CN101722175A - Method for producing thermoplastic plastics by recycling nonmetal materials of discarded printed circuit boards and related thermoplastic plastics - Google Patents
Method for producing thermoplastic plastics by recycling nonmetal materials of discarded printed circuit boards and related thermoplastic plastics Download PDFInfo
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- CN101722175A CN101722175A CN200910198603A CN200910198603A CN101722175A CN 101722175 A CN101722175 A CN 101722175A CN 200910198603 A CN200910198603 A CN 200910198603A CN 200910198603 A CN200910198603 A CN 200910198603A CN 101722175 A CN101722175 A CN 101722175A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Abstract
The invention relates to a method for producing thermoplastic plastics by recycling nonmetal materials of discarded printed circuit boards. The method comprises the following steps: (a) crushing nonmetal materials of discarded printed circuit boards into discarded printed circuit board nonmetal particles; (b) modifying the surface of the discarded printed circuit board nonmetal particles; (c) mixing processing aid used in production of polyolefin plastics and thermoplastic plastics; (d) extruding and pelleting into thermoplastic plastics, selecting with the size of the discarded printed circuit board nonmetal particles being 40-80 mesh and dosage being 0.3-1 time of polyolefin plastics, and modifying by using silicane or aluminate coupling agent. The invention also provides related thermoplastic plastics. The invention is artful in design, the thermoplastic plastics produced by recycling nonmetal materials of discarded printed circuit boards has good comprehensive performances and low production cost, and can be recycled for reuse, thus efficiently saving resources, reducing cost, mitigating environment pollution, and being suitable for large scale popularization.
Description
Technical field
The present invention relates to the regenerative use technology field, particularly nonmetal materials of discarded printed circuit boards regenerative use technology field is meant that specifically a kind of nonmetal materials of discarded printed circuit boards regeneration produces the method and the related thermoplastic plastics of thermoplastic.
Background technology
Annual about about 40,000 tons of discarded printed circuit boards, and increase year by year, be that electron wastes is the most complicated unmanageable.Can reclaim metals such as noble metal and copper during now waste printed circuit board reclaims and separate, these metals account for circuit board total content 40%, remaining separator is a non-metal powder.These non-metal powder sources are the substrate of circuit board.The baseplate material of circuit board is that heated lamination forms behind cloth, paper or glass cloth epoxy resin-impregnated or the phenolic resins, and wherein the circuit board of computer, mobile phone, television set etc. is that the main material heat lamination forms with the insulating paper impregnated phenolic resin all.
Plastics are a kind of macromolecule chemical materials, and the difference of character with heating can be divided into two kinds of thermoplastic and thermosetting plasticses.Deliquescing during the thermoplastic heating, even become the thick substances that certain flowability is arranged, have plasticity this moment, the plastic goods of making definite shape, cooling after-hardening typing.If heating again, it is deliquescing again, can be processed into another kind of shape again, typing again after the cooling.But this process repeated multiple times.Polyvinyl chloride, polyolefin, polystyrene etc. all are thermoplastics.Thermosetting plastics is adding man-hour, originally also can deliquescing, and have certain plasticity, can be made into the product of definite shape, but after continuing heating or adding curing agent, then because of following the generation hardening (curing) of chemical reaction, fixed in shape is got off, no longer change (i.e. typing).Plastics quality after the solidifying and setting is hard and be insoluble in the solvent, can not soften and have plasticity as heating again, and temperature is too high will decompose.Phenolic resins, epoxy resin, Lauxite etc. all are thermosetting plasticses.
Thermosetting plastics recycling just becomes a global problem, and existing technology in various countries and technology are with one-shot forming and once use and be feature, and in academia, thermosetting plastics can't be moulded again and also become final conclusion already.According to estimates, the thermosetting plastics that scrap global every year has more than 1,000,000 tons, and the thermosetting plastics that the overwhelming majority scraps has all advanced landfill yard.
Therefore, need provide a kind of nonmetal materials of discarded printed circuit boards regeneration method, thereby effectively economize on resources, reduce cost, reduce pollution environment.
Summary of the invention
The objective of the invention is to have overcome above-mentioned shortcoming of the prior art, provide a kind of nonmetal materials of discarded printed circuit boards regeneration to produce the method and the related thermoplastic plastics of thermoplastic, this method is skillfully constructed, the regeneration nonmetal materials of discarded printed circuit boards is produced thermoplastic, thermoplastic good combination property, the production cost produced are low, and recycling once more, thereby effectively economize on resources, reduce cost, reduce pollution, be suitable for large-scale promotion application environment.
To achieve these goals,, provide a kind of nonmetal materials of discarded printed circuit boards regeneration to produce the method for thermoplastic, be characterized in, may further comprise the steps in a first aspect of the present invention:
(a) pulverize nonmetal materials of discarded printed circuit boards and become the discarded printed circuit boards non-metallic particle;
(b) surface of described discarded printed circuit boards non-metallic particle is handled in modification;
(c) mixed with polyolefin plastics and thermoplastic production then with processing aid;
(d) extruding pelletization is processed into described thermoplastic.
Preferably, in step (a), the size of described discarded printed circuit boards non-metallic particle is 40～80 orders.
Preferably, in step (a), adopt flour mill to pulverize described nonmetal materials of discarded printed circuit boards.
Preferably, in step (b), adopt silane coupler or or the aluminate coupling agent modification surface of handling described discarded printed circuit boards non-metallic particle.
Preferably, in step (c), described polyolefin plastics is polypropylene or ethylene-propylene copolymer.
Preferably, in step (c), described thermoplastic production comprises one or more of lubricant, antioxidant, flexibilizer with processing aid.
More preferably, described lubricant is a Ployethylene Wax; Described antioxidant is phenolic antioxidant or sulfur type antioxidant; Described flexibilizer is ethylene-methyl acrylate copolymer (EMA) or propylene-octene copolymer (MOPE).
Further, described phenolic antioxidant is four [β-(3.5-2 tert-butyl-hydroxy phenyl) propionic acid] pentaerythritol ester (1010); Described sulfur type antioxidant is dilauryl thiodipropionate (DLTP).
Preferably, in step (c), the consumption of described discarded printed circuit boards non-metallic particle is 0.3～1 times of described polyolefin plastics consumption.
Preferably, in step (d), adopt the processing of parallel double-screw extruder extruding pelletization.
In a second aspect of the present invention, a kind of thermoplastic is provided, be characterized in that the method manufacturing of being produced thermoplastic by above-mentioned nonmetal materials of discarded printed circuit boards regeneration forms.
In a third aspect of the present invention, a kind of thermoplastic also is provided, has comprised polyolefin, be characterized in, described thermoplastic also comprises the discarded printed circuit boards non-metallic particle of surface modification, and described discarded printed circuit boards non-metallic particle is island and is coated in the described polyolefinic continuous phase.
Preferably, combine securely by chemical bonding force between described printed circuit board (PCB) non-metallic particle and the described polyolefin.
Preferably, the size of described discarded printed circuit boards non-metallic particle is 40～80 orders.
Preferably, described polyolefin is polypropylene or ethylene-propylene copolymer.
Preferably, described thermoplastic also comprises thermoplastic production processing aid.
More preferably, described thermoplastic production comprises one or more of lubricant, antioxidant, flexibilizer with processing aid.
Preferably, the consumption of described discarded printed circuit boards non-metallic particle is 0.3～1 times of described polyolefin plastics consumption.
(1) about the fineness of discarded printed circuit boards non-metallic particle
Polyolefin can add packing material when making industrial part and structure member, as talcum powder, Paris white etc., to improve gas dimensional stability, refractoriness etc.Because being the filler particles of island, the architectural feature of this material is coated in the polyolefinic continuous phase, play a part stress as the particle of the filler particles of decentralized photo and concentrate thing, reduced the average tensile strength of main body thing, these stress concentrate thing to make the many weakness of material production.Therefore, the particle size of these fillers has certain influence to the performance of material.Generally speaking, particle is thin more, and mechanical performance of products is superior more.But particle is pulverized carefully more, and the energy that consumes in the crushing process is high more.Preferable grain fineness is 40～80 orders in the practice.
(2) consumption of discarded printed circuit boards non-metallic particle
The consumption of discarded printed circuit boards non-metallic particle is big more, helps reducing product cost more, helps the recycling of discarded object more.But after the consumption of discarded printed circuit boards non-metallic particle was increased to a certain degree, each relevant mechanical performance all began obvious decline.Here, when described polyolefin plastics consumption was 100 weight portions, the consumption of discarded printed circuit boards non-metallic particle was that 30～100 weight portions are preferable.This depends primarily on the purposes of material.
(3) surface treatment of discarded printed circuit boards non-metallic particle
Filler is to the enhancing effect of plastics, depends on the intermolecular interaction force size of they and resin surface.If filling surface is hydrophily, polarity is arranged, and used polymer has the polarity of equal extent, filling surface just soaks into polymer easily so, and both interaction forces are big.But concerning non-polar polyolefin, if filler without surface treatment, then goods are merely the blends of polymer and filler, and mechanical property is reduced on the contrary.In order to strengthen the interaction force between polymer macromolecule and the filler, just to carry out surface treatment to filler earlier.
Here be to adopt silane coupler to handle, make the discarded printed circuit boards non-metallic particle obtain surface modification, certainly adopt other suitable surface modifier.Between filler that disperses and polyolefin continuous phase, form a kind of key bridge, become a kind of composite, thereby improved the effect of filler.
(4) select suitable polyolefin system for use
Polypropylene is a non-polar polymer, has excellent electric insulation, is not subjected to the influence (because of it does not absorb water) of humidity, has the better heat-resisting modification, and the temperature of its goods ability more than 100 ℃ has excellent chemical stability.The copolymer of propylene and other monomer copolymerization preparation can improve resistance to impact, the transparency, the flowability of HOPP resin.Therefore, the present invention adopts multiple polyacrylic blending and modifying material.
(5) processing aid
The selection of A, antioxidant
Because polyolefin such as polypropylene, polyethylene are easy to the oxidation by airborne oxygen institute, in being exposed to air, particularly are subjected to the time spent of doing of photo-thermal, their character just degenerates gradually.Since there is tertiary carbon atom in the polypropylene molecule, easier to be aging.Therefore to processing, storage and the application of the polypropylene plastics particular importance that seems.The compatibility with polymer is mainly considered in the selection of antioxidant, reduces the hot brightness property sent out, and reduces the contaminative to polymer, and has both the character of radical reaction terminator and peroxide decomposer, and is easy to use.The phenolic antioxidant of selecting radical terminator for use is a primary antioxidant, and the sulfur type antioxidant of peroxide decomposer is an auxiliary antioxidant, they and with significantly improving oxidation resistance.
B, selection of lubricants are used
Use a small amount of Ployethylene Wax lubricant to help to reduce frictional force between polymer and forming machine contact-making surface and the polymer molecular chain.
The present invention has following beneficial effect:
1. the present invention is the nonmetallic materials regeneration that discarded printed circuit boards is reclaimed, nonmetallic materials are ground into suitable fineness, after the modification processing is carried out on the surface, with polyolefin, processing aid mixed after, thermoplastic is processed in granulation, is skillfully constructed, and the thermoplastic good combination property of production, production cost are low, thereby effectively economize on resources, reduce cost, reduce pollution, be suitable for large-scale promotion application environment;
2. in the thermoplastic of the present invention, the discarded printed circuit boards non-metallic particle is island and is coated in the polyolefinic continuous phase, combines securely by chemical bonding force between printed circuit board (PCB) non-metallic particle and the polyolefin, has higher mechanical strength;
3. the present invention selects the plasticizing extruding pelletization production technology of common plastics processing for use, and production technology is simple, and energy consumption is low, non-environmental-pollution;
4. The present invention be directed to that recycling discarded printed circuit board (PCB) proposes, the product recycling once more by technical process of the present invention is made further economizes on resources, reduces cost, reduces the pollution to environment.
Description of drawings
Fig. 1 is the schematic flow sheet of a specific embodiment of the nonmetal materials of discarded printed circuit boards regeneration of the present invention method of producing thermoplastic.
The specific embodiment
The nonmetallic materials regeneration that the present invention reclaims discarded printed circuit boards, nonmetallic materials are ground into suitable fineness, after the modification processing is carried out on the surface, with polyolefin, processing aid mixed after, be processed into thermoplastic by the mixed plasticizing and granulating device that reaches of general plastics, its production procedure can be referring to shown in Figure 1.
In order more to be expressly understood technology contents of the present invention, describe in detail especially exemplified by following examples.
The technology that the following example 1～7 adopts is as follows substantially, and different concrete technological parameters see also following table:
The treatment process of A, printed circuit board (PCB) nonmetallic materials
A. the nonmetal materials of discarded printed circuit boards that reclaims being crushed to fineness with flour mill is 40～80 purpose discarded printed circuit boards non-metallic particles;
B. the discarded printed circuit boards non-metallic particle that crushes is poured in the high speed mixing machine, the high-speed stirred dehumidification when material temperature rise to 100 ℃, adds coupling agent (if employing) and carries out surface treatment.To package spare after the powder cooling of handling well.
B, multiple polypropylene and flexibilizer, antioxidant, lubricant respectively after the weighing, are poured into the high speed mixing machine and stirred.
C, the polypropylene granules that respectively surface-treated discarded printed circuit boards non-metallic particle is reached after mixing are put into storage vat, join according to a certain percentage and melt extrude granulation in the parallel double-screw extruder, the extrusion neck ring mold tie rod, through bosh cooling, pelletizing, reciprocating sieve sieve, after the forced air drying, weighing and bagging.
Embodiment 1 usefulness 100 weight portion polyolefin plastics, 100 weight portion fineness are to detect the gained result after 80 purpose non-metallic particles and other auxiliary material blend granulations
Embodiment 2 usefulness 100 weight portion polyolefin plastics, 30 weight portion fineness are to detect the gained result after 80 purpose non-metallic particles and other auxiliary material blend granulations
Embodiment 3 usefulness 100 weight portion polyolefin plastics, 67 weight portion fineness are to detect the gained result after 80 purpose non-metallic particles and other auxiliary material blend granulations
Embodiment 4 usefulness 100 weight portion polyolefin plastics, 100 weight portion fineness are to detect the gained result after 40 purpose non-metallic particles and other auxiliary material blend granulations
100 parts of polyolefin plastics of embodiment 5 usefulness, 30 parts of fineness are to detect the gained result after 40 purpose non-metallic particles and other auxiliary material blend granulations
In above 5 embodiment, plastics in the prescription and auxiliary material all are corresponding to, and non-metal powder all is to handle with 3% silane coupler, and difference is the fineness of non-metal powder and the percentage in plastics.
Embodiment 6 usefulness 100 weight portion polyolefin plastics, 30 weight portion fineness are to detect the gained result after 80 purpose non-metallic particles add 3% silane coupler processing back and other auxiliary material blend granulations
Embodiment 7 usefulness 100 weight portion polyolefin plastics, 30 weight portion fineness are to detect the gained result after 80 purpose non-metallic particles add 3% aluminate coupling agent processing back and other auxiliary material blend granulations
In above 2 examples, the plastics in the prescription, the fineness of non-metallic particle, percentage, the umber of coupling agent and auxiliary material all are corresponding to, and difference is the kind of coupling agent.
Embodiment 8 is a standard with truck stage casing, Feitian, Beijing backplate plastics, has done a prescription, and the result is as follows after testing:
| Project | Standard-required | Test result |
| ??MFR/g·(10min)-1 | ??4～8 | ??7.04 |
| Hot strength/MPa | ??≥25 | ??29.6 |
| The fracture extensibility/ | ??≥20 | ??21.8 |
| Project | Standard-required | Test result |
| Impact strength/Jm-1 | ??≥80 | ??41.4 |
| Hardness (HRR) | ??≥70 | ??90 |
| Heat distortion temperature/℃ | ??≥105 | ??108 |
| Molding shrinkage/ | ??0.5～1.1 | ??0.8 |
This shows that the NEW TYPE OF COMPOSITE thermoplastic that embodiment 1～7 produces is compared with other common polyolefin plastics, have case hardness height, not easy to wear, advantage such as little, product size good stability of phase shrinkage factor in length and breadth.The NEW TYPE OF COMPOSITE thermoplastic of producing with embodiment 1～7 all can carry out the processing of extruded product and injection product, has produced the industrial pallet of multiple style.The industrial pallet of the assembling-type of producing with this composite has: assembling is simple, cost of transportation is low, high not fragile, easy to maintenance, the rigidity of case hardness is higher than similar plastic pallet with bearing capacity.
To sum up, the method that thermoplastic is produced in nonmetal materials of discarded printed circuit boards regeneration of the present invention is skillfully constructed, the regeneration nonmetal materials of discarded printed circuit boards is produced thermoplastic, thermoplastic good combination property, the production cost produced are low, and recycling once more, thereby effectively economize on resources, reduce cost, reduce pollution, be suitable for large-scale promotion application environment.
In this specification, the present invention is described with reference to its certain embodiments.But, still can make various modifications and conversion obviously and not deviate from the spirit and scope of the present invention.Therefore, specification and accompanying drawing are regarded in an illustrative, rather than a restrictive.
Claims (18)
1. the method that thermoplastic is produced in the nonmetal materials of discarded printed circuit boards regeneration is characterized in that, may further comprise the steps:
(a) pulverize nonmetal materials of discarded printed circuit boards and become the discarded printed circuit boards non-metallic particle;
(b) surface of described discarded printed circuit boards non-metallic particle is handled in modification;
(c) mixed with polyolefin plastics and thermoplastic production then with processing aid;
(d) extruding pelletization is processed into described thermoplastic.
2. the method for thermoplastic is produced in nonmetal materials of discarded printed circuit boards regeneration according to claim 1, it is characterized in that in step (a), the size of described discarded printed circuit boards non-metallic particle is 40～80 orders.
3. the method for thermoplastic is produced in nonmetal materials of discarded printed circuit boards regeneration according to claim 1, it is characterized in that, in step (a), adopts flour mill to pulverize described nonmetal materials of discarded printed circuit boards.
4. the method for thermoplastic is produced in nonmetal materials of discarded printed circuit boards regeneration according to claim 1, it is characterized in that, in step (b), the surface of adopting silane coupler or aluminate coupling agent modification to handle described discarded printed circuit boards non-metallic particle.
5. the method for thermoplastic is produced in nonmetal materials of discarded printed circuit boards regeneration according to claim 1, it is characterized in that in step (c), described polyolefin plastics is polypropylene or ethylene-propylene copolymer.
6. the method for thermoplastic is produced in nonmetal materials of discarded printed circuit boards regeneration according to claim 1, it is characterized in that, in step (c), described thermoplastic production comprises one or more of lubricant, antioxidant, flexibilizer with processing aid.
7. the method for thermoplastic is produced in nonmetal materials of discarded printed circuit boards regeneration according to claim 6, it is characterized in that described lubricant is a Ployethylene Wax; Described antioxidant is phenolic antioxidant or sulfur type antioxidant; Described flexibilizer is ethylene-methyl acrylate copolymer or propylene-octene copolymer.
8. the method for thermoplastic is produced in nonmetal materials of discarded printed circuit boards regeneration according to claim 7, it is characterized in that described phenolic antioxidant is four [β-(3.5-2 tertiary butyl-4-hydroxy phenyl) propionic acid] pentaerythritol ester; Described sulfur type antioxidant is two ten diester of sulfuration dipropionic acid.
9. the method for thermoplastic is produced in nonmetal materials of discarded printed circuit boards regeneration according to claim 1, it is characterized in that, in step (c), the consumption of described discarded printed circuit boards non-metallic particle is 0.3～1 times of described polyolefin plastics consumption.
10. the method for thermoplastic is produced in nonmetal materials of discarded printed circuit boards regeneration according to claim 1, it is characterized in that, in step (d), adopts the processing of parallel double-screw extruder extruding pelletization.
11. a thermoplastic is characterized in that, the method manufacturing of producing thermoplastic by the arbitrary described nonmetal materials of discarded printed circuit boards regeneration of claim 1～10 forms.
12. a thermoplastic comprises polyolefin, it is characterized in that, described thermoplastic also comprises the discarded printed circuit boards non-metallic particle of surface modification, and described discarded printed circuit boards non-metallic particle is island and is coated in the described polyolefinic continuous phase.
13. thermoplastic according to claim 12 is characterized in that, combines securely by chemical bonding force between described printed circuit board (PCB) non-metallic particle and the described polyolefin.
14. thermoplastic according to claim 12 is characterized in that, the size of described discarded printed circuit boards non-metallic particle is 40～80 orders.
15. thermoplastic according to claim 12 is characterized in that, described polyolefin is polypropylene or ethylene-propylene copolymer.
16. thermoplastic according to claim 12 is characterized in that, described thermoplastic also comprises thermoplastic production processing aid.
17. thermoplastic according to claim 16 is characterized in that, described thermoplastic production comprises one or more of lubricant, antioxidant, flexibilizer with processing aid.
18. thermoplastic according to claim 12 is characterized in that, the consumption of described discarded printed circuit boards non-metallic particle is 0.3～1 times of described polyolefin plastics consumption.
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| Application Number | Priority Date | Filing Date | Title |
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| CN200910198603A CN101722175A (en) | 2009-11-10 | 2009-11-10 | Method for producing thermoplastic plastics by recycling nonmetal materials of discarded printed circuit boards and related thermoplastic plastics |
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| Application Number | Priority Date | Filing Date | Title |
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| CN200910198603A CN101722175A (en) | 2009-11-10 | 2009-11-10 | Method for producing thermoplastic plastics by recycling nonmetal materials of discarded printed circuit boards and related thermoplastic plastics |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102172597A (en) * | 2010-12-24 | 2011-09-07 | 广州有色金属研究院 | Discarded circuit board full-value recycling method |
| CN102294345A (en) * | 2011-06-24 | 2011-12-28 | 清远市东江环保技术有限公司 | Method for processing discarded PCBs (printed circuit boards) into composite municipal products |
| CN103923378A (en) * | 2013-01-10 | 2014-07-16 | 伟翔环保科技发展(上海)有限公司 | Waste paper-base printed circuit board recovery and reutilization method |
| CN104610651A (en) * | 2014-12-31 | 2015-05-13 | 上海第二工业大学 | Chemically-treated waste printed circuit board nonmetal powder/polypropylene composite material and preparation method thereof |
| CN105542270A (en) * | 2015-12-04 | 2016-05-04 | 福建师范大学 | Method for reinforcing waste polyolefin plastic with waste printed circuit board nonmetal powder |
| CN106005678A (en) * | 2016-06-23 | 2016-10-12 | 王传华 | PCB non-metallic material steel-plastic compound plate tray, preparing production line and preparing method |
| CN106042475A (en) * | 2016-06-23 | 2016-10-26 | 王传华 | PCB nonmetallic material steel-plastic composite building template as well as preparation production line and preparation method thereof |
| CN107353482A (en) * | 2017-08-22 | 2017-11-17 | 上海第二工业大学 | A kind of modified abandoned printed substrate non-metal powder/composite polyolefine material and preparation method thereof |
| CN107863582A (en) * | 2017-10-18 | 2018-03-30 | 界首市双特新材料科技有限公司 | The removal technique of metallic lead in a kind of old and useless battery encapsulating material |
| CN108485304A (en) * | 2018-04-26 | 2018-09-04 | 苏州市富荣环保科技有限公司 | A kind of preparation method of the plastic-wood section based on waste and old circuit board toner |
| CN116082729A (en) * | 2023-02-01 | 2023-05-09 | 盐城工学院 | Preparation method of nonmetal powder/recycled polyolefin composite material of circuit board |
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- 2009-11-10 CN CN200910198603A patent/CN101722175A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102172597A (en) * | 2010-12-24 | 2011-09-07 | 广州有色金属研究院 | Discarded circuit board full-value recycling method |
| CN102294345A (en) * | 2011-06-24 | 2011-12-28 | 清远市东江环保技术有限公司 | Method for processing discarded PCBs (printed circuit boards) into composite municipal products |
| CN103923378A (en) * | 2013-01-10 | 2014-07-16 | 伟翔环保科技发展(上海)有限公司 | Waste paper-base printed circuit board recovery and reutilization method |
| CN103923378B (en) * | 2013-01-10 | 2016-08-24 | 伟翔环保科技发展(上海)有限公司 | Discarded paper printing circuit board recycling method |
| CN104610651A (en) * | 2014-12-31 | 2015-05-13 | 上海第二工业大学 | Chemically-treated waste printed circuit board nonmetal powder/polypropylene composite material and preparation method thereof |
| CN104610651B (en) * | 2014-12-31 | 2019-07-12 | 上海第二工业大学 | A kind of chemical treatment abandoned printed circuit board non-metal powder/PP composite material and preparation method thereof |
| CN105542270B (en) * | 2015-12-04 | 2018-09-11 | 福建师范大学 | A method of waste polyolefine plastics are enhanced using waste printed circuit board nonmetal powder |
| CN105542270A (en) * | 2015-12-04 | 2016-05-04 | 福建师范大学 | Method for reinforcing waste polyolefin plastic with waste printed circuit board nonmetal powder |
| CN106005678A (en) * | 2016-06-23 | 2016-10-12 | 王传华 | PCB non-metallic material steel-plastic compound plate tray, preparing production line and preparing method |
| CN106042475A (en) * | 2016-06-23 | 2016-10-26 | 王传华 | PCB nonmetallic material steel-plastic composite building template as well as preparation production line and preparation method thereof |
| CN107353482A (en) * | 2017-08-22 | 2017-11-17 | 上海第二工业大学 | A kind of modified abandoned printed substrate non-metal powder/composite polyolefine material and preparation method thereof |
| CN107353482B (en) * | 2017-08-22 | 2019-07-05 | 上海第二工业大学 | A kind of modified abandoned printed wiring board non-metal powder/composite polyolefine material and preparation method thereof |
| CN107863582A (en) * | 2017-10-18 | 2018-03-30 | 界首市双特新材料科技有限公司 | The removal technique of metallic lead in a kind of old and useless battery encapsulating material |
| CN108485304A (en) * | 2018-04-26 | 2018-09-04 | 苏州市富荣环保科技有限公司 | A kind of preparation method of the plastic-wood section based on waste and old circuit board toner |
| CN116082729A (en) * | 2023-02-01 | 2023-05-09 | 盐城工学院 | Preparation method of nonmetal powder/recycled polyolefin composite material of circuit board |
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