JPS61115314A - Transformer - Google Patents

Transformer

Info

Publication number
JPS61115314A
JPS61115314A JP23780884A JP23780884A JPS61115314A JP S61115314 A JPS61115314 A JP S61115314A JP 23780884 A JP23780884 A JP 23780884A JP 23780884 A JP23780884 A JP 23780884A JP S61115314 A JPS61115314 A JP S61115314A
Authority
JP
Japan
Prior art keywords
copper
soldering
contact resistance
electroconductive substance
leaf
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23780884A
Other languages
Japanese (ja)
Inventor
Akio Nakamura
彰夫 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP23780884A priority Critical patent/JPS61115314A/en
Publication of JPS61115314A publication Critical patent/JPS61115314A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Regulation Of General Use Transformers (AREA)

Abstract

PURPOSE:To obtain a low contact resistance of the same level as a soldered article without soldering, by affixing a projecting electroconductive substance of copper or the like to a copper-leaf tape. CONSTITUTION:A projecting electroconductive substance 11 of copper or the like, which is shaped in a cone, a semicolumn or the like, is fixed beforehand to an upper-layer copper leaf 6 of a lapping portion by soldering or the like in such a state that the contact resistance thereof is zero. The electroconductive substance 11 itself may be a solder. When the copper-leaf tape thus prepared is superposed, the electroconductive substance 11 contacts with a lower-layer copper leaf 6. The contact point thereof is firmly fixed in a physical manner from the surroundings by the adhesion of an adhesive for the copper leaves, and a low contact resistance of several milliohms is obtained. The height, outside diameter and width of the electroconductive substance 11 are set in optimum dimensions in accordance with the width and length of the lapping portion of the copper leaves.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、リーケージフラックスを減衰させるためのシ
ョートリングを用いたトランスに、関するものである。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a transformer using a short ring for attenuating leakage flux.

従来例の構成とその問題点 まず、第1図〜第6図により、従来のトランスにおける
ショートリングについて説明する。一般に、低周波、及
び、高周波トランスは、第1図に示すように、コア(磁
心)3.ポビン42巻線(コイル)6から組立てられて
いる。さらに、リーケージフラックス(漏洩磁束)を、
減少させるため、固有抵抗値の低い鋼材等から成る1〜
2ターンのショートリング1が、組み合わせられている
。そして、第2図に示すこのショートリング1の巻始め
と巻終りの固定は、第3図、第4図に示すように半田2
で、半田付を施していた。
Configuration of Conventional Example and its Problems First, a short ring in a conventional transformer will be explained with reference to FIGS. 1 to 6. In general, low frequency and high frequency transformers have a core (magnetic core) 3. It is assembled from 42 windings (coils) 6. Furthermore, the leakage flux (leakage magnetic flux) is
In order to reduce the
Two-turn short ring 1 is combined. The beginning and end of winding of this short ring 1 shown in FIG. 2 are fixed by soldering 2 as shown in FIGS. 3 and 4.
And soldering was done.

ところが、半田付は、作業性が悪く、作業時間が長くか
かるため、コスト高の一因となっていた。
However, soldering has poor workability and takes a long time, contributing to high costs.

また、半田フラックスが、銅表面に付着すると腐食した
り、あるいは、半田付時の熱で、ボビン。
Also, if solder flux adheres to the copper surface, it may corrode, or the heat during soldering may cause damage to the bobbin.

巻線に悪影響を与える問題があった。There was a problem that adversely affected the winding.

また、第6図、第6図に示す通り、銅箔6に、非導電性
粘着剤8を、塗布した銅箔テープの場合、貼りあわせる
だけでは、接触抵抗が、半田付品では、数ミリΩに対し
て、最高、無限大までなり、ショートリングとして使用
する場合は、必らず、半田付を必要としていた。又、導
電性粘着剤を使用した場合は、コスト高で、量産には、
不適であった。さらに、第7図〜第9図に示すように、
重ね合わせ部の上層銅箔6に、凸部7を加工し、重ね合
わせた時、下層鋼箔6と接触固定させる方法があるが、
銅自体が変形してしまうため、接触点9が不安定となり
、接触抵抗が変動し、最高無限大にまでなることもあり
、半田付力(必要となる。
In addition, as shown in Figures 6 and 6, in the case of a copper foil tape in which a non-conductive adhesive 8 is applied to a copper foil 6, the contact resistance will increase by several millimeters if it is simply pasted together. Ω is up to infinity, and when used as a short ring, soldering was always required. In addition, when using conductive adhesive, the cost is high and mass production is difficult.
It was inappropriate. Furthermore, as shown in FIGS. 7 to 9,
There is a method in which a convex portion 7 is formed on the upper layer copper foil 6 of the overlapped portion, and when the upper layer copper foil 6 is overlapped, it is brought into contact with and fixed to the lower layer steel foil 6.
Since the copper itself deforms, the contact point 9 becomes unstable and the contact resistance fluctuates, sometimes reaching infinity, and the soldering force (required).

又、凸部7を1ケ所だけでなく、複数ケ所、加工する方
法もあるが、若干、接触抵抗は、低くなるものの、やは
り、半田付が、必要となる。
There is also a method of machining the convex portion 7 not only in one place but in a plurality of places, but although the contact resistance is slightly lowered, soldering is still required.

又、重なり部分の長さLを、通常6〜10+mぐらいだ
が、60 m程度にすると、若干、接触抵抗は、低くな
るものの、接触抵抗は、やはり、変動し、無限大になる
こともあり、半田付が必要である。
In addition, if the length L of the overlapping part is usually about 6 to 10+ m, but if it is set to about 60 m, the contact resistance will decrease slightly, but the contact resistance will still fluctuate and may become infinite. Soldering is required.

重なり部分の長さLを、さらに増やしても、完全には、
接触抵抗を安定に出来ず、半田付が必要でありまた、コ
ストアップになってしまう。
Even if the length L of the overlapped part is further increased, it will not be completely
Contact resistance cannot be stabilized, soldering is required, and costs increase.

また、別の方法として、第10図〜第12図に示すよう
に上層鋼箔6に、バーリング7を加工し、重ね合わせた
時、下層銅箔6と接触固定させる方法があるが、やはり
、銅自体が変形してしまうため、接触抵抗がバラツキ最
高、無限大にまでなることがあり、半田付が、必要とな
る。又、バーリング7を1ケ所だけでなく、複数ケ所加
工したり、重なり部分を増やしても、前述のように、半
田付が、必要となる。
Another method, as shown in FIGS. 10 to 12, is to process burrings 7 on the upper layer steel foil 6 and have them contact and fix with the lower layer copper foil 6 when overlapped. Since the copper itself is deformed, the contact resistance can vary up to infinity, making soldering necessary. Furthermore, even if the burring 7 is processed not only at one location but at a plurality of locations, or even if the overlapping portion is increased, soldering is required as described above.

発明の目的 本発明は、上記問題点に鑑み、半田付を行なわ厚 ずに、o、1べΣ211Ilv程度の銅箔テープにおい
て、巻きつけた後型なり部分の、凸部の接触点の回りの
粘着剤部分を押さえつけるだけで、数ミリΩの接触抵抗
を有するショートリングを有したトランスを提供するも
のである。
Purpose of the Invention In view of the above-mentioned problems, the present invention has been devised to solve the above problems by using a copper foil tape of about Σ211Ilv of about 0.1 x Σ211 lv without soldering, and after wrapping it around the contact point of the convex part of the molded part. The present invention provides a transformer having a short ring having a contact resistance of several milliohms by simply pressing the adhesive part.

発明の構成 上記目的を、達成する為に、本発明は、重ね合わせ部の
上層の銅箔に、凸状の銅等の導電物を、固定し、重ね合
わせ、凸部における接触点の回りの粘着剤部分を押さえ
つけると銅箔面上の粘着剤による接着力のみで、半田付
なしで、数ミリオームの低接触抵抗値を維持できるショ
ートリングを     )用いたトランスである。
Structure of the Invention In order to achieve the above object, the present invention fixes a convex conductive material such as copper to the upper layer of copper foil in the overlapping part, overlaps it, and then This transformer uses a short ring that can maintain a low contact resistance of several milliohms without soldering, using only the adhesive force of the adhesive on the copper foil surface when the adhesive part is pressed down.

実施例の説明 ′以下本発明の一実施例におけるショートリングを図面
と共に、説明する。
DESCRIPTION OF EMBODIMENTS A short ring according to an embodiment of the present invention will be described below with reference to the drawings.

第13図〜第16図は、本考案の実施例における0 、
1−り、2 m厚程度の銅箔テープの断面図および斜視
図で多る。重ね合わせ部の、上層の銅箔6には、円錐状
や半円柱等の凸状の銅等の導電物11が、半田付等で、
事前に、接触抵抗がゼロの、状態で固着されている。導
電物11は、それ自体が半田であっても良い。この銅箔
テープを重ね合わせると、導電物11と、下層の銅箔6
は接触し、その接触点は、銅箔の粘着剤の粘着力で、物
理的に周囲から強固に固着され、数ミリΩの低接触抵抗
が、得られる。導電物11の高さ、外径1幅は、銅箔の
重なり部の幅、及び長さに応じて、最適寸法に設定する
。なお、導電物11の数は、複数個であっても良い。
FIGS. 13 to 16 show 0 in the embodiment of the present invention,
There are many cross-sectional views and perspective views of copper foil tapes with a thickness of about 1-2 m. A conductive material 11 made of copper or the like having a convex shape such as a conical shape or a semi-cylindrical shape is attached to the upper layer copper foil 6 in the overlapped portion by soldering or the like.
It is fixed in advance in a state where the contact resistance is zero. The conductor 11 itself may be solder. When these copper foil tapes are overlapped, the conductive material 11 and the lower layer copper foil 6
contact, and the contact point is physically firmly fixed to the surrounding area by the adhesive force of the copper foil adhesive, resulting in a low contact resistance of several milliΩ. The height and outer diameter 1 width of the conductor 11 are set to optimal dimensions according to the width and length of the overlapping portion of the copper foil. Note that the number of conductors 11 may be plural.

発明の効果 以上のように、本発明は、円錐状や半円柱等の凸状の銅
等の導電物を銅箔テープにつけることに、より、重ね合
わせ部の接触点の回りの粘着剤部分を、おさえつけ固着
した時、半田付しなくても、半田付品と同レベルの数ミ
リオームの低接触抵抗が確保でき、容易に、ショートリ
ングをトランスに取りつけることが出来る。また、半田
付作業が不要になる為、作業時間の短縮が図れ、大巾な
コストダウンが可能となる。また、半田付をしないので
、鋼材面の変色がなく、美麗である。また、接触点は周
囲の粘着剤で、完全に覆われているため、接触点の腐食
も進行しない。
Effects of the Invention As described above, the present invention has the advantage of attaching a conductive material such as copper having a convex shape such as a cone shape or a semi-cylindrical shape to a copper foil tape. When held down and firmly fixed, a low contact resistance of several milliohms, on the same level as soldered products, can be ensured without soldering, and the short ring can be easily attached to the transformer. In addition, since soldering work is no longer required, work time can be shortened and costs can be significantly reduced. Also, since no soldering is required, there is no discoloration of the steel surface, making it beautiful. Furthermore, since the contact point is completely covered by the surrounding adhesive, corrosion at the contact point does not progress.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は〜トランスの外観図、第2図は従来からのショ
ートリングの斜視図、第3図、第4図は同ショートリン
グの重ね合わせ部における斜視図と、断面図、第6図、
第6図は粘着剤つきの銅箔テープの半田付の無い場合と
有る場合の重ね合わせ部を示す断面図、第7図〜第9図
は重ね合わせ部に凸状の接触部を有する銅粘着テープの
斜視図 ゛および断面図、第10図〜第12図は重ね合
わせ部にバーリングの接触部を有する銅粘1着テープの
斜視図および断面図、第13図〜第16図は本発明の実
施例における重ね合わせ部に、円錐状や半円柱等の凸状
の銅等の導電物を有する銅粘着テープの断面図および斜
視図である。 1・・・・・ショートリング、2・・・・・・半田、3
・・・・・・コア、4・・・・・・ボビン、6・・・・
・・巻線、6・・・・・・銅箔、7・・・・・・凸部、
8・・・・・・非導電性粘着剤、9・−・・接触点、1
0・・・・・・バーリング部、11・・・・・・導電物
。 代理人の氏名 弁理士 中 尾 敏 男 ほか1名第1
図 第2図 第 3 図 第 4 図 V%5図 第7図 第8図 第9図
Fig. 1 is an external view of the transformer, Fig. 2 is a perspective view of a conventional short ring, Figs. 3 and 4 are perspective views and cross-sectional views of the overlapping part of the short ring, Fig. 6
Figure 6 is a sectional view showing the overlapping parts of copper foil tape with adhesive without and with soldering, and Figures 7 to 9 are copper adhesive tapes with convex contact parts at the overlapping part. 10 to 12 are perspective views and sectional views of a single-adhesive copper tape having a burring contact portion at the overlapped portion, and FIGS. 13 to 16 are views showing the implementation of the present invention. FIG. 2 is a cross-sectional view and a perspective view of a copper adhesive tape having a conductive material such as copper having a convex shape such as a conical shape or a semi-cylindrical shape in an overlapping portion in an example. 1...Short ring, 2...Solder, 3
... Core, 4 ... Bobbin, 6 ...
... Winding wire, 6 ... Copper foil, 7 ... Convex part,
8...Non-conductive adhesive, 9...Contact point, 1
0... Burring part, 11... Conductive material. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 Figure 3 Figure 4 Figure V%5 Figure 7 Figure 8 Figure 9

Claims (1)

【特許請求の範囲】[Claims] コイル外周面に位置する、ショートリング面に、凸状の
導電体を有し、その導電体を介して、粘着剤のついたシ
ョートリングが、半田付をしなくても、接着固定だけで
導電ループを形成するショートリングを用いたトランス
The short ring surface located on the outer circumferential surface of the coil has a convex conductor, and the short ring with adhesive can conduct electricity through the conductor by simply fixing it with adhesive without soldering. A transformer using a short ring that forms a loop.
JP23780884A 1984-11-12 1984-11-12 Transformer Pending JPS61115314A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23780884A JPS61115314A (en) 1984-11-12 1984-11-12 Transformer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23780884A JPS61115314A (en) 1984-11-12 1984-11-12 Transformer

Publications (1)

Publication Number Publication Date
JPS61115314A true JPS61115314A (en) 1986-06-02

Family

ID=17020711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23780884A Pending JPS61115314A (en) 1984-11-12 1984-11-12 Transformer

Country Status (1)

Country Link
JP (1) JPS61115314A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018018865A (en) * 2016-07-26 2018-02-01 コーセル株式会社 Common mode choke coil

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018018865A (en) * 2016-07-26 2018-02-01 コーセル株式会社 Common mode choke coil

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