JPH0715023A - Photovoltaic device and its manufacture - Google Patents

Photovoltaic device and its manufacture

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Publication number
JPH0715023A
JPH0715023A JP5147654A JP14765493A JPH0715023A JP H0715023 A JPH0715023 A JP H0715023A JP 5147654 A JP5147654 A JP 5147654A JP 14765493 A JP14765493 A JP 14765493A JP H0715023 A JPH0715023 A JP H0715023A
Authority
JP
Japan
Prior art keywords
electrode film
photoelectric conversion
photoactive layer
conversion element
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5147654A
Other languages
Japanese (ja)
Other versions
JP3505201B2 (en
Inventor
Keiichi Sano
景一 佐野
Yoichiro Aya
洋一郎 綾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP14765493A priority Critical patent/JP3505201B2/en
Publication of JPH0715023A publication Critical patent/JPH0715023A/en
Application granted granted Critical
Publication of JP3505201B2 publication Critical patent/JP3505201B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

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  • Photovoltaic Devices (AREA)

Abstract

PURPOSE:To simply obtain a photovoltaic device of integration structure by working a plurality of photovoltaic transducers formed on a substrate, with a laser beam. CONSTITUTION:A part of optically active layer 3 is turned into an amorphous insulating layer 4 by ion implantation. A second electrode film 5 formed on the layer 4 is divided by an energy beam irradiation from the surface side of the insulating layer.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、半導体からなる光活性
層を備えた、複数の光電変換素子を基板上で直列接続と
なるように構成された光起電力装置及びその製造方法に
関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photovoltaic device having a photoactive layer made of a semiconductor and having a structure in which a plurality of photoelectric conversion elements are connected in series on a substrate and a method for manufacturing the photovoltaic device.

【0002】[0002]

【従来の技術】太陽電池に代表される光起電力装置は、
近年、時計や電卓等の小電源として使用されるまで普及
しているが、ここにきて商用電源設備を有する電力会社
に対して、その光起電力装置により得られた電力の余剰
分を売ることが可能となったことから、所謂電力用の電
源として新たな展開が始まろうとしている。
2. Description of the Related Art Photovoltaic devices represented by solar cells are
In recent years, it has become widespread until it is used as a small power source for clocks, calculators, etc., but now it sells surplus power obtained by the photovoltaic device to a power company that has a commercial power source facility. Since it has become possible, new development is about to begin as a power source for so-called electric power.

【0003】とりわけ、大面積化と低コスト化の容易さ
によって注目されている、薄膜半導体を用いた光起電力
装置では、商用電力コストとの競合が比較的有利である
ことから、早急な事業化が期待されている。
In particular, in a photovoltaic device using a thin film semiconductor, which is attracting attention due to its large area and ease of cost reduction, the competition with commercial power cost is relatively advantageous, and therefore it is an urgent business. Is expected.

【0004】斯る薄膜半導体による光起電力装置のもう
1つの特徴に、1枚の基板から実用レベルの高い電圧が
得られる所謂集積型構造がある。この集積型構造を備え
た光起電力装置は、従来周知の構造であり、例えば特公
昭58−21827号,特公昭62−5353号,特公
昭62−14954号などに詳細に記載されている。
Another characteristic of the photovoltaic device using such a thin film semiconductor is a so-called integrated structure capable of obtaining a practically high voltage from one substrate. The photovoltaic device having this integrated structure has a conventionally well-known structure and is described in detail in, for example, Japanese Patent Publication No. 58-21827, Japanese Patent Publication No. 62-5353, and Japanese Patent Publication No. 62-14954.

【0005】図3は斯る構造を備えた従来例光起電力装
置の製造工程を示す工程図である。同図にそって、本構
造の製造工程を簡単に説明すると、同図(a)に示す第
1工程では、ガラスや石英等の絶縁材料からなる基板(3
1)の全面に、酸化インジュウム錫等からなる、第1電極
膜を被着形成した後、レーザビームの照射により、この
第1電極膜(32)(32)…を複数の領域に分割する。
FIG. 3 is a process diagram showing a manufacturing process of a conventional photovoltaic device having such a structure. The manufacturing process of this structure will be briefly described with reference to the same drawing. In the first step shown in FIG. 3A, a substrate (3) made of an insulating material such as glass or quartz is used.
After depositing a first electrode film made of indium tin oxide or the like on the entire surface of 1), the first electrode films (32), (32) ... Are divided into a plurality of regions by irradiation with a laser beam.

【0006】次に、同図(b)に示す第2工程では、そ
れら第1電極膜(32)(32)…上に、当該第1電極膜の相互
の隣接間隔部a,b…の近傍に偏った位置であって、該
隣接間隔部の近い側から導電部材(33)(33)…及び絶縁部
材(34)(34)…を、各第1電極毎に形成する。この導電部
材の材料としては、Agペーストやその他の金属ペース
ト等であり、また絶縁部材としては、SiO2粉末のペ
ーストやその他の無機材料である。
Next, in the second step shown in FIG. 3B, on the first electrode films (32), (32) ... In the vicinity of the adjacent intervals a, b ... Of the first electrode films. The conductive members (33) (33) ... And the insulating members (34) (34) ... are formed for each of the first electrodes from the side closer to the adjacent spacing portion. The material of the conductive member is Ag paste or other metal paste, and the insulating member is paste of SiO 2 powder or other inorganic material.

【0007】そして、同図(c)に示す第3工程では、
導電部材(33)(33)…、絶縁部材(34)(34)…及び第1電極
膜(32)(32)…が含まれるように基板(31)全面に、内部に
半導体接合を備える薄膜半導体膜(35)を形成する。この
薄膜半導体膜としては、例えば膜面に並行なpin接合
を備えた非晶質シリコンや多結晶シリコン等がある。
Then, in the third step shown in FIG.
A thin film having a semiconductor junction on the entire surface of the substrate (31) so as to include the conductive members (33) (33), the insulating members (34) (34), and the first electrode films (32) (32). A semiconductor film (35) is formed. Examples of the thin film semiconductor film include amorphous silicon and polycrystalline silicon having a pin junction parallel to the film surface.

【0008】同図(d)に示す第4工程では、上記薄膜
半導体膜(35)に引き続いて、アルミニュウム等の金属材
料からなる第2電極膜(36)を薄膜半導体膜(35)上に形成
する。
In the fourth step shown in FIG. 3D, a second electrode film (36) made of a metal material such as aluminum is formed on the thin film semiconductor film (35) subsequent to the thin film semiconductor film (35). To do.

【0009】次に、同図(e)に示す第5工程では、導
電部材(33)(33)…及び絶縁部材(34)(34)…の表面上に位
置する薄膜半導体膜(35)及び第2電極膜(36)の積層体部
分に、この積層体部分の表面側から第1、第2のレーザ
ビーム(L1)(L2)を照射する。
Next, in a fifth step shown in FIG. 3E, the thin film semiconductor films (35) and the thin film semiconductor films (35) located on the surfaces of the conductive members (33) (33) ... And the insulating members (34) (34). The laminated body portion of the second electrode film (36) is irradiated with the first and second laser beams (L1) and (L2) from the surface side of the laminated body portion.

【0010】斯る第1レーザビーム(L1)の照射により、
その照射部分の第2電極膜(36)及び薄膜半導体膜(35)は
溶融され、その溶融物によって、相隣接する光電変換素
子の第2電極膜(36)と第1電極膜(32)とは、導電部材(3
3)を介して、電気的に接続されることとなる。また、第
2レーザビーム(L2)の照射によれば、その照射により当
該照射領域にある第2電極膜(36)及び薄膜半導体膜(35)
が除去され、その結果その第2電極膜(36)は各光電変換
素子毎に分割されることとなる。
By irradiating the first laser beam (L1),
The second electrode film (36) and the thin film semiconductor film (35) in the irradiated portion are melted, and the melt causes the second electrode film (36) and the first electrode film (32) of the photoelectric conversion element adjacent to each other to be melted. Is the conductive member (3
It will be electrically connected via 3). Further, according to the irradiation of the second laser beam (L2), the irradiation causes the second electrode film (36) and the thin film semiconductor film (35) in the irradiation region.
Are removed, and as a result, the second electrode film (36) is divided for each photoelectric conversion element.

【0011】従って、これらレーザビームの照射を行う
ことにより、基板(31)上の複数の光電変換素子は互いに
直列接続され、集積型構造の光起電力装置が完成するこ
ととなる。
Therefore, by irradiating these laser beams, the plurality of photoelectric conversion elements on the substrate (31) are connected in series with each other, and the photovoltaic device having the integrated structure is completed.

【0012】尤も、このレーザビームによる加工にあっ
ては、その波長及びレーザビーム強度等の種々の条件設
定を厳密に制御する必要があり、この様な製造方法によ
る光起電力装置としては、例えば特開昭63−1563
71号等の先行技術がある。
However, in processing with this laser beam, it is necessary to strictly control various conditions such as the wavelength and the laser beam intensity, and as a photovoltaic device by such a manufacturing method, for example, JP-A-63-1563
There is prior art such as No. 71.

【0013】[0013]

【発明が解決しようとする課題】然し乍ら、斯様な光起
電力装置にあっては、上述したレーザビームの照射条件
の調整が非常に困難であり、ややもすると電気接続の為
に必要な溶融部分が蒸発し消失してしまったり、或るい
は第2電極膜と半導体膜とを除去すべき箇所に残留物が
付着したりすることとなり、光起電力装置の特性劣化の
原因となる。
However, in such a photovoltaic device, it is very difficult to adjust the irradiation conditions of the laser beam as described above, and it is possible that the melting necessary for electrical connection is a little. A portion of the photovoltaic device is evaporated and disappears, or a residue is attached to a portion where the second electrode film and the semiconductor film should be removed, which causes deterioration of characteristics of the photovoltaic device.

【0014】更に、従来例光起電力装置の構造では、清
浄な状態が通常要求される半導体に、半導体とは全く異
なる材料から成る導電部材や絶縁部材を内部に含めるこ
ととなるため、斯る部材から半導体への汚染事故が発生
し易くなり、また、これら部材は通常ペースト状態で使
用することから、スクリーン印刷によるパターニングを
施す必要があり、印刷工程に因る製造工程の煩雑さやパ
ターン精度の限界といった問題をも生じてしまうことと
なる。
Further, in the structure of the conventional photovoltaic device, a semiconductor normally required to be in a clean state includes a conductive member or an insulating member made of a material completely different from that of the semiconductor therein. Contamination accidents from the member to the semiconductor are likely to occur, and since these members are usually used in a paste state, it is necessary to perform patterning by screen printing. There will also be problems such as limits.

【0015】[0015]

【課題を解決するための手段】本発明光起電力装置の特
徴とするところは、絶縁表面を有する基板上の複数の領
域に、第1電極膜、光活性層及び第2電極膜をこの順序
で積層した光電変換素子を分割配置し、それら光電変換
素子を当該素子間の隣接間隔部で、隣接する一方の光電
変換素子の第1電極膜と、他方の光電変換素子の第2電
極膜とを、上記一方の光電変換素子の光活性層から露出
した該第1電極膜の露出部において電気接続された光起
電力装置に於いて、上記一方の光電変換素子の光活性層
は、上記隣接間隔部の上記露出部側に非晶質絶縁層を備
えると共に、上記他方の光電変換素子の光活性層上から
上記第1電極膜の露出部及び上記非晶質絶縁層を越えて
上記一方の光電変換素子の光活性層上に被着された上記
第2電極膜は、上記非晶質絶縁層上のエネルギービーム
の照射により当該照射領域が除去され分割されているこ
とにあり、また、本発明製造方法の特徴とするところ
は、光活性層に非晶質絶縁層を形成するに際して、絶縁
表面を有する基板上の複数の領域に、第1電極膜を分割
配置する工程と、上記第1電極膜の一部が露出するよう
に、上記基板表面の上記領域毎に光活性層を形成する工
程と、上記光活性層の、上記領域の隣接間隔近傍であっ
て、上記露出部側にイオン注入を施すことにより、該注
入領域を非晶質絶縁層に変質せしめる工程と、上記他方
の光電変換素子の光活性層上から上記第1電極膜の露出
部及び上記非晶質絶縁層を越えて上記一方の光電変換素
子の光活性層上に上記第2電極膜を形成する工程と、上
記非晶質絶縁層上にエネルギービームを照射することで
当該照射部分の第2電極膜を除去し分割する工程と、か
らなることにある。
The photovoltaic device of the present invention is characterized in that a first electrode film, a photoactive layer and a second electrode film are provided in this order in a plurality of regions on a substrate having an insulating surface. The photoelectric conversion elements stacked in the above are divided and arranged, and the photoelectric conversion elements are adjacent to each other at an adjacent interval between the first electrode film of one photoelectric conversion element and the second electrode film of the other photoelectric conversion element. In a photovoltaic device electrically connected at the exposed portion of the first electrode film exposed from the photoactive layer of the one photoelectric conversion element, the photoactive layer of the one photoelectric conversion element is An amorphous insulating layer is provided on the exposed portion side of the spacing portion, and the one of the photoelectric conversion elements of the other photoelectric conversion element is provided over the exposed portion of the first electrode film and the amorphous insulating layer. The second electrode film deposited on the photoactive layer of the photoelectric conversion element is The irradiation region is removed and divided by irradiation of the energy beam on the amorphous insulating layer, and the feature of the manufacturing method of the present invention is that the amorphous insulating layer is formed on the photoactive layer. In doing so, a step of dividingly arranging the first electrode film in a plurality of regions on the substrate having an insulating surface, and photoactivating each region of the substrate surface so that a part of the first electrode film is exposed. A step of forming a layer, and a step of transforming the implanted region into an amorphous insulating layer by performing ion implantation on the exposed portion side in the vicinity of the space adjacent to the region of the photoactive layer, The second electrode film is formed on the photoactive layer of the other photoelectric conversion element over the exposed portion of the first electrode film and the amorphous insulating layer from the photoactive layer of the other photoelectric conversion element. Process and energy beam on the amorphous insulating layer A step of dividing removing the second electrode layer of the irradiated portion by irradiating is to consist of.

【0016】[0016]

【作用】本発明光起電力装置によれば、光活性層の、光
電変換素子の隣接間隔部近傍に、非晶質絶縁層を備えさ
せ、該非晶質絶縁層上に被着された第2電極膜に該絶縁
層上の表面側からエネルギービームを照射することで分
割したものであることから、基板上に形成された複数の
光電変換素子を相互に直列接続とすることが可能とな
る。
According to the photovoltaic device of the present invention, an amorphous insulating layer is provided in the photoactive layer in the vicinity of the space between adjacent photoelectric conversion elements, and the second insulating layer is deposited on the amorphous insulating layer. Since the electrode film is divided by irradiating the surface of the insulating layer with an energy beam, a plurality of photoelectric conversion elements formed on the substrate can be connected in series with each other.

【0017】従って、本発明では、光活性層の所定の位
置に非晶質絶縁層を設け、これをエネルギービーム照射
時の絶縁材料として利用するものであることから、従来
の導電部材や絶縁部材を使用する必要がなく、汚染等の
問題が生じないこととなる。
Therefore, according to the present invention, an amorphous insulating layer is provided at a predetermined position of the photoactive layer and is used as an insulating material at the time of energy beam irradiation. Therefore, the conventional conductive member or insulating member is used. Therefore, there is no need to use, and problems such as contamination will not occur.

【0018】また、本発明光起電力装置の製造方法によ
れば、光活性層の、隣接間隔近傍であって、第1電極膜
の上記露出部側に、イオン注入を施すことによって、当
該注入領域の光活性層を非晶質絶縁層に変質させ、該絶
縁層上に被着された第2電極膜をこの絶縁層の表面側か
らのエネルギービーム照射により除去分割することで、
基板上に形成された複数の光電変換素子を、直列に接続
させることが可能となる。このため、第2電極膜の分割
のために必要とされる絶縁材料として、光活性層と同一
材料を出発材料とすることから、従来のような半導体と
は異種の材料であるSiO2ペースト等を使用する必要
がなく、それによる光活性層への汚染を防止することが
可能となる。
Further, according to the method for manufacturing a photovoltaic device of the present invention, by performing ion implantation on the exposed portion side of the first electrode film in the vicinity of the adjacent spacing of the photoactive layer, the implantation is performed. By changing the quality of the photoactive layer in the region into an amorphous insulating layer and removing and dividing the second electrode film deposited on the insulating layer by energy beam irradiation from the surface side of this insulating layer,
It is possible to connect a plurality of photoelectric conversion elements formed on the substrate in series. Therefore, as the insulating material required for dividing the second electrode film, the same material as the photoactive layer is used as a starting material, so that a SiO 2 paste or the like, which is a material different from a conventional semiconductor, is used. It is possible to prevent the photoactive layer from being contaminated due to the absence of the use of.

【0019】更に、イオン注入により上記非晶質絶縁層
を形成することから、イオン注入の加工精度がそのまま
その絶縁層の形成位置制御等に反映させることができる
こととなり、従来のスクリーン印刷法と比べ、パターン
精度を飛躍的に向上させることが可能となる。
Further, since the amorphous insulating layer is formed by ion implantation, the processing accuracy of ion implantation can be directly reflected on the control of the position of formation of the insulating layer, etc. It is possible to dramatically improve the pattern accuracy.

【0020】[0020]

【実施例】図1は、本発明の実施例光起電力装置を説明
するための素子構造図である。同図中に示す(1)はガラ
スや石英等からなる絶縁表面を有する基板、(2)(2)…は
基板(1)表面に分割配置された、酸化インジュウム錫や
酸化錫等の透明導電膜からなる第1電極膜、(3)(3)…
は第1電極膜(2)(2)…の一部が露出する(2a)(2a)…よう
に第1電極膜毎に形成された薄膜半導体から成る光活性
層で、具体的には非晶質シリコンや、多結晶シリコン等
からなり、その内部にはpn接合或るいはpin接合等
を膜面に並行に含んでいる。
DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an element structure diagram for explaining a photovoltaic device according to an embodiment of the present invention. In the figure, (1) is a substrate having an insulating surface made of glass or quartz, (2) (2) ... is a transparent conductive material such as indium tin oxide or tin oxide, which is divided and arranged on the surface of the substrate (1). First electrode film made of a film, (3) (3) ...
Is a photoactive layer made of a thin film semiconductor formed for each first electrode film so that a part of the first electrode film (2) (2) ... Is exposed (2a) (2a). It is made of crystalline silicon, polycrystalline silicon, or the like, and inside thereof includes a pn junction or a pin junction in parallel with the film surface.

【0021】この非晶質シリコンの製造法としてはプラ
ズマCVD法や光CVD法があり、又多結晶シリコン等
の製造法としては、固相成長法(参考文献:Japanese J
ournal of Applied Physice voi.29 No.11,pp.2327〜23
31,1991)やレーザ再結晶法(参考文献:Japanese Jour
nal of Applied Physice voi.30 No.12B,pp.3700〜370
3,1991)がある。
As a method for producing this amorphous silicon, there are a plasma CVD method and a photo CVD method, and as a method for producing polycrystalline silicon etc., a solid phase growth method (reference: Japanese J
ournal of Applied Physice voi.29 No.11, pp.2327-23
31, 1991) and laser recrystallization (reference: Japanese Jour
nal of Applied Physice voi.30 No.12B, pp.3700〜370
3, 1991).

【0022】(4)(4)…は、光活性層の、隣接間隔近傍で
あって、第1電極膜の上記露出部(2a)(2a)…側に配置さ
れた非晶質絶縁層、具体的な材料としては、非晶質シリ
コンカーバイド、非晶質シリコンナイトライド等があ
る。(5)(5)…は光電変換素子の、アルミニュウム膜やチ
タン膜或るいはクロム膜等から成る第2電極膜であっ
て、この膜は各光電変換素子間に於いて、非晶質絶縁層
(4)(4)…上のその表面側からのエネルギービームの照射
により除去され、各光電変換素子毎に分割されている。
(4) (4) ... Amorphous insulating layers arranged in the vicinity of the adjacent space of the photoactive layer and on the exposed portions (2a) (2a) ... side of the first electrode film, Specific materials include amorphous silicon carbide and amorphous silicon nitride. (5) (5) ... is a second electrode film made of an aluminum film, a titanium film or a chrome film of the photoelectric conversion element, and this film is an amorphous insulating film between the photoelectric conversion elements. layer
(4) (4) ... Is removed by irradiation with an energy beam from the surface side above, and is divided into photoelectric conversion elements.

【0023】本発明光起電力装置では、第2電極膜を、
一方の光電変換素子から上記第1電極膜の露出部(2a)(2
a)…及び非晶質絶縁層(4)(4)…を越えて他方の光電変換
素子の光活性層上に被着させていることから、上記非晶
質絶縁層(4)(4)…上で第2電極膜(5)(5)…を分割除去す
るのみで、複数の光電変換素子を容易に直列接続させる
ことが可能となる。
In the photovoltaic device of the present invention, the second electrode film is
The exposed part (2a) (2a) (2a) of the first electrode film from one photoelectric conversion element
a) ... and the amorphous insulating layers (4) (4) ... are deposited on the photoactive layer of the other photoelectric conversion element, so that the amorphous insulating layers (4) (4) A plurality of photoelectric conversion elements can be easily connected in series only by dividing and removing the second electrode films (5), (5), ... Above.

【0024】次に、本発明光起電力装置の製造方法を図
2に示す工程別素子構造図に沿って説明する。尚、図中
の符号は、図1と同様の材料を使用するものについては
同一の符号を付している。
Next, a method of manufacturing the photovoltaic device of the present invention will be described with reference to the element structure diagram for each step shown in FIG. In addition, the reference numerals in the drawings are the same as those of the materials using the same materials as those in FIG.

【0025】同図(a)に示す第1工程では、基板(1)
上に膜厚が約2000Å〜5000Åの透明導電膜から
なる第1電極膜をスパッタ法や蒸着法等で被着させた
後、エネルギービームを照射することで、該第1電極膜
(2)(2)…を各光電変換素子毎に分割配置する。
In the first step shown in FIG. 3A, the substrate (1) is
A first electrode film made of a transparent conductive film having a film thickness of about 2000 Å to 5000 Å is deposited thereon by a sputtering method, a vapor deposition method, or the like, and then the first electrode film is irradiated with an energy beam.
(2) (2) ... Are divided and arranged for each photoelectric conversion element.

【0026】このエネルギービームは、基板(1)に殆ど
吸収されないような波長とすることが適当であることか
ら、例えば基板としてガラスを使用する場合にあって
は、0.35μm〜2.5μmの波長のパルス出力型が
好ましく、代表的なものとしては、波長約1.06μ
m、エネルギー密度13J/cm2、パルス繰り返し周
波数3KHzのQスイッチ付きNd:YAGレーザが挙
げられる。
Since it is appropriate that the energy beam has a wavelength that is hardly absorbed by the substrate (1), for example, when glass is used as the substrate, the energy beam is 0.35 μm to 2.5 μm. A pulse output type of wavelength is preferable, and a typical one is a wavelength of about 1.06μ.
m, an energy density of 13 J / cm 2 , and a pulse repetition frequency of 3 KHz, which is an Nd: YAG laser with a Q switch.

【0027】次に、同図(b)に示す第2工程では、第
1電極膜(2)(2)…が含まれるように基板全面に非晶質半
導体からなる光活性層(3a)を膜厚が5000Å〜100
000Åの範囲となるようにプラスマCVD法等で形成
する。本例ではこの非晶質半導体として、従来周知のp
型の非晶質シリコン膜を使用した。
Next, in the second step shown in FIG. 3B, a photoactive layer (3a) made of an amorphous semiconductor is formed on the entire surface of the substrate so as to include the first electrode films (2) (2). Film thickness is 5000Å-100
It is formed by a plasma CVD method or the like so as to have a range of 000Å. In this example, as the amorphous semiconductor, a conventionally known p
Type amorphous silicon film was used.

【0028】そして、同図(c)に示す第3工程では、
光活性層(3a)を各光電変換素子毎に分割すべく、上記第
1電極膜(2)の一部が露出するように、この光活性層(3
a)の、上記第1電極膜の隣接間隔近傍にエネルギービー
ムを照射し、該光活性層を分割する。因みに、斯る場合
のエネルギービームとしては、例えば波長が0.51μ
m、出力2×103W/cm2、CWのArレーザ等が適
当である。
Then, in the third step shown in FIG.
In order to divide the photoactive layer (3a) into photoelectric conversion elements, the photoactive layer (3a) is exposed so that a part of the first electrode film (2) is exposed.
The energy beam is radiated to the vicinity of the adjacent space of the first electrode film in a) to divide the photoactive layer. Incidentally, the energy beam in such a case has a wavelength of 0.51 μm, for example.
m, an output of 2 × 10 3 W / cm 2 , and a CW Ar laser are suitable.

【0029】次に、同図(d)に示す第4工程では、基
板(1)が400℃〜1000℃の温度範囲で約8時間の
熱処理を施すことで、非晶質半導体であった光活性層(3
a)(3a)…を多結晶化させ、引き続いて該光活性層(3a)(3
a)…の表面側から従来周知のリン等によるn型不純物を
熱拡散することで、この層の内部にpn接合を形成させ
る。これにより、多結晶半導体から成るpn接合の光活
性層(3)(3)…が得られる。
Next, in the fourth step shown in FIG. 3D, the substrate (1) is subjected to heat treatment for about 8 hours in the temperature range of 400 ° C. to 1000 ° C. Active layer (3
a) (3a) ... is polycrystallized, and subsequently the photoactive layer (3a) (3a)
A n-type impurity such as conventionally known phosphorus is thermally diffused from the surface side of a) to form a pn junction inside this layer. As a result, pn junction photoactive layers (3), (3) ... Of polycrystalline semiconductor are obtained.

【0030】そして、同図(e)に示す第5工程では、
光活性層(3)(3)…の、上記隣接間隔近傍であって、上記
露出部(2a)(2a)…側にイオン注入(I)(I)…を施すことに
より、この光活性層の端部を非晶質絶縁層(4)(4)…に変
質させる。
Then, in the fifth step shown in FIG.
By performing ion implantation (I) (I) on the exposed portions (2a) (2a) ... side of the photoactive layers (3) (3). The end portions of are transformed into amorphous insulating layers (4) (4).

【0031】このイオン注入法としては、シリコンイオ
ン、窒素イオン、炭素イオン、フッ素イオン或るいは水
素イオン等を30〜100keVの加速電圧でその光活
性層に注入する。
As the ion implantation method, silicon ions, nitrogen ions, carbon ions, fluorine ions or hydrogen ions are implanted into the photoactive layer at an accelerating voltage of 30 to 100 keV.

【0032】同図(f)に示す第6工程では、第1電極
膜の露出部(2a)(2a)…及び非晶質絶縁層(4)(4)…を越え
て、光活性層上に膜厚が500Å〜2000Åのアルミ
ニュウムやクロム等の金属からなる第2電極(5)を形成
する。
In the sixth step shown in FIG. 3F, the photoactive layer is crossed over the exposed portions (2a) (2a) of the first electrode film and the amorphous insulating layers (4) (4). Then, a second electrode (5) having a film thickness of 500Å to 2000Å and made of metal such as aluminum or chromium is formed.

【0033】として、次に同図(g)に示す第7工程で
は、その非晶質絶縁層(4)(4)…上に、この非晶質絶縁層
(4)(4)…の表面側からエネルギービーム(EB)を照射する
ことにより、その照射部分の第2電極膜(5)を除去し、
各光電変換素子毎にこの第2電極膜を分離する。本工程
により、各光電変換素子は基板上で直列接続されること
となる。
Next, in the seventh step shown in FIG. 7G, the amorphous insulating layer is formed on the amorphous insulating layers (4), (4).
(4) By irradiating the energy beam (EB) from the surface side of (4) ..., the second electrode film (5) in the irradiated portion is removed,
The second electrode film is separated for each photoelectric conversion element. Through this step, the photoelectric conversion elements are connected in series on the substrate.

【0034】このエネルギービームの照射領域の第2電
極(5)下に、非晶質絶縁層(4)(4)…を配置したことか
ら、たとえエネルギービームが第2電極膜の厚みを越え
て、被照射物を除去したとしてもこの非晶質絶縁層(4)
(4)…による保護があることから、光電変換素子が破壊
されることなく加工することができることとなる。
Since the amorphous insulating layers (4), (4) ... Are arranged under the second electrode (5) in the irradiation region of this energy beam, even if the energy beam exceeds the thickness of the second electrode film. , Even if the object to be irradiated is removed, this amorphous insulating layer (4)
Since the photoelectric conversion element is protected by (4) ..., the photoelectric conversion element can be processed without being destroyed.

【0035】具体的な、このエネルギービームとして
は、例えば波長1.06μmのYAGレーザ等が使用で
きる。
As this concrete energy beam, for example, a YAG laser having a wavelength of 1.06 μm can be used.

【0036】従って、本発明製造方法によれば、イオン
注入によって光活性層(3)(3)…内に非晶質絶縁層(4)(4)
…を設けていることから、従来のような絶縁ペースト等
によるパターニングが不要となり、またその絶縁層の出
発材料として光活性層自体を使用することから、絶縁層
による光活性層への汚染問題が生じないこととなる。
Therefore, according to the manufacturing method of the present invention, the amorphous insulating layers (4) and (4) are formed in the photoactive layers (3) (3) by ion implantation.
Since the ... is provided, patterning with an insulating paste or the like as in the past is unnecessary, and since the photoactive layer itself is used as a starting material for the insulating layer, there is a problem of contamination of the photoactive layer by the insulating layer. It will not occur.

【0037】因みに、本実施例では、イオン注入による
非晶質絶縁層を形成する部分として、第2電極膜を分割
せしめる部分のみならず、上記隣接間隔部にあって、該
第2電極を分割するための非晶質絶縁層と対向する部
分、図2によれば(4)’(4)’…にも非晶質絶縁層を形成
した。これは第2電極膜(5)(5)…が隣接する光電変換素
子の第1電極膜(2)(2)…に延出する際に、光活性層(3)
(3)…の側面に沿って配線されたならば生じるリーク電
流を低減せしめるために設けたものである。
Incidentally, in the present embodiment, not only the portion for dividing the second electrode film as the portion for forming the amorphous insulating layer by the ion implantation but also the second electrode is divided at the adjacent space portion. The amorphous insulating layer was formed also in the portion facing the amorphous insulating layer for the purpose, that is, (4) '(4)' in FIG. This is because when the second electrode films (5) (5) ... Extend to the first electrode films (2) (2) ... of the adjacent photoelectric conversion element, the photoactive layer (3)
(3) It is provided in order to reduce the leakage current generated when the wiring is provided along the side surface of.

【0038】また、本発明実施例では、基板側からの光
入射により発電する光起電力装置についてのみ説明した
が、本発明はこれに限られるものではなく膜形成面側か
らの光入射により発電する光起電力装置についても同様
に実施することができる。また、実施例では、非晶質半
導体膜に熱処理を施すことにより、多結晶半導体とした
ものを使用したが、本発明はこれに限られず通常の非晶
質状態のままを光活性層としても何ら問題がない。更に
は、多結晶半導体と非晶質半導体とで半導体接合を構成
した薄膜半導体を使用してもよい。
Further, in the embodiments of the present invention, only the photovoltaic device for generating power by light incident from the substrate side has been described, but the present invention is not limited to this, and power is generated by light incidence from the film forming surface side. The same can be applied to the photovoltaic device. Further, in the embodiment, a polycrystalline semiconductor is used by subjecting an amorphous semiconductor film to heat treatment, but the present invention is not limited to this, and a normal amorphous state may be used as a photoactive layer. There is no problem. Further, a thin film semiconductor having a semiconductor junction formed of a polycrystalline semiconductor and an amorphous semiconductor may be used.

【0039】尚、光起電力装置の各光活性層の端部を絶
縁化させる技術として、例えば特公平4−45990号
があるが、これは光活性層の側面に沿って流れるリーク
電流を低減させるためのものではあり、本発明における
ような集積型構造とする際のエネルギービーム加工によ
る絶縁材料ではなく、本発明とは全く異なるものであ
る。
As a technique for insulating the ends of the photoactive layers of the photovoltaic device, there is, for example, Japanese Patent Publication No. 4-45990, which reduces the leakage current flowing along the side surface of the photoactive layer. This is for the purpose of making it an insulating material by energy beam processing when forming an integrated structure as in the present invention, and is completely different from the present invention.

【0040】[0040]

【発明の効果】本発明光起電力装置によれば、光活性層
の、光電変換素子の隣接間隔部近傍に、非晶質絶縁層を
備えさせ、該非晶質絶縁層上に被着された第2電極膜に
該絶縁層上の表面側からエネルギービームを照射するこ
とで分割したものであることから、基板上に形成された
複数の光電変換素子を相互に直列接続とすることが可能
となる。
According to the photovoltaic device of the present invention, an amorphous insulating layer is provided in the photoactive layer in the vicinity of the space adjacent to the photoelectric conversion element, and the amorphous insulating layer is deposited on the amorphous insulating layer. Since the second electrode film is divided by irradiating an energy beam from the surface side on the insulating layer, it is possible to connect a plurality of photoelectric conversion elements formed on the substrate in series with each other. Become.

【0041】従って、本発明では、光活性層の所定の位
置に非晶質絶縁層を設け、これをエネルギービーム照射
時の絶縁材料として利用するものであることから、従来
の導電部材や絶縁部材を使用する必要がなく、汚染等の
問題が生じない。。
Therefore, according to the present invention, an amorphous insulating layer is provided at a predetermined position of the photoactive layer and is used as an insulating material at the time of energy beam irradiation. Does not need to be used, and problems such as contamination do not occur. .

【0042】また、本発明光起電力装置の製造方法によ
れば、光活性層の、隣接間隔近傍であって、第1電極膜
の上記露出部側に、イオン注入を施すことによって、当
該注入領域の光活性層を非晶質絶縁層に変質させ、該絶
縁層上に被着された第2電極膜をこの絶縁層の表面側か
らのエネルギービーム照射により除去分割することで、
基板上に形成された複数の光電変換素子を、直列に接続
させることが可能となる。このため、第2電極膜の分割
のために必要とされる絶縁材料として、光活性層と同一
材料を出発材料とすることから、従来のような半導体と
は異種の材料であるSiO2ペースト等を使用する必要
がなく、それによる光活性層への汚染を抑圧することが
可能となる。
Further, according to the method for manufacturing a photovoltaic device of the present invention, by performing ion implantation on the exposed portion side of the first electrode film in the vicinity of the adjacent spacing of the photoactive layer, the implantation is performed. By changing the quality of the photoactive layer in the region into an amorphous insulating layer and removing and dividing the second electrode film deposited on the insulating layer by energy beam irradiation from the surface side of this insulating layer,
It is possible to connect a plurality of photoelectric conversion elements formed on the substrate in series. Therefore, as the insulating material required for dividing the second electrode film, the same material as the photoactive layer is used as a starting material, so that a SiO 2 paste or the like, which is a material different from a conventional semiconductor, is used. Therefore, it is possible to suppress the contamination of the photoactive layer due to the use of the.

【0043】更に、イオン注入により上記非晶質絶縁層
を形成することから、イオン注入の加工精度がそのまま
その絶縁層の形成位置制御等に反映させることができる
こととなり、従来のスクリーン印刷法と比べ、パターン
精度を飛躍的に向上させることが可能となる。
Furthermore, since the above-mentioned amorphous insulating layer is formed by ion implantation, the processing precision of ion implantation can be reflected as it is in the formation position control of the insulating layer, etc. It is possible to dramatically improve the pattern accuracy.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明光起電力装置の一実施例を示す素子構造
断面図である。
FIG. 1 is a sectional view of an element structure showing an embodiment of a photovoltaic device of the present invention.

【図2】本発明光起電力装置の製造方法を説明するため
の工程別素子構造断面図である。
FIG. 2 is a sectional view of the element structure for each step for explaining the method for manufacturing the photovoltaic device of the present invention.

【図3】従来例光起電力装置の製造方法を説明するため
の工程別素子構造断面図である。
FIG. 3 is a sectional view of an element structure for each step for explaining a method for manufacturing a conventional photovoltaic device.

【符号の説明】[Explanation of symbols]

(1)…基板 (2)…第1電
極膜 (2a)…露出部 (3)…光活性
層 (4)…非晶質絶縁層 (5)…第2電
極膜 (I)…イオン注入
(1) ... Substrate (2) ... First electrode film (2a) ... Exposed part (3) ... Photoactive layer (4) ... Amorphous insulating layer (5) ... Second electrode film (I) ... Ion implantation

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 絶縁表面を有する基板上の複数の領域
に、第1電極膜、光活性層及び第2電極膜をこの順序で
積層した光電変換素子を分割配置し、それら光電変換素
子を当該素子間の隣接間隔部で、隣接する一方の光電変
換素子の第1電極膜と、他方の光電変換素子の第2電極
膜とを、上記一方の光電変換素子の光活性層から露出し
た該第1電極膜の露出部において電気接続された光起電
力装置に於いて、 上記一方の光電変換素子の光活性層は、上記隣接間隔部
の上記露出部側に非晶質絶縁層を備えると共に、上記他
方の光電変換素子の光活性層上から上記第1電極膜の露
出部及び上記非晶質絶縁層を越えて上記一方の光電変換
素子の光活性層上に被着された上記第2電極膜は、上記
非晶質絶縁層上のエネルギービームの照射により当該照
射領域が除去され分割されていることを特徴とする光起
電力装置。
1. A photoelectric conversion element in which a first electrode film, a photoactive layer, and a second electrode film are laminated in this order is divided and arranged in a plurality of regions on a substrate having an insulating surface, and the photoelectric conversion elements are The first electrode film of one of the photoelectric conversion elements and the second electrode film of the other photoelectric conversion element, which are adjacent to each other, are exposed from the photoactive layer of the one photoelectric conversion element in the adjacent space between the elements. In the photovoltaic device electrically connected to the exposed portion of the one-electrode film, the photoactive layer of the one photoelectric conversion element includes an amorphous insulating layer on the exposed portion side of the adjacent spacing portion, The second electrode deposited on the photoactive layer of the other photoelectric conversion element beyond the exposed portion of the first electrode film and the amorphous insulating layer on the photoactive layer of the other photoelectric conversion element. The film is irradiated with an energy beam on the amorphous insulating layer. Photovoltaic device, characterized in that frequency is divided is removed.
【請求項2】 絶縁表面を有する基板上の複数の領域
に、第1電極膜、光活性層及び第2電極膜をこの順序で
積層した光電変換素子を分割配置し、それら光電変換素
子を当該素子間の隣接間隔部で、隣接する一方の光電変
換素子の第1電極膜と、他方の光電変換素子の第2電極
膜とを、上記一方の光電変換素子の光活性層から露出し
た該第1電極膜の露出部において電気接続された光起電
力装置の製造方法に於いて、 絶縁表面を有する基板上の複数の領域に、第1電極膜を
分割配置する工程と、 上記第1電極膜の一部が露出するように、上記基板表面
の上記領域毎に光活性層を形成する工程と、 上記光活性層の、上記領域の隣接間隔近傍であって、上
記露出部側にイオン注入を施すことにより、該注入領域
を非晶質絶縁層に変質せしめる工程と、 上記他方の光電変換素子の光活性層上から上記第1電極
膜の露出部及び上記非晶質絶縁層を越えて上記一方の光
電変換素子の光活性層上に上記第2電極膜を形成する工
程と、 上記非晶質絶縁層上にエネルギービームを照射すること
で当該照射部分の第2電極膜を除去し分割する工程と、 からなる光起電力装置の製造方法。
2. A photoelectric conversion element in which a first electrode film, a photoactive layer and a second electrode film are laminated in this order is divided and arranged in a plurality of regions on a substrate having an insulating surface, and the photoelectric conversion elements are The first electrode film of one of the photoelectric conversion elements and the second electrode film of the other photoelectric conversion element, which are adjacent to each other, are exposed from the photoactive layer of the one photoelectric conversion element in the adjacent space between the elements. In a method of manufacturing a photovoltaic device electrically connected to an exposed portion of one electrode film, a step of dividingly arranging the first electrode film in a plurality of regions on a substrate having an insulating surface; A step of forming a photoactive layer in each of the regions on the surface of the substrate so that a part of the region is exposed, and ion implantation is performed on the exposed portion side in the vicinity of the adjacent spacing of the regions of the photoactive layer. A step of transforming the implantation region into an amorphous insulating layer by applying And the second electrode film on the photoactive layer of the other photoelectric conversion element over the exposed portion of the first electrode film and the amorphous insulating layer from the photoactive layer of the other photoelectric conversion element. A method of manufacturing a photovoltaic device, comprising: a step of forming; and a step of irradiating the amorphous insulating layer with an energy beam to remove and divide the second electrode film in the irradiated portion.
JP14765493A 1993-06-18 1993-06-18 Method for manufacturing photovoltaic device Expired - Lifetime JP3505201B2 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19651655A1 (en) * 1996-07-28 1998-01-29 Angew Solarenergie Ase Gmbh Thin layer solar module
JP2009158861A (en) * 2007-12-27 2009-07-16 Sanyo Electric Co Ltd Solar cell module and method for manufacturing the solar cell module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19651655A1 (en) * 1996-07-28 1998-01-29 Angew Solarenergie Ase Gmbh Thin layer solar module
DE19651655C2 (en) * 1996-07-28 2002-10-02 Rwe Solar Gmbh Interconnected solar cells, in particular series-connected thin-film solar modules, and method for their production
JP2009158861A (en) * 2007-12-27 2009-07-16 Sanyo Electric Co Ltd Solar cell module and method for manufacturing the solar cell module

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