JPH07161755A - Method for fixing starting end of superfine wire for manufacture of semiconductor device to spool - Google Patents
Method for fixing starting end of superfine wire for manufacture of semiconductor device to spoolInfo
- Publication number
- JPH07161755A JPH07161755A JP33971993A JP33971993A JPH07161755A JP H07161755 A JPH07161755 A JP H07161755A JP 33971993 A JP33971993 A JP 33971993A JP 33971993 A JP33971993 A JP 33971993A JP H07161755 A JPH07161755 A JP H07161755A
- Authority
- JP
- Japan
- Prior art keywords
- starting end
- spool
- wire
- ultrafine wire
- adhesive tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/30—Handled filamentary material
- B65H2701/36—Wires
- B65H2701/361—Semiconductor bonding wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Storage Of Web-Like Or Filamentary Materials (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、半導体装置用ボンデ
ィングワイヤーなどの極細線をスプールの導電部に常に
導通状態になるように止着する方法に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of fixing an ultrafine wire such as a bonding wire for a semiconductor device to a conductive portion of a spool so that it is always in a conductive state.
【０００２】[0002]
【従来の技術】従来、半導体ボンディングワイヤーなど
の極細線は、図４に示されるように、フランジ２を有す
るスプール１に巻回した状態で保管または輸送される。
上記スプール１はアルマイト処理したアルミニウムもし
くはアルミニウム合金またはプラスチックで形成されて
おり、上記スプール１のフランジ２の外周面に導電性金
属メッキ４の導電部が形成されている。2. Description of the Related Art Conventionally, an ultrafine wire such as a semiconductor bonding wire is stored or transported while being wound around a spool 1 having a flange 2 as shown in FIG.
The spool 1 is made of anodized aluminum, aluminum alloy, or plastic, and a conductive portion of a conductive metal plating 4 is formed on the outer peripheral surface of the flange 2 of the spool 1.
【０００３】上記スプール１に巻回された極細線３の始
端部３′は、粘着テープ５によってフランジ２の外周面
に形成された導電性金属メッキ４の表面に止着される。The starting end portion 3'of the ultrafine wire 3 wound around the spool 1 is fixed to the surface of the conductive metal plating 4 formed on the outer peripheral surface of the flange 2 by the adhesive tape 5.
【０００４】このような極細線３を巻回したスプール１
を、スプールホルダー（図示せず）に、フランンジ２の
外周面に形成された導電性金属メッキ４がスプールホル
ダーの端子（図示せず）に接するように装着すると、極
細線３の始端部３′は導電性金属メッキ４に導通し、導
電性金属メッキ４は上記スプールホルダーの端子に導通
し、端子を接地しておけば極細線３は導電状態となって
極細線３の断線は容易に検出されることになる（例え
ば、実開昭６１−４２８３８号公報などを参照）。A spool 1 around which such an ultrafine wire 3 is wound
Is attached to a spool holder (not shown) so that the conductive metal plating 4 formed on the outer peripheral surface of the flange 2 is in contact with a terminal (not shown) of the spool holder. Is conductive to the conductive metal plating 4, the conductive metal plating 4 is conductive to the terminal of the spool holder, and if the terminal is grounded, the ultrafine wire 3 becomes conductive and the disconnection of the ultrafine wire 3 can be easily detected. (See, for example, Japanese Utility Model Laid-Open No. 61-42838).
【０００５】上記粘着テープ５は、通常、市販の粘着テ
ープが使用されており、この粘着テープはテープ本体お
よび粘着部分から構成され、粘着部分の厚さは５０〜１
００μｍである。As the adhesive tape 5, a commercially available adhesive tape is usually used. This adhesive tape is composed of a tape body and an adhesive portion, and the thickness of the adhesive portion is 50 to 1
It is 00 μm.
【０００６】一方、半導体ボンディングワイヤーなどに
用いられる極細線は、通常、直径：２０〜３０μｍのも
のが使用されている。On the other hand, ultrafine wires used for semiconductor bonding wires or the like are usually those having a diameter of 20 to 30 μm.
【０００７】[0007]
【発明が解決しようとする課題】上記極細線３の始端部
３′に粘着テープ５を押し付けて図５（ａ）に示される
ようにフランジ２の導電性金属メッキ４に止着すると、
図５（ｂ）の断面図に示されるように、粘着部分５”の
厚さが極細線３の径より大きいために、極細線３の始端
部３′が粘着部分５”に完全に埋没し、極細線３の始端
部３′がフランジの外周面に形成された導電部の導電性
金属メッキ４に接触しないことがある。かかる状態で極
細線３の始端部３′がスプール導電部の導電性金属メッ
キ４に止着されるとスプールホルダーの端子（図示せ
ず）からスプール１に巻回された極細線３に電流が流れ
なくなり、極細線３の断線が検出されず、断線を知らず
にボンディング作業を続行すると不良品が発生し、多大
な損害をもたらすなどの課題があった。When the adhesive tape 5 is pressed against the starting end portion 3'of the ultrafine wire 3 and fixed to the conductive metal plating 4 of the flange 2 as shown in FIG. 5 (a),
As shown in the sectional view of FIG. 5B, since the thickness of the adhesive portion 5 ″ is larger than the diameter of the ultrafine wire 3, the starting end 3 ′ of the ultrafine wire 3 is completely buried in the adhesive portion 5 ″. In some cases, the starting end portion 3'of the extra fine wire 3 does not come into contact with the conductive metal plating 4 of the conductive portion formed on the outer peripheral surface of the flange. In this state, when the starting end portion 3'of the ultrafine wire 3 is fixed to the conductive metal plating 4 of the spool conductive portion, a current is applied from the terminal (not shown) of the spool holder to the ultrafine wire 3 wound around the spool 1. There is a problem in that the flow of the extra fine wire 3 is not detected, and if the bonding work is continued without noticing the disconnection, a defective product is generated, resulting in great damage.
【０００８】[0008]
【課題を解決するための手段】そこで、本発明者等は、
市販の接着テープを使用して極細線３の始端部３′をフ
ランジ２の外周面の導電性金属メッキ４の表面に止着し
ても、常に始端部３′と導電性金属メッキ４とが接触し
て導通性を確保できるよう工夫した結果、極細線３の始
端部の上に支持体を重ねて載置するか、または始端部
３′の一部に少なくとも１巻きの曲げ部分を形成し、そ
の上から粘着テープを押し付けて貼付けると、支持体ま
たは曲げ部分の存在により極細線の始端部が粘着テープ
の粘着部分に完全に埋没することなく常にフランジ２の
外周面の導電部の導電性金属メッキ４に接触し、導通状
態を確保することができるという知見を得たのである。Therefore, the present inventors have
Even if the starting end portion 3'of the ultrafine wire 3 is fixed to the surface of the conductive metal plating 4 on the outer peripheral surface of the flange 2 using a commercially available adhesive tape, the starting end portion 3'and the conductive metal plating 4 are always attached. As a result of devising so as to ensure contact and ensure continuity, a support is placed on the starting end of the ultrafine wire 3 or at least one bent portion is formed in a part of the starting end 3 '. When the adhesive tape is pressed and stuck from above, the start end of the ultrafine wire is not completely buried in the adhesive part of the adhesive tape due to the presence of the support or the bent part, and the conductive part on the outer peripheral surface of the flange 2 is always conductive. It was found that the conductive metal plating 4 can be contacted and a conductive state can be secured.
【０００９】この発明は、かかる知見に基づいてなされ
たものであって、（１） 極細線の始端部と粘着テープ
の間に支持体を介在させて上記始端部をスプールの導電
部に止着する半導体装置製造用極細線始端部のスプール
止着方法、（２） 極細線の始端部の一部に少なくとも
１巻きの曲げ部分を形成し、上記始端部の曲げ部分をス
プールの導電部に粘着テープで止着する半導体装置製造
用極細線始端部のスプール止着方法、に特徴を有するも
のである。The present invention has been made on the basis of the above findings, and (1) a support is interposed between the starting end of the ultrafine wire and the adhesive tape to fix the starting end to the conductive portion of the spool. (2) At least one winding portion is formed on a part of the starting end portion of the ultrafine wire, and the bending portion of the starting end portion is adhered to the conductive portion of the spool. The present invention is characterized by a spool fastening method of a starting end portion of an ultrafine wire for manufacturing a semiconductor device, which is fastened with a tape.
【００１０】上記支持体としては、金属、合成樹脂、木
材、紙、布などのいずれかで構成された細線、細糸、細
帯などを用いることができる。これら支持体を極細線の
始端部の上に重ね、その上から粘着テープを貼付けた時
に、極細線の径と支持体の厚さの合計が粘着テープの粘
着部分の厚さよりも大きくなることが必要であり、それ
によって極細線が粘着テープの粘着部分に完全に埋没す
ることなく常にスプールの導電部である導電性金属メッ
キに接触するようになるのである。As the support, a fine wire, a fine thread or a fine strip made of any one of metal, synthetic resin, wood, paper, cloth and the like can be used. When these supports are stacked on the starting end of the ultrafine wire and the adhesive tape is applied from above, the total diameter of the ultrafine wire and the thickness of the support may be larger than the thickness of the adhesive portion of the adhesive tape. This is necessary so that the ultrafine wire will always come into contact with the conductive metal plating, which is the conductive portion of the spool, without being completely buried in the adhesive portion of the adhesive tape.
【００１１】例えば、図１（ａ）に示されるように、極
細線の始端部３′の上に交又するように支持体である鋼
線６を重ね、その上から粘着テープ５を押し付けて図１
（ｂ）に示されるようにフランジ２の導電部の導電性金
属メッキ４に貼付けると、極細線３の始端部３′は粘着
テープ５の粘着部分５”に完全に埋没することがなく、
常に始端部３′は導電性金属メッキ４に接触し、導通状
態が維持される。For example, as shown in FIG. 1 (a), a steel wire 6 as a support is laid on the starting end portion 3'of the ultrafine wire so as to cross it, and an adhesive tape 5 is pressed onto the steel wire 6. Figure 1
When it is attached to the conductive metal plating 4 of the conductive portion of the flange 2 as shown in (b), the starting end portion 3'of the ultrafine wire 3 is not completely buried in the adhesive portion 5 "of the adhesive tape 5,
The starting end portion 3'is always in contact with the conductive metal plating 4 and the conductive state is maintained.
【００１２】また支持体として合成樹脂製細帯７を用
い、図２（ａ）に示されるように、極細線の始端部３′
の上に交又するように合成樹脂製細帯７を重ね、その上
から粘着テープ５を押し付けて図２（ｂ）に示されるよ
うに始端部３′が粘着テープ５の粘着部分５”に完全に
埋没するのを防止し、極細線の始端部３′を導電性金属
メッキ４に常に接触させて導通状態を維持させることも
できる。A thin strip 7 made of synthetic resin is used as a support, and as shown in FIG.
The synthetic resin strips 7 are laid on top of each other, and the adhesive tape 5 is pressed onto the strip 7 so that the starting end portion 3 ′ becomes the adhesive portion 5 ″ of the adhesive tape 5 as shown in FIG. 2 (b). It is also possible to prevent it from being completely buried, and to always keep the conductive metal plating 4 in contact with the starting end portion 3 ′ of the ultrafine wire so as to maintain the conductive state.
【００１３】図１および図２においては、いずれも支持
体を使用して始端部３′が粘着部分５”に完全に埋没す
るのを防止したが、図３に示されるように極細線の始端
部３′に少なくとも１巻きの曲げ部分８を形成し、この
曲げ部分８によって始端部３′が粘着部分５”に完全に
埋没するのを防止し、始端部３′と導電性金属メッキ４
を接触せしめることにより導通状態を確保してもよい。In both FIGS. 1 and 2, a support is used to prevent the starting end portion 3'from being completely buried in the adhesive portion 5 ". However, as shown in FIG. At least one turn of the bent portion 8 is formed in the portion 3 ', and the bent portion 8 prevents the starting end portion 3'from being completely buried in the adhesive portion 5 ", and the starting end portion 3'and the conductive metal plating 4 are formed.
The electrical connection may be ensured by bringing them into contact with each other.
【００１４】[0014]
【実施例】実施例１ 直径：３０μｍの金線からなる極細線３が巻回してあ
り、フランジ２に導電性金属メッキ４を施した図４の如
きスプール１を用意した。Example 1 A spool 1 as shown in FIG. 4 was prepared in which an ultrafine wire 3 made of a gold wire having a diameter of 30 μm was wound, and a flange 2 was plated with a conductive metal 4.
【００１５】一方、テープ本体５′および粘着部分５”
からなり、粘着部分５”の厚さが５０μｍの市販の粘着
テープ５および直径：３０μｍの鋼線からなる細線６を
用意した。On the other hand, the tape body 5'and the adhesive portion 5 "
A commercially available adhesive tape 5 having a thickness of the adhesive portion 5 ″ of 50 μm and a thin wire 6 made of a steel wire having a diameter of 30 μm were prepared.
【００１６】上記スプール１のフランジ２の導電性金属
メッキ４に極細線３の始端部３′を接触させ、その上に
鋼線６を交又するように乗せ、さらにその上から上記粘
着テープ５を押し付けて図１に見られるように貼付けた
ところ、極細線３と導電性金属メッキ４とは導通状態に
あった。The starting end portion 3'of the ultrafine wire 3 is brought into contact with the conductive metal plating 4 of the flange 2 of the spool 1 and the steel wire 6 is placed thereon, and the adhesive tape 5 is placed thereon. When was pressed and stuck as shown in FIG. 1, the ultrafine wire 3 and the conductive metal plating 4 were in a conductive state.
【００１７】実施例２ 厚さ：３５μｍ、幅：１．５mmの合成樹脂製細帯７を用
意し、実施例１で用意したスプールの導電性金属メッキ
４にスプールに巻回された極細線の始端部３′を図２に
示されるように上記合成樹脂製細帯７を介在させて止着
したところ、極細線の始端部３′と導電性金属メッキと
は接触し導通状態に保持された。Example 2 A thin strip 7 made of synthetic resin having a thickness of 35 μm and a width of 1.5 mm was prepared, and a fine metal wire wound around the conductive metal plating 4 of the spool prepared in Example 1 was wound around the spool. As shown in FIG. 2, the starting end portion 3'was fixed by interposing the synthetic resin thin strip 7, and the starting end portion 3'of the ultrafine wire and the conductive metal plating were in contact with each other and held in a conductive state. .
【００１８】実施例３ 図３に示されるように、極細線の始端部３′に、外径：
６５μｍのリング状曲げ部８を形成し、その上から実施
例１で用意した粘着テープで始端部３′をスプールの導
電性金属メッキ４の上に貼り付けたところ、極細線の始
端部３′と導電性金属メッキ４とは導通状態が保持され
た。Embodiment 3 As shown in FIG. 3, the outer diameter:
A ring-shaped bent portion 8 of 65 μm was formed, and the starting end portion 3 ′ was attached onto the conductive metal plating 4 of the spool from above with the adhesive tape prepared in Example 1, and the starting end portion 3 ′ of the ultrafine wire was formed. The conductive state was maintained between the conductive metal plating 4 and the conductive metal plating 4.
【００１９】従来例１ 極細線の始端部３′を直線状態でスプールのフランジ２
に形成された導電性金属メッキ４の上に置き、その上か
ら実施例１で用意した粘着テープ５を押し付けて貼り付
けたところ、図５（ｂ）に示されるように始端部３′が
粘着テープ５の粘着部分５”に埋没し、始端部３′と導
電性金属メッキ４が接触しなくなり、始端部３′と導電
性金属メッキ４とは絶縁状態となった。Conventional Example 1 Spool flange 2 in which the leading end 3'of an ultrafine wire is straight
When the adhesive tape 5 prepared in Example 1 was pressed and stuck on the conductive metal plating 4 formed on the first end 3 ', the starting end 3'adhesed as shown in FIG. 5 (b). The tape 5 was buried in the adhesive portion 5 ″, the starting end 3 ′ and the conductive metal plating 4 did not contact each other, and the starting end 3 ′ and the conductive metal plating 4 were insulated.
【００２０】[0020]
【発明の効果】上述のように、この発明の方法により極
細線３の始端部３′を、スプール１のフランジ２に形成
された導電性金属メッキ４に止着すると、始端部３′が
粘着テープ５の粘着部分５”に完全に埋没することなく
常に始端部３′と導電性金属メッキ４が接触して導通状
態を保つことができ、極細線３の断線の検出漏れを防ぐ
ことができるという優れた効果を奏するものである。As described above, when the starting end portion 3'of the ultrafine wire 3 is fixed to the conductive metal plating 4 formed on the flange 2 of the spool 1 by the method of the present invention, the starting end portion 3'is adhered. The start end 3'and the conductive metal plating 4 are always in contact with each other without being completely buried in the adhesive portion 5 "of the tape 5, so that the conductive state can be maintained and the omission of the disconnection of the ultrafine wire 3 can be prevented. That is an excellent effect.
【図１】この発明のスプールにおける極細線始端部の止
着方法を示す説明図であり、（ａ）は平面図、（ｂ）は
Ｉ−Ｉの断面図である。1A and 1B are explanatory views showing a method of fastening a leading end portion of an ultrafine wire in a spool of the present invention, in which FIG. 1A is a plan view and FIG. 1B is a sectional view taken along line I-I.
【図２】この発明のスプールにおける極細線始端部の止
着方法を示す説明図であり、（ａ）は平面図、（ｂ）は
ＩＩ−ＩＩの断面図である。2A and 2B are explanatory views showing a method for fastening the leading end portion of the ultrafine wire in the spool of the present invention, wherein FIG. 2A is a plan view and FIG. 2B is a sectional view taken along line II-II.
【図３】この発明のスプールにおける極細線始端部の止
着方法を示す説明図であり、（ａ）は平面図、（ｂ）は
ＩＩＩ−ＩＩＩの断面図である。3A and 3B are explanatory views showing a method of fixing the leading end portion of the ultrafine wire in the spool of the present invention, in which FIG. 3A is a plan view and FIG. 3B is a sectional view taken along line III-III.
【図４】従来のスプールに極細線を巻回し、その始端部
をフランジに市販の粘着テープで止着した状態を示す斜
視図である。FIG. 4 is a perspective view showing a state in which an extra fine wire is wound around a conventional spool, and the starting end portion is fixed to a flange with a commercially available adhesive tape.
【図５】従来のスプールにおける極細線始端部の止着方
法を示す説明図であり、（ａ）は平面図、（ｂ）はＶ−
Ｖの断面図である。5A and 5B are explanatory views showing a method of fixing the starting end portion of an ultrafine wire in a conventional spool, in which FIG. 5A is a plan view and FIG.
It is a sectional view of V.
１ スプール ２ フランジ ３ 極細線 ３′ 始端部 ４ 導電性金属メッキ ５ 粘着テープ ５′ テープ本体 ５” 粘着部分 ６ 鋼線 ７ 合成樹脂製細帯 ８ 曲げ部 1 Spool 2 Flange 3 Extra fine wire 3'Starting end 4 Conductive metal plating 5 Adhesive tape 5'Tape body 5 "Adhesive part 6 Steel wire 7 Synthetic resin strip 8 Bending part
Claims (3)
ールの導電部に粘着テープで止着する方法において、 上記極細線の始端部と粘着テープの間に支持体を介在さ
せて止着することを特徴とする半導体装置製造用極細線
始端部のスプール止着方法。1. A method of fixing the starting end of an ultrafine wire for manufacturing a semiconductor device to a conductive portion of a spool with an adhesive tape, wherein a support is interposed between the starting end of the ultrafine wire and the adhesive tape. A method for fastening a spool at a starting end of an ultrafine wire for manufacturing a semiconductor device, which is characterized in that:
介在させる支持体は、極細線の径と支持体の厚さの合計
が粘着テープの粘着部分の厚さよりも大となるような厚
さを有することを特徴とする請求項１記載の半導体装置
製造用極細線始端部のスプール止着方法。2. The support interposed between the starting end of the ultrafine wire and the adhesive tape is such that the total diameter of the ultrafine wire and the thickness of the support is larger than the thickness of the adhesive portion of the adhesive tape. The method for fastening a spool at a leading end of an ultrafine wire for manufacturing a semiconductor device according to claim 1, wherein the spool has a thickness.
ールの導電部に粘着テープで止着する方法において、 上記極細線の始端部の一部に少なくとも１巻きの曲げ部
分を形成し、上記曲げ部分を粘着テープで止着すること
を特徴とする半導体装置製造用極細線始端部のスプール
止着方法。3. A method for fixing the starting end of an ultrafine wire for manufacturing a semiconductor device to a conductive portion of a spool with an adhesive tape, wherein at least one bent portion is formed in a part of the starting end of the ultrafine wire, and A method for fastening a spool at a leading end of an ultrafine wire for manufacturing a semiconductor device, characterized in that the bent portion is fastened with an adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33971993A JP3003492B2 (en) | 1993-12-06 | 1993-12-06 | Spool fastening method for the start end of ultrafine wire for semiconductor device manufacturing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33971993A JP3003492B2 (en) | 1993-12-06 | 1993-12-06 | Spool fastening method for the start end of ultrafine wire for semiconductor device manufacturing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07161755A true JPH07161755A (en) | 1995-06-23 |
| JP3003492B2 JP3003492B2 (en) | 2000-01-31 |
Family
ID=18330167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33971993A Expired - Fee Related JP3003492B2 (en) | 1993-12-06 | 1993-12-06 | Spool fastening method for the start end of ultrafine wire for semiconductor device manufacturing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3003492B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009081437A (en) * | 2007-09-18 | 2009-04-16 | Wc Heraeus Gmbh | Spool wound with gold alloy wire used for bonding process |
-
1993
- 1993-12-06 JP JP33971993A patent/JP3003492B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009081437A (en) * | 2007-09-18 | 2009-04-16 | Wc Heraeus Gmbh | Spool wound with gold alloy wire used for bonding process |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3003492B2 (en) | 2000-01-31 |
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