CN105504516A - Chemical treatment waste printed wiring board non-metal powder/polypropylene toughened composite material and preparation method thereof - Google Patents
Chemical treatment waste printed wiring board non-metal powder/polypropylene toughened composite material and preparation method thereof Download PDFInfo
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- CN105504516A CN105504516A CN201610033507.6A CN201610033507A CN105504516A CN 105504516 A CN105504516 A CN 105504516A CN 201610033507 A CN201610033507 A CN 201610033507A CN 105504516 A CN105504516 A CN 105504516A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
- C08L23/12—Polypropene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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Abstract
The invention discloses a chemical treatment waste printed wiring board non-metal powder/polypropylene toughened composite material and a preparation method thereof. The preparation method comprises the following steps: proportionally mixing polypropylene, waste printed wiring board powder, a toughener, a compatilizer, an antioxidant and a lubricant, carrying out extrusion granulation, and carrying out injection molding, wherein the chemical treatment waste printed wiring board non-metal powder is prepared by carrying out chemical treatment on pretreated chemical treatment waste printed wiring board non-metal powder by using one or two chemical treatment reagents from decanoic acid, pelargonic acid, caproic acid and stearic acid. The non-metal powder residue after metal recovery is directly used for strengthening and toughening polypropylene to prepare the composite material without secondary pulverization, so that the chemical treatment waste printed wiring board non-metal powder is reutilized, thereby being beneficial to environmental protection and obtaining the composite material with excellent comprehensive properties.
Description
Technical field
The present invention relates to a kind of chemical treatment abandoned printed circuit board non-metal powder/polypropylene toughening matrix material and preparation method thereof, belong to scrap concrete technical field.
Background technology
Electronic product has been widely used in the every field such as industrial and agricultural production and daily life, particularly improves our quality of life, and TV, air-conditioning, refrigerator, washing machine have become requisite daily necessities in our life.These electric equipment products have entered update peak period at present, and along with the speed quickening of development in science and technology and the not reasonable consumption (as mutually unrealistically compared) of people, the renewal speed of electronic product presents the trend of increase, cause shorten the working life of electronic product, all will produce a large amount of electron wastes every year.In recent years, the rate of growth of electron wastes has exceeded the rate of growth of other solid waste, becomes the solid waste that rate of growth is the fastest.
Printed circuit board (PCB) (PrintedCircuitBoards is called for short PCB) is components and parts the most basic in electronic product, is the requisite components and parts of each electronic product.From electronic watch to computer, household electrical appliance, signal equipment all contain printed circuit board (PCB), and the discarded of a large amount of electronic product will produce millions of discarded PCB.
Discarded PCB is mainly derived from two aspects: one is derive from the various electric equipment productss scrapped; Another source is a large amount of scrap stock and unacceptable product that produce in PCB production process.Scrap stock and unacceptable product account for greatly 10 ~ 20% of PCB production, will produce the discarded PCB of substantial amounts with regard to this thus every year.
The household electronic products substantial amounts that China scraps, the discarded PCB that annual generation is a large amount of.Containing various metals in discarded PCB, there is higher recovery value.The steps such as process is disassembled, fragmentation, sorting, metal recovery recycled, remaining a large amount of non-metal powder becomes secondary pollutant.
Current, extensive method mainly landfill and the burning disposing these non-metal powders.Landfill not only takies valuable land resources, and pollutes the environment.Burning can produce a large amount of toxic substances, particularly many bromos dibenzo Dioxins and PBDF, and these toxic substances are because brominated PCB substrate produces in combustion.
Due to the thermosetting epoxy resin material that discarded PCB non-metal base plate is glass fiber reinforcement, insolublely not melt, be difficult to recycle by the conventional method reclaiming plastic waste.With discarded PCB non-metal powder prepare material of construction, matrix material (particularly polymer composite) is a research field at present of greatest concern about discarded PCB non-metal powder resource utilization.But be need to pulverize the non-metal powder degree of depth by a difficult point of the filling-modified macromolecular material of non-metal powder, general needs are crushed to very little particle such as 180 orders (CN102161798, CN102161802, CN102675736) just has using value.Discarded PCB non-metal base plate is difficult to depth crushing due to special tridimensional network.In strong shattering process, not only consume too much energy, increase cost, and produce noise, and a large amount of dust and hazardous and noxious substances, cause secondary pollution.
Patent (CN104610651A) inner chemical treatment is discarded PCB non-metal powder MODIFIED PP and is prepared matrix material, although obtain the matrix material that over-all properties is good, but its toughness reduces comparatively large, makes its range of application be subject to a definite limitation, when particularly toughness reguirements is higher.The present invention, on the basis of a upper invention, prepares the matrix material of toughen and intensify by toughner and the common MODIFIED PP of discarded PCB non-metal powder.Result shows, and when granular size is identical, the toughness of matrix material is greatly improved, even if add a small amount of compatilizer.
Summary of the invention
In order to overcome the deficiencies in the prior art, the object of the present invention is to provide a kind of chemical treatment abandoned printed circuit board non-metal powder/polypropylene toughening matrix material and preparation method thereof, the inventive method technique is simple, environmentally friendly, the discarded PCB non-metal powder used is non-metal powder residual after Footwall drift, without the need to secondary breaking, less energy consumption, can reduce because the degree of depth pulverizes the secondary environmental pollution brought simultaneously; The polypropylene toughening matrix material of high comprehensive performance not only effectively can be obtained by the inventive method.
The object of the invention is to be realized by following technical scheme.
The invention provides a kind of chemical treatment abandoned printed circuit board non-metal powder/polypropylene toughening matrix material, described compound
The formula of material comprises polypropylene, chemical treatment abandoned printed circuit board non-metal powder, toughner, compatilizer, lubricant and oxidation inhibitor; The weight ratio of described polypropylene, chemical treatment abandoned printed circuit board non-metal powder, toughner, compatilizer, lubricant and oxidation inhibitor is (39 ~ 79): (10 ~ 50): (10 ~ 30): (5 ~ 25): (0.5 ~ 3): (0.5 ~ 2).
In the present invention, described toughner is one or both in EVA, POE, EPDM, POE grafted maleic anhydride POE-g-MAH or EPDM grafted maleic anhydride EPDM-G-MAH.
In the present invention, described compatilizer is one or both in polypropylene grafted maleic anhydride PP-g-MAH, POE grafted maleic POE-g-MAH or EPDM grafted maleic anhydride EPDM-G-MAH; Described lubricant is polyethylene wax, oxidized polyethlene wax, whiteruss, stearic acid, calcium stearate or N, N ' one or both in-ethylene bis stearamide; Described oxidation inhibitor by four [β-(3,5-di-tert-butyl-hydroxy phenyl) propionic acid] pentaerythritol esters and tricresyl phosphite [2.4-di-tert-butyl-phenyl] ester with weight ratio 1:(1 ~ 3) compositely to form.
In the present invention, the preparation method of described chemical treatment abandoned printed circuit board non-metal powder is as follows:
1. volume ratio 1:(3 ~ 8 by weight) g/mL, be that to join volumetric molar concentration be in the mineral acid of 1 ~ 8mol/L to 20 order ~ 180 object abandoned printed circuit board non-metal powders by particle diameter, react 0.5 ~ 30 hour at the temperature of 50 DEG C ~ 95 DEG C, reaction terminates rear filtration, with water, non-metal powder is washed till neutrality, drying, obtains mineral acid treatment abandoned printed circuit board non-metal powder;
2. be (90 ~ 94) by mineral acid treatment abandoned printed circuit board non-metal powder and chemical treatment regimens according to weight ratio: (6 ~ 10) are in the mixing of homogenizer high speed, dry after mixing, obtain chemical treatment abandoned printed circuit board non-metal powder; Wherein: described chemical treatment regimens be selected from certain herbaceous plants with big flowers acid, n-nonanoic acid, caproic acid, stearic acid one or both; Described high-speed mixing speed is 1500 ~ 2000rpm/min, and the time is 12 ~ 35min; After mixing, drying temperature is 100 ~ 140 DEG C, and the time is 2 ~ 12 hours.
Above-mentioned steps 1. in, the described particle diameter scrap stock that to be 20 order ~ 180 object abandoned printed circuit board non-metal powders produced by abandoned printed circuit board or the wiring board production process with components and parts through pulverizing, sorting and process of sieving obtain; Described mineral acid is one or both in sulfuric acid, hydrochloric acid or nitric acid.
The present invention further provides a kind of preparation method of chemical treatment abandoned printed circuit board non-metal powder/polypropylene toughening matrix material, concrete steps are as follows:
(1) printed-wiring board (PWB) non-metal powder is abandoned in preparative chemistry process
(2) extruding pelletization
First described polypropylene, chemical treatment abandoned printed circuit board non-metal powder, toughner, compatilizer, lubricant, oxidation inhibitor are mixed in proportion, through extruding pelletization, obtain toughening composition pellet; Again described toughening composition pellet is carried out drying treatment, obtain dried toughening composition pellet; Wherein: in described extruding pelletization process, the temperature in each section of district is all within the scope of 180 ~ 230 DEG C, and screw speed is 80 ~ 180rpm/min;
(3) injection moulding
Dried toughening composition pellet is carried out injection moulding, obtains chemical treatment abandoned printed circuit board non-metal powder/polypropylene toughening matrix material; Described injection moulding Ge Duan district temperature is between 180 ~ 230 DEG C.
In above-mentioned preparation method, in step (two), the temperature of drying treatment toughening composition pellet is 70 ~ 120 DEG C, and the time is 10 ~ 30 hours.
The present invention compared with prior art, has the following advantages:
1. the non-metal powder that the present invention's chemical treatment abandoned printed circuit board used non-metal powder is residual after adopting Footwall drift, without the need to separating twice, can not increase cost and produce hazardous and noxious substances, dust and noise because the degree of depth pulverizes.
2. the inventive method technique is simple, can effectively by abandoned printed circuit board non-metal powder resource utilization.
3. the mineral acid that the present invention uses reclaims and recycles, and does not cause secondary pollution.
Embodiment
Describe the present invention below in conjunction with embodiment; but the following example is not limited to the present invention; compatilizer in the following example, oxidation inhibitor mixing raw material also can select the product of commercially available similar performance; every there is no other any do not deviate from spirit of the present invention and principle under do change, modification, substitute, combine, simplify; all be considered as the substitute mode of equivalence, be included in protection scope of the present invention.
In the present invention, when Mechanics Performance Testing is carried out to matrix material, its tensile strength with electronic universal tester (3360, American I nstron company), according to ASTMD638 standard test; Flexural strength with electronic universal tester (3360, American I nstron company), according to ASTMD790 standard test; Shock strength with balance weight impact testing machine (ZBC7000, Mei Tesi industrial system (China) company limited), according to ASTMD256 standard test.
Embodiment 1
By abandoned printed circuit board through pulverizing, sorting, collection of sieving, obtain the abandoned printed circuit board non-metal powder of different meshes.
The abandoned printed circuit board non-metal powder 100g of different meshes is joined in 300mL4M nitric acid, after 8 hours in 80 DEG C of heating, filters, with water, non-metal powder is washed till neutrality, dry, obtain the nitric acid treatment abandoned printed circuit board non-metal powder of different meshes.Filtrate recycling.
Embodiment 2
Ethanolic soln embodiment 1 being obtained 40 ~ 60 order nitric acid treatment abandoned printed circuit board non-metal powders and certain herbaceous plants with big flowers acid joins high-speed mixing in homogenizer, dry after mixing, obtains certain herbaceous plants with big flowers acid treatment abandoned printed circuit board non-metal powder.Described nitric acid treatment abandoned printed circuit board non-metal powder and the weight ratio of certain herbaceous plants with big flowers acid are 94:6; In described certain herbaceous plants with big flowers acid ethanolic soln, certain herbaceous plants with big flowers acid and ethanol weight ratio are 15:85; Described high-speed mixing, rotating speed 1800rpm/min, the time is 15 minutes; Described drying temperature is 110 DEG C, and the time is 10 hours.
By certain herbaceous plants with big flowers acid treatment abandoned printed circuit board non-metal powder obtained above, polypropylene, toughner POE, Compatibilizer PP-g-MAH, oxidic polyethylene, compound antioxidant (four [β-(3,5-di-tert-butyl-hydroxy phenyl) propionic acid] pentaerythritol ester and tricresyl phosphite [2.4-di-tert-butyl-phenyl] ester weight ratio 1:1 mix) by weight being 20:68:8:2:1.5:0.5 high-speed mixing in high-speed mixer, extruding pelletization, obtain composite material granular, drying for standby.Described high-speed mixing, rotating speed is 1800rpm/min, and the time is 12 minutes; Six Ge Duan district temperature of forcing machine are respectively: 200 DEG C, 210 DEG C, 220 DEG C, 230 DEG C, 220 DEG C, 210 DEG C, screw speed is 120rpm/min; Drying temperature is 100 DEG C, 12 hours time.
By the composite material granular injection moulding of above-mentioned drying, obtain described chemical treatment abandoned printed circuit board non-metal powder/polypropylene toughening matrix material; Injection moulding Ge Duan district temperature is 200 DEG C, 210 DEG C, 220 DEG C, 205 DEG C.
Detected result shows, the tensile strength of the matrix material of the present embodiment is 30.59MPa; Flexural strength is 29.88MPa; Shock strength is 37.13kJ/m
2.
Embodiment 3
Ethanolic soln embodiment 1 being obtained 40 ~ 60 order nitric acid treatment abandoned printed circuit board non-metal powders and certain herbaceous plants with big flowers acid joins high-speed mixing in homogenizer, dry after mixing, obtains certain herbaceous plants with big flowers acid treatment abandoned printed circuit board non-metal powder.Described nitric acid treatment abandoned printed circuit board non-metal powder and the weight ratio of certain herbaceous plants with big flowers acid are 94:6; In described certain herbaceous plants with big flowers acid ethanolic soln, certain herbaceous plants with big flowers acid and ethanol weight ratio are 15:85; Described high-speed mixing, rotating speed 1800rpm/min, the time is 15 minutes; Described drying temperature is 110 DEG C, and the time is 10 hours.
By certain herbaceous plants with big flowers acid treatment abandoned printed circuit board non-metal powder obtained above, polypropylene, toughner EPDM, compatilizer EPDM-g-MAH, N, N '-ethylene bis stearamide, compound antioxidant (four [β-(3,5-di-tert-butyl-hydroxy phenyl) propionic acid] pentaerythritol ester and tricresyl phosphite [2.4-di-tert-butyl-phenyl] ester weight ratio 1:1 mix) by weight being 20:68:8:2:1.5:0.5 high-speed mixing in high-speed mixer, extruding pelletization, obtain composite material granular, drying for standby.Described high-speed mixing, rotating speed is 1800rpm/min, and the time is 12 minutes; Six Ge Duan district temperature of forcing machine are respectively: 200 DEG C, 210 DEG C, 220 DEG C, 230 DEG C, 220 DEG C, 210 DEG C, screw speed is 120rpm/min; Drying temperature is 110 DEG C, 10 hours time.
By the composite material granular injection moulding of above-mentioned drying, obtain described chemical treatment abandoned printed circuit board non-metal powder/polypropylene toughening matrix material; Injection moulding Ge Duan district temperature is 200 DEG C, 210 DEG C, 220 DEG C, 205 DEG C.
Detected result shows, the tensile strength of the matrix material of the present embodiment is 33.62MPa; Flexural strength is 31.29MPa; Shock strength is 37.12kJ/m
2.
Embodiment 4
Ethanolic soln embodiment 1 being obtained 60 ~ 80 order nitric acid treatment abandoned printed circuit board non-metal powders and certain herbaceous plants with big flowers acid joins high-speed mixing in homogenizer, dry after mixing, obtains certain herbaceous plants with big flowers acid treatment abandoned printed circuit board non-metal powder.Described nitric acid treatment abandoned printed circuit board non-metal powder and the weight ratio of certain herbaceous plants with big flowers acid are 94:6; In described certain herbaceous plants with big flowers acid ethanolic soln, certain herbaceous plants with big flowers acid and ethanol weight ratio are 10:90; Described high-speed mixing, rotating speed 1800rpm/min, the time is 15 minutes; Described drying temperature is 110 DEG C, and the time is 10 hours.
By certain herbaceous plants with big flowers acid treatment abandoned printed circuit board non-metal powder obtained above, polypropylene, toughner EPDM, Compatibilizer PP-g-MAH, polyethylene wax/calcium stearate (composite by weight 1:1), compound antioxidant (four [β-(3,5-di-tert-butyl-hydroxy phenyl) propionic acid] pentaerythritol ester and tricresyl phosphite [2.4-di-tert-butyl-phenyl] ester weight ratio 1:3 mix) by weight being 20:68:8:2:1.5:0.5 high-speed mixing in high-speed mixer, extruding pelletization, obtain composite material granular, drying for standby.Described high-speed mixing, rotating speed is 1800rpm/min, and the time is 12 minutes; Six Ge Duan district temperature of forcing machine are respectively: 200 DEG C, 210 DEG C, 220 DEG C, 230 DEG C, 220 DEG C, 210 DEG C, screw speed is 120rpm/min; Drying temperature is 110 DEG C, 10 hours time.
By the composite material granular injection moulding of above-mentioned drying, obtain described chemical treatment abandoned printed circuit board non-metal powder/polypropylene toughening matrix material; Injection moulding Ge Duan district temperature is 200 DEG C, 210 DEG C, 220 DEG C, 205 DEG C.
Detected result shows, the tensile strength of the matrix material of the present embodiment is 34.12MPa; Flexural strength is 31.43MPa; Shock strength is 39.33kJ/m
2.
Embodiment 5
Ethanolic soln embodiment 1 being obtained 40 ~ 60 order nitric acid treatment abandoned printed circuit board non-metal powders and certain herbaceous plants with big flowers acid joins high-speed mixing in homogenizer, dry after mixing, obtains certain herbaceous plants with big flowers acid treatment abandoned printed circuit board non-metal powder.Described nitric acid treatment abandoned printed circuit board non-metal powder and the weight ratio of certain herbaceous plants with big flowers acid are 94:6; In described certain herbaceous plants with big flowers acid ethanolic soln, certain herbaceous plants with big flowers acid and ethanol weight ratio are 10:90; Described high-speed mixing, rotating speed 1800rpm/min, the time is 15 minutes; Described drying temperature is 110 DEG C, and the time is 10 hours.
By certain herbaceous plants with big flowers acid treatment abandoned printed circuit board non-metal powder obtained above, polypropylene, EPDM, Compatibilizer PP-g-MAH, N, N '-ethylene bis stearamide/polyethylene wax (composite by weight 1:1), compound antioxidant (four [β-(3,5-di-tert-butyl-hydroxy phenyl) propionic acid] pentaerythritol ester and tricresyl phosphite [2.4-di-tert-butyl-phenyl] ester weight ratio 1:1 mix) by weight being 30:58:8:2:1.5:0.5 high-speed mixing in high-speed mixer, extruding pelletization, obtain composite material granular, drying for standby.Described high-speed mixing, rotating speed is 1800rpm/min, and the time is 12 minutes; Six Ge Duan district temperature of forcing machine are respectively: 200 DEG C, 210 DEG C, 220 DEG C, 230 DEG C, 220 DEG C, 210 DEG C, screw speed is 120rpm/min; Drying temperature is 110 DEG C, 10 hours time.
By the composite material granular injection moulding of above-mentioned drying, obtain described chemical treatment abandoned printed circuit board non-metal powder/polypropylene toughening matrix material; Injection moulding Ge Duan district temperature is 200 DEG C, 210 DEG C, 220 DEG C, 205 DEG C.
Detected result shows, the tensile strength of the matrix material of the present embodiment is 32.79MPa; Flexural strength is 30.68MPa; Shock strength is 36.74kJ/m
2.
Claims (7)
1. chemical treatment abandoned printed circuit board non-metal powder/polypropylene toughening matrix material, is characterized in that: described compound
The formula of material comprises polypropylene, chemical treatment abandoned printed circuit board non-metal powder, toughner, compatilizer, lubricant and oxidation inhibitor; The weight ratio of described polypropylene, chemical treatment abandoned printed circuit board non-metal powder, toughner, compatilizer, lubricant and oxidation inhibitor is (39 ~ 79): (10 ~ 50): (10 ~ 30): (5 ~ 25): (0.5 ~ 3): (0.5 ~ 2).
2. toughening composition according to claim 1, is characterized in that: described toughner be EVA, POE, EPDM,
One or both in POE grafted maleic anhydride POE-g-MAH or EPDM grafted maleic anhydride EPDM-G-MAH.
3. toughening composition according to claim 1, is characterized in that: described compatilizer is one or both in polypropylene grafted maleic anhydride PP-g-MAH, POE grafted maleic POE-g-MAH or EPDM grafted maleic anhydride EPDM-G-MAH; Described lubricant is polyethylene wax, oxidized polyethlene wax, whiteruss, stearic acid, calcium stearate or N, N ' one or both in-ethylene bis stearamide; Described oxidation inhibitor by four [β-(3,5-di-tert-butyl-hydroxy phenyl) propionic acid] pentaerythritol esters and tricresyl phosphite [2.4-di-tert-butyl-phenyl] ester with weight ratio 1:(1 ~ 3) compositely to form.
4. toughening composition according to claim 1, is characterized in that, described chemical treatment abandoned printed circuit board is non-
The preparation method of metal powder is as follows:
1. volume ratio 1:(3 ~ 8 by weight) g/mL, be that to join volumetric molar concentration be in the mineral acid of 1 ~ 8mol/L to 20 order ~ 180 object abandoned printed circuit board non-metal powders by particle diameter, react 0.5 ~ 30 hour at the temperature of 50 DEG C ~ 95 DEG C, reaction terminates rear filtration, with water, non-metal powder is washed till neutrality, drying, obtains mineral acid treatment abandoned printed circuit board non-metal powder;
2. be (90 ~ 94) by mineral acid treatment abandoned printed circuit board non-metal powder and chemical treatment regimens according to weight ratio: (6 ~ 10) are in the mixing of homogenizer high speed, dry after mixing, obtain chemical treatment abandoned printed circuit board non-metal powder; Wherein: described chemical treatment regimens be selected from certain herbaceous plants with big flowers acid, n-nonanoic acid, caproic acid, stearic acid one or both; Described high-speed mixing speed is 1500 ~ 2000rpm/min, and the time is 12 ~ 35min; After mixing, drying temperature is 100 ~ 140 DEG C, and the time is 2 ~ 12 hours.
5. toughening composition according to claim 4, it is characterized in that: step 1. in, the described particle diameter scrap stock that to be 20 order ~ 180 object abandoned printed circuit board non-metal powders produced by abandoned printed circuit board or the wiring board production process with components and parts through pulverizing, sorting and process of sieving obtain; Described mineral acid is one or both in sulfuric acid, hydrochloric acid or nitric acid.
6. a preparation method for chemical treatment abandoned printed circuit board non-metal powder/polypropylene toughening matrix material, it is characterized in that, concrete steps are as follows:
(1) printed-wiring board (PWB) non-metal powder is abandoned in preparative chemistry process
(2) extruding pelletization
First described polypropylene, chemical treatment abandoned printed circuit board non-metal powder, toughner, compatilizer, lubricant, oxidation inhibitor are mixed in proportion, through extruding pelletization, obtain toughening composition pellet; Again described toughening composition pellet is carried out drying treatment, obtain dried toughening composition pellet; Wherein: in described extruding pelletization process, the temperature in each section of district is all within the scope of 180 ~ 230 DEG C, and screw speed is 80 ~ 180rpm/min;
(3) injection moulding
Dried toughening composition pellet is carried out injection moulding, obtains chemical treatment abandoned printed circuit board non-metal powder/polypropylene toughening matrix material; Described injection moulding Ge Duan district temperature is between 180 ~ 230 DEG C.
7. preparation method according to claim 6, is characterized in that, in step (two), the temperature of drying treatment toughening composition pellet is 70 ~ 120 DEG C, and the time is 10 ~ 30 hours.
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| CN201610033507.6A CN105504516A (en) | 2016-01-19 | 2016-01-19 | Chemical treatment waste printed wiring board non-metal powder/polypropylene toughened composite material and preparation method thereof |
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| CN106750888A (en) * | 2016-11-10 | 2017-05-31 | 无锡市明盛强力风机有限公司 | A kind of method of waste printed circuit board reclaiming padded coaming |
| CN106824982A (en) * | 2017-01-06 | 2017-06-13 | 韶关市金鼎盛再生资源有限公司 | The production technology of resin section bar |
| CN107353482A (en) * | 2017-08-22 | 2017-11-17 | 上海第二工业大学 | A kind of modified abandoned printed substrate non-metal powder/composite polyolefine material and preparation method thereof |
| CN109337209A (en) * | 2018-10-15 | 2019-02-15 | 深圳市宜和勤环保科技有限公司 | A kind of composite material and preparation method of the nonmetallic powder preparation of printed wiring board |
| CN116082729A (en) * | 2023-02-01 | 2023-05-09 | 盐城工学院 | Preparation method of nonmetal powder/recycled polyolefin composite material of circuit board |
| CN116218067A (en) * | 2023-02-01 | 2023-06-06 | 盐城工学院 | Preparation method of circuit board nonmetal powder reinforced recycled polyethylene composite material |
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| CN104610651A (en) * | 2014-12-31 | 2015-05-13 | 上海第二工业大学 | Chemically-treated waste printed circuit board nonmetal powder/polypropylene composite material and preparation method thereof |
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| CN103923378A (en) * | 2013-01-10 | 2014-07-16 | 伟翔环保科技发展(上海)有限公司 | Waste paper-base printed circuit board recovery and reutilization method |
| CN104610651A (en) * | 2014-12-31 | 2015-05-13 | 上海第二工业大学 | Chemically-treated waste printed circuit board nonmetal powder/polypropylene composite material and preparation method thereof |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106750888A (en) * | 2016-11-10 | 2017-05-31 | 无锡市明盛强力风机有限公司 | A kind of method of waste printed circuit board reclaiming padded coaming |
| CN106824982A (en) * | 2017-01-06 | 2017-06-13 | 韶关市金鼎盛再生资源有限公司 | The production technology of resin section bar |
| CN107353482A (en) * | 2017-08-22 | 2017-11-17 | 上海第二工业大学 | A kind of modified abandoned printed substrate non-metal powder/composite polyolefine material and preparation method thereof |
| CN107353482B (en) * | 2017-08-22 | 2019-07-05 | 上海第二工业大学 | A kind of modified abandoned printed wiring board non-metal powder/composite polyolefine material and preparation method thereof |
| CN109337209A (en) * | 2018-10-15 | 2019-02-15 | 深圳市宜和勤环保科技有限公司 | A kind of composite material and preparation method of the nonmetallic powder preparation of printed wiring board |
| CN116082729A (en) * | 2023-02-01 | 2023-05-09 | 盐城工学院 | Preparation method of nonmetal powder/recycled polyolefin composite material of circuit board |
| CN116218067A (en) * | 2023-02-01 | 2023-06-06 | 盐城工学院 | Preparation method of circuit board nonmetal powder reinforced recycled polyethylene composite material |
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