the red phosphorus flame retardant whose surface is further coated with a phenol resin and / or an epoxy resin is 60 to 9%.
5% by weight is preferred. If it is less than 60% by weight, the coating layer becomes thicker and the effect of flame retardation is reduced. If it exceeds 95% by weight, the coating layer becomes thinner, causing a redox heterogeneous reaction in the presence of moisture, and from red phosphorus. Since phosphate ions and phosphite ions are easily generated, there is a possibility that the humidity resistance reliability is reduced.

As the phenol resin used for coating, 1
Monomers, oligomers, and polymers generally having two or more phenolic hydroxyl groups in the molecule are not particularly limited in molecular weight and molecular structure. For example, phenol novolak resin, cresol novolak resin, dicyclopentadiene-modified phenol resin Terpene-modified phenolic resin, triphenol methane type resin, phenol aralkyl resin (having a phenylene skeleton, biphenylene skeleton, etc.), naphthol aralkyl resin (having a phenylene skeleton, biphenylene skeleton, etc.), and the like. These may be used in combination.

The epoxy resin used for the coating includes all monomers, oligomers and polymers having two or more epoxy groups in one molecule, and their molecular weight and molecular structure are not particularly limited. Resin, bisphenol type epoxy resin, stilbene type epoxy resin, phenol novolak type epoxy resin,
Cresol novolak epoxy resin, triphenolmethane epoxy resin, alkyl-modified triphenolmethane epoxy resin, epoxy resin containing triazine nucleus,
Dicyclopentadiene-modified phenolic epoxy resin,
Phenol aralkyl type epoxy resins (having a phenylene skeleton, biphenylene skeleton and the like), naphthol type epoxy resins and the like can be used, and these may be used alone or in combination of two or more. As a curing agent to be incorporated into the epoxy resin used for coating, a monomer, an oligomer, and a polymer generally having two or more phenolic hydroxyl groups in one molecule are referred to, and their molecular weight and molecular structure are not particularly limited. Phenol novolak resin, cresol novolak resin, dicyclopentadiene-modified phenol resin, terpene-modified phenol resin, triphenolmethane type resin, phenol aralkyl resin (having a phenylene skeleton, biphenylene skeleton, etc.), naphthol aralkyl resin (phenylene skeleton, biphenylene skeleton, etc.) And these may be used alone or in combination of two or more. The total amount of the phenol resin, the epoxy resin, and the curing agent used for coating is preferably 40% by weight or less in the red phosphorus-based flame retardant.

The red phosphorus flame retardant coated with aluminum hydroxide on the surface of red phosphorus and further coated with a phenol resin and / or an epoxy resin has an average particle diameter of 0.1 to 70.
μm and those having a maximum particle size of 200 μm or less are preferred. If the average particle size is less than 0.1 μm, agglomeration or the like occurs, and
If it exceeds, the dispersibility may be reduced. In order to improve the dispersibility, the maximum particle size is preferably 200 μm or less, and if it exceeds 200 μm, the dispersibility may be reduced. These coated red phosphorus flame retardants include, for example, Nova Excel and Novaquel manufactured by Rin Kagaku Kogyo Co., Ltd., and can be easily obtained from the market.

The content of the red phosphorus flame retardant of the present invention is as follows:
0.2 to 2% by weight of the total epoxy resin composition is preferred. If it is less than 0.2% by weight, the flame retardancy is insufficient, and if it exceeds 2% by weight, the moisture resistance may be significantly reduced.

The phosphazene compound and the red phosphorus flame retardant are
Each of them has the property of imparting flame retardancy even if used alone, but a large amount of compounding is required to express sufficient flame retardancy. However, if it is blended in a large amount, the moldability and strength tend to decrease, and the moisture absorption rate tends to increase, and solder resistance decreases.
In order to prevent these physical properties from deteriorating, it is necessary to reduce the compounding amount as much as possible. The present inventors have found that by using a phosphazene compound and a red phosphorus-based flame retardant in combination, flame retardancy can be further improved as a synergistic effect, and the blending amount can be reduced. The flame retarding mechanism of the phosphazene compound has the effect of promoting carbonization by the contained phosphorus, that is, the effect of protecting the surface of the cured product and blocking oxygen by forming a nonflammable carbonized layer on the surface of the cured product. What is obtained, also, due to the nitrogen contained, nitrogen gas is generated during pyrolysis,
By blocking oxygen even in the gas phase. The phosphazene compound can impart high flame retardancy due to the flame retardant effect working in both the solid phase and the gas phase. Red phosphorus has the effect of improving the strength of the carbonized layer by forming a film of polyphosphoric acid. Although the reason is not clear, the combined use of both makes it possible to complement each other's abilities and obtain high flame retardancy as a synergistic effect. As a result, the flame retardancy can be maintained even if the compounding amount is reduced, and a decrease in moldability and strength, an increase in moisture absorption, and the like can be prevented.

The epoxy resin composition of the present invention comprises (A)
In addition to the component (F), a flame retardant such as a brominated epoxy resin or antimony trioxide may be contained as necessary, but the stability of the electrical characteristics of the semiconductor device at a high temperature of 150 to 200 ° C. For applications required, the content of bromine atoms and antimony atoms is preferably less than 0.1% by weight in the total epoxy resin composition, and more preferably not completely contained. If either the bromine atom or the antimony atom is 0.1% by weight or more, the resistance value of the semiconductor device will increase with time when left at high temperatures, and eventually the failure of the gold wire of the semiconductor element to break will occur. Can occur. Also, from the viewpoint of environmental protection, it is desirable that the content of each of the bromine atom and the antimony atom is less than 0.1% by weight and that they are not contained as much as possible. The epoxy resin composition of the present invention contains the components (A) to (F) as essential components,
In addition, various additives such as a silane coupling agent, a colorant such as carbon black, a release agent such as a natural wax and a synthetic wax, and various additives such as a low-stress additive such as silicone oil and rubber are appropriately compounded as necessary. No problem.
In addition, the epoxy resin composition of the present invention is prepared by mixing the components (A) to (F) and other additives sufficiently and uniformly using a mixer or the like, and then melt-kneading with a hot roll or a kneader. , After cooling and pulverized. Various electronic components such as semiconductor elements are encapsulated using the epoxy resin composition of the present invention, and semiconductor devices are manufactured by curing and molding using conventional molding methods such as transfer molding, compression molding, and injection molding. do it.

[0023]

EXAMPLES Hereinafter, the present invention will be described specifically with reference to Examples, but the present invention is not limited thereto. The mixing ratio is by weight. <Example 1> Biphenyl type epoxy resin [4,4'-bis (2,3-epoxypropoxy) -3,3 ', 5,5'-tetramethylbiphenyl is a main component. Melting point 105 ° C, epoxy equivalent 191] 5.9 parts by weight Phenol aralkyl resin (softening point 75 ° C, hydroxyl equivalent 174) 5.1 parts by weight triphenylphosphine 0.2 parts by weight Fused spherical silica (average particle diameter 20 µm) 86. 9 parts by weight 0.5 part by weight of a phosphazene compound represented by the formula (3)

Embedded image Red Phosphorus Flame Retardant 1 (Nova Excel ST140, manufactured by Rin Kagaku Kogyo Co., Ltd., obtained by coating the surface of red phosphorus with aluminum hydroxide and then coating the surface with a phenol resin. Red phosphorus content 93 0.2 parts by weight Carbon black 0.3 parts Carnauba wax 0.5 parts by weight Other additives 0.4 parts by weight were mixed at room temperature using a mixer. , Surface temperature is 90
The mixture was kneaded using two rolls at a temperature of 45 ° C. and 45 ° C., cooled and pulverized to obtain an epoxy resin composition. The obtained epoxy resin composition was evaluated by the following method. Table 1 shows the results.

<Evaluation method> Spiral flow: Using a mold for measuring spiral flow according to EMMI-1-66, a mold temperature of 175 ° C.
The measurement was performed at an injection pressure of 7 MPa and a curing time of 120 seconds. The unit is cm. Curability: Using a transfer molding machine, mold temperature 17
Molding was performed at 5 ° C., an injection pressure of 7.5 MPa, and a curing time of 120 seconds. The surface hardness of the runner 10 seconds after the mold was opened was measured with a Bacol hardness tester # 935. Bacol hardness is an index of curability, and the larger the numerical value, the better the curability. Moisture absorption: Using a low-pressure transfer molding machine, mold a disc having a diameter of 50 mm and a thickness of 3 mm at a mold temperature of 175 ° C., an injection pressure of 7.5 MPa, and a curing time of 120 seconds.
After post-curing for 8 hours, it was left for 168 hours in an environment of 85 ° C. and a relative humidity of 85%, and the change in weight was measured to determine the moisture absorption. The unit is% by weight. Flexural strength during heating: 240 ° C according to JIS K 6911
Was measured for bending strength. The unit is N / mm ² . Flame retardancy: mold temperature 1 using low pressure transfer molding machine
The test piece (1 at 75 ° C., pressure 7 MPa, curing time 120 seconds)
27mm x 12.7mm x 3.2mm), and 17
After post-curing at 5 ° C. for 8 hours, ΔF and Fmax were measured according to the UL-94 vertical method to determine the flame retardancy. Solder resistance: 80 pQFP (2 mm thick, chip size 9.0 mm ×) with a mold temperature of 175 ° C., an injection pressure of 7.5 MPa, and a curing time of 120 seconds using a low-pressure transfer molding machine.
9.0 mm), and post-cured at 175 ° C. for 8 hours.
Leave at 85 ° C. and 85% relative humidity for 168 hours, then
It was immersed in a solder bath at 40 ° C. for 10 seconds. Observe with a microscope,
Crack occurrence rate [(number of external crack occurrence packages) /
(The total number of packages) × 100]. Units%.
Further, the ratio of the semiconductor element area to the peeled area of the cured product of the epoxy resin composition was measured using an ultrasonic flaw detector, and the peeling rate [(peeled area) / (semiconductor element area) × 100] was determined. Units%. High-temperature storage characteristics: 16 at a mold temperature of 175 ° C., a pressure of 7 MPa, and a curing time of 120 seconds using a low-pressure transfer molding machine.
After molding a pDIP (chip size: 3.0 mm x 3.5 mm) and post-curing at 175 ° C for 8 hours, a high-temperature storage test (185 ° C, 1000 hours) was performed, and the electrical resistance between the wirings became the initial value. On the other hand, the package which increased by 20% was judged to be defective. The percentage (defective rate) of the defective number in the 15 packages is shown in percentage. Units%. Content of bromine atom and antimony atom: Compression molded to a diameter of 40 mm and a thickness of 5 to 7 mm at a pressure of 5.9 MPa, and the obtained molded product was subjected to X-ray fluorescence spectroscopy to obtain bromine atoms in all epoxy resin compositions. And the content of antimony atoms were quantified. The unit is% by weight.

<Examples 2 to 3, Comparative Examples 1 to 6> An epoxy resin composition was obtained in the same manner as in Example 1 in accordance with the composition shown in Table 1, and evaluated in the same manner as in Example 1. Table 1 shows the results
Shown in The red phosphorus flame retardant 2 used in Example 3 was NOVAQUEL RX630 manufactured by Rin Kagaku Kogyo KK (the surface of red phosphorus was coated with aluminum hydroxide, and the surface was further coated with a phenol resin. Red phosphorus content 30% by weight,
The average particle size is 30 μm and the maximum particle size is 150 μm). The phosphazene compound used in Example 2 is represented by the formula (4).

Embedded image The brominated bisphenol A type epoxy resin used in the comparative example had an epoxy equivalent of 365 and a bromine atom content of 48% by weight.
It is.

[0026]

[Table 1]

[0027]

According to the present invention, an epoxy resin composition for encapsulating a semiconductor which does not contain a halogen-based flame retardant and an antimony compound and has excellent moldability can be obtained. Excellent solder resistance, flame retardancy, and high temperature storage characteristics.

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (Reference) H01L 23/29 H01L 23/30 R 23/31 F-term (Reference) 4J002 CC03X CC04X CC05X CC07X CC27X CD02W CD03W CD04W CD05W CD06W CD14W CQ013 DA058 DE147 DJ007 DJ017 DJ047 EU116 EU206 EW016 EW176 EY016 FB078 FB268 FD017 FD138 FD156 GQ05 4J036 AA01 DA01 DA02 DA05 DC41 DC46 DD07 FA01 FA04 FB06 FB07 GA23 JA07 4M109 AA01 BA01 CA21 EA02 EB03 EB04 EB03 EB03 EB04 EB03 EC04

Claims (9)

[Claims] 1. An essential component comprising (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler, (E) a phosphazene compound, and (F) a red phosphorus-based flame retardant. An epoxy resin composition for encapsulating a semiconductor, comprising: 2. The red phosphorus-based flame retardant is obtained by coating the surface of red phosphorus with an organic compound and / or an inorganic compound.
The epoxy resin composition for semiconductor encapsulation according to the above. 3. The epoxy resin composition for semiconductor encapsulation according to claim 1, wherein the red phosphorus-based flame retardant is obtained by coating the surface of red phosphorus with a thermosetting resin and / or a metal hydroxide. . 4. The red phosphorus flame retardant is obtained by coating the surface of red phosphorus with aluminum hydroxide and then coating the surface with a phenol resin and / or an epoxy resin. 4. The semiconductor according to claim 1, wherein the content of red phosphorus is 60 to 95% by weight, and the average particle size of the red phosphorus flame retardant is 0.1 to 70 [mu] m and the maximum particle size is 200 [mu] m or less. Epoxy resin composition for sealing. 5. The epoxy resin composition for semiconductor encapsulation according to claim 1, wherein the phosphazene compound is a cyclic phosphazene compound. 6. The epoxy resin composition for semiconductor encapsulation according to claim 5, wherein the cyclic phosphazene compound is a cyclic phosphazene compound represented by the general formula (1). Embedded image (In the formula, n represents an integer of 3 to 7, and R represents the same or different organic groups.) 7. The epoxy resin composition for semiconductor encapsulation according to claim 6, wherein at least n out of 2n Rs in the cyclic phosphazene compound represented by the general formula (1) are phenoxy groups. 8. The semiconductor according to claim 1, wherein the total amount of bromine atoms and antimony atoms contained in the total epoxy resin composition is less than 0.1% by weight, respectively. Epoxy resin composition for sealing. 9. A semiconductor device comprising a semiconductor element encapsulated with the epoxy resin composition for semiconductor encapsulation according to claim 1.