JPH0715124Y2 - High voltage penetration type porcelain capacitor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a high-voltage feedthrough porcelain capacitor that can be miniaturized.

[Conventional technology]

High voltage through porcelain capacitors are used as filter capacitors for magnetron tubes of microwave ovens.

As an example of this type of capacitor, as shown in FIGS. 5 and 7, a porcelain dielectric 111 having through holes 112, 113 is provided.
Capacitor electrodes 114, 115 are provided on one surface of the same, and a capacitor electrode 116 is also provided on the opposite surface opposite to the capacitor electrodes 114, 115.
Corresponding holes are provided corresponding to 2,113. Then, the capacitor electrode 116 is connected to the ground plate 11 having a window 118 opened at the center.
Concatenated to 7, the center conductor 119 _1, 119 ₂ of the conductive portion 120 _1, 120 ₂ of the electrode fitting 122 ₁ is connected to the capacitor electrode 114 and 115, 122
₂ , the capacitor electrodes 114 and 115, the porcelain dielectric 111, the capacitor electrode 116, and the window 118 of the ground plate 117 are sequentially penetrated, and the conductor portions 120 ₁ and 120 ₂ are protected by silicon tubes 123 ₁ and 123 ₂ as insulating tubes. Further, an insulating case 124 and an insulating cover 125 are provided on both sides of the ground plate 117 to cover them, and an insulating resin mold 126 such as an epoxy resin is injected and fixed therein. The center conductor 119 _1, 119 _2, the conductor portion
120 ₁ and 120 ₂ and the connection tabs 121 ₁ and 121 ₂ are formed so as to be integrated.

Further, as shown in FIG. 6, the electrode metal fittings 122 ₁ and 122 ₂ are formed in a step-like shape, and the central portion thereof is located closer to the electrodes 114 and 115 than the outer peripheral portion.
On the other hand, the ground plate 117 was similarly drawn twice, for example, to form the stepped portion while being formed into a floating shape.

[Problems to be solved by the device]

As described above, the conventional high-voltage through-type porcelain capacitor cannot be downsized because the structure of the electrode fitting and the ground plate is too high, and the electrode fitting and the ground plate use deep drawing material for double drawing. Not only is it inevitably costly, but an insulating case and insulating cover are provided on both sides of the ground plate to cover the porcelain dielectric, etc., but the insulating case and insulating cover were fitted with the ground plate interposed. Since the connection is made, the connection and connection of the ground plate to the electrode becomes unstable, and there is a problem in reliability, position adjustment is complicated, assembly work takes time, and productivity cannot be improved.

The present invention can downsize the entire high-voltage through-type porcelain capacitor by improving the structure of the electrode fitting, the ground plate, and the insulating member while maintaining the same high voltage resistance, heat resistance, and durability as the conventional one, and the durability is also improved. The purpose of the present invention is to further improve the assembling property without any defective connection.

[Means for Solving the Problems]

According to the present invention, a grounding plate is jointed and fitted between the overlapping portion of the insulating case and the insulating cover, electrodes are provided on both sides of the porcelain dielectric, and a central conductor is penetrated. In a through-type porcelain capacitor in which the other electrode is electrically connected to the center conductor through an electrode fitting and an insulating resin is injected and solidified around the porcelain dielectric, the center conductor is integrated with the center conductor. The electrode fitting is formed in a flat plate shape and connected to the electrodes 14 and 15, and a flange portion parallel to the electrode fitting is provided at the lower end portion of the insulating case and the upper outer peripheral portion of the insulating cover, respectively. The ground plate is sandwiched, and the ground plate is connected to the electrode.

[Action]

In the present invention, since the electrode fitting is formed in a flat plate shape and is integrally connected to the center conductor, the adhesion strength between the electrode fitting and the center conductor is increased, and the electrode fitting is fitted and bonded to the center conductor as in the past. In this case, since it was necessary to bury the center conductor with insulating resin above the electrode fittings in order to reinforce the adhesive strength, the height of the resin layer had to be increased by that much. It was Further, the height of the resin layer can be further reduced by further reducing the electrode contact step portion of the ground plate.

Furthermore, by covering the ground plate with the insulating member, the electrode and the ground plate can be properly connected, and the reliability and the assemblability can be significantly improved.

〔Example〕

An embodiment of the present invention will be described with reference to FIGS. 1 to 3. The overall structure of this capacitor is shown in FIG. 1. The outer peripheral surface of a ground plate 17 formed by a single drawing process, An insulating case 24 and an insulating cover 25 are fitted and arranged on the inner peripheral surface, respectively. An annular flange 24a is provided at the lower end of the insulating case 24, and a height corresponding to the step height from the outer periphery of the upper portion of the insulating cover 25, specifically, the upper end of the ground plate 17. Collar portions 25a are respectively provided on the outer peripheral portions of the lower positions, and the ground plate 17 is held by these collar portions.

Meanwhile, ₁ disc-shaped electrode fitting 22, 22 ₂ are the conductor portions 20 _1, 20 ₂ integrally formed with the center conductor 19 _1, 19 ₂ of the conductive portion 20 _1, 20 ₂ of the upper part . In order to form such an integrally molded product, a processing means such as processing the header of the conductor portion or fixing a flat washer to the conductor portion is adopted.

The porcelain conductor 11 has an oval shape, and the through holes 12, 13
Is provided, and the central portion of the upper surface is separated by a kerf. Then, on the upper end surface and the lower end surface of the porcelain dielectric 11, cutout portions 11a, 11 are formed on the outer end edge and the inner end edges of the through holes 12, 13, respectively.
b, 12a, 12b, 13a, 13b are provided. The notch may be a step notch as shown in the drawing, or may be a chamfered chamfer (Fig. 4). Electrodes 14, 15, 16 are formed on the upper end surface and the lower end surface of the porcelain dielectric 111, respectively.

In the figure, 18 is a window, 21 ₁ and 21 ₂ are connection tabs, 23 ₁ and 23 ₂ are silicon tubes, 26 is an insulating resin mold, and the thickness of the resin mold above the porcelain dielectric 11 is The thickness of the resin mold on the side surface side of the porcelain dielectric 11 is almost equal, the insulating case 24 is at the same height as the upper end surface of the resin mold 26, and the grounding plate 17 is formed into a step by drawing once. Has been formed.

Further, in this embodiment, since the insulating case 24 and the insulating cover 25 are provided with the flange portions 24a and 25a, respectively, the electrically insulating space distance of the capacitor can be made substantially equal to that of the conventional one, and thus the insulating property is not deteriorated without deteriorating the insulating property. I shortened my height. There is an advantage that a general material other than deep drawing can be used as the material of the ground plate 17.

If the notch 11a, 11b, 12a, 12b, 13a, 13b of the porcelain dielectric 11 is not provided, the insulation resin around the electrode and the electrode fitting and the ground plate will be poor, and the covering of the edge will be defective, resulting in insulation Although the durability is inferior, the edge covering is improved by providing the notch.

Next, in the embodiment shown in FIG. 4, the notch portion 11a of the dielectric body,
11b, 12a, 12b, 13a, 13b is formed in a slope shape, but in this example, in addition to the effect of miniaturization of the capacitor described above, since the bubbles easily escape during the injection of the resin mold 26, There is an advantage that the operation can be performed more simply and accurately.

[Effect of device]

In the present invention, the electrode metal fitting is formed in a flat plate shape, and since it is integrally connected to the central conductor, the height of the high-voltage through-type porcelain capacitor can be reduced and the size can be reduced. Since the ease of manufacture is increased and the amount of insulating resin used can be reduced, it has a high industrial utility value. Moreover, it is possible to further reduce the height by forming the ground plate by one-step drawing. In addition, by providing a notch at the edge of the porcelain dielectric, the insulating resin is well placed between each electrode and the electrode fitting and the ground plate, making it easy to fabricate, and the insulating case and the insulating cover form the ground plate. By holding it, it can be connected and connected to the electrode, the assembling work with the ground plate is simple, the connection with the electrode does not become defective, and the safety, durability and high pressure resistance are improved.

[Brief description of drawings]

1 to 3 show an embodiment of the present invention.
FIG. 5 is an assembly explanatory view of a high voltage through-type porcelain capacitor, FIG. 2 is a front sectional view thereof, FIG. 3 is a side sectional view thereof, and FIG. 4 is a side sectional view of another embodiment. FIG. 7 shows a conventional example, FIG. 5 is an assembly explanatory view of a high voltage through type ceramic capacitor, FIG. 6 is a front sectional view thereof, and FIG. 7 is a side sectional view thereof. 11 ... Porcelain dielectric, 12, 13 ... Through hole, 11a, 11b, 12a, 12
b, 13a, 13b ... Notch, 14-16 ... Capacitor electrode, 17
...... ground plate, 18 ...... windows, 19 _1, 19 ₂ ...... center conductor, 20 _1, 2
0 ₂ ...... Conductor part, 21 ₁ , 21 ₂ ...... Connection tab, 22 ₁ , 22 ₂ ...... Electrode metal fitting, 23 ₁ , 23 ₂ ...... Silicon tube, 24 …… Insulation case, 24 a …… Collar part, 25 ...... Insulation cover, 25a ...... Collar part,
26 ... Insulating resin mold.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Isao Fujiwara 1-13-1 Nihonbashi, Chuo-ku, Tokyo TDC Inc. (56) References: 57-154138 (JP, U) -26589 (JP, Y1)

Claims (1)

[Scope of utility model registration request] 1. A grounding plate 17 is joined and fitted between the insulating case 24 and the overlapping portion of the insulating cover 25, and electrodes are provided on both sides of the porcelain dielectric 11.
14, 15 and 16 are provided and central conductors 19 ₁ and 19 ₂ are provided so as to penetrate therethrough, and one electrode 16 of the porcelain dielectric 11 is joined and conducted to the ground plate 17, and the other electrode 14 is connected to the electrode fitting 22 ₁ , The central conductors 19 ₁ and 19 ₂ are electrically connected to each other via 22 ₂ and the porcelain dielectric 11
In a through-type porcelain capacitor in which an insulating resin 26 is injected and solidified around the periphery of the electrodes, electrode fittings 22 ₁ and 22 ₂ integrally provided on the central conductors 19 ₁ and 19 ₂ are formed in a flat plate shape to form electrodes 14 and 15 on the electrodes 14, 15. A collar portion 24a, which is connected and is parallel to the electrode fittings 22 ₁ and 22 ₂ ,
25a are provided on the lower end of the insulating case 24 and the upper outer peripheral portion of the insulating cover 25, respectively, and the flanges 24a and 25a sandwich the ground plate 17, and the ground plate 17 is connected to the electrode 16. A high-voltage through-type porcelain capacitor characterized in that