CN107353482B - A kind of modified abandoned printed wiring board non-metal powder/composite polyolefine material and preparation method thereof - Google Patents
A kind of modified abandoned printed wiring board non-metal powder/composite polyolefine material and preparation method thereof Download PDFInfo
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- CN107353482B CN107353482B CN201710725418.2A CN201710725418A CN107353482B CN 107353482 B CN107353482 B CN 107353482B CN 201710725418 A CN201710725418 A CN 201710725418A CN 107353482 B CN107353482 B CN 107353482B
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/12—Adsorbed ingredients, e.g. ingredients on carriers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
Abstract
The invention discloses a kind of modified abandoned printed wiring board non-metal powder/composite polyolefine materials and preparation method thereof, which includes: modified non-metal powder and polyolefin, and the weight ratio of modified non-metal powder and polyolefin is 10 ~ 50:50 ~ 90.Wherein, modified non-metal powder includes: the weight ratio of non-metal powder and graphene oxide, non-metal powder and graphene oxide is 100:0.1 ~ 10.Non-metal powder is the non-metal powder obtained by abandoned printed circuit board non-metal powder and inorganic acid reaction.Composite material of the invention is modified by non-metal powder using graphene oxide, improves the compatibility of non-metal powder and polyolefin, while improving the mechanical property of composite material, has a good application prospect.
Description
Technical field
The present invention relates to the composite materials of a kind of non-metal powder and polyolefin, and in particular to a kind of modified abandoned printed wire
Plate non-metal powder/composite polyolefine material and preparation method thereof.
Background technique
With the improvement of living standards with science and technology progress, electronic product have become we life necessity, especially
The electronic products such as TV, washing machine, air-conditioning, refrigerator and computer.In China, these household electrical appliance are in last century the nineties
Largely enter daily life, enters the peak period eliminated and scrapped now.As the speed that electronic product updates is accelerated,
The emergence of multifunction electronic product accelerates scrapping and eliminating for electronic product, make the quantity of electron wastes present by
The trend that year increases.
Printed circuit board (Printed Circuit Boards, abbreviation PCB) is component most basic in electronic product,
It is each component basis interconnected in electronic product.It accounts in the maximum household electrical appliance of electronic product ratio containing a large amount of
PCB.With being continuously increased for discarded household appliances quantity, the amount of discarded PCB also increases year by year.It all generates every year a large amount of discarded
PCB。
In addition to deriving from electronic waste beyond the region of objective existence, discarding PCB there are one source is exactly the corner generated in PCB production process
Material and rejected product.Leftover pieces and rejected product account about the 10~20% of PCB production.China is printed circuit board
Big producer, thus the leftover pieces and rejected product of substantial amounts will be generated every year.
Contain various metals, recovery value with higher in the discarded PCB of substantial amounts.By disassembling, being crushed, divide
Choosing and etc., by after metal recovery by remaining non-metal powder.These non-metal powders also contain a small amount of metal, because of existing sorting
Technology is difficult to for metal being totally separated from non-metal powder, these metals are largely heavy metal, is harmful to environment and the mankind are strong
Health.In addition, also containing brominated flame retardant in non-metal powder.Thus correctly it cannot handle and dispose, these non-metal powders will be right
Environment causes great harm.
Landfill and burning are the conventional methods for disposing these non-metal powders on a large scale.Landfill does not only take up valuable soil
Resource, and pollute the environment, if the metal contained in non-metal powder can be discharged into environment, the brominated flame retardant contained also can
It is leached and contaminated soil and underground water etc. by rainwater.Burning can generate a large amount of noxious material, especially more bromo dibenzo two
It dislikes English and polybrominated dibenzofurans, these noxious materials is since brominated PCB substrate generates in combustion.
It is a kind of technology with actual application prospect that these non-metal powders, which are used for filling-modified polymer composite,.
But since particle most of in these powder is all that thermosetting resin is wrapped in glass fibre, so that these powder and high score
The compatibility of subtree rouge is very poor, and composite materials property is caused to reduce.
Summary of the invention
The object of the present invention is to provide a kind of modified abandoned printed wiring board non-metal powder/composite polyolefine material and its systems
Preparation Method, the composite material solve the prior art and are difficult to non-metal powder and macromolecule resin is compatible, to obtain composite material
Poor mechanical property the problems such as, can be modified by non-metal powder, there is good compatibility with polyolefin, mechanical property improves.
In order to achieve the above object, the present invention provides a kind of modified abandoned printed wiring board non-metal powder/polyolefin is multiple
Condensation material, which includes: modified non-metal powder and polyolefin, the weight ratio of the modification non-metal powder and polyolefin
For 10 ~ 50:50 ~ 90.
Wherein, the modification non-metal powder includes: non-metal powder and graphene oxide, the non-metal powder and oxidation
The weight ratio of graphene is 100:0.1 ~ 10.
Wherein, the non-metal powder is nonmetallic to be obtained by abandoned printed circuit board non-metal powder and inorganic acid reaction
Powder.
The polyolefin is polyethylene and/or polypropylene.
The partial size of the non-metal powder is 20 mesh ~ 180 mesh.
The inorganic acid includes: in hydrochloric acid, sulfuric acid, nitric acid and phosphoric acid any one or it is two or more.
Modified abandoned printed wiring board non-metal powder/composite polyolefine material that the present invention also provides a kind of according to
Preparation method, this method includes:
Step 1: abandoned printed circuit board being crushed, is sorted, non-metal powder is recycled, and screens the non-gold for collecting different meshes
Belong to powder；
Step 2: the non-metal powder being collected into being added in inorganic acid, reaction makes non-metal powder surface have polar group
Group, filtering, is washed till neutrality, dry；
Step 3: adding graphene oxide into dispersant for ultrasonic dispersion, obtain graphene oxide dispersion, by the oxygen
Graphite alkene dispersion liquid is added in step 2 non-metal powder that obtains that treated, and high-speed stirred is dry, obtains being modified non-gold
Belong to powder；
Step 4: by the modification non-metal powder and polyolefin blend, melting extrusion is granulated, and obtains modified abandoned printing
Wiring board non-metal powder/composite polyolefine material.
In step 2, the weight of the non-metal powder: the volume of inorganic acid is 1g:3 ~ 10mL, and the inorganic acid is dense
Degree is 1 ~ 8mol/L.
In step 2, the inorganic acid be hydrochloric acid, sulfuric acid, nitric acid and phosphoric acid in any one or it is two or more.
In step 2, the reaction time is 0.5 h ~ 20h, and temperature is 50 DEG C~95 DEG C.
In step 3, the dispersing agent includes: water, ethyl alcohol, methanol, ethylene glycol, tetrahydrofuran, N, N- dimethyl methyl
In amide and dimethyl sulfoxide any one or it is two or more.
In step 3, the concentration of the graphene oxide dispersion is 0.1 g/L ~ 10g/L；The high-speed stirred
Speed be 120~200rpm/min, time of the high-speed stirred is 10 ~ 30min.
In step 4, the melting extrusion temperature is 200 DEG C ~ 250 DEG C.
Modified abandoned printed wiring board non-metal powder/composite polyolefine material of the invention and preparation method thereof, solves
The prior art is difficult to the problems such as poor mechanical property of non-metal powder and macromolecule resin is compatible, to obtain composite material, has
Following advantages:
(1) composite material of the invention is remaining after broken, sorting recycling metal powder using abandoned printed circuit board
Non-metal powder preparation, can make full use of waste resource, and can be avoided tradition and non-metal powder is filled and burned bring
Environmental pollution, such as heavy metal release and noxious material generation；
(2) non-metal powder of the invention is remaining non-metal powder after recycling metal, is not necessarily to separating twice, Bu Huiyin
Separating twice and increase cost and generate poisonous and harmful substance, dust and noise；
(3) composite material of the invention loads graphene oxide using non-metal powder, on the one hand huge using graphene oxide
The modified non-metal powder of big surface area, both sexes and carbon skeleton, enables non-metal powder and compatible polyolefin, improves composite material
Mechanical property；On the other hand, keep graphene oxide evenly dispersed, avoid reuniting；
(4) the preparation method simple process of composite material of the invention, had both solved abandoned printed circuit board non-metal powder
Recycling, also solve the reunion of graphene oxide, and inorganic acid used can be recycled, and not will cause secondary pollution.
Specific embodiment
The following further describes the technical solution of the present invention with reference to embodiments.
A kind of modified abandoned printed wiring board non-metal powder/composite polyolefine material, which includes: modified non-gold
Belong to powder and polyolefin, the weight ratio for being modified non-metal powder and polyolefin is 10 ~ 50:50 ~ 90.Wherein, modified non-metal powder includes:
The weight ratio of non-metal powder and graphene oxide, non-metal powder and graphene oxide is 100:0.1 ~ 10.
Preferably, graphene oxide is the graphene oxide with single atomic layer.Surface of graphene oxide and edge contain
There is a large amount of hydrophilic radical, contains hydroxyl, epoxy group at random on graphene oxide monolithic, and the edge of graphene oxide contains
There is carboxyl etc., since polar group is contained on its surface, the skeleton of simultaneous oxidation graphene is mainly carbon, thus has both sexes (parent
Aqueous and hydrophobicity) the characteristics of.The polar group that graphene oxide contains can be mutual with hydroxyl, the amino on non-metal powder surface etc.
Effect, on the one hand, make graphene oxide be uniformly distributed in non-metal powder surface, achieve the purpose that modified non-metal powder；Another party
Face, it is graphene oxide-loaded to be conducive to graphene oxide in non-metal powder surface and disperse in the composite, avoid graphite oxide
The reunion of alkene.In addition, graphene oxide has very high intensity, modified abandoned printed wiring board non-metal powder/polyene is improved
Mechanical property of hydrocarbon composite material, including shock resistance, bending resistance and tensile strength etc..
Non-metal powder is the non-metal powder obtained by abandoned printed circuit board non-metal powder and inorganic acid reaction；Polyolefin is
Polyethylene and/or polypropylene.
The partial size of non-metal powder is 20 mesh ~ 180 mesh.
Inorganic acid includes: in hydrochloric acid, sulfuric acid, nitric acid and phosphoric acid any one or it is two or more.
A kind of preparation method according to above-mentioned modified abandoned printed wiring board non-metal powder/composite polyolefine material, the party
Method includes:
Step 1: abandoned printed circuit board being crushed, is sorted, non-metal powder is recycled, and screens the non-gold for collecting different meshes
Belong to powder；
Step 2: the non-metal powder being collected into being added in inorganic acid, reaction makes non-metal powder surface portion thermosetting property tree
Rouge decomposes, so that non-metal powder surface be made to have a certain number of polar groups, filtering is washed till neutrality, dry, to go to remove water
Point；
Step 3: adding graphene oxide into dispersant for ultrasonic dispersion, obtain graphene oxide dispersion, by the oxygen
Graphite alkene dispersion liquid is added in step 2 non-metal powder that obtains that treated, and high-speed stirred is dry, obtains being modified non-gold
Belong to powder；The polar group on non-metal powder surface and the Electronic interactions of graphene oxide pass through chemical bond or intermolecular work
Graphene oxide is firmly set to be carried on non-metal powder surface securely；
Step 4: by modified non-metal powder and polyolefin blend, melting extrusion is granulated, and obtains modified abandoned printed wiring board
Non-metal powder/composite polyolefine material；The hydrophobicity of the carbon skeleton of graphene oxide enables and is modified non-metal powder and polyene
Hydrocarbon has good compatibility.
In step 2, the weight of non-metal powder: the volume of inorganic acid is 1g:3 ~ 10mL, and inorganic acid concentration is 1 ~ 8mol/
L。
In step 2, inorganic acid be hydrochloric acid, sulfuric acid, nitric acid and phosphoric acid in any one or it is two or more.Inorganic acid energy
It is enough by it is untreated fall metal powder react away.
In step 2, the reaction time is 0.5 h ~ 20h, and temperature is 50 DEG C~95 DEG C.
In step 3, dispersing agent includes: water, ethyl alcohol, methanol, ethylene glycol, tetrahydrofuran, n,N-Dimethylformamide and
In dimethyl sulfoxide any one or it is two or more.
In step 3, the concentration of graphene oxide dispersion is 0.1 g/L ~ 10g/L；The speed of high-speed stirred be 120~
The time of 200rpm/min, high-speed stirred are 10 ~ 30min, and graphene oxide is made to be dispersed in non-metal powder particle surface.
In step 4, melting extrusion temperature is 200 DEG C ~ 250 DEG C, and polypropylene and polyethylene can melt at this temperature.
When carrying out Mechanics Performance Testing to the material in following each embodiments, tensile strength electronic universal tester
(model specification 3360, Instron company, the U.S.), according to 527 standard test of ISO；Bending strength electronic universal tester
(model specification 3360, Instron company, the U.S.), according to ISO178 standard test；Impact strength balance weight impact testing machine (type
Number specification ZBC7000, Mei Tesi industrial system (China) Co., Ltd), according to ISO180 standard test (cantilever beam, notch).
Embodiment 1
A kind of modified abandoned printed wiring board non-metal powder/composite polyethylene material, which includes: modified non-gold
Belong to powder and polyethylene, the weight ratio for being modified non-metal powder and polyethylene is 1:3.Wherein, modified non-metal powder includes: non-metal powder
And graphene oxide, the weight ratio of non-metal powder and graphene oxide are 100:1.
Non-metal powder is that partial size is 40 mesh ~ 60 mesh abandoned printed circuit board non-metal powder.
Non-metal powder is to be existed by 40 mesh ~ 60 mesh abandoned printed circuit board non-metal powder 110g and 330mL 4mol/L nitric acid
Lower 80 DEG C of normal pressure are reacted obtained non-metal powder.
Embodiment 2
The preparation method of modified abandoned printed wiring board non-metal powder/composite polyethylene material of embodiment 1, this method packet
Contain:
Step 1: abandoned printed circuit board being crushed, is sorted, non-metal powder is recycled, and screening mesh number is 40 mesh ~ 60 purposes
Non-metal powder is collected；
Step 2: the non-metal powder that 110g step 1 obtains is added in 330mL 4mol/L nitric acid, in 80 DEG C of reaction 6h,
Decompose non-metal powder surface portion thermosetting resin, to make non-metal powder surface that there is a certain number of polar groups, mistake
Filter, is washed till neutrality for non-metal powder with water, dry, filtrate recycling and reusing；
Step 3: adding graphene oxide into ultrasonic disperse in water, the graphene oxide that preparation concentration is 1g/L disperses
The graphene oxide dispersion is added in step 2 non-metal powder that obtains that treated, non-metal powder and graphite oxide by liquid
The weight ratio of alkene is 100:1, and 15min is stirred under 120rpm/min speed, dry, obtains modified non-metal powder；
Step 4: modified non-metal powder being blended with polyethylene with weight ratio 1:3, is made in 200 DEG C ~ 250 DEG C melting extrusions
Grain, obtains modified abandoned printed wiring board non-metal powder/composite polyethylene material of embodiment 1.
By Mechanics Performance Testing, modified abandoned printed wiring board non-metal powder/composite polyethylene material of embodiment 1
Tensile strength is 37.09MPa；Bending strength is 47.26MPa；Impact strength is 23.30kJ/m2。
Embodiment 3
A kind of modified abandoned printed wiring board non-metal powder/composite polyethylene material, which includes: modified non-gold
Belong to powder and polyethylene, the weight ratio for being modified non-metal powder and polyethylene is 1:3.Wherein, modified non-metal powder includes: non-metal powder
And graphene oxide, the weight ratio of non-metal powder and graphene oxide are 100:3.
Non-metal powder is that partial size is 40 mesh ~ 60 mesh abandoned printed circuit board non-metal powder.
Non-metal powder is to be existed by 40 mesh ~ 60 mesh abandoned printed circuit board non-metal powder 110g and 330mL 4mol/L nitric acid
Lower 80 DEG C of normal pressure are reacted obtained non-metal powder.
Embodiment 4
The preparation method of modified abandoned printed wiring board non-metal powder/composite polyethylene material of embodiment 3, with embodiment
2 preparation method is identical, and difference is that the concentration of the graphene oxide dispersion prepared in step 3 is 0.5g/L, dispersion liquid
For ethyl alcohol, the speed of stirring is 200rpm/min；Non-metal powder is modified in step 4 to be blended with polyethylene with weight ratio 1:3.
By Mechanics Performance Testing, modified abandoned printed wiring board non-metal powder/composite polyethylene material of embodiment 3
Tensile strength is 41.26MPa；Bending strength is 48.94MPa；Impact strength is 33.96kJ/m2。
Embodiment 5
A kind of modified abandoned printed wiring board non-metal powder/composite polyethylene material, which includes: modified non-gold
Belong to powder and polyethylene, the weight ratio for being modified non-metal powder and polyethylene is 1:4.Wherein, modified non-metal powder includes: non-metal powder
And graphene oxide, the weight ratio of non-metal powder and graphene oxide are 100:3.
Non-metal powder is that partial size is 60 mesh ~ 80 mesh abandoned printed circuit board non-metal powder.
Non-metal powder is to be existed by 60 mesh ~ 80 mesh abandoned printed circuit board non-metal powder 110g and 330mL 4mol/L nitric acid
Lower 80 DEG C of normal pressure are reacted obtained non-metal powder.
Embodiment 6
The preparation method of modified abandoned printed wiring board non-metal powder/composite polyethylene material of embodiment 5, with embodiment
2 preparation method is identical, and difference is that the partial size of the abandoned printed circuit board non-metal powder sorted in step 1 is 40 mesh
The concentration of ~ 60 mesh, the graphene oxide dispersion prepared in step 3 is 0.5g/L, and dispersion liquid is ethylene glycol, in step 4
Modified non-metal powder is blended with polyethylene with weight ratio 1:4.
By Mechanics Performance Testing, modified abandoned printed wiring board non-metal powder/composite polyethylene material of embodiment 5
Tensile strength is 37.72MPa；Bending strength is 50.22MPa；Impact strength is 39.11kJ/m2。
Embodiment 7
A kind of modified abandoned printed wiring board non-metal powder/composite polyethylene material, which includes: modified non-gold
Belong to powder and polyethylene, the weight ratio for being modified non-metal powder and polyethylene is 1:3.Wherein, modified non-metal powder includes: non-metal powder
And graphene oxide, the weight ratio of non-metal powder and graphene oxide are 100:3.
Non-metal powder is that partial size is 80 mesh ~ 100 mesh abandoned printed circuit board non-metal powder.
Non-metal powder is by 80 mesh ~ 100 mesh abandoned printed circuit board non-metal powder 110g and 330mL 4mol/L nitric acid
React obtained non-metal powder for 80 DEG C under normal pressure.
Embodiment 8
The preparation method of modified abandoned printed wiring board non-metal powder/composite polyethylene material of embodiment 7, with embodiment
2 preparation method is identical, and difference is that the partial size of the abandoned printed circuit board non-metal powder sorted in step 1 is 80 mesh
~ 100 mesh, the concentration of the graphene oxide dispersion prepared in step 3 are 10g/L, and dispersion liquid is the aqueous solution of ethyl alcohol.
By Mechanics Performance Testing, modified abandoned printed wiring board non-metal powder/composite polyethylene material of embodiment 7
Tensile strength is 37.99MPa；Bending strength is 52.34MPa；Impact strength is 42.06kJ/m2。
Embodiment 9
A kind of modified abandoned printed wiring board non-metal powder/PP composite material, which includes: modified non-gold
Belong to powder and polypropylene, modified non-metal powder and polyacrylic weight ratio are 1:1.5.Wherein, modified non-metal powder includes: nonmetallic
The weight ratio of powder and graphene oxide, non-metal powder and graphene oxide is 100:10.
Non-metal powder is that partial size is 80 mesh ~ 100 mesh abandoned printed circuit board non-metal powder.
Non-metal powder is by 80 mesh ~ 100 mesh abandoned printed circuit board non-metal powder 110g and 550mL 2mol/L nitric acid
React obtained non-metal powder for 90 DEG C under normal pressure.
Embodiment 10
The preparation method of modified abandoned printed wiring board non-metal powder/PP composite material of embodiment 9, with embodiment
2 preparation method is identical, and difference is that the partial size of the abandoned printed circuit board non-metal powder sorted in step 1 is 80 mesh
~ 100 mesh, the concentration of the graphene oxide dispersion prepared in step 3 are 0.1g/L, and dispersion liquid is the aqueous solution of ethylene glycol.
By Mechanics Performance Testing, modified abandoned printed wiring board non-metal powder/PP composite material of embodiment 7
Tensile strength is 37.21MPa；Bending strength is 46.51MPa；Impact strength is 5.13kJ/m2。
Modified abandoned printed wiring board non-metal powder/composite polyolefine material of the invention is widely used, can be used for electronics
The fields such as electric equipment products, automobile, agricultural, transportation, chemical industry, daily life.
In conclusion modified abandoned printed wiring board non-metal powder/composite polyolefine material of the invention and its preparation side
Method, the composite material utilize the hydrophobicity and hydrophily of graphene oxide, can be improved the compatibility of non-metal powder and polyolefin,
And the mechanical property of composite material is improved, there is good practical prospect.
It is discussed in detail although the contents of the present invention have passed through above preferred embodiment, but it should be appreciated that above-mentioned
Description is not considered as limitation of the present invention.After those skilled in the art have read above content, for of the invention
A variety of modifications and substitutions all will be apparent.Therefore, protection scope of the present invention should be limited to the appended claims.
Claims (10)
1. a kind of modified abandoned printed wiring board non-metal powder/composite polyolefine material, which is characterized in that the composite material packet
Contain: the weight ratio of modified non-metal powder and polyolefin, the modification non-metal powder and polyolefin is 10~50:50~90；
Wherein, the modification non-metal powder includes: non-metal powder and graphene oxide, the non-metal powder and graphite oxide
The weight ratio of alkene is 100:0.1~10；
The non-metal powder is the non-metal powder obtained by abandoned printed circuit board non-metal powder and inorganic acid reaction；
The composite material is prepared by the inclusion of the method for following steps:
Step 1: abandoned printed circuit board being crushed, is sorted, non-metal powder is recycled, and screens and collects the nonmetallic of different meshes
Powder；
Step 2: the non-metal powder being collected into being added in inorganic acid, reaction makes non-metal powder surface have polar group, mistake
Filter, is washed till neutrality, dry；
Step 3: adding graphene oxide into dispersant for ultrasonic dispersion, obtain graphene oxide dispersion, by the oxidation stone
Black alkene dispersion liquid is added in step 2 non-metal powder that obtains that treated, and high-speed stirred is dry, obtains modified non-metal powder；
Step 4: by the modification non-metal powder and polyolefin blend, melting extrusion is granulated, and obtains modified abandoned printed wire
Plate non-metal powder/composite polyolefine material.
2. modified abandoned printed wiring board non-metal powder/composite polyolefine material according to claim 1, feature exist
In the polyolefin is polyethylene and/or polypropylene.
3. modified abandoned printed wiring board non-metal powder/composite polyolefine material according to claim 1, feature exist
In the partial size of the non-metal powder is 20 mesh~180 mesh.
4. modified abandoned printed wiring board non-metal powder/composite polyolefine material according to claim 1, feature exist
In the inorganic acid includes: in hydrochloric acid, sulfuric acid, nitric acid and phosphoric acid any one or it is two or more.
5. a kind of modified abandoned printed wiring board non-metal powder/polyolefin described in any one of -4 according to claim 1 is multiple
The preparation method of condensation material, which is characterized in that this method includes:
Step 1: abandoned printed circuit board being crushed, is sorted, non-metal powder is recycled, and screens and collects the nonmetallic of different meshes
Powder；
Step 2: the non-metal powder being collected into being added in inorganic acid, reaction makes non-metal powder surface have polar group, mistake
Filter, is washed till neutrality, dry；
Step 3: adding graphene oxide into dispersant for ultrasonic dispersion, obtain graphene oxide dispersion, by the oxidation stone
Black alkene dispersion liquid is added in step 2 non-metal powder that obtains that treated, and high-speed stirred is dry, obtains modified non-metal powder；
Step 4: by the modification non-metal powder and polyolefin blend, melting extrusion is granulated, and obtains modified abandoned printed wire
Plate non-metal powder/composite polyolefine material.
6. the preparation method of modified abandoned printed wiring board non-metal powder/composite polyolefine material according to claim 5,
It is characterized in that, in step 2, the weight of the non-metal powder: the volume of inorganic acid is 1g:3~10mL, and described is inorganic
Acid concentration is 1~8mol/L.
7. the preparation method of modified abandoned printed wiring board non-metal powder/composite polyolefine material according to claim 5,
It is characterized in that, in step 2, the reaction time is 0.5h~20h, temperature is 50 DEG C~95 DEG C.
8. the preparation method of modified abandoned printed wiring board non-metal powder/composite polyolefine material according to claim 5,
It is characterized in that, in step 3, the dispersing agent includes: water, ethyl alcohol, methanol, ethylene glycol, tetrahydrofuran, N, N- dimethyl
In formamide and dimethyl sulfoxide any one or it is two or more.
9. the preparation method of modified abandoned printed wiring board non-metal powder/composite polyolefine material according to claim 5,
It is characterized in that, in step 3, the concentration of the graphene oxide dispersion is 0.1g/L~10g/L；The high-speed stirring
The speed mixed is 120~200rpm/min, and the time of the high-speed stirred is 10~30min.
10. the preparation side of modified abandoned printed wiring board non-metal powder/composite polyolefine material according to claim 5
Method, which is characterized in that in step 4, the melting extrusion temperature is 200 DEG C~250 DEG C.
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| CN106829945A (en) * | 2016-12-30 | 2017-06-13 | 广州锋尚电器有限公司 | A kind of layer type casting moulding Graphene nonmetallic composite and preparation method |
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| CN107353482A (en) | 2017-11-17 |
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