JPS61104968A - Winding tape for part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a winding tape for parts.

Recently, electronic parts, for example, are produced continuously as a way to store the same parts that are mass-produced, and because it is convenient to sequentially mount those parts on printed boards etc. using automated equipment. This invention has been widely adopted for parts, and the present invention improves the structure of the tape for winding these parts.

[Conventional technology]

In order to store electronic components or automatically mount them, a method has been adopted in which the components are stored on a winding tape.
A method of winding the tape in a spiral is widely used.

There are many types of parts that can be wound in this way, and electric parts such as resistors, capacitors, semiconductor devices, and other mass-produced parts are widely used.

Conventionally, the tape used to wind up these parts is a narrow tape with adhesive tape attached at predetermined intervals along the center line of the length of the tape. The parts being carried out are synchronized with the speed of the winding tape, and are carried out while sequentially coming into contact with and being stuck to the winding tape, so that they are wound up in a spiral shape.

However, when winding up the part, for example, in a semiconductor integrated circuit (IC), etc., which has boards on all four sides of the package, when the part is wound up on the winding tape,
If the lead is in the same direction as the length of the take-up tape, the take-up tape will curve in a convex shape, so there is no risk of deformation due to the pressure of the tape being rolled up on the top of the part, and this will not cause much of a problem. Since the lead frame in the lateral direction of the take-up tape is on the same plane as the take-up tape, there is a disadvantage that the lead is deformed due to the pressure exerted by the spirally wound upper take-up tape.

FIG. 4(a) is a top view for explaining the structure of a conventional component winding tape, and FIG. 4(a) is a side view thereof.

There is a take-up tape 1 of a predetermined size, an adhesive tape 3 is pasted on a paper tape 2, there are areas 4 on the surface of which parts are adhered at predetermined intervals, and tape feed holes are provided on both end surfaces of the take-up tape. 5 is a provision.

FIG. 5(a) shows, for example, a semiconductor device 6 being wound onto a tape 1.
FIG. 5 is a top view showing a state in which the take-up tape is wound up in a spiral shape with a semiconductor device attached thereto; FIGS. Assuming that the semiconductor device on surface 1 is 6 and the semiconductor device on tape surface 1' is 6', the semiconductor device 6 on tape surface 1 will be pressed by tape surface 1'. When the device glue portion 7 is the same as the length direction of the tape, the tape is curved in a convex shape, so that the leads are not deformed.

FIG. 6(al) shows a semiconductor device 8 having leads on both sides of the semiconductor device, and FIG. 6(b) is a plan view showing a semiconductor device 9 having leads on all sides.

In this case, in the case of a semiconductor device 8 that has leads on both sides, no pressure is applied to the leads because the leads are arranged in the length direction of the winding tape as described above, but in the case of a semiconductor device 8 that has leads on both sides, no pressure is applied to the leads. In the case of device 9, since the leads are also located in the width direction of the tape, pressure is applied to the leads of the semiconductor device.

FIG. 7(a) is a plan view of a semiconductor device 9 having leads on all sides attached to tape 1, and FIG.
) shows a cross section in the width direction of the spiral tape.

The semiconductor device 9 on the tape 11 is pressed by the spirally wound tape 11', and pressure is applied to the semiconductor device lead 13. As a result, the lead 13 is deformed and the semiconductor device is mounted by an automatic mounting machine. It becomes impossible to mount it on a printed board.

[Problem that the invention seeks to solve]

With the winding tape of the above configuration, when winding up a semiconductor device with a structure in which leads extend in the lateral direction, the upper layer of the winding tape presses the package part of the semiconductor device on the lower surface, so that the semiconductor device is pulled out from the semiconductor device. The problem is that the lead is deformed because pressure is applied to the lead, but the lead does not escape.

[Means for solving problems]

The present invention provides a tape for winding parts, which solves the above-mentioned problems. This can be achieved by a winding tape for parts, which is characterized in that openings are formed on both side surfaces of the part to which the parts are adhered with the winding tape, so that the lead wires of the wound parts are not crimped. .

[Effect]

For example, in the case of a winding tape that spirally winds up a semiconductor device with leads drawn out in all directions, the present invention provides openings on both side surfaces of the tape where parts are adhered.
Even if there is pressure from the top tape on the package part of the semiconductor device, the openings on the side of the tape are designed to prevent the leads from being deformed so that the lead wires will not be crimped on the leads that are lying on the side of the semiconductor device. It is something.

[Example] FIG. 1(a) is a plan view of a winding tape for explaining the present invention in detail, and FIG. 1(b) is a side view thereof.

The winding tape 21 consists of a paper tape 22 and an adhesive tape 23, and has feed holes 24 provided on both sides thereof.
The parts are adhered to the adhesive area 25 at predetermined intervals and transferred.

The winding tape according to the present invention takes into consideration the case where the component is a semiconductor device with leads taken out on all sides, and even if the leads of the semiconductor device on the winding tape are pressed by the winding tape on the upper part, the leads will not remain. The purpose is to provide a deformation prevention hole 26 for the lead so that the lead does not deform.

FIG. 2 shows a state in which a semiconductor device 27 having leads on all sides is adhered to a winding tape 21, and leads 28 are also arranged in the width direction of the winding tape.
The leads in the width direction are located in the deformation prevention holes 26.

Figure 3 shows a part of the winding tape arranged in this manner, which is cut in the width direction of the winding tape in a state in which the semiconductor device is stuck to the semiconductor device and wound into a spiral shape. FIG. 3 is a cross-sectional view for explaining the state of applied pressure.

The winding tapes, which are spirally wound to form multiple layers, are marked 21' and 21-, and the semiconductor devices are 27' and 21-.
7'', but the lead 28 of the semiconductor device 27' that is pressed by the winding tape 21 with the semiconductor device 27 will sink into the deformation prevention hole 26 provided in the winding tape even if it is pressed. and will not deform.

〔Effect of the invention〕

As explained in detail above, the present invention has a great effect in that even if there are leads pulled out in all directions in a semiconductor device, for example, the parts will not be pressed during winding and will not be deformed. .

[Brief explanation of drawings]

Fig. 1 is a plan view of the component winding tape of the present invention, Fig. 2 is a plan view of a semiconductor device adhered to the component winding tape of the present invention, and Fig. 3 is a plan view of the component winding tape of the present invention. 4 is a plan view of a conventional component winding tape, FIG. 5 is a sectional view of a semiconductor device mounted on a component winding tape, and FIG. 6 is a semiconductor device. 7 is a partial sectional view of the winding section when a conventional component winding tape is used. In the figure, 21 is the winding tape, 22 is the paper tape,
23 is an adhesive tape, 24 is a feed hole, 25 is an adhesive area, 2
6 is a deformation prevention hole for a lead, 27 is a semiconductor device, and 28 is a lead. Figure 1 Figure 2 Figure 3 Figure 17-1

Claims (1)

[Claims] In a winding tape for parts in which parts are continuously stuck at predetermined intervals and wound up in a spiral shape, openings are formed on both sides of the part to which the parts are stuck with the winding tape, and the parts are wound up. A winding tape for a component, characterized in that the lead wire of the component is not crimped.