JPH07144324A - Phenol resin molding material - Google Patents
Phenol resin molding materialInfo
- Publication number
- JPH07144324A JPH07144324A JP29501293A JP29501293A JPH07144324A JP H07144324 A JPH07144324 A JP H07144324A JP 29501293 A JP29501293 A JP 29501293A JP 29501293 A JP29501293 A JP 29501293A JP H07144324 A JPH07144324 A JP H07144324A
- Authority
- JP
- Japan
- Prior art keywords
- phenol resin
- semi
- cured
- cured matter
- molding material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
Landscapes
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Moulding By Coating Moulds (AREA)
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、積層板の廃材等を再利
用することができるフェノール樹脂成形材料に関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a phenol resin molding material capable of reusing waste materials of laminated plates.
【０００２】[0002]
【従来の技術】従来、プリント配線板、フェノール樹脂
積層板及びこれらの製造時に発生する廃材は、埋め立て
処理されることが多いが、最近では埋め立て地も確保で
きない。加えて、地球環境の保全面でも問題になってい
る。2. Description of the Related Art Conventionally, printed wiring boards, phenol resin laminated boards and waste materials produced during their manufacture are often landfilled, but recently landfills cannot be secured. In addition, it has become a problem in terms of conservation of the global environment.
【０００３】したがって、フェノール樹脂積層板等は、
粉砕されて粉体にされ、アスファルトやコンクリートの
骨材としてあるいは、接着性の樹脂等により固形化した
ブロック類等として再利用する提案がなされている。Therefore, the phenolic resin laminated plate, etc.
It has been proposed to pulverize it into powder and reuse it as an aggregate of asphalt or concrete, or blocks that are solidified with an adhesive resin or the like.
【０００４】また、熱硬化性樹脂積層板等については、
焼却により生ずる熱エネルギーとして採熱し、例えば、
ボイラーや発電の熱源として利用する提案もされてい
る。Regarding the thermosetting resin laminated plate, etc.,
Heat is collected as heat energy generated by incineration, for example,
It has also been proposed to use it as a heat source for boilers and power generation.
【０００５】さらにこれに加えて、フェノール樹脂等の
熱硬化性樹脂を焼却する場合には、燃焼温度が高いた
め、炉の損傷が激しく寿命が短くなってしまうという問
題があった。In addition to this, when incinerating a thermosetting resin such as a phenol resin, there is a problem that the furnace is severely damaged and the life is shortened due to the high combustion temperature.
【０００６】しかし、これらのフェノール樹脂等の熱硬
化性樹脂の再利用については、実用化されているものも
あるが、いずれも満足できる段階には至っていない。However, although some of the thermosetting resins such as phenol resins have been put into practical use, they have not reached the stage where they can be satisfied.
【０００７】そこで、銅張りフェノール樹脂積層板等の
金属張りフェノール樹脂積層板を粉砕して得られた粉体
をバージン材に添加した成形材料として再利用する試み
がなされているが、バージンの樹脂を必要とするために
廃材の消費量が増大しない。Therefore, an attempt has been made to reuse powder obtained by crushing a metal-clad phenolic resin laminated plate such as a copper-clad phenolic resin laminated plate as a virgin material as a molding material. The consumption of waste materials does not increase because of the need for
【０００８】[0008]
【発明が解決しようとする課題】本発明は上記の事実に
鑑みてなされたもので、その目的とするところは、プリ
ント配線板及び銅張りフェノール樹脂積層板等の金属張
りフェノール樹脂積層板等のフェノール樹脂の硬化物の
廃材並びにその製造工程から発生するフェノール樹脂の
プリプレグ等のフェノール樹脂の半硬化物の端材等の廃
材の使用を条件としてバージンの樹脂を用いずに廃材の
消費量の増大を図ったフェノール樹脂成形材料を提供す
ることにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above facts, and an object of the present invention is to provide a printed wiring board and a metal-clad phenol resin laminate such as a copper-clad phenol resin laminate. Increasing consumption of waste materials without using virgin resin, provided that waste materials such as cured materials of phenolic resins and waste materials of semi-cured phenolic resins such as prepreg of phenolic resins generated from the manufacturing process are used The purpose is to provide a phenolic resin molding material aiming at the above.
【０００９】[0009]
【課題を解決するための手段】本発明の請求項１に係る
フェノール樹脂成形材料は、パルプ紙に含浸したフェノ
ール樹脂が半硬化した半硬化物の粉砕物とパルプ紙に含
浸したフェノール樹脂が硬化した硬化物の粉砕物とを含
有し、これら主成分の全量に対して、上記半硬化物の粉
砕物を少なくとも１０重量％以上含有することを特徴と
する。In the phenol resin molding material according to claim 1 of the present invention, a pulverized product of a semi-cured semi-cured phenol resin impregnated in pulp paper and a phenol resin impregnated in pulp paper are cured. And a pulverized product of the cured product obtained above, and at least 10% by weight or more of the pulverized product of the semi-cured product is contained with respect to the total amount of these main components.
【００１０】本発明の請求項２に係るフェノール樹脂成
形材料は、上記半硬化物の粉砕物が３０メッシュ以下の
粉体であって、かつ硬化物の粉砕物が６０メッシュ以下
の粉体であることを特徴とする。In the phenol resin molding material according to claim 2 of the present invention, the pulverized product of the semi-cured product is a powder of 30 mesh or less, and the pulverized product of the cured product is a powder of 60 mesh or less. It is characterized by
【００１１】[0011]
【作用】本発明のフェノール樹脂成形材料によると、パ
ルプ紙に含浸したフェノール樹脂が半硬化した半硬化物
の粉砕物とパルプ紙に含浸したフェノール樹脂が硬化し
た硬化物の粉砕物とを含有し、半硬化物の粉砕物は、反
応する余地が残っているため、バージンの樹脂を用いず
にこれらの粉砕物のみでフェノール樹脂成形材料として
使用することができ、成形して成形品を得ることができ
る。According to the phenol resin molding material of the present invention, a pulverized product of the semi-cured phenol resin impregnated in the pulp paper and a pulverized product of the cured phenol resin impregnated in the pulp paper are contained. Since the crushed product of semi-cured material has room for reaction, it can be used as a phenolic resin molding material without using virgin resin and can be molded to obtain a molded product. You can
【００１２】以下、本発明を詳述する。本発明に用いる
パルプ紙に含浸したフェノール樹脂が半硬化した半硬化
物としては、フェノール樹脂のワニスを紙等の基材に含
浸させたフェノール樹脂のプリプレグ等があり、この過
程では、フェノール樹脂の反応は、完結していない。す
なわち、この反応段階は、相当の未反応の官能基を残し
た半硬化状態であり、Ｂステージと呼ばれている。The present invention will be described in detail below. Examples of the semi-cured product obtained by semi-curing the phenol resin impregnated in the pulp paper used in the present invention include a prepreg of a phenol resin in which a base material such as paper is impregnated with a varnish of a phenol resin. The reaction is not complete. That is, this reaction stage is a semi-cured state in which a considerable amount of unreacted functional group remains, and is called B stage.
【００１３】また、パルプ紙に含浸したフェノール樹脂
が硬化した硬化物としては、上記フェノール樹脂のプリ
プレグに添って移送された、銅箔等の金属箔を積層して
積層体とし、この積層体を熱盤間に挟んで熱圧成形する
ことによって、積層体中のフェノール樹脂を加熱硬化さ
せた金属張りフェノール樹脂積層板等がある。As the cured product obtained by curing the phenol resin impregnated in the pulp paper, a metal foil such as a copper foil transferred along with the prepreg of the above-mentioned phenol resin is laminated to form a laminated body. There is a metal-clad phenol resin laminated plate in which the phenol resin in the laminate is heat-cured by being sandwiched between hot plates and subjected to thermocompression molding.
【００１４】この金属張りフェノール樹脂積層板の金属
の導電層をエッチングしてプリント配線回路を形成した
ものが、プリント配線板である。The printed wiring board is formed by etching the metal conductive layer of the metal-clad phenolic resin laminated board to form a printed wiring circuit.
【００１５】したがって、金属張りフェノール樹脂積層
板及びプリント配線板の反応は、かなり進んでおり完全
に反応が終結して完全硬化した状態の反応度を１００と
すると、反応度は、８０〜９０程度で略硬化した状態で
ある。そしてこの反応段階は、Ｃステージと呼ばれてい
る。Therefore, the reaction between the metal-clad phenolic resin laminate and the printed wiring board has progressed considerably, and the reactivity is about 80 to 90, assuming that the reaction is completely finished and the resin is completely cured. It is in a substantially cured state. And this reaction stage is called C stage.
【００１６】これらの製造工程では、積層板の幅等を一
定にするために耳を切断する。それによって、端材等の
不要物が発生する。In these manufacturing processes, the ears are cut in order to keep the width of the laminated plate constant. As a result, unnecessary materials such as scraps are generated.
【００１７】この不要になったフェノール樹脂のプリプ
レグ、プリント配線板及び金属張りフェノール樹脂積層
板をまず、カッターミル等の粗砕機で粒径５〜１０ｍｍ
程度に粗砕する。The prepreg of the unnecessary phenol resin, the printed wiring board, and the metal-clad phenol resin laminated board are firstly crushed with a crusher such as a cutter mill to a particle size of 5 to 10 mm.
Crush roughly.
【００１８】次にボールミル等の粉砕機でフェノール樹
脂のプリプレグについては、３０メッシュ（５９０μ
ｍ）以下に、プリント配線板及び金属張りフェノール樹
脂積層板については、６０メッシュ（２５０μｍ）以下
に粉砕する。Next, using a crusher such as a ball mill, the prepreg of the phenol resin is 30 mesh (590 μm).
m) and below, the printed wiring board and the metal-clad phenolic resin laminated board are pulverized to 60 mesh (250 μm) or less.
【００１９】プリント配線板及び金属張りフェノール樹
脂積層板をボールミルまたは振動ミル等の粉砕機で粉砕
する過程で、フェノール樹脂は細かい粉状になっていく
のに対して、銅等の金属は延伸されて箔状になる。すな
わち、フェノール樹脂と銅等の金属との粒度差が広がっ
ていく。In the process of crushing the printed wiring board and the metal-clad phenolic resin laminated board with a crusher such as a ball mill or a vibration mill, the phenol resin becomes fine powder, while the metal such as copper is stretched. Becomes a foil. That is, the difference in particle size between the phenol resin and the metal such as copper increases.
【００２０】続いて、このプリント配線板及び金属張り
フェノール樹脂積層板については、篩または風篩等の分
級機により分級し、銅等の金属とフェノール樹脂との粒
度差または比重差等を利用して、銅等の金属を除去しな
がら金属が殆ど含有されていない６０メッシュ（２５０
μｍ）通過粉体を得る。Subsequently, the printed wiring board and the metal-clad phenol resin laminate are classified by a classifier such as a sieve or a wind sieve, and the difference in particle size or specific gravity between the metal such as copper and the phenol resin is utilized. 60 mesh (250 mesh containing almost no metal while removing metals such as copper)
μm) A passing powder is obtained.
【００２１】このフェノール樹脂のプリプレグの３０メ
ッシュ（５９０μｍ）通過粉体が主要成分の全量に対し
て１０重量％以上になるように、上記フェノール樹脂の
プリプレグの３０メッシュ（５９０μｍ）通過粉体とプ
リント配線板及び金属張りフェノール樹脂積層板の６０
メッシュ（２５０μｍ）通過粉体とをリボンブレンダー
等の混合機等により混合してフェノール樹脂成形材料を
得る。The above-mentioned phenol resin prepreg 30 mesh (590 μm) passing powder is printed so that the content of the phenol resin prepreg 30 mesh (590 μm) passing powder is 10% by weight or more based on the total amount of the main components. 60 of wiring board and metal-clad phenolic resin laminated board
The powder passing through the mesh (250 μm) is mixed with a mixer such as a ribbon blender to obtain a phenol resin molding material.
【００２２】ここでフェノール樹脂成形材料の粉体の粒
度として好ましくは、１００メッシュ（１４９μｍ）以
下がよい。The particle size of the powder of the phenol resin molding material is preferably 100 mesh (149 μm) or less.
【００２３】また、取扱い性をよくするために、上記フ
ェノール樹脂成形材料の粉体を造粒機により造粒し、粒
状のフェノール樹脂成形材料にしてもよい。Further, in order to improve the handling property, the powder of the above-mentioned phenol resin molding material may be granulated by a granulator to obtain a granular phenol resin molding material.
【００２４】すなわち本発明により、プリント配線板及
び銅張りフェノール樹脂積層板等の金属張りフェノール
樹脂積層板の廃材並びにその製造工程から発生するフェ
ノール樹脂のプリプレグ等の端材等の廃材を使用したフ
ェノール樹脂成形材料を得ることができる。That is, according to the present invention, phenol using waste materials such as printed wiring boards and metal-clad phenol resin laminates such as copper-clad phenol resin laminates and scraps such as prepregs of phenol resin generated from the manufacturing process thereof A resin molding material can be obtained.
【００２５】[0025]
【実施例】以下、本発明を実施例によって詳述する。EXAMPLES The present invention will be described in detail below with reference to examples.
【００２６】実施例１〜実施例３、比較例１及び比較例
２の配合成分の内訳は、表１に示した配合量を用いた。For the breakdown of the compounding ingredients of Examples 1 to 3, Comparative Example 1 and Comparative Example 2, the compounding amounts shown in Table 1 were used.
【００２７】ここでフェノール樹脂のプリプレグの３０
メッシュ（５９０μｍ）通過粉体を粉体Ａ、プリント配
線板及び銅張りフェノール樹脂積層板の６０メッシュ
（２５０μｍ）通過粉体を粉体Ｂと記した。Here, 30 of the prepreg of the phenol resin is used.
The powder passing through the mesh (590 μm) is referred to as powder A, and the powder passing through the 60 mesh (250 μm) of the printed wiring board and the copper-clad phenolic resin laminate is referred to as powder B.
【００２８】フェノール樹脂成形材料としての良否の判
断は、ＪＩＳ Ｋ ６９１５の一般用（ＧＧ）及び耐衝
撃用（ＭＥ）の曲げ強さ及びシャルピー衝撃強さの規格
を基準とした。すなわち、曲げ強さが６ｋｇｆ／ｍｍ2
以上及びシャルピー衝撃強さが３ｋｇｆ・ｃｍ／ｃｍ2
以上になるフェノール樹脂成形材料を合格とした。The quality of the phenol resin molding material was judged based on the JIS K 6915 general (GG) and impact resistant (ME) standards of bending strength and Charpy impact strength. That is, the bending strength is 6 kgf / mm 2
Above and Charpy impact strength is 3kgf · cm / cm 2
The above-mentioned phenol resin molding material was accepted.
【００２９】[0029]
【表１】 [Table 1]
【００３０】（実施例１）フェノール樹脂のプリプレ
グ、プリント配線板及び銅張りフェノール樹脂積層板を
まず、カッターミルで粒径５〜１０ｍｍ程度に粗砕し
た。Example 1 A prepreg of a phenol resin, a printed wiring board and a copper-clad phenol resin laminated board were first crushed with a cutter mill to a particle size of about 5 to 10 mm.
【００３１】次にフェノール樹脂のプリプレグを振動ミ
ルで３０メッシュ（５９０μｍ）以下に粉砕して粉体Ａ
を得た。Next, the prepreg of the phenol resin was pulverized by a vibration mill to 30 mesh (590 μm) or less and powder A was obtained.
Got
【００３２】次に振動ミルでプリント配線板及び銅張り
フェノール樹脂積層板を、６０メッシュ（２５０μｍ）
以下に粉砕し、篩機により分級し、銅とフェノール樹脂
との粒度差を利用して、銅を除去しながら銅が殆ど含有
されていない６０メッシュ（２５０μｍ）通過粉体Ｂを
得た。Next, the printed wiring board and the copper-clad phenolic resin laminated board were made into 60 mesh (250 μm) with a vibration mill.
The powder was pulverized and classified by a sieving machine to obtain a 60-mesh (250 μm) passing powder B containing almost no copper while removing copper by utilizing the particle size difference between copper and phenol resin.
【００３３】この粉体Ｂの銅の含有率は、３重量％であ
った。この粉体Ａを１０重量部と、粉体Ｂを９０重量部
とをリボンブレンダーにより混合して１００重量部のフ
ェノール樹脂成形材料を得た。The content of copper in this powder B was 3% by weight. 10 parts by weight of this powder A and 90 parts by weight of powder B were mixed with a ribbon blender to obtain 100 parts by weight of a phenol resin molding material.
【００３４】このフェノール樹脂成形材料を使用してＪ
ＩＳ Ｋ ６９１１に規定されたテストピースを成形
し、曲げ強さ及びシャルピー衝撃強さの評価結果を表１
の評価欄に示した。Using this phenol resin molding material, J
The test piece specified in IS K 6911 was molded, and the evaluation results of bending strength and Charpy impact strength are shown in Table 1.
Is shown in the evaluation column.
【００３５】（実施例２）実施例１において、粉体Ａを
３０重量部と、粉体Ｂを７０重量部とをリボンブレンダ
ーにより混合して１００重量部のフェノール樹脂成形材
料を得た。(Example 2) In Example 1, 30 parts by weight of powder A and 70 parts by weight of powder B were mixed by a ribbon blender to obtain 100 parts by weight of a phenol resin molding material.
【００３６】（実施例３）実施例１において、粉体Ａを
７０重量部と、粉体Ｂを３０重量部とをリボンブレンダ
ーにより混合して１００重量部のフェノール樹脂成形材
料を得た。(Example 3) In Example 1, 70 parts by weight of powder A and 30 parts by weight of powder B were mixed by a ribbon blender to obtain 100 parts by weight of a phenol resin molding material.
【００３７】（比較例１）実施例１において、粉体Ｂの
みのフェノール樹脂成形材料を得た。Comparative Example 1 In Example 1, a phenol resin molding material containing only powder B was obtained.
【００３８】（比較例２）実施例１において、粉体Ａを
５重量部と、粉体Ｂを９５重量部とをリボンブレンダー
により混合して１００重量部のフェノール樹脂成形材料
を得た。(Comparative Example 2) In Example 1, 5 parts by weight of powder A and 95 parts by weight of powder B were mixed by a ribbon blender to obtain 100 parts by weight of a phenol resin molding material.
【００３９】表１において記載した数値は、全てＪＩＳ
Ｋ ６９１１に基づいて測定した。All the values shown in Table 1 are JIS
It was measured based on K 6911.
【００４０】表１の結果、実施例１〜実施例３のように
本発明によると、成形品の代表的な機械的強度として曲
げ強さ及びシャルピー衝撃強さで評価した結果は、それ
ぞれＪＩＳ Ｋ ６９１５の一般用（ＧＧ）及び耐衝撃
用（ＭＥ）の規格の最低値の６ｋｇｆ／ｍｍ2 及び３ｋ
ｇｆ・ｃｍ／ｃｍ2 をいずれも上回っているのでフェノ
ール樹脂成形材料として使用できる。As shown in Table 1, according to the present invention as in Examples 1 to 3, the evaluation results of bending strength and Charpy impact strength as typical mechanical strengths of molded products are JIS K, respectively. 6915 general-purpose (GG) and impact-resistant (ME) standard minimum values of 6 kgf / mm 2 and 3 k
Since it exceeds gf · cm / cm 2 , it can be used as a phenol resin molding material.
【００４１】これに対して、比較例１及び比較例２で
は、曲げ強さ及びシャルピー衝撃強さの評価結果は、そ
れぞれＪＩＳ規格の最低値の６ｋｇｆ／ｍｍ2 及び３ｋ
ｇｆ・ｃｍ／ｃｍ2 をいずれも下回っているのでフェノ
ール樹脂成形材料として実用の域に達していない。On the other hand, in Comparative Example 1 and Comparative Example 2, the bending strength and the Charpy impact strength are evaluated by the JIS standard minimum values of 6 kgf / mm 2 and 3 k, respectively.
Since both are below gf · cm / cm 2 , they have not reached the practical range as a phenol resin molding material.
【００４２】[0042]
【発明の効果】本発明のフェノール樹脂成形材料による
と、プリント配線板及び銅張りフェノール樹脂積層板等
の金属張りフェノール樹脂積層板の廃材並びにその製造
工程から発生するフェノール樹脂のプリプレグ等の端材
等の廃材を使用したフェノール樹脂成形材料を得ること
ができる。According to the phenolic resin molding material of the present invention, waste materials of metal-clad phenolic resin laminates such as printed wiring boards and copper-clad phenolic resin laminates, and scrap materials such as prepreg of phenolic resin generated from the manufacturing process thereof. It is possible to obtain a phenol resin molding material using a waste material such as.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 // Ｂ２９Ｃ 70/58 Ｂ２９Ｋ 61:04 105:06 105:26 Ｃ０８Ｌ 61:00 (72)発明者 広畑 健 大阪府東大阪市高井田中１丁目38大阪府立 産業技術総合研究所内 (72)発明者 斉藤 正 大阪府門真市大字門真1048番地松下電工株 式会社内─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 6 Identification number Office reference number FI technical display location // B29C 70/58 B29K 61:04 105: 06 105: 26 C08L 61:00 (72) Inventor Ken Hirohata 1-38 Takaidanaka, Higashi-Osaka City, Osaka Prefecture, Osaka National Institute of Advanced Industrial Science and Technology (72) Inventor Tadashi Saito, 1048, Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Works Co., Ltd.
Claims (2)
硬化した半硬化物の粉砕物とパルプ紙に含浸したフェノ
ール樹脂が硬化した硬化物の粉砕物とを含有し、これら
主成分の全量に対して、上記半硬化物の粉砕物を少なく
とも１０重量％以上含有することを特徴とするフェノー
ル樹脂成形材料。1. A crushed product of a semi-cured phenol resin impregnated into pulp paper and a crushed product of a cured phenol resin impregnated into pulp paper are contained. And a crushed product of the above semi-cured product is contained in an amount of at least 10% by weight or more.
下の粉体であって、かつ硬化物の粉砕物が６０メッシュ
以下の粉体であることを特徴とする請求項１記載のフェ
ノール樹脂成形材料。2. The phenol resin according to claim 1, wherein the pulverized product of the semi-cured product is a powder of 30 mesh or less, and the pulverized product of the cured product is a powder of 60 mesh or less. Molding material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29501293A JP3474239B2 (en) | 1993-11-25 | 1993-11-25 | Phenolic resin molding materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29501293A JP3474239B2 (en) | 1993-11-25 | 1993-11-25 | Phenolic resin molding materials |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07144324A true JPH07144324A (en) | 1995-06-06 |
| JP3474239B2 JP3474239B2 (en) | 2003-12-08 |
Family
ID=17815197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29501293A Expired - Lifetime JP3474239B2 (en) | 1993-11-25 | 1993-11-25 | Phenolic resin molding materials |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3474239B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0940239A1 (en) * | 1998-03-06 | 1999-09-08 | Matsushita Electric Industrial Co., Ltd. | Recycling of cured phenolic resin and a product such as a vacuum thermal insulator obtained thereby |
| JPH11320558A (en) * | 1998-03-18 | 1999-11-24 | Idemitsu Petrochem Co Ltd | Method for crushing thermosetting resin |
| KR100389966B1 (en) * | 2000-09-07 | 2003-07-02 | 동화기업 주식회사 | Methods of a Particleboard by the wasted low pressure Melamin and the Phenol laminate and Particleboard by the wasted scrap in short-cycle pressing of laminate |
| JP2006192702A (en) * | 2005-01-13 | 2006-07-27 | Asahi Kasei Construction Materials Co Ltd | Separation method of flexible face material of resin foam with flexible face material and resin foam |
| JP2016113595A (en) * | 2014-12-18 | 2016-06-23 | 株式会社デンソー | Composite material, formed body, and production method therefor |
-
1993
- 1993-11-25 JP JP29501293A patent/JP3474239B2/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0940239A1 (en) * | 1998-03-06 | 1999-09-08 | Matsushita Electric Industrial Co., Ltd. | Recycling of cured phenolic resin and a product such as a vacuum thermal insulator obtained thereby |
| JPH11320558A (en) * | 1998-03-18 | 1999-11-24 | Idemitsu Petrochem Co Ltd | Method for crushing thermosetting resin |
| KR100389966B1 (en) * | 2000-09-07 | 2003-07-02 | 동화기업 주식회사 | Methods of a Particleboard by the wasted low pressure Melamin and the Phenol laminate and Particleboard by the wasted scrap in short-cycle pressing of laminate |
| JP2006192702A (en) * | 2005-01-13 | 2006-07-27 | Asahi Kasei Construction Materials Co Ltd | Separation method of flexible face material of resin foam with flexible face material and resin foam |
| JP4545597B2 (en) * | 2005-01-13 | 2010-09-15 | 旭化成建材株式会社 | Separating method of flexible foam of resin foam with flexible face material and resin foam |
| JP2016113595A (en) * | 2014-12-18 | 2016-06-23 | 株式会社デンソー | Composite material, formed body, and production method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3474239B2 (en) | 2003-12-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Marques et al. | A review of the recycling of non-metallic fractions of printed circuit boards | |
| CN100467531C (en) | Method for preparing bakelite by using nonmetal material in waste printing circuit board | |
| Wang et al. | PVC-based composite material containing recycled non-metallic printed circuit board (PCB) powders | |
| Kasper et al. | Characterization and recovery of polymers from mobile phone scrap | |
| CN102152373B (en) | Zero-carbon high-fiber environment-friendly sheet synthesized by waste circuit board powder and production process thereof | |
| Peng et al. | A physical process for recycling and reusing waste printed circuit boards | |
| CN102189689A (en) | Preparation method for municipal manhole cover through fragmenting and sorting waste circuit boards | |
| CN101696315A (en) | Nonmetal powder filled phenolic resin composite material and preparation method thereof | |
| JP3474239B2 (en) | Phenolic resin molding materials | |
| Yokoyama et al. | Recycling system for printed wiring boards with mounted parts | |
| Kanchanapiya et al. | Recycling of non-metallic powder from printed circuit board waste as a filler material in a fiber reinforced polymer | |
| JPH06166032A (en) | Production of frp molding material reclaimed from frp waste | |
| JPH0760227A (en) | Recovery of valuables from printed circuit board | |
| CA3173401A1 (en) | Electronic waste composite article or material and process for making same | |
| JP2006233141A (en) | Phenolic resin molding material | |
| EP3838538A1 (en) | Method of recycling carbon fiber prepreg | |
| CN102294345A (en) | Method for processing discarded PCBs (printed circuit boards) into composite municipal products | |
| JP2003154283A (en) | Method of pulverizing prepreg end material | |
| JP2003064423A (en) | Combustion improving agent containing raw metal, and manufacturing method thereof | |
| JP2000226902A (en) | Board for construction material | |
| KR20230108486A (en) | Apparatus and method for recycling waste PCB | |
| Sohaili et al. | Effect of particle size and amount of nonmetallic PCB materials on the mechanical properties of rHDPE/PCB composites | |
| JP2005081794A (en) | Recycled fiber reinforced plastic molding | |
| JPH06296957A (en) | Method for recycling printed circuit board wastes | |
| JP2006007138A (en) | Method for manufacturing molded article |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080919 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080919 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090919 Year of fee payment: 6 |
|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090919 Year of fee payment: 6 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090919 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100919 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110919 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110919 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120919 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120919 Year of fee payment: 9 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313115 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120919 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130919 Year of fee payment: 10 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |