JPH07170088A - Shielding package of electronic element - Google Patents

Abstract

PURPOSE:To obtain the shielding package which can be miniaturized, which is provided with a heat-dissipating function and which can fulfill a shielding action sufficiently. CONSTITUTION:In a package body 10, a printed-wiring board 12, one face of which is covered with a wiring circuit pattern 16 and the other face of which is covered with a copper plate 18 so as to sandwich a polyimide resin layer 14, is molded by a two-step deep-drawing molding operation in such a way that it is recessed to become a box shape. By using the two-step deepdrawing molding operation, an opening part is formed in two steps, and a shelf-shaped part 22 is formed around a housing part 20 at the innermost part. On the other hand, a package lid part 30 is formed of a ferrite the surface of which is coated with an insulating film, and the package lid part 30 is attached to the shelf- shaped part 22 in the package body 10. Consequently, the copper plate 18 on the outside cuts off electromagnetic wave, the ferrite in the opening part absorbs the electromagnetic wave, and it is possible to suitably shield an electromagnetic-wave noise from an IC arranged at the inside and an electromagnetic-wave noise from the outside.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic element shield package for shielding an electromagnetic wave generated from an electronic element arranged inside.

[0002]

2. Description of the Related Art For example, an electronic element such as an IC prevents the frequency characteristic from becoming unstable due to the influence of electromagnetic waves from the outside, and prevents the high frequency generated from the electronic element from affecting nearby devices. In order to make it, a shield is necessary.

Conventionally, for example, when an electronic element is housed in a housing for shielding, or when an electronic element is provided on a printed wiring board (hereinafter, also simply referred to as a board), it has a box-like shape that reflects electromagnetic waves. A shield cover is installed to cover the electronic element, shield electromagnetic waves from the outside against the electronic element, and shield electromagnetic waves generated from the electronic element from leaking to the outside.

[0004]

However, in the conventional case, since the housing or the shield cover performs the electromagnetic wave shielding function, the shield layer is formed on the main body and lid of the housing or the shield cover by a method such as plating or vapor deposition. It was necessary and troublesome. In addition, in the case of the housing, the main body and the lid are required, and in the case of the shield cover, the box-shaped cover is also required, and there is a demand for further miniaturization in this respect as well. For example, with the development of small communication devices such as mobile phones and various mobile terminals, the demand for miniaturization is becoming stronger and stronger.

Further, in order to reduce the size, heat generated from an electronic element becomes a problem, and if heat is not dissipated well, heat will be trapped inside the package, which may cause an adverse effect. SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an electronic element shield package which can be miniaturized, has a heat dissipation function, and can sufficiently perform a shielding function, with the object of solving the above problems.

[0006]

In order to achieve the above object, the present invention has the following constitution as means for solving the problems. That is, the electronic element shield package according to claim 1 has a printed circuit board provided with a wiring circuit pattern on one surface and a metal plate on the other surface, and the surface provided with the wiring circuit pattern has a printed circuit board covered with a metal plate. A package main body that is recessed to the inside, and a package lid part that is formed of ferrite having a shape corresponding to the opening of the package main body and that is attached to the opening to cover the package. To do.

In the electronic element shield package having the above structure, the wiring circuit pattern is located inside the package body, and the metal plate is located outside to shield electromagnetic waves. Since the package lid made of ferrite is attached to the opening, it also shields electromagnetic waves. Therefore, when an electronic element such as an IC is arranged inside, electromagnetic wave noise generated from the electronic element, electromagnetic wave noise acting on the electronic element from the outside, and the like can be suitably shielded.

As described above, since the package body itself is the printed wiring board, it is not necessary to separately prepare a board or the like.
Can be miniaturized. Also, regarding heat dissipation, which is a problem in realizing miniaturization, since ferrite has relatively high thermal conductivity, it also solves the heat dissipation problem. Further, if a metal having high thermal conductivity such as copper is used as the metal plate, good heat dissipation can be expected in the entire package.

Further, since the package lid portion made of ferrite is attached to the opening portion, the ferrite is placed on the line from the electronic element, which also functions as a line filter. The recess of the package body described above may be formed, for example, by deep drawing a printed wiring board. At this time, as described in claim 3,
By forming a shelf-like portion on which the package lid can be placed by forming the printed wiring board in two stages by deep drawing, by mounting and mounting the package lid on the shelf-like portion , The mounting state of the main body and the lid portion becomes more reliable.

If the end portion of the package body is formed so that the surface on the wiring circuit pattern side can be bent to the surface on the metal plate side, the wiring circuit pattern can be formed at the end portion. Since it is arranged on both sides, it is possible to easily attach a connector to that portion.

On the other hand, as described in claim 5, the end portion of the package body is bent to the surface on the side of the metal plate to the surface on the side of the wiring circuit pattern, and the end portion of the package body is brought into contact with the package lid portion attached to the opening of the package body. If they are formed so as to be in contact with each other, the shield effect becomes more reliable.

[0012]

Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 shows an electronic element shield package (hereinafter also simply referred to as a package) S which is an embodiment of the present invention.
It is a perspective view of P.

The package SP includes a package body 10
And a package lid 30. The following will be described in order. The package body 10 is formed by molding the printed wiring board 12, and the printed wiring board 1
2 is a polyimide (PI) resin layer 14 of an ultra-thin film
The wiring circuit pattern 16 is provided on one surface, and the other surface is covered with a copper plate 18 as a metal plate. Then, the printed wiring board 12 having such a configuration
In the present embodiment, the so-called deep drawin
According to g), the package body 10 is formed by recessing it in a box shape. Further, the opening portion is made into two stages (see FIGS. 1 and 2 (b) etc.) by performing deep drawing in two stages,
A shelf-like portion 22 is formed around the innermost storage portion 20.

On the other hand, the package lid portion 30 has a shape corresponding to the opening portion of the package body 10, that is, the innermost storage portion 20 which is placed on the shelf portion 22 in this embodiment.
Is formed of ferrite having a size capable of closing all the openings, and the surface thereof is coated with an insulating film using a resin or the like. In addition,
In this embodiment, the thickness of the package lid 30 is equal to that of the shelf-like portion 2.
It is adjusted to the height from 2 to the upper surface 24 of the package body 10.

The package S of this embodiment having the above structure
According to P, the wiring circuit pattern 16 is located inside the package body 10, and the storage section 20 stores electronic elements such as the IC 50. On the other hand, since the copper plate 18 is located on the outside of the package body 10, electromagnetic waves from the outside are transmitted to the IC 5
It shields against 0, and also shields the emission of electromagnetic waves to the outside.

Then, the opening portion of the package body 10,
In this embodiment, a package lid 30 made of ferrite is attached to the shelf-like portion 22, and this package lid 3
When 0, all the opening portions of the storage section 20 are closed. As a method of attaching the package lid portion 30, various methods such as using an adhesive or using an adhesive tape can be considered.

Therefore, the package lid 30 is present on the ceiling viewed from the storage portion 20, and when the electromagnetic wave generated from the IC 50 hits the package lid 30, the electromagnetic wave is a ferrite package lid. It is absorbed by the portion 30 and attenuated. In this way, when the electronic element such as the IC 50 is arranged inside, electromagnetic wave noise generated from the IC 50, electromagnetic wave noise acting on the IC 50 from the outside, and the like can be favorably shielded.

Further, since the package body 10 itself is formed by molding the printed wiring board 12, it is not necessary to prepare another board or the like other than the package parts, and the miniaturization can be realized. Further, regarding heat dissipation which is a problem in realizing miniaturization, since the ferrite used in the package lid 30 has relatively high thermal conductivity, it also solves the heat dissipation problem. Furthermore, since the copper plate 18 is used as the metal plate that covers the outside, the thermal conductivity is excellent, and since the PI resin layer 14 also uses the ultra-thin film, good heat dissipation can be expected in the entire package 10. In addition, if a fin or the like is attached, a better heat dissipation effect can be achieved.

Further, since the package lid 30 made of ferrite is attached to the opening of the package body 10, the ferrite is placed on the wiring circuit pattern 16 which is a signal line from the IC 50, and acts as a line filter. Will also be fulfilled.

Next, another mode will be described. Figure 2
[FIG. 3] is a cross-sectional view of a state in which the package lid portion 30 is attached to the package main body 10, in which (b) corresponds to the cross-sectional view in the case of FIG. 1. (A) is the package body 10
When forming, is a one-stage deep drawing,
The shelf-like portion 22 seen in (b) and the like is not formed. In this case, in order to prevent the package lid portion 30 from falling into the storage portion 20, the side wall 20a of the storage portion 20 is prevented.
Should be tapered. On the other hand, the one shown in (c) is
The package lid portion 30 has the metal layer 32 on the outer side thereof, and in combination with the copper plate 18 of the package body 10, a better electromagnetic shielding function is achieved.

FIG. 3 is a sectional view showing a method of attaching the package SP to the housing 70. In the case of (a),
This is a case where the package lid 30 is attached in a state of being arranged above. The housing 70 is provided with locking hooks 72 that are spaced apart according to the width of the package SP (specifically, the distance between the ends of the package body 10), and includes locking pieces 72 a facing each other. The height at which the locking piece 72a is provided matches the height of the package SP (the height from the bottom surface 23 to the top surface 24 of the package body 10). The tip of the locking piece 72a reaches the upper surface of the package lid 30 to hold the package body 10 and prevent the package lid 30 from falling off.

On the other hand, the case shown in (b) is a case where the package lid portion 30 is attached in a state of being arranged downward.
In this case, the housing 80 has the package S
Locking hooks 82 are provided corresponding to the width of P,
The locking piece 82a is provided so as to face each other.
The height at which a is provided is adjusted to the thickness of the printed wiring board 12 that constitutes the package body 10 (specifically, the thickness of the end portion of the printed wiring board 12).

In the case of FIG. 3 (b), the depth of the storage portion 20 and the thickness of the package lid portion 30 are adjusted so that the package lid portion 30 and the IC 50 are in contact with each other. By contacting the IC 50 with the package lid 30, the relatively high thermal conductivity of ferrite is effectively used, and the heat dissipation efficiency is further increased.

FIG. 4 is a sectional view showing a modified example of the end portion of the package body 10. In the structure shown in (a), the end of the package body 10 is formed so that the surface on the side of the wiring circuit pattern 16 can be bent to the opposite surface on the side of the copper plate 18. Therefore, the wiring circuit pattern 16 is exposed on the entire surface at the end portion, and the connector can be easily attached to the portion.

On the other hand, in the structure shown in FIG. 4B, the end portion of the package body 10 is bent to the surface on the side of the wiring circuit pattern 16 opposite to the surface on the copper plate 18 side, and the package body 1
It is formed so as to come into contact with the package lid 30 attached to the opening portion of 0. Therefore, the shield effect of the package SP as a whole becomes more reliable.

Further, in FIG. 3, the housings 70 and 80 are
Although the example of attaching to the printed wiring board (PWB) 90 is shown in FIG. 5, it can be attached to the printed wiring board (PWB) 90. In this case, the package lid 30 side is brought into contact with the PWB 90 side. Therefore, the wiring circuit pattern 16 of the package body 10 comes into contact with the wiring circuit pattern 92 of the PWB 90, so that electrical connection can be easily performed. In this case, the ferrite package lid 30 is not attached to the PWB 9
There is a possibility of contact with the wiring circuit pattern 92 of 0,
As described above, the package lid 30 has the surface of ferrite coated with an insulating film made of a resin or the like, so that a short circuit can be prevented.

In the above embodiment, the copper plate 18 is used as the metal plate constituting the printed wiring board 12, but the metal plate may be any metal having a conventionally known electromagnetic wave shielding effect or conductivity. For example, nickel, iron, aluminum, silver, gold, etc. may be mentioned. However, a material having excellent thermal conductivity such as the copper plate 18 is preferable.

The type of resin forming the printed wiring board 12 is not limited to the PI resin described above, and any type of resin that can provide insulation, such as epoxy or phenol, can be used. On the other hand, the thickness of the ferrite used for the package lid portion 30 can be appropriately selected according to the application, but is preferably 0.05 mm or more from the viewpoint of the electromagnetic wave absorption effect. Even if the thickness is not uniform, a thick ferrite layer may be provided only in an appropriate portion.

The present invention is not limited to the embodiments as described above, and may be carried out in various modes without departing from the gist of the present invention.

[0030]

As described above in detail, according to the electronic element shield package of the present invention, since the package body itself is the printed wiring board, it is not necessary to separately prepare a board or the like, so that miniaturization can be realized and miniaturization can be achieved. With respect to heat dissipation, which is a problem in realizing the above, since ferrite has relatively high thermal conductivity, it also solves the heat dissipation problem. Further, the metal plate on the main body side and the package lid portion made of ferrite can sufficiently perform the shielding function.

[Brief description of drawings]

FIG. 1 is a perspective view of an electronic element shield package that is an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a state in which a lid is attached to a main body.

FIG. 3 is a cross-sectional view showing a state in which the shield package of the present embodiment is attached to a housing.

FIG. 4 is a cross-sectional view showing a modified example of the end portion of the shield package body of the present embodiment.

FIG. 5 is a cross-sectional view showing a state in which the shield package of this embodiment is attached to a printed wiring board.

[Explanation of symbols]

SP ... Package, 10 ... Package body,
12 ... Printed wiring board, 14 ... Polyimide resin layer, 1
6 ... Wiring circuit pattern, 18 ... Copper plate, 20 ... Storage section,
22 ... Shelf-like portion, 30 ... Package lid portion, 32 ... Metal layer, 70, 80 ... Housing, 72, 82 ... Locking hook,
72a, 82a ... Locking piece

Claims (5)

[Claims] 1. A printed wiring board having a wiring circuit pattern provided on one surface and a metal plate covered on the other surface is recessed so that the surface provided with the wiring circuit pattern is the inner side. An electronic element shield package, comprising: a package body; and a package lid portion formed of ferrite having a shape corresponding to an opening portion of the package body, the package lid portion being attached to the opening portion to provide a lid. 2. The electronic element shield package according to claim 1, wherein the package body is formed by deep drawing the printed wiring board. 3. The package body is characterized in that a shelf-like portion on which the package lid portion can be placed is formed in the opening portion by forming the printed wiring board by deep drawing in two steps. The electronic element shield package according to claim 2. 4. The electronic element shield package, wherein the end of the package body is formed by bending the surface on the side of the wiring circuit pattern to the surface on the side of the metal plate. 5. The end of the package body is formed so that the surface on the side of the metal plate is bent to the surface on the side of the wiring circuit pattern and abuts on the package lid attached to the opening of the package body. An electronic element shield package characterized by being made.