CN100467531C - Method for preparing bakelite by using nonmetal material in waste printing circuit board - Google Patents
Method for preparing bakelite by using nonmetal material in waste printing circuit board Download PDFInfo
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- CN100467531C CN100467531C CNB2007100386079A CN200710038607A CN100467531C CN 100467531 C CN100467531 C CN 100467531C CN B2007100386079 A CNB2007100386079 A CN B2007100386079A CN 200710038607 A CN200710038607 A CN 200710038607A CN 100467531 C CN100467531 C CN 100467531C
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Abstract
The invention discloses a method for preparing bakelite, which uses nonmetallic material of waste printed circuit board as raw material to replace wood powder. The method includes steps: mixing 100 quotient of phenolic resin, 25-75 quotient of waster circuit board nonmetallic material particles, 25-55 quotient of wood powder, 15-20 quotient of curing agent, 10-30 quotient of inorganic filler and 2-6 quotient of lubricant under temperature of 90-110 DEG C, cooling, granulating and obtaining the product. The invention can solve problems of treatment and pollution of waste circuit board nonmetallic material, and can reduce production cost of bakelite.
Description
Technical field
The present invention relates to a kind of method of utilizing non-metallic material in the discarded printed circuit boards to prepare phenolaldehyde moulding compound, recycle nonmetal materials of discarded printed circuit boards instead of part wood powder, prepare phenolaldehyde moulding compound cheaply.Belong to trade waste processing, resource utilization field in the environmental protection technical field.
Background technology
Discarded printed circuit boards (PCB) is a kind of of electronic waste, wherein contains tens kinds of metals that recovery value is higher such as copper, gold and silver, palladium, as the metal content in the waste mobile phone circuit card is: golden 280g/t, silver-colored 2kg/t, copper 1000g/t, palladium 100g/t.The value of metal is the main economic motivating force that waste printed circuit board reclaims industry, and the emphasis of investigator's research also mainly concentrates in the recovery of rare precious metal and valuable metal in the discarded printed circuit boards, and ignores nonmetallic recovery and reuse problem.
At present, the metal in the method separation printed circuit board (PCB) of many employing fragmentations and nonmetal, the main metal that reclaims wherein, and the non-metallic material in the discarded printed circuit boards are lost as rubbish.Non-metallic material in the printed circuit board (PCB) mainly are the mixtures of forming with glass fibre, epoxies and phenolic resinoid.Wherein epoxies and phenolic resinoid are thermosetting resin, are difficult to fusing and dissolving; The glass fibre calorific value is lower, can't use the method for burning to handle.Landfill is the extensive at present main method of handling waste and old printed circuit board, loses but it is used as rubbish, can cause a large amount of wastings of resources and environmental pollution.Document " pyrolysis of printed wiring board waste and product analysis thereof " (Sun Lushi, Lu Jidong etc., " chemistry of fuel journal " the 3rd phase in 2002) and document " the pyrolysis experimental study of substrate for printed circuit board " (Peng Ke etc., " Techniques and Equipment for Environmental Pollution Control " 2004 the 5th phases) introduced with method for pyrolysis and handled waste and old printed circuit board.This method mainly is to make the polymer among the PCB have material to be cracked into small molecules alkane, can do fuel and industrial chemicals use after rationally reclaiming; Simultaneously inorganics such as glass fibre scarcely changes among the PCB, still exists with the solid waste form.Owing in PCB, contain a spot of macromolecule organic material, and in pyrolytic process, produce a lot of obnoxious flavoures (can generate many bromos dibenzo dioxan and PBDF) as polybromodiphenyl ether.Therefore, this method exists cost height, complex process, causes problems such as secondary environmental pollution, is not the optimal method of handling non-metallic material in the discarded printed circuit boards.
Phenolaldehyde moulding compound is the synthetic materials that is developed and applied the earliest on the human history, and it has the characteristics of inexpensive, good insulating, good heat resistance, is widely used in fields such as domestic cookers, electronic apparatus and automobile making.Wood powder is one of main raw material(s) of producing phenolaldehyde moulding compound, and along with the continuous increase of domestic and international phenolaldehyde moulding compound output, the demand of wood powder is also increasing.In recent years, environmental consciousness day by day strengthened, timber resources exhaustion and price increase day by day, and the equivalent material of seeking wood powder is protected timber resources and reduced production costs becomes the task of top priority of many phenolaldehyde moulding compounds manufacturer.
Summary of the invention
The objective of the invention is at the deficiencies in the prior art, a kind of method of utilizing non-metallic material in the discarded printed circuit boards to prepare phenolaldehyde moulding compound is provided, solve the problem of environmental pollution of circuit board non-metal material, can obtain low cost, high-quality environment-friendly type synthetic materials simultaneously again.
For achieving the above object; the present invention is from regeneration and these two angles of environment protection of resource; with waste circuit board nonmetallic material as starting material; the instead of part wood powder is used for the production of phenolaldehyde moulding compound; with waste circuit board nonmetallic material particle and resol, wood powder, solidifying agent, mineral filler and and mix lubricant even; mixing to suitable degree after the cooling, granulation, promptly obtain the environment-friendly type phenolaldehyde moulding compound.
Method of the present invention is specific as follows:
By weight, feed composition is: 100 parts in resol, waste circuit board nonmetallic material particle 25-75 part, wood powder 25-55 part, solidifying agent 12-20 part, mineral filler 10-30 part, lubricant 2-6 part;
Earlier be 10% waste circuit board nonmetallic material particle and solidifying agent premix of curing dose, again all raw materials mixed consumption, 90-110 ℃ mixing 3-5 minutes down, cooling then, granulation promptly obtains composite phenol formaldehyde mould plastic.
Wherein, resol is acid catalysis solid phenolic resin or modified phenolic resins.
The particle size of waste circuit board nonmetallic material is 80 order all-pass mistakes.
The wood powder fineness is 80 order all-pass mistakes, and moisture content is less than 8%.
Mineral filler is one or more in lime carbonate, talcum powder, mica powder, magnesium oxide, calcium hydroxide, hydrated aluminium silicate, the aluminium hydroxide.
Solidifying agent is one or more in hexamethylenetetramine, Paraformaldehyde 96, the Resins, epoxy.
Lubricant is one or more in stearic acid, Zinic stearas, calcium stearate, stearic amide, stearic acid butyl ester, ethylene bis stearic acid amide, the methylene bis stearic amide.
Advantage of the present invention: (1) makes the non-metallic material in the waste printed circuit board obtain recycling, and has reduced the secondary environmental pollution that its landfill or burning disposal cause; (2) as the filler of phenolaldehyde moulding compound, the instead of part wood powder has been protected the forest reserves, has reduced production cost; (3) this method technology is simple, and the product conformance with standard helps realizing industrial applications.
Embodiment
Below by specific embodiment technical scheme of the present invention is further described.The raw material that following examples adopted does not constitute the qualification to technical solution of the present invention.
Embodiment 1
Feed composition is by weight: 100 parts in resol, 25 parts of waste circuit board nonmetallic material particles, 55 parts of wood powders, 15 parts of hexamethylenetetramines, 30 parts of talcum powder, 6 parts of stearic acid.
The waste circuit board nonmetallic material particle and the hexamethylenetetramine that with consumption are hexamethylenetetramine consumption 10% earlier carry out premix, again the raw material behind the premix and other all raw materials are mixed, descended mixing 4 minutes at 100 ℃, then cooling, granulation promptly obtains composite phenol formaldehyde mould plastic.
After tested, the relative density of gained composite phenol formaldehyde mould plastic is 1.42, and flexural strength is 75MPa, and notched Izod impact strength is 2.2KJ/m
2, heat-drawn wire is 159 ℃, dielectric strength is 3.0MV/m.
In the above testing data, relative density records according to the A method of stipulating among the GB1033-86;
Flexural strength records according to GB/T 9341;
Notched Izod impact strength is according to GB/T 1034, and breach is pressed among the GB1404 5.7 regulation;
Heat-drawn wire is according to GB/T 1634, and pressure is to record under the 1.80MPa;
Dielectric strength records according to GB/T 1408.
This shows that the phenolaldehyde moulding compound of present embodiment gained satisfies universal moulding compound performance requriements fully.
Embodiment 2
Feed composition is by weight: 100 parts in resol, 45 parts of waste circuit board nonmetallic material particles, 45 parts of wood powders, 16 parts of hexamethylenetetramines, 15 parts in lime carbonate, 4 parts of Zinic stearass.
The waste circuit board nonmetallic material particle and the hexamethylenetetramine that with consumption are hexamethylenetetramine consumption 10% earlier carry out premix, again the raw material behind the premix and other all raw materials are mixed, descended mixing 5 minutes at 90 ℃, then cooling, granulation promptly obtains composite phenol formaldehyde mould plastic.
After tested, the relative density of gained composite phenol formaldehyde mould plastic is 1.40, and flexural strength is 81MPa, and notched Izod impact strength is 2.2KJ/m
2, heat-drawn wire is 176 ℃, dielectric strength is 2.9MV/m.
Testing method is with embodiment 1.The phenolaldehyde moulding compound of present embodiment gained satisfies universal moulding compound performance requriements fully.
Embodiment 3
Feed composition is by weight: 100 parts in resol, 75 parts of waste circuit board nonmetallic material particles, 25 parts of wood powders, 20 parts of hexamethylenetetramines, 10 parts of talcum powder, 2 parts of Zinic stearass.
The waste circuit board nonmetallic material particle and the hexamethylenetetramine that with consumption are hexamethylenetetramine consumption 10% earlier carry out premix, again the raw material behind the premix and other all raw materials are mixed, descended mixing 3 minutes at 110 ℃, cooling, granulation promptly obtain composite phenol formaldehyde mould plastic then.
After tested, the relative density of gained composite phenol formaldehyde mould plastic is 1.40, and flexural strength is 77MPa, and notched Izod impact strength is 2.2KJ/m
2, heat-drawn wire is 176 ℃, dielectric strength is 3.8MV/m.
Testing method is with embodiment 1.The phenolaldehyde moulding compound of present embodiment gained satisfies universal moulding compound performance requriements fully.
Claims (5)
1, a kind of method of utilizing non-metallic material in the discarded printed circuit boards to prepare phenolaldehyde moulding compound, it is characterized in that feed composition is by weight: 100 parts in resol, waste circuit board nonmetallic material particle 25-75 part, wood powder 25-55 part, solidifying agent 12-20 part, mineral filler 10-30 part, lubricant 2-6 part; Earlier be 10% waste circuit board nonmetallic material particle and solidifying agent premix of curing dose, again all raw materials mixed consumption, 90-110 ℃ mixing 3-5 minutes down, cooling, granulation promptly obtain composite phenol formaldehyde mould plastic then; Wherein, described solidifying agent is one or more in hexamethylenetetramine, Paraformaldehyde 96, the Resins, epoxy; Described lubricant is one or more in stearic acid, Zinic stearas, calcium stearate, stearic amide, stearic acid butyl ester, ethylene bis stearic acid amide, the methylene bis stearic amide.
2, the non-metallic material in the discarded printed circuit boards utilized according to claim 1 prepare the method for phenolaldehyde moulding compound, it is characterized in that described resol is acid catalysis solid phenolic resin or modified phenolic resins.
3, the non-metallic material in the discarded printed circuit boards utilized according to claim 1 prepare the method for phenolaldehyde moulding compound, and the particle size that it is characterized in that described waste circuit board nonmetallic material is 80 order all-pass mistakes.
4, the non-metallic material in the discarded printed circuit boards utilized according to claim 1 prepare the method for phenolaldehyde moulding compound, it is characterized in that described wood powder fineness is 80 order all-pass mistakes, and moisture content is less than 8%.
5, the non-metallic material in the discarded printed circuit boards utilized according to claim 1 prepare the method for phenolaldehyde moulding compound, it is characterized in that described mineral filler is one or more in lime carbonate, talcum powder, mica powder, magnesium oxide, calcium hydroxide, hydrated aluminium silicate, the aluminium hydroxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100386079A CN100467531C (en) | 2007-03-29 | 2007-03-29 | Method for preparing bakelite by using nonmetal material in waste printing circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100386079A CN100467531C (en) | 2007-03-29 | 2007-03-29 | Method for preparing bakelite by using nonmetal material in waste printing circuit board |
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| Publication Number | Publication Date |
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| CN101037527A CN101037527A (en) | 2007-09-19 |
| CN100467531C true CN100467531C (en) | 2009-03-11 |
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| CNB2007100386079A Expired - Fee Related CN100467531C (en) | 2007-03-29 | 2007-03-29 | Method for preparing bakelite by using nonmetal material in waste printing circuit board |
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Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100547025C (en) * | 2007-09-24 | 2009-10-07 | 四川长虹电器股份有限公司 | The recoverying and utilizing method of polypropylene composite material and discarded printed circuit boards |
| CN101705006B (en) * | 2009-11-12 | 2011-07-06 | 严志龙 | Glass plastic product with composite material resin circular fiber power |
| CN102152373B (en) * | 2010-12-30 | 2012-07-04 | 肖超锋 | Zero-carbon high-fiber environment-friendly sheet synthesized by waste circuit board powder and production process thereof |
| RU2544707C2 (en) * | 2010-12-30 | 2015-03-20 | Фошань Веп Инвайренментал Протекшн Текнолоджи Ко., Лтд | Board made of powder from reject printed-circuit boards, method of making same |
| US20140113154A1 (en) * | 2011-06-16 | 2014-04-24 | Guangdong Wep Energy-Saving Technology Co., Ltd. | Formaldehyde-free zero-carbon-emission environment-friendly plate made from circuit board powder and manufacturing process thereof |
| CN102675717B (en) * | 2012-05-24 | 2014-03-26 | 江苏嘉铂新材料有限公司 | Modified nonmetallic reclaimed material of printed circuit board and preparation method thereof |
| CN103130983B (en) * | 2013-01-25 | 2015-05-13 | 北京交通大学 | Environment-friendly plate material compounded by organic silicon modified epoxy resin and waste circuit board non-metallic powder |
| CN103113648B (en) * | 2013-01-25 | 2015-05-13 | 北京交通大学 | Method for manufacturing environment-friendly board by using waste PCB (Printed Circuit Board) |
| CN103834100A (en) * | 2013-12-05 | 2014-06-04 | 江苏理工学院 | Reinforced resin-plastic compound plate prepared from waste printed circuit board (PCB) powder and preparation method thereof |
| CN103756345A (en) * | 2014-01-16 | 2014-04-30 | 上海绿澄环保科技有限公司 | Method for manufacturing plastic wood |
| CN104045966A (en) * | 2014-06-10 | 2014-09-17 | 常熟东南塑料有限公司 | Phenolic molding plastic for electric baking pan housing and preparation method of phenolic molding plastic |
| CN104045967A (en) * | 2014-06-10 | 2014-09-17 | 常熟东南塑料有限公司 | Phenolic molding plastic for gas meter rotor and preparation method of phenolic molding plastic |
| CN104403338A (en) * | 2014-11-03 | 2015-03-11 | 中南林业科技大学 | Uniform mixing method of wood powder and inorganic reinforced particles |
| CN106750060B (en) * | 2016-12-15 | 2019-03-29 | 西南林业大学 | A kind of biomass accelerates phenolic resin cured and preparation method thereof |
| CN109338106A (en) * | 2018-10-23 | 2019-02-15 | 东莞理工学院 | A kind of waste printed circuit board resource utilization reuse method |
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Granted publication date: 20090311 Termination date: 20140329 |