JPH07161756A - Method for fixing starting end of superfine wire used for manufacture of semiconductor device to spool - Google Patents
Method for fixing starting end of superfine wire used for manufacture of semiconductor device to spoolInfo
- Publication number
- JPH07161756A JPH07161756A JP5339720A JP33972093A JPH07161756A JP H07161756 A JPH07161756 A JP H07161756A JP 5339720 A JP5339720 A JP 5339720A JP 33972093 A JP33972093 A JP 33972093A JP H07161756 A JPH07161756 A JP H07161756A
- Authority
- JP
- Japan
- Prior art keywords
- starting end
- spool
- conductive
- semiconductor device
- adhesive tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/30—Handled filamentary material
- B65H2701/36—Wires
- B65H2701/361—Semiconductor bonding wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Storage Of Web-Like Or Filamentary Materials (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、半導体装置用ボンデ
ィングワイヤーなどの極細線をスプールのフランジに止
着する方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for fixing an ultrafine wire such as a bonding wire for a semiconductor device to a flange of a spool.
【０００２】[0002]
【従来の技術】従来、半導体ボンディングワイヤーなど
の極細線は、図３に示されるように、フランジ２を有す
るスプール１に巻回した状態で保管または輸送される。
上記スプール１はアルマイト処理したアルミニウムもし
くはアルミニウム合金またはプラスチックで形成されて
おり、上記スプール１のフランジ２の外周面に導電性金
属メッキ４が形成されている。2. Description of the Related Art Conventionally, an ultrafine wire such as a semiconductor bonding wire is stored or transported around a spool 1 having a flange 2 as shown in FIG.
The spool 1 is made of alumite-treated aluminum or aluminum alloy or plastic, and a conductive metal plating 4 is formed on the outer peripheral surface of the flange 2 of the spool 1.
【０００３】上記スプール１に巻回された極細線３の始
端部３′は、粘着テープ５によってフランジ２の外周面
に形成された導電性金属メッキ４の表面に止着される。The starting end portion 3'of the ultrafine wire 3 wound around the spool 1 is fixed to the surface of the conductive metal plating 4 formed on the outer peripheral surface of the flange 2 by the adhesive tape 5.
【０００４】このような極細線３を巻回したスプール１
を、スプールホルダー（図示せず）に、フランンジ２の
外周面に形成された導電性金属メッキ４がスプールホル
ダーの端子（図示せず）に接するように装着すると、極
細線３の始端部３′は導電性金属メッキ４に導通し、導
電性金属メッキ４はスプールホルダーの端子に導通し、
端子を接地しておけば極細線３は導電状態となって極細
線３の断線は容易に検出されることになる（例えば、実
開昭６１−４２８３８号公報などを参照）。A spool 1 around which such an ultrafine wire 3 is wound
Is attached to a spool holder (not shown) so that the conductive metal plating 4 formed on the outer peripheral surface of the flange 2 is in contact with a terminal (not shown) of the spool holder. Is conductive to the conductive metal plating 4, the conductive metal plating 4 is conductive to the terminal of the spool holder,
If the terminal is grounded, the ultrafine wire 3 becomes conductive and the disconnection of the ultrafine wire 3 can be easily detected (for example, see Japanese Utility Model Laid-Open No. 61-42838).
【０００５】上記粘着テープ５は、通常、市販の粘着テ
ープが使用されており、この粘着テープは、テープ本体
および粘着部分で構成され、粘着部分の厚さは５０〜１
００μｍである。As the adhesive tape 5, a commercially available adhesive tape is usually used. This adhesive tape is composed of a tape body and an adhesive portion, and the thickness of the adhesive portion is 50 to 1
It is 00 μm.
【０００６】一方、半導体ボンディングワイヤーなどに
用いられる極細線は、通常、直径：２０〜３０μｍのも
のが使用されている。On the other hand, ultrafine wires used for semiconductor bonding wires or the like are usually those having a diameter of 20 to 30 μm.
【０００７】[0007]
【発明が解決しようとする課題】上記極細線３の始端部
３′に市販の粘着テープ５を押し付けて図２（ａ）に示
されるようにフランジ２の導電性金属メッキに止着する
と、図２（ｂ）のＩＩ−ＩＩ断面図に示されるように、
粘着部分５”の厚さが極細線３の径より大きいために、
極細線３の始端部３′が粘着部分５”に完全に埋没し、
極細線３の始端部３′がフランジの外周面に形成された
導電部の導電性金属メッキ４に接触せず、始端部３′と
導電性金属メッキ４とが導通しなくなることがある。When a commercially available adhesive tape 5 is pressed against the starting end portion 3'of the ultrafine wire 3 and fixed to the conductive metal plating of the flange 2 as shown in FIG. As shown in the II-II sectional view of 2 (b),
Since the thickness of the adhesive portion 5 "is larger than the diameter of the extra fine wire 3,
The starting end 3'of the extra fine wire 3 is completely buried in the adhesive portion 5 ",
The starting end 3 ′ of the ultrafine wire 3 may not come into contact with the conductive metal plating 4 of the conductive portion formed on the outer peripheral surface of the flange, and the starting end 3 ′ and the conductive metal plating 4 may become non-conductive.
【０００８】始端部３′と導電性金属メッキ４の導通性
を失うと、極細線３の断線を検出することができず、極
細線３の断線を知らずに半導体装置のボンディング作業
を続行すると不良品が発生し、これを知らずにボンディ
ング作業を続行すると、不良品が多数製造され、多大の
損害をもたらすことになる。If the electrical continuity between the starting end portion 3'and the conductive metal plating 4 is lost, the disconnection of the ultrafine wire 3 cannot be detected, and if the disconnection of the ultrafine wire 3 is not known and the semiconductor device bonding operation is continued, it is not possible. If a non-defective product is generated and the bonding work is continued without noticing it, a large number of defective products will be produced, resulting in great damage.
【０００９】[0009]
【課題を解決するための手段】そこで、本発明者等は、
かかる観点から常に始端部３と導電性金属メッキ４の導
通性を確保することのできる粘着方法を得るべく研究を
行った結果、粘着テープとして、少なくとも粘着部分に
導電性を有する導電粘着テープを用いて始端部３′を導
電性金属メッキ４に止着すると、常に始端部３′と導電
性金属メッキ４との導通性を確保することができるとい
う知見を得たのである。Therefore, the present inventors have
From this point of view, as a result of conducting research to obtain an adhesive method capable of always ensuring electrical continuity between the starting end portion 3 and the conductive metal plating 4, as the adhesive tape, a conductive adhesive tape having conductivity at least in the adhesive portion is used. It has been found that if the starting end portion 3'is fixed to the conductive metal plating 4 by means of fixing the starting end portion 3'to the conductive metal plating 4, the electrical continuity between the starting end portion 3'and the conductive metal plating 4 can be always secured.
【００１０】この発明は、かかる知見に基づいてなされ
たものであって、半導体装置製造用極細線の始端部をス
プールの導電部に粘着する方法において、少なくとも導
電性粘着部分を有する導電粘着テープを使用する半導体
装置製造用極細線始端部のスプール止着方法に特徴を有
するものである。The present invention has been made on the basis of such findings, and in a method of adhering the starting end of an ultrafine wire for manufacturing a semiconductor device to a conductive portion of a spool, a conductive adhesive tape having at least a conductive adhesive portion is provided. The method is characterized by a spool fastening method for the starting end of an ultrafine wire for manufacturing a semiconductor device to be used.
【００１１】極細線の始端部３′を導電粘着テープ６で
粘着した状態の平面図を図１（ａ）に示す。さらに図１
（ａ）のＩ−Ｉ断面図を図１（ｂ）に示す。FIG. 1A is a plan view showing a state in which the starting end portion 3'of the ultrafine wire is adhered with the conductive adhesive tape 6. Furthermore, FIG.
A sectional view taken along the line I-I of FIG. 1A is shown in FIG.
【００１２】図１（ｂ）に示されるように、スプールの
フランジ２に形成された導電性金属メッキ４の上に極細
線の始端部３′を置き、その上からテープ本体６′およ
び導電性粘着部分６”からなる導電粘着テープ６を押し
付けて粘着させ、始端部３′が導電性粘着部分６”に完
全に埋没しても、導電性粘着部分６”は導電性であるた
めに常に始端部３′と導電性金属メッキ４との導通性が
確保される。As shown in FIG. 1 (b), the starting end portion 3'of the ultrafine wire is placed on the conductive metal plating 4 formed on the flange 2 of the spool, and the tape body 6'and the conductive material are placed on the starting end portion 3 '. Even if the starting end portion 3'is completely buried in the conductive adhesive portion 6 "by pressing and sticking the conductive adhesive tape 6 consisting of the adhesive portion 6", since the conductive adhesive portion 6 "is conductive, the starting end portion is always The electrical continuity between the portion 3'and the conductive metal plating 4 is secured.
【００１３】上記導電粘着テープ６の導電性を有する粘
着部分６”は、通常の粘着テープの粘着剤中にＮｉ等の
金属粉末、金属ウィスカー、金属箔を含有せしめて作製
することができる。一方、導電粘着テープ６のテープ本
体６′はアルミニウム、銅などの金属テープを用いるこ
とができるが、テープ本体６′は必ずしも導電体である
必要はなく、通常のビニール、セロハンなどのテープで
あってもよい。The conductive adhesive portion 6 "of the conductive adhesive tape 6 can be produced by adding a metal powder such as Ni, a metal whisker, and a metal foil to the adhesive of a normal adhesive tape. The tape body 6'of the conductive adhesive tape 6 may be made of a metal tape such as aluminum or copper, but the tape body 6'is not necessarily a conductor, but may be a normal vinyl, cellophane, or other tape. Good.
【００１４】[0014]
【実施例】平均粒径：０．５μｍのＮｉ粉を３０容量％
含有した導電性粘着剤を用意し、この導電性粘着剤をテ
ープ本体に塗布して導電粘着テープを作製した。この導
電粘着テープを用いてスプールのフランジ外周面に形成
された導電性金属メッキと極細線の始端部を粘着したと
ころ、極細線の始端部と導電性金属メッキとは導通状態
にあった。[Example] 30% by volume of Ni powder having an average particle size of 0.5 μm
The contained conductive adhesive was prepared, and this conductive adhesive was applied to the tape body to prepare a conductive adhesive tape. When this conductive adhesive tape was used to adhere the conductive metal plating formed on the outer peripheral surface of the flange of the spool to the starting end of the ultrafine wire, the starting end of the ultrafine wire and the conductive metal plating were in a conductive state.
【００１５】一方、市販の粘着テープを用意し、この市
販の粘着テープを用いてスプールのフランジ外周面に形
成された導電性金属メッキと極細線の始端部を粘着させ
たところ、導電性金属メッキと極細線の始端部とは絶縁
状態になっていた。On the other hand, when a commercially available adhesive tape was prepared and the commercially available adhesive tape was used to adhere the conductive metal plating formed on the outer peripheral surface of the flange of the spool and the starting end of the extra fine wire, the conductive metal plating was performed. And the starting end of the ultrafine wire were insulated.
【００１６】[0016]
【発明の効果】上述のように、この発明の止着方法によ
ると、スプールのフランジ外周面に形成された導電性金
属メッキと極細線の始端部とは安定して導通状態を確保
することができ、極細線の断線の検出漏れを防ぐことが
できるという優れた効果を奏するものである。As described above, according to the fastening method of the present invention, the conductive metal plating formed on the outer peripheral surface of the flange of the spool and the starting end portion of the extra fine wire can stably secure a conductive state. Therefore, it has an excellent effect that it is possible to prevent the omission of the detection of the breakage of the ultrafine wire.
【図１】この発明の導電粘着テープを用いた極細線始端
部の止着状態を示す説明図であり、（ａ）は平面図、
（ｂ）はＩ−Ｉ断面図である。FIG. 1 is an explanatory view showing a fixed state of an ultrafine wire starting end portion using a conductive adhesive tape of the present invention, (a) is a plan view,
(B) is an II sectional view.
【図２】従来の粘着テープを用いた極細線始端部の止着
状態を示す説明図であり、（ａ）は平面図、（ｂ）はＩ
Ｉ−ＩＩ断面図である。2A and 2B are explanatory views showing a fastening state of an ultrafine wire starting end portion using a conventional adhesive tape, in which FIG. 2A is a plan view and FIG.
It is an I-II sectional view.
【図３】極細線をスプールに巻回し、始端部をフランジ
に粘着テープで止着した状態を示すスプールの斜視図で
ある。FIG. 3 is a perspective view of the spool showing a state in which an ultrafine wire is wound around a spool and a starting end portion is fixed to a flange with an adhesive tape.
ｌ スプール ２ フランジ ３ 極細線 ３′ 始端部 ４ 導電性金属メッキ ５ 粘着テープ ５′ テープ本体 ５” 粘着部分 ６ 導電粘着テープ ６′ テープ本体 ６” 導電性粘着部分 l Spool 2 Flange 3 Extra fine wire 3'Starting end 4 Conductive metal plating 5 Adhesive tape 5'Tape body 5 "Adhesive part 6 Conductive adhesive tape 6'Tape body 6" Conductive adhesive part
Claims (1)
ールの導電部にテープ本体と粘着部分からなる粘着テー
プで止着する方法において、 上記粘着テープは、少なくとも粘着部分に導電性を有す
る導電粘着テープを使用することを特徴とする半導体装
置製造用極細線始端部のスプール止着方法。1. A method of fixing a starting end portion of an ultrafine wire for manufacturing a semiconductor device to a conductive portion of a spool with an adhesive tape composed of a tape body and an adhesive portion, wherein the adhesive tape has a conductive property at least in an adhesive portion. A method for fastening a spool at the starting end of an ultrafine wire for manufacturing a semiconductor device, characterized by using an adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5339720A JPH07161756A (en) | 1993-12-06 | 1993-12-06 | Method for fixing starting end of superfine wire used for manufacture of semiconductor device to spool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5339720A JPH07161756A (en) | 1993-12-06 | 1993-12-06 | Method for fixing starting end of superfine wire used for manufacture of semiconductor device to spool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07161756A true JPH07161756A (en) | 1995-06-23 |
Family
ID=18330175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5339720A Pending JPH07161756A (en) | 1993-12-06 | 1993-12-06 | Method for fixing starting end of superfine wire used for manufacture of semiconductor device to spool |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07161756A (en) |
-
1993
- 1993-12-06 JP JP5339720A patent/JPH07161756A/en active Pending
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20000125 |