KR20230108486A - Apparatus and method for recycling waste PCB - Google Patents

Abstract

The present invention is implemented to recycle waste PCB by mixing non-metallic fraction of waste PCB (NMF-PCB) from which metal components of waste PCB are removed with polyethylene (PE) to manufacture a polyolefin composite It relates to a waste PCB recycling device and method, wherein the NMF-PCB supply unit supplies NMF-PCB from which metal components of the waste PCB are removed; The polyethylene supply unit supplies polyethylene; The mixing unit mixes the NMF-PCB supplied from the NMF-PCB supply unit and the polyethylene supplied from the polyethylene supply unit to prepare a polyolefin composite.

Description

Waste PCB recycling apparatus and method {Apparatus and method for recycling waste PCB}

The technical field of the present invention relates to a waste PCB recycling apparatus and method, and in particular, NMF-PCB (non-metallic fraction of waste PCB) from which metal components of waste PCB are removed is mixed with polyethylene (PE) to polyolefin. It relates to a device and method for recycling waste PCBs manufactured with a (polyolefin) composite and implemented to recycle waste PCBs.

According to UN statistics in 2016, e-waste amounts to about 45 million tons, but only 20 (%) is recycled, and the rest is disposed of in landfills or incineration. In addition, about 5 (wt%) of electronic waste is PCB (printed circuit board), and metals such as aluminum, copper, gold, lithium, nickel, tin, zinc, palladium, and platinum are recovered and used through crushing and sorting of the PCB. However, in the case of NMF-PCB (non-metallic fraction of waste PCB), it is currently at the level of landfill or incineration.

Korea Patent Registration No. 10-0226228 (registered on July 26, 1999) first classifies electronic components and solder on the PCB by a heating method, and then completely classifies/recovers the resin powder and residual metal from the classified PCB so that it does not cause pollution. A PCB recycling device and method capable of recovering all recyclable parts and materials from waste PCBs at a high recovery rate and a method therefor are disclosed. A melting classification device that melts the solder for fixing electronic components mounted on the PCB, collects and classifies the solder from the waste PCB to the lower side, physically separates the upper and lower electronic components, and discharges the PCB from which the electronic components and solder are removed. It is characterized in that it consists of a PCB pulverization and classification device for sequentially pulverizing and pulverizing the PCBs discharged from the classification device and then classifying a mixture of metal powder and resin powder using a difference in weight. According to the disclosed technology, the electronic components and solder on the PCB board are first classified by a heating method, and then the classified PCB is pulverized through a rough pulverization process by a cutting + shear type grinder and a fine pulverization process by a compression + shear type grinder, , It is possible to recover all recyclable parts and materials from waste PCBs with a high recovery rate without causing pollution by completely classifying/recovering resin powder and residual metal by gravity classification.

Korean Patent Registration No. 10-2169313 (registered on October 19, 2020) increases the recycling of waste PCBs by pulverizing waste PCBs and then separating metals and other materials from the pulverized waste PCB particles by wind power and electrostatic separation. , Disclosed is an eco-friendly waste PCB recycling facility that does not use explosives. According to the disclosed technology, a hammer crusher having a crushing unit and a perforated network therein to crush the waste PCB into waste PCB particles of a certain size; A mill crusher for finely pulverizing waste PCB particles supplied from the hammer crusher into waste PCB fine particles; a screen sorter that selects the particle size of waste PCB microparticles discharged from the mill; A wind power gravity sorter that separates the primary copper component by sorting the waste PCB microparticles from the screen sorter by specific gravity by wind power; and an electrostatic separator for separating secondary copper components by electrostatic separation by applying voltage to the waste PCB fine particles discharged from the wind gravity gravity separator, and conveying the waste PCB particles pulverized by the hammer crusher between the hammer crusher and the mill crusher. A first cyclone that receives and filters the primary waste PCB particles in a cyclone method and a vibration feeder that vibrates the waste PCB particles discharged from the first cyclone to enable uniform transportation of the waste PCB particles are installed, and a wheat grinder and a screen sorter are installed. A second cyclone is installed between the screen sorter and the wind gravity sorter to receive the finely ground waste PCB fine particles from the mill grinder and filter the secondary waste PCB particles in a cyclone method. A screw conveyor is installed to transfer the particles to the wind gravity gravity separator by the rotational force of the spiral screw. Between the wind gravity gravity separator and the electrostatic separator, the waste PCB microparticles sorted by the wind gravity gravity separator are transferred and the secondary waste PCB particles are separated by a cyclone method. A third cyclone for filtering is installed, and the grinding unit is formed in a drum shape that rotates around the rotation axis on both sides, and a circular spacer plate disposed at regular intervals, a connecting shaft connecting the spacer plate to each other in a radial manner, , It includes a plurality of grinding blades fastened at regular intervals on the connecting shaft between the spacing plates, and the grinding blade includes a grinding blade portion made of a fan shape and a main body portion made of a square shape and having a coupling hole, and the grinding blade portion A plurality of teeth are formed on both sides of the main body portion adjacent to, and the mill grinder has a grinding body in which waste PCB particles are finely pulverized, an impeller accommodated in the grinding body to finely pulverize waste PCB particles, and along the outer circumference of the impeller It includes wheat grinding blade blocks combined at regular intervals, but in the grinding body, mixed powder consisting of 30 to 40 parts by weight of chromium (Cr), 0.5 to 2 parts by weight of titanium (Ti) and 3 to 7 parts by weight of nickel (Ni) It is characterized in that the thermal spray coating is formed by thermal spraying, and the mill grinding blade block is forged with special steel (SKD11).

In the conventional technology as described above, NMF-PCB, which accounts for about 60 (wt%) of the total waste PCB, becomes microplastics during the grinding process and becomes a major cause of environmental pollution, which is an epoxy-based insoluble polymer material. However, there is still a disadvantage that its utilization is insufficient because it cannot be re-molded. Therefore, recycling NMF-PCBs that are landfilled or incinerated is an urgent task and is in line with the government's carbon neutral policy.

In the conventional technology as described above, in relation to the recycling of waste PCBs among a large amount of electronic industrial waste, recovering metal resources of high recycling value such as gold, silver, copper, and rare earth metals among waste PCBs, landfill or Research on the recycling of NMF-PCB to be incinerated is needed. In other words, for NMF-PCB. It has the disadvantage of causing environmental pollution because it is treated at a landfill or incineration plant for a fee, and also, the treatment of NMF-PCB waste in the form of powder has a very high risk of causing secondary environmental pollution as well as additional cost. Therefore, it will be said that NMF-PCB recycling and upcycling-related research is absolutely necessary.

Korean Patent Registration No. 10-0226228 Korean Patent Registration No. 10-2169313

The problem to be solved by the present invention is to solve the above-mentioned disadvantages or needs, NMF-PCB (non-metallic fraction of waste PCB) from which metal components of waste PCB are removed is polyethylene (PE) ) to provide a waste PCB recycling device and method implemented to recycle waste PCBs by manufacturing them into a polyolefin composite.

As a means for solving the above problems, according to one feature of the present invention, the NMF-PCB supply unit for supplying the NMF-PCB from which the metal component of the waste PCB is removed; A polyethylene supply unit that supplies polyethylene; and a mixing unit for producing a polyolefin composite by mixing the NMF-PCB supplied from the NMF-PCB supply unit and the polyethylene supplied from the polyethylene supply unit.

In one embodiment, the NMF-PCB supply unit is characterized in that by using a grinding device to pulverize the NMF-PCB to supply the powdery NMF-PCB to the mixing unit.

In one embodiment, the NMF-PCB supply unit, after crushing the waste PCB, recovers the metal by a dry method or a wet method, and supplies the recovered NMF-PCB to the mixing unit as a polyolefin reinforcing material. .

In one embodiment, the NMF-PCB supply unit is characterized in that it supplies NMF-PCB containing 50 to 60 percent of glass fibers to the mixing unit.

In one embodiment, the mixing unit is characterized in that the NMF-PCB supplied from the NMF-PCB supply unit is mixed with the polyethylene supplied from the polyethylene supply unit to contain 30 to 60 percent.

In one embodiment, the mixing unit is characterized by adding 50 to 60 percent of the NMF-PCB supplied from the NMF-PCB supply unit to the polyethylene supplied from the polyethylene supply unit.

In one embodiment, the mixing unit is characterized in that the NMF-PCB supplied from the NMF-PCB supply unit is mixed with the polyethylene supplied from the polyethylene supply unit to contain 30%.

In one embodiment, the mixing unit, the mixing unit 130, is characterized in that the NMF-PCB content supplied from the NMF-PCB supply unit is added to the polyethylene supplied from the polyethylene supply unit by 50%.

In one embodiment, the mixing unit is characterized in that the NMF-PCB supplied from the NMF-PCB supply unit is added to the polyethylene supplied from the polyethylene supply unit at 60%.

In one embodiment, the waste PCB recycling apparatus is characterized in that it further comprises a compatibilizer supply unit for supplying compatibilizers of TU300T, TU300CB and EM101 to the mixing unit.

In one embodiment, the mixing unit, after mixing the NMF-PCB supplied from the NMF-PCB supply unit with the polyethylene supplied from the polyethylene supply unit, TU300T, TU300CB and EM101 supplied from the compatibilizer supply unit each 2% It is characterized by adding more.

In one embodiment, the mixing unit adds 50 to 60% of the NMF-PCB supplied from the NMF-PCB supply unit to the polyethylene supplied from the polyethylene supply unit, and TU300T, TU300CB and EM101 are added by 2% each characterized in that it is added.

In one embodiment, the waste PCB recycling device is characterized in that it further comprises a water supply unit for supplying water to the mixing unit.

In one embodiment, the waste PCB recycling device further comprises a dehumidifying or humidifying device unit for measuring moisture in the NMF-PCB supplied from the NMF-PCB supply unit and dehumidifying or supplying moisture to a desired moisture content. do.

In one embodiment, the mixing unit is characterized in that the NMF-PCB supplied from the NMF-PCB supply unit is used by containing 5 to 10% of moisture.

In one embodiment, the mixing unit is characterized in that the NMF-PCB supplied from the NMF-PCB supply unit is used without moisture.

In one embodiment, the waste PCB recycling device is characterized in that it further comprises a cross-linking agent supply unit for supplying a cross-linking agent to the mixing unit.

In one embodiment, the mixing unit is characterized in that, after adding the NMF-PCB supplied from the NMF-PCB supply unit to the polyethylene supplied from the polyethylene supply unit without water, a crosslinking agent is further added to prepare a polyolefin composite.

In one embodiment, the mixing unit, after adding 5 to 10 percent of moisture to the NMF-PCB supplied from the NMF-PCB supply unit, added to the polyethylene supplied from the polyethylene supply unit, and then further adding a crosslinking agent to prepare a polyolefin composite It is characterized by doing.

As a means for solving the above problems, according to another feature of the present invention, NMF-PCB supply unit supplying the NMF-PCB from which the metal component of the waste PCB is removed; supplying polyethylene supply unit polyethylene; and a mixing unit mixing the NMF-PCB supplied from the NMF-PCB supply unit and the polyethylene supplied from the polyethylene supply unit to prepare a polyolefin composite.

As an effect of the present invention, NMF-PCB (non-metallic fraction of waste PCB) from which the metal component of waste PCB is removed is mixed with polyethylene (PE) to produce a polyolefin composite, thereby reducing waste PCB. By providing a waste PCB recycling device and method implemented to recycle, it is possible to increase national industrial competitiveness through import substitution and cost reduction through recycling and reproduction of industrial waste resources, and to minimize the generation of waste generated from inefficient use of resources for the environment. Social costs caused by the problem can be reduced, and by securing new products, companies can diversify their products and expand employment.

1 is a diagram illustrating a waste PCB recycling device according to an embodiment of the present invention.
FIG. 2 is a view showing the synthesis effect on the tensile strength of the polyolefin composite prepared in the mixing section shown in FIG. 1. FIG.
FIG. 3 is a view showing the synthesis effect on the modulus of the polyolefin composite prepared in the mixing section shown in FIG. 1. FIG.
4 is a view showing the effect of moisture and synthesis on the tensile strength of the polyolefin composite prepared in the mixing section shown in FIG.
5 is a view showing the effect of moisture and synthesis on the modulus of the polyolefin composite prepared in the mixing section shown in FIG.
6 is a view showing the effect of NMF-PCB and synthesis on the flexural strength of the polyolefin composite prepared in the mixing section shown in FIG.
7 is a view showing the effect of NMF-PCB and synthesis on the flexural modulus of the polyolefin composite prepared in the mixing section shown in FIG.
8 is a view showing the effect of moisture and synthesis on the flexural strength of the polyolefin composite prepared in the mixing section shown in FIG.
9 is a view showing the effect of moisture and synthesis on the flexural modulus of the polyolefin composite prepared in the mixing section shown in FIG.
10 is a view showing a fracture surface of polyethylene supplied from the polyethylene supply unit shown in FIG.
FIG. 11 is a view showing a fracture surface of a polyolefin composite prepared without moisture in the mixing section shown in FIG. 1 .
12 is a view showing a fracture surface of a polyolefin composite prepared by containing 5 (wt%) water in the mixing section shown in FIG.
13 is a view showing a fracture surface of a polyolefin composite prepared by containing 10 (wt%) moisture in the mixing section shown in FIG.
14 and 15 are diagrams showing fracture surfaces of polyolefin composites prepared by adding a crosslinking agent without moisture in the mixing section shown in FIG. 1 .
16 is a view showing a fracture surface of a polyolefin composite prepared by adding a crosslinking agent and containing 5 (wt%) moisture in the mixing section shown in FIG.
17 is a view showing a fracture surface of a polyolefin composite prepared by adding a crosslinking agent and containing 10 (wt%) moisture in the mixing section shown in FIG.
18 and 19 are views showing fracture surfaces of polyolefin composites prepared by adding TU300T and containing 10 (wt%) moisture in the mixing section shown in FIG.
20 and 21 are views showing fracture surfaces of polyolefin composites prepared by adding TU300T without moisture in the mixing section shown in FIG.
22 is a diagram for explaining a waste PCB recycling method according to an embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily carry out the present invention. However, since the description of the present invention is only an embodiment for structural or functional description, the scope of the present invention should not be construed as being limited by the embodiments described in the text. That is, since the embodiment can be changed in various ways and can have various forms, it should be understood that the scope of the present invention includes equivalents capable of realizing the technical idea. In addition, since the object or effect presented in the present invention does not mean that a specific embodiment should include all of them or only such effects, the scope of the present invention should not be construed as being limited thereto.

The meaning of terms described in the present invention should be understood as follows.

Terms such as "first" and "second" are used to distinguish one component from another, and the scope of rights should not be limited by these terms. For example, a first element may be termed a second element, and similarly, a second element may be termed a first element. It should be understood that when an element is referred to as “connected” to another element, it may be directly connected to the other element, but other elements may exist in the middle. On the other hand, when an element is referred to as being “directly connected” to another element, it should be understood that no intervening elements exist. Meanwhile, other expressions describing the relationship between components, such as “between” and “immediately between” or “adjacent to” and “directly adjacent to” should be interpreted similarly.

Singular expressions should be understood to include plural expressions unless the context clearly dictates otherwise, and terms such as “comprise” or “having” refer to a described feature, number, step, operation, component, part, or It should be understood that it is intended to indicate that a combination exists, and does not preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

All terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs, unless defined otherwise. Terms defined in commonly used dictionaries should be interpreted as consistent with meanings in the context of related art, and cannot be interpreted as having ideal or excessively formal meanings unless explicitly defined in the present invention.

Now, a waste PCB recycling apparatus and method according to an embodiment of the present invention will be described in detail with reference to the drawings.

1 is a view illustrating a waste PCB recycling apparatus according to an embodiment of the present invention, FIG. 2 is a view showing the synthesis effect on the tensile strength of the polyolefin composite prepared in the mixing unit shown in FIG. 1, and FIG. 1 is a view showing the synthesis effect on the modulus of the polyolefin composite prepared in the mixing section shown in FIG. 4 is a view showing the effect of moisture and synthesis on the tensile strength of the polyolefin composite prepared in the mixing section shown in FIG. 5 is a view showing the effect of moisture and synthesis on the modulus of the polyolefin composite prepared in the mixing section shown in FIG. 1, and FIG. 6 is NMF-PCB and synthesis on the flexural strength of the polyolefin composite prepared in the mixing section shown in FIG. 7 is a view showing the effect of NMF-PCB and synthesis on the flexural modulus of the polyolefin composite prepared in the mixing section shown in FIG. 1, and FIG. 8 is a polyolefin prepared in the mixing section shown in FIG. Figure 9 is a view showing the effect of moisture and synthesis on the flexural strength of the composite, Figure 9 is a view showing the effect of moisture and synthesis on the flexural modulus of the polyolefin composite prepared in the mixing section shown in Figure 1, Figure 10 is shown in Figure 1 It is a view showing the fracture surface of polyethylene supplied from the polyethylene supply unit, FIG. 11 is a view showing the fracture surface of the polyolefin composite prepared without moisture in the mixing unit shown in FIG. 1, and FIG. 13 is a view showing the fracture surface of a polyolefin composite prepared by containing 5 (wt%) water, and FIG. 13 shows a fracture surface of a polyolefin composite prepared by containing 10 (wt%) water in the mixing section shown in FIG. 14 and 15 are views showing the fracture surface of a polyolefin composite prepared by adding a crosslinking agent without moisture in the mixing unit shown in FIG. 1, and FIG. 16 is a view showing a fracture surface of 5 (wt%) ) A view showing the fracture surface of a polyolefin composite prepared by adding a crosslinking agent and containing water, and FIG. 18 and 19 are views showing the fracture surface of a polyolefin composite prepared by adding TU300T and containing 10 (wt%) moisture in the mixing section shown in FIG. 1, FIG. 20 and FIG. 21 is a view showing the fracture surface of the polyolefin composite prepared by adding TU300T without moisture in the mixing section shown in FIG.

1 to 21, the waste PCB recycling device 100 includes a non-metallic fraction of waste PCB (NMF-PCB) supply unit 110, a polyethylene (PE) supply unit 120, and a mixing unit 130. includes

The NMF-PCB supply unit 110 supplies NMF-PCB from which metal components of the waste PCB are removed to the mixing unit 130.

In one embodiment, the NMF-PCB supply unit 110 may pulverize the NMF-PCB using a pulverizer and supply the powdered NMF-PCB to the mixing unit 130 .

In one embodiment, the NMF-PCB supply unit 110, in order to recover metal, which is a major resource from the waste PCB, recovers the metal by dry method or wet method (mainly used a lot) after grinding the waste PCB, and recovers the metal NMF-PCB may be supplied to the mixing unit 130.

In one embodiment, the NMF-PCB supply unit 110 causes microplastic contamination because NMF-PCB is powdered through a grinding process, and in the case of NMF-PCB powder, curing epoxy is the main material, so It is impossible to mold, but it can be used as a polymer reinforcing material due to the high content of glass fiber (GF), and thus, powdery NMF-PCB can be supplied to the mixing unit 130 to be used as a polyolefin reinforcing material.

In one embodiment, the NMF-PCB supply unit 110 may supply the NMF-PCB to the mixing unit 130 such that about 50 to 60 (wt%) of glass fibers (GF) are included.

The polyethylene supply unit 120 supplies polyethylene to the mixing unit 130 .

The mixing unit 130 receives NMF-PCB from the NMF-PCB supply unit 110 and polyethylene from the polyethylene supply unit 120, and mixes the supplied NMF-PCB and polyethylene to form a polyolefin composite. it does Here, wt% refers to the weight percent added when the polyethylene supplied from the polyethylene supply unit 120 is 100.

In one embodiment, the mixing unit 130 is NMF-PCB supplied from the NMF-PCB supply unit 110 at 30 (wt%) or polyethylene supplied from the polyethylene supply unit 120 to contain 30 (wt%) or more. By mixing in to prepare a polyolefin composite, the mechanical strength of the polyolefin composite compared to general polyolefin can be 200% or more.

In one embodiment, the mixing unit 130 may add 30 to 60 (wt%) of the NMF-PCB supplied from the NMF-PCB supply unit 110 to the polyethylene supplied from the polyethylene supply unit 120. there is.

In one embodiment, the mixing unit 130 receives powdered NMF-PCB from the NMF-PCB supply unit 110 and uses it as a reinforcing material for polyolefin and mixes it with polyethylene supplied from the polyethylene supply unit 120 to form a polyolefin composite. By manufacturing, it is possible to obtain high-strength polyolefin composites as well as recycling waste PCBs.

The waste PCB recycling device 100 having the configuration as described above, when manufacturing the waste PCB (in particular, NMF-PCB) as a polyolefin composite for recycling, the NMF-PCB supplied from the NMF-PCB supply unit 110 NMF-PCB can be recycled by mixing it with polyethylene supplied from the polyethylene supply unit 120 to prepare a polyolefin composite with a PE composite.

The waste PCB recycling device 100 having the configuration described above may further include a compatibilizer supply unit 140 .

The compatibilizer supply unit 140 supplies TU300T, TU300CB, and EM101 to the mixing unit 130 as compatibilizers.

In one embodiment, the mixing unit 130, after mixing the NMF-PCB supplied from the NMF-PCB supply unit 110 with the polyethylene supplied from the polyethylene supply unit 120, TU300T supplied from the compatibilizer supply unit 140 , TU300CB and EM101 compatibilizers may be further added by 2 (wt%) each to prepare a polyolefin composite. At this time, TU300T, TU300CB and EM101 are to use three types provided by Lotte Chemical as compatibilizers.

In one embodiment, the mixing unit 130, for the tensile test (Tensile test) of the mechanical properties, NMF-PCB supplied from the NMF-PCB supply unit 110 to the polyethylene supplied from the polyethylene supply unit 120, 30, 40, 50, 60, 70, 80 (wt%) can be added to prepare the first polyolefin composite, and NMF-PCB supplied from the NMF-PCB supply unit 110 to the polyethylene supplied from the polyethylene supply unit 120 30, 40, 50, 60, 70, 80 (wt%) may be added, and TU300T, TU300CB, and EM101 may be further added by 2 (wt%) each as a compatibilizer.

In one embodiment, the mixing unit 130, looking at the change in tensile strength and modulus of the first polyolefin composite and the second polyolefin composite prepared as described above, as shown in FIGS. 2 and 3 can let you Here, FIG. 2 is a view showing the effect of compatibilizer on tensile strength of PE composites of the first polyolefin composite and the second polyolefin composite prepared in the mixing unit shown in FIG. 1, and FIG. 1 is a diagram showing the effect of compatibilizer on modulus of PE composites of the first polyolefin composite and the second polyolefin composite prepared in the mixing unit.

2 and 3, it can be seen that the tensile strength and modulus of the first polyolefin composite and the second polyolefin composite increase as the content of the NMF-PCB supplied from the NMF-PCB supply unit 110 increases, , When the content of NMF-PCB supplied from the NMF-PCB supply unit 110 was 60 (wt%), it increased to 150 (%) and 270 (%), respectively, but it can be seen that it decreases rapidly at 70% or more . Accordingly, the mixing unit 130 will preferably add the content of NMF-PCB supplied from the NMF-PCB supply unit 110 to the polyethylene supplied from the polyethylene supply unit 120 at 60 (wt%).

2 and 3, when the content of NMF-PCB supplied from the NMF-PCB supply unit 110 is 50 (wt%), TU300T, TU300CB and EM101 are further added as compatibilizers by 2 (wt%) each It can be seen that the values of tensile strength and modulus increase to 30 ~ 40 (%) than when one case is not added, which is the main component of the NMF-PCB supplied from the NMF-PCB supply unit 110 (epoxy). ) and glass fibers. However, it can be seen that when the content of NMF-PCB supplied from the MF-PCB supply unit 110 is used at 70 (wt%) or more, it decreases even when a compatibilizer is used. Accordingly, the mixing unit 130 adds the content of the NMF-PCB supplied from the NMF-PCB supply unit 110 to the polyethylene supplied from the polyethylene supply unit 120 at 50 to 60 (wt%) and also uses TU300T as a compatibilizer. , it would be preferable to add 2 (wt%) each of TU300CB and EM101 more.

The waste PCB recycling device 100 having the configuration described above may further include a water supply unit 150. Alternatively, the waste PCB recycling device 100 having the configuration described above measures the moisture in the NMF-PCB supplied from the NMF-PCB supply unit 110 and dehumidifies or supplies moisture to a desired moisture content, or It may further include a humidifier unit (not shown in the drawing for convenience of description).

The water supply unit 150 supplies water to the mixing unit 130.

In one embodiment, the mixing unit 130 may be used by containing 10 (wt%) of water supplied to the water supply unit 150 in the NMF-PCB supplied from the NMF-PCB supply unit 110. When using this 10 (wt%) NMF-PCB, TU300T, which is effective as a compatibilizer, is used to measure the tensile strength and modulus of the effect of moisture, and the results can be shown in comparison with FIGS. 4 and 5 . Here, FIG. 4 is a view showing the effect of H 2 O and compatibilizer on tensile strength _of PE composites on the tensile strength of the first polyolefin composite and the second polyolefin composite prepared in the mixing unit shown in FIG. 5 is a view showing the effect of H 2 O and compatibilizer on modulus _of PE composites on the modulus of the first polyolefin composite and the second polyolefin composite prepared in the mixing unit shown in FIG.

In one embodiment, the mixing unit 130 may be used without moisture in the NMF-PCB supplied from the NMF-PCB supply unit 110.

In Figures 4 and 5, it can be seen that the tensile strength and modulus increase even when the NMF-PCB without moisture is added with the content of 60 (wt%), but the NMF with 10 (wt%) moisture -In the case of using PCB, it can be seen that the value decreases when the content of NMF-PCB is 50 (wt%) or more because the total moisture content increases as the content of NMF-PCB increases. This result is because a significant amount of moisture was volatilized during the composite manufacturing process because it was carried out in an open system, but it is difficult to predict that the same result will be obtained because it is carried out in a closed system in industrial mass production. will be. In addition, even when using TU300T added to increase the compatibility of the NMF-PCB supplied from the NMF-PCB supply unit 110 and the polyethylene supplied from the polyethylene supply unit 120, there is no significant change in the tensile strength and modulus of the polyolefin composite can know

In one embodiment, the mixing unit 130, in order to evaluate the strength of the polyolefin composite through a flexural test of mechanical properties, the polyethylene supplied from the polyethylene supply unit 120 from the NMF-PCB supply unit 110 The first polyolefin composite can be prepared by adding 30, 40, 50, 60, 70, 80 (wt%) of the supplied NMF-PCB, and also to the polyethylene supplied from the polyethylene supply unit 120, the NMF-PCB supply unit ( 110), 30, 40, 50, 60, 70, and 80 (wt%) of NMF-PCB may be added, and 2 (wt%) of each of TU300T, TU300CB, and EM101 as compatibilizers may be further added.

In one embodiment, the mixing unit 130, looking at the change in flexural strength and modulus of the first polyolefin composite and the second polyolefin composite prepared as described above, will be as shown in FIGS. 6 and 7 can Here, FIG. 6 shows the effect of NMF-PCB and compatibilizer on flexural strength of PE composites on the flexural strength of the first polyolefin composite and the second polyolefin composite prepared in the mixing unit shown in FIG. 7 is a view showing the effect of NMF-PCB and compatibilizer on flexural modulus of PE composites on the flexural modulus of the first polyolefin composite and the second polyolefin composite prepared in the mixing unit shown in FIG. ) is a drawing showing.

6 and 7, it can be seen that the flexural strength and modulus of the first polyolefin composite and the second polyolefin composite increase as the content of the NMF-PCB supplied from the NMF-PCB supply unit 110 increases, , It can be seen that when the content of NMF-PCB supplied from the NMF-PCB supply unit 110 was 50 (wt%), it increased to 240 (%) and 700 (%), respectively. Accordingly, the mixing unit 130 will say that it is preferable to add 50 (wt%) of the NMF-PCB supplied from the NMF-PCB supply unit 110 to the polyethylene supplied from the polyethylene supply unit 120.

6 and 7, when the content of the NMF-PCB supplied from the NMF-PCB supply unit 110 is 50 (wt%), TU300T, TU300CB and EM101 are further added by 2 (wt%) each as a compatibilizer It can be seen that the value of flexural strength increases to 60 (%) than when one case is not added, and also when NMF-PCB supplied from the MF-PCB supply unit 110 is added at 70 (wt%) It can be seen that there is a continuous increase in Similar to the results in tensile strength, it can be seen that the compatibility between NMF-PCB and PE increased with the introduction of the compatibilizer. Accordingly, the mixing unit 130 adds the content of the NMF-PCB supplied from the NMF-PCB supply unit 110 to the polyethylene supplied from the polyethylene supply unit 120 at 50 to 60 (wt%) and also uses TU300T as a compatibilizer. , it would be preferable to add 2 (wt%) each of TU300CB and EM101 more.

In one embodiment, the mixing unit 130 may be used by containing 10 (wt%) of moisture in the NMF-PCB supplied from the NMF-PCB supply unit 110, and thus NMF having a moisture of 10 (wt%) -When using a PCB, it is possible to measure the flexural strength and flexural modulus of the effect of moisture using TU300T, which is effective as a compatibilizer, and compare the results in FIGS. 8 and 9. Here, FIG. 8 is a view showing the effect of H 2 O _and compatibilizer on flexural strength of PE composites on the flexural strength of the first polyolefin composite and the second polyolefin composite prepared in the mixing unit shown in FIG. 9 is a view showing the effect of H ₂ O and compatibilizer on flexural modulus of PE composites on the flexural modulus of the first polyolefin composite and the second polyolefin composite prepared in the mixing unit shown in FIG. am.

8 and 9, when using NMF-PCB containing 10 (wt%) of moisture, the flexural modulus slightly increased or did not change significantly even when the compatibilizer was added, but the flexural strength was obtained by adding the compatibilizer. It can be seen that it decreases in some cases, and it can be seen that this is the effect of the hydrophilic group of the compatibilizer and the attraction of moisture.

In one embodiment, the mixing unit 130, the NMF-PCB supplied from the NMF-PCB supply unit 110, the polyethylene supplied from the polyethylene supply unit 120 without moisture (ie, the fracture surface as shown in FIG. 10) It is possible to form a fracture surface of the polyolefin composite as shown in FIG. 11 by preparing a polyolefin composite by adding it to polyethylene) to form a fracture surface of the polyolefin composite. Let's look at the impact.

In FIG. 11, when polyethylene and dry NMF-PCB are mixed, compatibility is not sufficient, but it can be seen that they are well dispersed without voids between the GF and PE matrix, and thus the tensile strength and flexural strength are improved. It can be seen that it has increased.

In one embodiment, the mixing unit 130 contains 5 (wt%) of moisture in the NMF-PCB supplied from the NMF-PCB supply unit 110 and mixes it with polyethylene supplied from the polyethylene supply unit 120 to form a polyolefin composite. It can be manufactured to form the fracture surface of the polyolefin composite as shown in FIG. 12, and also by containing 10 (wt%) of moisture in the NMF-PCB supplied from the NMF-PCB supply unit 110 to obtain from the polyethylene supply unit 120. A polyolefin composite may be prepared by mixing with supplied polyethylene to form a fracture surface of the polyolefin composite as shown in FIG. 13 .

12 and 13, when polyethylene and NMF-PCB containing 5 (wt%) and 10 (wt%) of water are mixed, voids are seen between the GF and PE matrix, and bubbles are generated in the PE matrix It can be seen that this appears, and it can be seen that this phenomenon is generated as the moisture contained in the NMF-PCB is volatilized during the melting and mixing process, and as a result, the tensile modulus and flexural modulus have lower values than those using dry NMF-PCB. know what you have Accordingly, the mixing unit 130 will say that it is preferable to use the NMF-PCB supplied from the NMF-PCB supply unit 110 by containing 5 (wt%) and 10 (wt%) of moisture.

The waste PCB recycling device 100 having the configuration described above may further include a crosslinking agent supply unit 160 .

The crosslinking agent supply unit 160 supplies the crosslinking agent to the mixing unit 130 .

In one embodiment, the mixing unit 130 adds the NMF-PCB supplied from the NMF-PCB supply unit 110 to the polyethylene supplied from the polyethylene supply unit 120 without water, and is also supplied from the crosslinking agent supply unit 160. A crosslinking agent (eg, DCP, etc.) may be further added to prepare a polyolefin composite to form a fracture surface of the polyolefin composite as shown in FIGS. By observing the cross-sectional morphology, the influence of the compatibilizing agent can be observed.

14 and 15, it can be seen that when polyethylene and dry NMF-PCB are mixed and DCP is further added as a crosslinking agent, the surface of the PE matrix appears rougher than when DCP is not added, which is due to DCP It can be seen that some cross-linking has occurred, but since voids are still observed between the GF and PE matrices, it can be seen that the compatibility is not sufficient.

In one embodiment, the mixing unit 130 contains 5 (wt%) of water in the NMF-PCB supplied from the NMF-PCB supply unit 110 and mixes it with polyethylene supplied from the polyethylene supply unit 120, and also a crosslinking agent A polyolefin composite may be prepared by further adding a crosslinking agent (eg, DCP) supplied from the supply unit 160 to form a fracture surface of the polyolefin composite as shown in FIG. 16 . In addition, the mixing unit 130 mixes the NMF-PCB supplied from the NMF-PCB supply unit 110 with 10 (wt%) of moisture and mixes it with the polyethylene supplied from the polyethylene supply unit 120, and the crosslinking agent supply unit 160 A polyolefin composite may be prepared by further adding a crosslinking agent (eg, DCP, etc.) supplied therefrom to form a fracture surface of the polyolefin composite as shown in FIG. 17 .

16 and 17, when polyethylene and NMF-PCB containing 5 (wt% 0, 10 (wt%) of water) are mixed and DCP is further added as a crosslinking agent, a gap is formed between the GF and PE matrix It can be seen that the roughness of the surface is lower than that of NMF-PCB without moisture, and as a result, the tensile strength and flexural strength are slightly lower, and the appearance of bubbles in the PE matrix is observed in some parts. can

In one embodiment, the mixing unit 130 mixes the NMF-PCB supplied from the NMF-PCB supply unit 110 with the polyethylene supplied from the polyethylene supply unit 120 by containing 10 (wt%) of moisture, and also commercialized A polyolefin composite can be prepared using TU300T having zero effect to form a fracture surface of the polyolefin composite as shown in FIGS. 18 and 19 . And the mixing unit 130 mixes the NMF-PCB supplied from the NMF-PCB supply unit 110 with the polyethylene supplied from the polyethylene supply unit 120 without moisture, and also uses TU300T, which is effective as a compatibilizer, to form a polyolefin composite. prepared to form the fracture surface of the polyolefin composite as shown in FIGS. 20 and 21 .

The waste PCB recycling device 100 having the configuration described above is implemented to recycle the waste PCB by mixing the NMF-PCB from which the metal component of the waste PCB is removed with polyethylene to make a polyolefin composite, thereby recycling and reproducing industrial waste resources It is possible to increase national industrial competitiveness through import substitution and cost reduction, and minimize waste generation from inefficient use of resources to reduce social costs caused by environmental problems. Diversification and employment expansion can be achieved.

The waste PCB recycling device 100 having the configuration as described above makes the NMF-PCB contain about 50 to 60 (wt%) of glass fiber (GF), and the tensile strength and flexural strength of the polyolefin composite to which it is applied It can be seen that the increase is due to the dominant effect of GF, but as the strength increases, the elongation at break rapidly decreases. can

In the waste PCB recycling device 100 having the configuration as described above, the effect of moisture contained in NMF-PCB was not significantly affected, and when a compatibilizer was added, tensile properties and flexural properties The content of the silver NMF-PCB increased up to 60 (wt%), which is because the compatibility of the PE matrix with epoxy and glass fiber increased by the compatibilizer, and the NMF-PCB containing 10 (wt%) moisture In the case of using , there was no significant change in tensile and flexural properties, but it can be seen that the tensile modulus and flexural modulus decrease at 50 (wt%) or more as the content of NMF-PCB increases.

The waste PCB recycling device 100 having the configuration as described above can make the tensile strength of the polyolefin composite more than 150% and the modulus more than 200% compared to general polyolefin by the mixing unit 130, and Compared to general polyolefin, the flexural strength of the polyolefin composite may be 200% or more and the flexural modulus may be 300% or more.

22 is a diagram explaining a waste PCB recycling method according to an embodiment of the present invention.

Referring to FIG. 22, the NMF-PCB supply unit 110 supplies the NMF-PCB from which the metal component of the waste PCB is removed to the mixing unit 130 (S201).

In supplying the NMF-PCB in step S201 described above, in the NMF-PCB supply unit 110, the NMF-PCB is pulverized using a crushing device to supply the powdery NMF-PCB to the mixing unit 130. .

In supplying the NMF-PCB in the above-described step S201, in the NMF-PCB supply unit 110, in order to recover metal, which is a major resource from the waste PCB, the waste PCB is pulverized and then the metal It is possible to recover and supply the NMF-PCB from which the metal is recovered to the mixing unit 130.

In supplying the NMF-PCB in the above-described step S201, in the NMF-PCB supply unit 110, since the NMF-PCB is powdered through a grinding process, microplastic contamination is caused, and in the case of the NMF-PCB powder Since curing type epoxy is the main material, it is impossible to re-mold, but it can be used as a polymer reinforcing material due to the high content of glass fiber (GF), and the mixing section ( 130) can be supplied.

In supplying the NMF-PCB in the above-described step S201, in the NMF-PCB supply unit 110, about 50 to 60 (wt%) of glass fiber (GF) is included in the NMF-PCB to the mixing unit 130 can supply

At the same time as supplying the NMF-PCB in the above-described step S201, the polyethylene supply unit 120 supplies polyethylene to the mixing unit 130 (S202).

When polyethylene is supplied in step S202 described above, in the mixing unit 130, NMF-PCB is supplied from the NMF-PCB supply unit 110 and polyethylene is supplied from the polyethylene supply unit 120, and the supplied NMF-PCB and Polyethylene is mixed to produce a polyolefin composite (S203).

In preparing the polyolefin composite in step S203 described above, in the mixing unit 130, the NMF-PCB supplied from the NMF-PCB supply unit 110 is contained at 30 (wt%) or 30 (wt%) or more. By mixing with the polyethylene supplied from the polyethylene supply unit 120 to prepare a polyolefin composite, the mechanical strength of the polyolefin composite compared to general polyolefin can be 200% or more.

In preparing the polyolefin composite in step S203 described above, in the mixing unit 130, the content of the NMF-PCB supplied from the NMF-PCB supply unit 110 is 30 to 60 (wt%), and the polyethylene supply unit 120 It can also be added to polyethylene supplied from

In preparing the polyolefin composite in the above-described step S203, in the mixing unit 130, NMF-PCB in powder form is supplied from the NMF-PCB supply unit 110 and used as a reinforcing material for polyolefin from the polyethylene supply unit 120. By mixing with the supplied polyethylene to produce a polyolefin composite, it is possible to obtain a high-strength polyolefin composite as well as recycling waste PCBs.

In preparing the polyolefin composite in step S203 described above, in the mixing unit 130, the compatibilizer supply unit 140 may supply TU300T, TU300CB, and EM101 to the mixing unit 130 as compatibilizers. Therefore, in the mixing unit 130, after mixing the NMF-PCB supplied from the NMF-PCB supply unit 110 with the polyethylene supplied from the polyethylene supply unit 120, TU300T, TU300CB and TU300CB supplied from the compatibilizer supply unit 140 A polyolefin composite may be prepared by adding 2 (wt%) of each EM101 compatibilizer.

In preparing the polyolefin composite in step S203 described above, in the mixing unit 130, NMF supplied from the NMF-PCB supply unit 110 is added to the polyethylene supplied from the polyethylene supply unit 120 for the tensile test of mechanical properties. -The first polyolefin composite can be prepared by adding 30, 40, 50, 60, 70, 80 (wt%) of PCB, and also from the NMF-PCB supply unit 110 to the polyethylene supplied from the polyethylene supply unit 120. 30, 40, 50, 60, 70, 80 (wt%) of supplied NMF-PCB may be added, and TU300T, TU300CB, and EM101 may be further added by 2 (wt%) each as a compatibilizer.

In preparing the polyolefin composite in step S203 described above, in the mixing unit 130, the NMF-PCB content supplied from the NMF-PCB supply unit 110 is supplied from the polyethylene supply unit 120 at 60 (wt%). It would be desirable to add it to the received polyethylene.

In preparing the polyolefin composite in step S203 described above, in the mixing unit 130, the content of the NMF-PCB supplied from the NMF-PCB supply unit 110 is 50 to 60 (wt%), and the polyethylene supply unit 120 It would be preferable to add 2 (wt%) each of TU300T, TU300CB and EM101 as compatibilizers to the polyethylene supplied from .

In preparing the polyolefin composite in step S203 described above, the water supply unit 150 may supply water to the mixing unit 130. Accordingly, in the mixing unit 130, the NMF-PCB supplied from the NMF-PCB supply unit 110 may be used by containing 10 (wt%) of water supplied to the water supply unit 150, or alternatively, the NMF-PCB NMF-PCB supplied from the supply unit 110 may be used without moisture.

In preparing the polyolefin composite in step S203 described above, in the dehumidifying or humidifying device unit, the moisture in the NMF-PCB supplied from the NMF-PCB supply unit 110 is measured and the desired moisture content (eg, 1, 2, 5, 10 (wt%), etc.) may be used to dehumidify or supply moisture.

In preparing the polyolefin composite in step S203 described above, in the mixing unit 130, in order to evaluate the strength of the polyolefin composite through a bending test among mechanical properties, the polyethylene supplied from the polyethylene supply unit 120 is supplied with NMF-PCB A first polyolefin composite may be prepared by adding 30, 40, 50, 60, 70, 80 (wt%) of NMF-PCB supplied from the supply unit 110, and also to polyethylene supplied from the polyethylene supply unit 120. 30, 40, 50, 60, 70, 80 (wt%) of NMF-PCB supplied from the NMF-PCB supply unit 110 was added, and 2 (wt%) of TU300T, TU300CB, and EM101 were added as compatibilizers, respectively. may be

In preparing the polyolefin composite in step S203 described above, in the mixing unit 130, the NMF-PCB content supplied from the NMF-PCB supply unit 110 is supplied from the polyethylene supply unit 120 at 50 (wt%). It would be desirable to add it to the received polyethylene.

In preparing the polyolefin composite in step S203 described above, in the mixing unit 130, the content of the NMF-PCB supplied from the NMF-PCB supply unit 110 is 50 to 60 (wt%), and the polyethylene supply unit 120 It would be preferable to add 2 (wt%) each of TU300T, TU300CB and EM101 as compatibilizers to the polyethylene supplied from .

In preparing the polyolefin composite in step S203 described above, in the mixing unit 130, the NMF-PCB supplied from the NMF-PCB supply unit 110 contains 5 (wt%) and 10 (wt%) of water would be preferable to use.

In preparing the polyolefin composite in the above-described step S203, the crosslinking agent supply unit 160 may supply the crosslinking agent to the mixing unit 130. Accordingly, in the mixing unit 130, the NMF-PCB supplied from the NMF-PCB supply unit 110 is added to the polyethylene supplied from the polyethylene supply unit 120 without moisture, and the crosslinking agent supplied from the crosslinking agent supply unit 160 (eg For example, DCP, etc.) can be further added to prepare a polyolefin composite.

As described above, the embodiments of the present invention are not implemented only through the above-described device and/or operating method, but through a program for realizing functions corresponding to the configuration of the embodiment of the present invention and a recording medium on which the program is recorded. It may be implemented, and such an implementation can be easily implemented by an expert in the technical field to which the present invention belongs based on the description of the above-described embodiment. Although the embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concept of the present invention defined in the following claims are also included in the scope of the present invention. that fall within the scope of the right.

100: waste PCB recycling device
110: NMF-PCB supply unit
120: polyethylene supply unit
130: mixing section
140: compatibilizer supply unit
150: water supply unit
160: crosslinking agent supply unit

Claims (5)

NMF-PCB supply unit for supplying NMF-PCB from which metal components of the waste PCB are removed;
A polyethylene supply unit that supplies polyethylene; and
Waste PCB recycling device comprising a mixing unit for producing a polyolefin composite by mixing the NMF-PCB supplied from the NMF-PCB supply unit and the polyethylene supplied from the polyethylene supply unit.
The method of claim 1, wherein the NMF-PCB supply unit,
Waste PCB recycling device, characterized in that for supplying the powdered NMF-PCB to the mixing unit by pulverizing the NMF-PCB using a crushing device.
The method of claim 1, wherein the NMF-PCB supply unit,
Waste PCB recycling apparatus, characterized in that after crushing the waste PCB, recovering the metal by a dry method or a wet method, and supplying the recovered NMF-PCB to the mixing section as a reinforcing material of polyolefin.
The method of claim 1, wherein the NMF-PCB supply unit,
Waste PCB recycling device, characterized in that for supplying NMF-PCB containing 50 to 60% of glass fibers to the mixing unit.
Supplying the NMF-PCB from which the metal component of the waste PCB is removed by the NMF-PCB supply unit;
supplying polyethylene supply unit polyethylene; and
Waste PCB recycling method comprising the step of mixing the NMF-PCB supplied from the NMF-PCB supply unit and the polyethylene supplied from the polyethylene supply unit to prepare a polyolefin composite.