CN106750888A - A kind of method of waste printed circuit board reclaiming padded coaming - Google Patents
A kind of method of waste printed circuit board reclaiming padded coaming Download PDFInfo
- Publication number
- CN106750888A CN106750888A CN201610989341.5A CN201610989341A CN106750888A CN 106750888 A CN106750888 A CN 106750888A CN 201610989341 A CN201610989341 A CN 201610989341A CN 106750888 A CN106750888 A CN 106750888A
- Authority
- CN
- China
- Prior art keywords
- padded coaming
- circuit board
- printed circuit
- waste printed
- crushed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
- C08L23/12—Polypropene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B9/00—Making granules
- B29B9/02—Making granules by dividing preformed material
- B29B9/06—Making granules by dividing preformed material in the form of filamentary material, e.g. combined with extrusion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/14—Applications used for foams
Abstract
The invention discloses the method that padded coaming is produced in a kind of reclaiming of waste printed circuit board, including：(1) after waste printed circuit board being removed into metal material, crushed；(2) the particle alkali cleaning for obtaining will be crushed, is washed after removal of impurities；(3) by the particle after washing and PP GRANULES according to 1:2‑1:4 weight is than mixing；(4) by well mixed mixture extruding pelletization；(5) particles fuse for obtaining step (4), is poured into mould, obtains the padded coaming of alveolate texture, obtains the padded coaming of honey comb structure, and the honey comb structure wall thickness is 0.5 1mm.The present invention is reclaimed by waste printed circuit board, and broken rear and polypropylene is used in mixed way preparation honeycomb padded coaming, for manufacturing bumper padded coaming, so as to realize recycling.
Description
Technical field
The present invention relates to technical field of automobile, more particularly to a kind of old circuit board reclaiming method.
Background technology
Since the nineties in 20th century, electronic information technology is developed rapidly.Abandoned printed circuit board is used as a kind of typical case
Electron wastes occur nearly in all of electronic product, enormous amount, species are various.World's printed circuit board (PCB) in recent years
Up to 8.7%, south east asia annual growth is 10.8% to industry annual average rate of increase, and the growth rate of China is up to
14.4%, its yield has occupied first place in the world.China's Mainland needs the waste printed circuit board disposed more than 500,000 tons every year.
How to process the waste printed circuit board of enormous amount has turned into what is faced including the electronic information industry big country including China
Common issue.About 30% macromolecular material, 30% indifferent oxide and 40% metal are usually contained in printed substrate.
Wherein the recovery and utilization technology of metal ingredient is quite ripe, but accounts for more than 60% nonmetallic materials usually by as rubbish
Rubbish is abandoned, burns or filled.This not only brings huge pressure while also result in the huge wasting of resources to environment.
The research of WPCBN recyclings is focused primarily upon at present be used as thermosetting resin (such as epoxy resin and
Phenolic resin) or thermoplastic resin (such as polypropylene) filler, waste printed circuit board non-metal powder and the new polypropylene system such as Wang Xinjie
For composite, shadow of the factors such as non-metal powder particle diameter, addition to composite materials property has been investigated in these researchs
Ring, indicate the feasibility of the method.But its particular use is not fully up to expectations.
Therefore recycled after how above-mentioned waste printed circuit board to be reclaimed, be one of technical barrier of this area.
The content of the invention
It is an object of the invention to propose a kind of method that padded coaming is produced in waste printed circuit board reclaiming, can make
Obtain waste printed circuit board to be reclaimed, the material after treatment is used as manufacture bumper buffering.
It is that, up to this purpose, the present invention uses following technical scheme：
The method that padded coaming is produced in a kind of reclaiming of waste printed circuit board, including：
(1) after waste printed circuit board being removed into metal material, crushed；
(2) the particle alkali cleaning for obtaining will be crushed, is washed after removal of impurities；
(3) by the particle after washing and PP GRANULES according to 1:2-1:4 weight is than mixing；
(4) by well mixed mixture extruding pelletization；
(5) particles fuse for obtaining step (4), is poured into mould, obtains the padded coaming of alveolate texture, obtains honeybee
The padded coaming of nido structure, the honey comb structure wall thickness is 0.5-1mm.
Padded coaming of the present invention, uses it for itself energy-absorbing type car bumper system, and it includes outside plate, inner panel
With middle padded coaming.
It is of the invention initiative that WPCBN as filler is mixed with PP GRANULES and obtains composite, it is described multiple
The stretching of condensation material, impact strength are gradually reduced with the increase of WPCBN consumptions, and bending strength then increases therewith.It is contained in WPCBN
Glass fibre be a kind of rigid filled, result in the rigidity reinforced of composite, increase bending strength.Therefore it is particularly suitable
For preparing energy-absorbing material.
Waste printed circuit board is reclaimed and is prepared into cellular padded coaming by the present invention, is placed in after bumper outside plate,
Outside plate is subject to energy-absorbing after external force collision.When impact is smaller, only there is elastic deformation in the alveolate texture, prevent from protecting
Dangerous thick stick outside plate rupture tears.When impact is larger, the alveolate texture energy-absorbing crumple can be conducive to the protection of passenger.
The present invention will reclaim the waste and old printed circuit board for obtaining removing after metal material and be prepared into particle, as filler with it is poly-
Propylene mixes, and then is prepared into the padded coaming for honey comb structure, realizes refuse reclamation.
Specific embodiment
Technical scheme is further illustrated below by specific embodiment.
Embodiment 1
The method that padded coaming is produced in a kind of reclaiming of waste printed circuit board, including：
(1) after waste printed circuit board being removed into metal material, crushed；
(2) the particle alkali cleaning for obtaining will be crushed, is washed after removal of impurities；
(3) by the particle after washing and PP GRANULES according to 1:2 weight is than mixing；
(4) by well mixed mixture extruding pelletization；
(5) particles fuse for obtaining step (4), is poured into mould, obtains the padded coaming of alveolate texture, obtains honeybee
The padded coaming of nido structure, the honey comb structure wall thickness is 0.5mm.
Embodiment 2
The method that padded coaming is produced in a kind of reclaiming of waste printed circuit board, including：
(1) after waste printed circuit board being removed into metal material, crushed；
(2) the particle alkali cleaning for obtaining will be crushed, is washed after removal of impurities；
(3) by the particle after washing and PP GRANULES according to 1:4 weight is than mixing；
(4) by well mixed mixture extruding pelletization；
(5) particles fuse for obtaining step (4), is poured into mould, obtains the padded coaming of alveolate texture, obtains honeybee
The padded coaming of nido structure, the honey comb structure wall thickness is 1mm.
Embodiment 3
The method that padded coaming is produced in a kind of reclaiming of waste printed circuit board, including：
(1) after waste printed circuit board being removed into metal material, crushed；
(2) the particle alkali cleaning for obtaining will be crushed, is washed after removal of impurities；
(3) by the particle after washing and PP GRANULES according to 1:3 weight is than mixing；
(4) by well mixed mixture extruding pelletization；
(5) particles fuse for obtaining step (4), is poured into mould, obtains the padded coaming of alveolate texture, obtains honeybee
The padded coaming of nido structure, the honey comb structure wall thickness is 0.8mm.
Test proves that, the bumper padded coaming prepared using recycling method described herein,
In impact test, honey comb structure energy-absorbing effect is good.
Claims (1)
1. the method that padded coaming is produced in a kind of reclaiming of waste printed circuit board, including：
(1) after waste printed circuit board being removed into metal material, crushed；
(2) the particle alkali cleaning for obtaining will be crushed, is washed after removal of impurities；
(3) by the particle after washing and PP GRANULES according to 1:2-1:4 weight is than mixing；
(4) by well mixed mixture extruding pelletization；
(5) particles fuse for obtaining step (4), is poured into mould, obtains the padded coaming of alveolate texture, obtains honeycomb
The padded coaming of structure, the honey comb structure wall thickness is 0.5-1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610989341.5A CN106750888A (en) | 2016-11-10 | 2016-11-10 | A kind of method of waste printed circuit board reclaiming padded coaming |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610989341.5A CN106750888A (en) | 2016-11-10 | 2016-11-10 | A kind of method of waste printed circuit board reclaiming padded coaming |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106750888A true CN106750888A (en) | 2017-05-31 |
Family
ID=58973594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610989341.5A Pending CN106750888A (en) | 2016-11-10 | 2016-11-10 | A kind of method of waste printed circuit board reclaiming padded coaming |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106750888A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102002185A (en) * | 2010-10-29 | 2011-04-06 | 广东工业大学 | Method for preparing polypropylene composite material by glass fibers recycled from waste circuit boards |
| CN102675736A (en) * | 2012-04-26 | 2012-09-19 | 中国电器科学研究院有限公司 | Recycled composite material for enhancing modified waste polypropylene by using waste printed circuit board powder/glass fiber and preparation method of recycled composite material |
| CN104387660A (en) * | 2014-08-28 | 2015-03-04 | 天津市利顺塑料制品有限公司 | Nonmetal modified polypropylene plastic in waste and old circuit boards and preparation method thereof |
| CN104610651A (en) * | 2014-12-31 | 2015-05-13 | 上海第二工业大学 | Chemically-treated waste printed circuit board nonmetal powder/polypropylene composite material and preparation method thereof |
| CN105504516A (en) * | 2016-01-19 | 2016-04-20 | 上海第二工业大学 | Chemical treatment waste printed wiring board non-metal powder/polypropylene toughened composite material and preparation method thereof |
-
2016
- 2016-11-10 CN CN201610989341.5A patent/CN106750888A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102002185A (en) * | 2010-10-29 | 2011-04-06 | 广东工业大学 | Method for preparing polypropylene composite material by glass fibers recycled from waste circuit boards |
| CN102675736A (en) * | 2012-04-26 | 2012-09-19 | 中国电器科学研究院有限公司 | Recycled composite material for enhancing modified waste polypropylene by using waste printed circuit board powder/glass fiber and preparation method of recycled composite material |
| CN104387660A (en) * | 2014-08-28 | 2015-03-04 | 天津市利顺塑料制品有限公司 | Nonmetal modified polypropylene plastic in waste and old circuit boards and preparation method thereof |
| CN104610651A (en) * | 2014-12-31 | 2015-05-13 | 上海第二工业大学 | Chemically-treated waste printed circuit board nonmetal powder/polypropylene composite material and preparation method thereof |
| CN105504516A (en) * | 2016-01-19 | 2016-04-20 | 上海第二工业大学 | Chemical treatment waste printed wiring board non-metal powder/polypropylene toughened composite material and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 韩爱民 主编: "《汽车运用基础》", 31 January 2014, 中央广播电视大学出版社 * |
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| SE01 | Entry into force of request for substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170531 |
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