JP2000226902A - Board for construction material - Google Patents
Board for construction materialInfo
- Publication number
- JP2000226902A JP2000226902A JP2752199A JP2752199A JP2000226902A JP 2000226902 A JP2000226902 A JP 2000226902A JP 2752199 A JP2752199 A JP 2752199A JP 2752199 A JP2752199 A JP 2752199A JP 2000226902 A JP2000226902 A JP 2000226902A
- Authority
- JP
- Japan
- Prior art keywords
- board
- printed circuit
- circuit board
- weight
- waste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Panels For Use In Building Construction (AREA)
- Disintegrating Or Milling (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリント基板廃棄
物のマテリアルリサイクルを実現するものであり、この
プリント基板廃棄物を再利用して得られた剛性、強度等
の機械的物性バランスに優れた建材用ボードに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention realizes material recycling of printed circuit board waste, and has excellent mechanical properties such as rigidity and strength obtained by reusing printed circuit board waste. It relates to a board for building materials.
【０００２】[0002]
【従来の技術】プリント基板は電子部品として極めて多
くの電気製品等に利用されており、電気製品等が廃棄さ
れたり、また、プリント基板及び電気製品等が製造工程
において不良品等として工場内で廃棄されると、必然的
にこのプリント基板も廃棄物になることから、プリント
基板の廃棄物量も年々増加の一途をたどっている。2. Description of the Related Art Printed circuit boards are used as an electronic component in an extremely large number of electric products and the like, and the electric products and the like are discarded. When discarded, this printed circuit board is inevitably turned into waste, and the amount of printed circuit board waste is increasing year by year.
【０００３】そして、このようなプリント基板廃棄物の
処理方法については、その廃棄物量の少ない過去におい
ては埋め立て等による方法がとられていたが、廃棄物量
が増加した現在では、金属資源の問題や環境問題等の観
点から、このようなプリント基板廃棄物の処理プラント
の開発も進んでいる。[0003] In the past, such a method of treating printed circuit board waste was carried out by reclamation in the past where the amount of waste was small. However, now that the amount of waste has increased, there is a problem of metal resources. From the viewpoint of environmental problems and the like, development of such a printed circuit board waste treatment plant is also progressing.
【０００４】このようなプリント基板廃棄物の処理プラ
ントにおいては、通常、先ずこのプリント基板廃棄物を
粉砕し、次いでその金属成分と非金属成分とを分離し、
金属成分についてはリサイクルして再利用することが行
われている。しかしながら、このような処理プラントで
発生する非金属成分については、依然として再利用のた
めの用途開発が進まず、管理型産業廃棄物として埋め立
て処分による処理に頼らざるを得ないのが現状であり、
廃棄物量を可及的に低減して循環型社会を確立するため
のマテリアルリサイクル化には至っていないのが現状で
ある。In such a plant for treating printed circuit board waste, usually, the printed circuit board waste is first crushed, and then the metal component and the non-metal component are separated.
Metal components are being recycled and reused. However, for non-metal components generated in such processing plants, application development for reuse has not progressed yet, and at present it is necessary to resort to landfill disposal as managed industrial waste.
At present, material recycling to establish a recycling-oriented society by reducing the amount of waste as much as possible has not been achieved.
【０００５】[0005]
【発明が解決しようとする課題】そこで、本発明者は、
このようなプリント基板廃棄物のマテリアルリサイクル
化を如何に進めるべきかについて鋭意検討した結果、プ
リント基板廃棄物を粉砕処理して得られるプリント基板
粉砕物が建材用ボードの製造原料として有効に活用でき
ることを見いだし、本発明を完成した。Therefore, the present inventor has proposed:
As a result of intensive studies on how to promote the material recycling of printed circuit board waste, it was found that the crushed printed circuit board obtained by crushing printed circuit board waste can be effectively used as a raw material for manufacturing building material boards. And completed the present invention.
【０００６】すなわち、プリント基板廃棄物を粉砕処理
して得られたプリント基板粉砕物に所定量の熱硬化性樹
脂を配合し、これを例えば汎用のプレス成形装置等で成
形することにより、機械的物性バランスに優れ、建材と
して充分に再利用可能なボードを製造し得ることを見い
だしたものである。That is, a predetermined amount of a thermosetting resin is blended into a crushed printed circuit board obtained by crushing a printed circuit board waste, and this is molded by, for example, a general-purpose press molding apparatus or the like. It has been found that a board having an excellent balance of physical properties and being sufficiently reusable as a building material can be manufactured.
【０００７】従って、本発明の目的は、従来はその処理
に苦慮してきたプリント基板廃棄物のマテリアルリサイ
クル化を達成することにある。また、本発明の他の目的
は、プリント基板廃棄物を粉砕処理した際に得られるプ
リント基板粉砕物を建材用ボードの製造原料として活用
し、機械的物性バランスに優れた建材用ボードを提供す
ることにある。更に、本発明の他の目的は、プリント基
板廃棄物を粉砕処理した際に得られ、廃棄処分されてき
た非金属成分リッチのプリント基板粉砕物を建材用ボー
ドの製造原料として再利用し、同時に建材として有用な
機械的物性バランスに優れた建材用ボードを提供するこ
とにある。Accordingly, it is an object of the present invention to achieve material recycling of printed circuit board waste, which has conventionally been difficult to treat. Another object of the present invention is to provide a building material board excellent in mechanical property balance by utilizing a crushed printed board obtained when crushing printed board waste is used as a raw material for manufacturing a building material board. It is in. Further, another object of the present invention is to recycle a non-metallic component-rich pulverized printed circuit board obtained and obtained by pulverizing a printed circuit board waste as a raw material for building material boards, It is an object of the present invention to provide a board for building materials which is useful as a building material and has an excellent balance of mechanical properties.
【０００８】[0008]
【課題を解決するための手段】すなわち、本発明は、プ
リント基板廃棄物を粉砕処理して得られたプリント基板
粉砕物１００重量部に対して熱硬化性樹脂１〜３０重量
部を配合し成形してなる建材用ボードである。以下、本
発明を具体的に説明する。That is, according to the present invention, a thermosetting resin is blended in an amount of 1 to 30 parts by weight with respect to 100 parts by weight of a crushed printed board obtained by crushing printed board waste. It is a building material board made of: Hereinafter, the present invention will be described specifically.
【０００９】本発明において、プリント基板粉砕物と
は、電気製品等に使用され、この電気製品等が廃棄物と
なった際に同時に排出されるプリント基板廃棄物や、プ
リント基板及び電気製品等の製造工程において不良品等
として工場内で発生するプリント基板廃棄物を、プリン
ト基板処理プラント等により粉砕処理して得られる粉砕
物であり、金属成分と非金属成分とが分離される前のも
のであっても、また、これら金属成分と非金属成分とを
分離して回収された非金属成分リッチの粉砕物であって
もよく、その化学組成については特に制限されることな
く使用可能である。In the present invention, the pulverized printed circuit board is used for electric products and the like, and printed circuit board waste and printed circuit boards and electric products and the like discharged simultaneously when the electric products and the like become waste. This is a crushed product obtained by crushing printed circuit board waste generated in the factory as a defective product etc. in the manufacturing process by a printed circuit board processing plant etc., before metal components and non-metal components are separated. Even if it is, a nonmetallic component-rich pulverized product separated and recovered from the metal component and the nonmetal component may be used, and the chemical composition thereof can be used without any particular limitation.
【００１０】しかしながら、プリント基板粉砕物の金属
成分と非金属成分とを分離して回収された金属成分につ
いては、それ単独で有効利用の途が多くて利用価値が高
く、しかも、処理に苦慮していた非金属成分単独でもフ
ィラーとしての性能に優れているので、マテリアルリサ
イクルの意義の観点より、好ましくは金属成分と非金属
成分とを分離して回収される非金属成分リッチの粉砕物
である。However, the metal component recovered by separating the metal component and the non-metal component of the pulverized printed circuit board is often used independently and has high utility value. Since the non-metal component alone had excellent performance as a filler, from the viewpoint of the significance of material recycling, it is preferably a non-metal component-rich pulverized material separated and recovered from the metal component and the non-metal component. .
【００１１】そして、この非金属成分リッチのプリント
基板粉砕物については、特にこの粉砕物中の金属成分の
含有量について制限はないが、金属成分と非金属成分の
分離コスト及び回収金属成分の有効利用価値のバランス
を考えると、金属成分含有量が０．１〜５重量％程度で
あることが望ましい。この金属成分含有量が０．１重量
％より少なくなるように分離処理するためには莫大な高
コストと作業手間が必要であり、逆に金属成分含有量が
５重量％を超えると回収金属成分の有効利用価値が低減
することから好ましくない。There is no particular limitation on the content of the metal component in the pulverized printed circuit board rich in the non-metal component, but the separation cost of the metal component and the non-metal component and the effective use of the recovered metal component are not limited. Considering the balance of utility value, it is desirable that the metal component content be about 0.1 to 5% by weight. In order to perform the separation treatment so that the content of the metal component is less than 0.1% by weight, enormous high cost and labor are required. Conversely, if the content of the metal component exceeds 5% by weight, the recovered metal component Is not preferred because the effective utilization value of the
【００１２】また、このプリント基板粉砕物において、
その形状については特に制限されるものではないが、プ
リント基板廃棄物処理プラント等における粉砕処理の関
係上、また、熱硬化性樹脂との混練操作の関係上、好ま
しくは粒子形状であるのがよく、特に、好ましくはその
９８重量％以上が粒子径１ｍｍ以下であり、より好まし
くはその９８重量％以上が０．５ｍｍ以下であり、更に
より好ましくはその９８重量％以上が０．１ｍｍ以下で
あるのがよい。このようにプリント基板粉砕物の粒子径
が細かくなればなるほど、得られる建材用ボードの曲げ
強度及び曲げ弾性率の物性発現性が向上するという利点
が生じる。なお、粒子径の測定方法については特に制限
されるものではないが、汎用のふるいで分別し、ふるい
対象全量に対するふるい通過分の重量比率を求める方法
が代表的である。In this pulverized printed circuit board,
The shape is not particularly limited, but in relation to the pulverization treatment in a printed circuit board waste treatment plant or the like, and also in relation to the kneading operation with a thermosetting resin, preferably in the form of particles. In particular, preferably 98% by weight or more of the particles have a particle size of 1 mm or less, more preferably 98% by weight or more of 0.5 mm or less, and still more preferably 98% by weight or more of 0.1 mm or less. Is good. As described above, as the particle size of the pulverized printed circuit board becomes finer, there is an advantage that the physical properties of the bending strength and the bending elastic modulus of the obtained building material board are improved. The method for measuring the particle size is not particularly limited, but a typical method is to classify the particles with a general-purpose sieve and determine the weight ratio of the amount of the sieve that passes through the entire sieve target.
【００１３】更に、プリント基板処理プラント等で処理
され、金属成分を分離して得られる非金属成分リッチの
プリント基板粉砕物について、特にその化学成分や構成
物組成等について制限されるものではないが、現在、電
気製品等で使用されている汎用のプリント基板を粉砕し
たものの場合、代表的には、熱硬化後の硬質エポキシ樹
脂とガラス繊維の混合粉末、熱硬化後の硬質フェノール
樹脂と紙の混合粉末、又はこれら混合粉末の混合物が挙
げられる。Further, the non-metallic component-rich pulverized printed circuit board obtained by separating a metal component, which is processed in a printed circuit board processing plant or the like, is not particularly limited with respect to its chemical component and composition. In the case of crushed general-purpose printed circuit boards currently used in electrical products and the like, typically, a mixed powder of a hard epoxy resin and glass fiber after thermosetting, and a hard phenol resin and paper after thermosetting. A mixed powder or a mixture of these mixed powders may be mentioned.
【００１４】また、本発明において、熱硬化性樹脂とと
ては、フェノール樹脂、エポキシ樹脂、ポリエステル樹
脂、メラミン樹脂等やこれらの混合物を挙げることがで
き、なかでも、機械的物性バランス及び材料コストの観
点から、フェノール樹脂が特に好ましい。In the present invention, examples of the thermosetting resin include a phenol resin, an epoxy resin, a polyester resin, a melamine resin and the like, and a mixture thereof. In view of the above, a phenol resin is particularly preferred.
【００１５】上記プリント基板粉砕物に対する熱硬化性
樹脂の添加量は、通常、プリント基板粉砕物１００重量
部に対して熱硬化性樹脂１〜３０重量部の範囲であり、
得られる建材ボードの諸物性バランスと材料コストとの
相関より、好ましくは２〜２０重量部、より好ましくは
３〜１０重量部である。この熱硬化性樹脂の添加量が１
重量部より少ないと、得られる建材用ボードについて充
分な機械的物性が得られず、また、３０重量部を超える
と、得られる建材用ボードの機械的物性は損なわれない
が、材料コストが上昇して実用的でない。The amount of the thermosetting resin added to the pulverized printed circuit board is usually in the range of 1 to 30 parts by weight of the thermosetting resin per 100 parts by weight of the pulverized printed circuit board.
The amount is preferably 2 to 20 parts by weight, more preferably 3 to 10 parts by weight from the correlation between the balance of various physical properties of the obtained building material board and the material cost. When the addition amount of this thermosetting resin is 1
If the amount is less than 10 parts by weight, sufficient mechanical properties of the resulting building material board cannot be obtained. If the amount exceeds 30 parts by weight, the mechanical properties of the resulting building material board will not be impaired, but the material cost will increase. Not practical.
【００１６】また、本発明の建材用ボードでは、マイ
カ、タルク、硫酸バリウム、硫酸カルシウム、炭酸バリ
ウム、炭酸カルシウム、カオリン、セピオライト等の鉱
物状無機充填材を無機強化フィラーとして配合すること
が可能である。もちろんこれらの混合物でも差し支えな
い。これらの中でもマイカ、タルク、炭酸カルシウムは
機械的物性バランスの面からも好ましい鉱物状無機強化
フィラーとなる。これらの鉱物状無機強化フィラーの配
合量は、得られる建材ボードの諸物性バランスの観点よ
り、プリント基板粉砕物と熱硬化性樹脂の合計１００重
量部に対して１〜１００重量部の範囲であることが好ま
しい。Further, in the building material board of the present invention, a mineral inorganic filler such as mica, talc, barium sulfate, calcium sulfate, barium carbonate, calcium carbonate, kaolin, sepiolite or the like can be blended as an inorganic reinforcing filler. is there. Of course, these mixtures can be used. Among them, mica, talc, and calcium carbonate are preferable mineral-like inorganic reinforcing fillers from the viewpoint of balance of mechanical properties. The amount of these mineral-like inorganic reinforcing fillers is in the range of 1 to 100 parts by weight with respect to the total 100 parts by weight of the pulverized printed board and the thermosetting resin from the viewpoint of the balance of various physical properties of the resulting building material board. Is preferred.
【００１７】また、本発明の建材用ボードにおいては、
必要により、軽石、シラス、砂、珪砂、人工軽量骨材、
石炭灰（フライアッシュ）、人工中空粒子、ガラスバル
ーン、発泡ガラス粒子等やこれらの混合物からなる建材
用ボードの骨材を配合することができ、なかでも軽石、
珪砂、人工軽量骨材、石炭灰は、機械的物性バランスの
点から特に好ましい骨材である。このような骨材の配合
量は、得られる建材ボードの諸物性バランスの観点よ
り、プリント基板粉砕物と熱硬化性樹脂の合計１００重
量部に対して１〜１００重量部の範囲であることが好ま
しい。Further, in the construction material board of the present invention,
If necessary, pumice, shirasu, sand, quartz sand, artificial lightweight aggregate,
Coal ash (fly ash), artificial hollow particles, glass balloons, foamed glass particles, and the like, and aggregates of building material boards made of a mixture thereof can be blended.
Silica sand, artificial lightweight aggregate, and coal ash are particularly preferred aggregates in terms of balance of mechanical properties. From the viewpoint of the balance of various physical properties of the obtained building material board, the amount of such aggregate may be in the range of 1 to 100 parts by weight based on 100 parts by weight of the total of the pulverized printed circuit board and the thermosetting resin. preferable.
【００１８】また、本発明の建材用ボードにおいては、
必要により、チョップドストランド状、マット状、ネッ
ト状等の繊維系強化フィラーを配合することもできる。
この繊維の材質については、特に制限するものではない
が、ガラス繊維、ロックウール、カーボン繊維等の無機
質繊維や、ビニロンやポリエステル等の有機質繊維等が
代表的であり、これらの混合物でも差し支えない。更
に、これらの繊維にフェノール樹脂、ポリエステル樹
脂、エポキシ樹脂、メラミン樹脂等の熱硬化性樹脂を含
浸せしめ、これを半硬化させてプリプレグ化したものも
好適に用いることができる。これらの繊維系強化フィラ
ーは、建材用ボードの表面近傍に積層しても、また、内
部に積層してもよく、更に、単層であっても、２層以上
の複層であってもよい。Further, in the construction material board of the present invention,
If necessary, a fibrous reinforcing filler in a chopped strand shape, mat shape, net shape or the like can be blended.
The material of the fiber is not particularly limited, but inorganic fibers such as glass fiber, rock wool, and carbon fiber, and organic fibers such as vinylon and polyester are typical, and a mixture thereof may be used. Further, a fiber obtained by impregnating these fibers with a thermosetting resin such as a phenol resin, a polyester resin, an epoxy resin, or a melamine resin, and semi-curing the same to form a prepreg can also be suitably used. These fibrous reinforcing fillers may be laminated near the surface of the building material board, or may be laminated inside, and may be a single layer or a multilayer of two or more layers. .
【００１９】なお、本発明の建材用ボードにおいては、
目的に応じて、また、本発明の範囲を著しく損なわない
範囲で、「プラスチック読本」〔（株）プラスチックエ
ージ発行〕や「新版プラスチック材料読本」〔（株）工
業調査会発行：桜内雄次郎氏著作〕等に記載される可塑
剤、離型剤、表面処理剤、酸化防止剤、紫外線吸収剤、
燃焼防止剤、帯電防止剤、着色材、熱安定剤等の種々の
添加剤を併用してもよい。In the construction material board of the present invention,
Depending on the purpose and within a range that does not significantly impair the scope of the present invention, "Plastic Reader" [published by Plastic Age Co., Ltd.] or "New Edition Plastic Material Reader" [published by the Industrial Research Institute, Inc .: Yujiro Sakurauchi Work) plasticizers, release agents, surface treatment agents, antioxidants, ultraviolet absorbers, etc.
Various additives such as a combustion inhibitor, an antistatic agent, a coloring material, and a heat stabilizer may be used in combination.
【００２０】本発明の建材用ボードは、上記プリント基
板粉砕物と熱硬化性樹脂、更に必要に応じて配合される
骨材、繊維系強化フィラー、その他の添加剤を所定の割
合で配合し、ブレンダーにより均一に混合し、得られた
混合物を金板や金型に敷き詰めて汎用のプレス成形装置
等により加圧成形することにより、容易に製造すること
ができる。上記ブレンダーによる混合は一括混合でもよ
いし、また、混合組成内容に応じて数回に分けて混合し
てもよく、また、プレス装置は一段プレス装置でもよい
ほか、複数段のプレス面からなる多段プレス装置を用い
てもよく、多段プレス装置を用いることは生産効率の面
で好ましい。The building material board of the present invention comprises the above-mentioned pulverized printed board, a thermosetting resin, and, if necessary, an aggregate, a fiber-based reinforcing filler, and other additives in a predetermined ratio. It can be easily manufactured by uniformly mixing with a blender, spreading the obtained mixture on a metal plate or a metal mold, and press-molding with a general-purpose press molding apparatus or the like. The mixing by the blender may be batch mixing, or may be performed by mixing several times depending on the content of the mixed composition.In addition, the pressing device may be a single-stage pressing device, or a multi-stage pressing surface having a plurality of stages. A press device may be used, and using a multi-stage press device is preferable in terms of production efficiency.
【００２１】また、本発明の建材用ボードについては、
汎用のプレス成形装置等により加圧成形することができ
れば、その大きさ、形状等に特に制限はないが、汎用建
材ボードとしての種々の作業性上の観点から、好ましく
はその厚さが１〜３０ｍｍ、より好ましくは３〜２０ｍ
ｍの薄物であるのがよい。このような本発明の建材用ボ
ードは、例えば、汎用コンパネ、型枠合板、構造用合
板、内装ボード等の用途の建材ボードとして好適に用い
ることができる。[0021] The board for building materials of the present invention is as follows.
If it can be pressure-formed by a general-purpose press molding device or the like, its size, shape, etc. are not particularly limited, but from the viewpoint of various workability as a general-purpose building material board, preferably, its thickness is 1 to 1. 30 mm, more preferably 3 to 20 m
m should be thin. Such a building material board of the present invention can be suitably used as a building material board for applications such as general-purpose instrument panels, formwork plywood, structural plywood, and interior boards.
【００２２】[0022]
【発明の実施の形態】以下、実施例及び比較例に基づい
て、本発明の好適な実施の形態を具体的に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be specifically described below based on examples and comparative examples.
【００２３】実施例１〜４及び比較例１〜３ 熱硬化後の硬質エポキシ樹脂とガラス繊維の混合粉末か
らなるプリント基板粉砕物（プリント基板処理プラント
より入手）１００重量部に、フェノール樹脂（住友デュ
レズ製ＮＫ−７００１）を表１に示すように０．５〜４
０重量部の割合で配合し、回転式ブレンダーにて混合し
た後、得られた混合物を５０トンプレス機〔（株）庄司
鉄工製〕の型内に充填し、１７０℃で１０分間プレスし
て厚さ５ｍｍ前後の建材用ボードを成形し、このボード
からテストピースを切り出した。なお、プリント基板粉
砕物としては、その９８重量％が粒子径０．１ｍｍ以
下、０．５ｍｍ以下、及び２ｍｍ以下のものを使用し
た。Examples 1 to 4 and Comparative Examples 1 to 3 100 parts by weight of a pulverized printed circuit board (obtained from a printed circuit board processing plant) composed of a mixed powder of a hard epoxy resin and glass fiber after thermosetting were mixed with a phenol resin (Sumitomo). Durez NK-7001) was used for 0.5 to 4 as shown in Table 1.
After mixing at a ratio of 0 parts by weight and mixing with a rotary blender, the obtained mixture was filled in a mold of a 50-ton press (manufactured by Shoji Iron Works) and pressed at 170 ° C. for 10 minutes. A building material board having a thickness of about 5 mm was formed, and a test piece was cut out from the board. In addition, as the pulverized printed circuit board, those whose 98% by weight had a particle diameter of 0.1 mm or less, 0.5 mm or less, and 2 mm or less were used.
【００２４】曲げ強度及び曲げ弾性率はＪＩＳ−Ａ１４
０８に準じて曲げ試験を行って測定し、また、外観は目
視により判定する方式を採用し、更に、比重は直方体の
試験片の厚み×高さ×長さより得られる体積と重量より
算出して求めた。物性判定は、一般に汎用建材として使
用上問題ないと判断される測定物性値である判定基準、
すなわち、目視外観が良好で、比重：１．８ｇ／ｃｍ3
以下、曲げ強度：９０ｋｇｆ／ｃｍ2 以上、曲げ弾性
率：１８０００ｋｇｆ／ｃｍ2 以上を設定し、これらの
外観及び物性値の全てをクリヤしたものを○、全てをク
リヤできなかったものを×として評価した。結果を表１
に示す。The flexural strength and flexural modulus are JIS-A14
Bending test is performed according to 08 and measured, and appearance is determined by visual inspection. Specific gravity is calculated from volume and weight obtained from thickness x height x length of rectangular parallelepiped specimen. I asked. Physical property judgment is a criterion that is a measured physical property value that is generally judged to be no problem in use as a general-purpose building material,
That is, the visual appearance is good, and the specific gravity is 1.8 g / cm 3.
Hereinafter, flexural strength: 90 kgf / cm 2 or more, the flexural modulus: 18000kgf / cm 2 to set the above evaluation those clears all of these appearance and physical properties ○, as × those that could not be cleared of all did. Table 1 shows the results
Shown in
【００２５】[0025]
【表１】 [Table 1]
【００２６】実施例５〜７及び比較例４〜５ 熱硬化後の硬質フェノール樹脂と紙の混合粉末よりなる
プリント基板粉砕物（プリント基板処理プラントより入
手）１００重量部に、フェノール樹脂（住友デュレズ製
ＮＫ−７００１）を表１に示すように５重量部及び１０
重量部の割合で配合し、実施例１の場合と同様にして厚
さ６ｍｍ前後の建材用ボードを作成し、このボードから
テストピースを切り出した。なお、プリント基板粉砕物
としては、その９８重量％が粒子径０．１ｍｍ以下、
０．３ｍｍ以下、及び２ｍｍ以下のものを使用した。Examples 5 to 7 and Comparative Examples 4 to 5 100 parts by weight of a pulverized printed circuit board (obtained from a printed circuit board processing plant) composed of a mixed powder of hard phenol resin and paper after thermosetting were mixed with a phenol resin (Sumitomo Durez). NK-7001) as shown in Table 1 by 5 parts by weight and 10 parts by weight.
The composition was blended in parts by weight, and a building material board having a thickness of about 6 mm was prepared in the same manner as in Example 1, and a test piece was cut out from the board. In addition, 98% by weight of the pulverized printed circuit board had a particle diameter of 0.1 mm or less,
0.3 mm or less and 2 mm or less were used.
【００２７】実施例１と同様にして、外観、比重、曲げ
強度及び曲げ弾性率を測定し、物性判定を行った。結果
を表２に示す。In the same manner as in Example 1, the appearance, specific gravity, flexural strength and flexural modulus were measured to determine the physical properties. Table 2 shows the results.
【００２８】[0028]
【表２】 [Table 2]
【００２９】[0029]
【発明の効果】本発明によれば、従来はその処理に苦慮
してきたプリント基板廃棄物のマテリアルリサイクル化
を達成することができ、同時にこのプリント基板粉砕物
を再利用し、建材として有用な機械的物性バランスに優
れた建材用ボードを得ることができる。According to the present invention, it is possible to achieve a material recycling of printed circuit board waste, which has been conventionally difficult to treat, and at the same time, to recycle the printed circuit board pulverized material to be useful as a building material. Thus, it is possible to obtain a building material board excellent in physical property balance.
Claims (4)
れたプリント基板粉砕物１００重量部に対して熱硬化性
樹脂１〜３０重量部を配合し成形してなる建材用ボー
ド。1. A building material board formed by mixing and molding 1 to 30 parts by weight of a thermosetting resin with 100 parts by weight of a crushed printed board obtained by crushing printed board waste.
棄物の処理プラントで金属成分を除去して得られた非金
属成分リッチの粉砕物である請求項１に記載の建材用ボ
ード。2. The building material board according to claim 1, wherein the pulverized printed circuit board is a non-metallic component-rich pulverized product obtained by removing a metal component in a printed circuit board waste treatment plant.
以上が粒子径１ｍｍ以下である請求項１又は２に記載の
建材用ボード。3. The weight of the pulverized printed circuit board is 98% by weight.
The building material board according to claim 1 or 2, wherein the particle diameter is 1 mm or less.
が熱硬化後の硬質エポキシ樹脂とガラス繊維の混合粉
末、熱硬化後の硬質フェノール樹脂と紙の混合粉末、又
はこれら混合粉末の混合物である請求項１〜３のいずれ
かに記載の建材用ボード。4. The pulverized printed circuit board is a mixed powder of a hard epoxy resin and glass fiber after thermosetting, a mixed powder of hard phenol resin and paper after thermosetting, or a mixture of these mixed powders. The building material board according to any one of claims 1 to 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2752199A JP2000226902A (en) | 1999-02-04 | 1999-02-04 | Board for construction material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2752199A JP2000226902A (en) | 1999-02-04 | 1999-02-04 | Board for construction material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000226902A true JP2000226902A (en) | 2000-08-15 |
Family
ID=12223441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2752199A Withdrawn JP2000226902A (en) | 1999-02-04 | 1999-02-04 | Board for construction material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000226902A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004182782A (en) * | 2002-11-29 | 2004-07-02 | Sanritsu Kakoki Kk | Method for producing resin for recycled board and method for producing recycled board |
| CN110903528A (en) * | 2019-12-05 | 2020-03-24 | 深圳雅居乐环保科技有限公司 | Method for preparing composite material by using waste circuit board |
-
1999
- 1999-02-04 JP JP2752199A patent/JP2000226902A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004182782A (en) * | 2002-11-29 | 2004-07-02 | Sanritsu Kakoki Kk | Method for producing resin for recycled board and method for producing recycled board |
| CN110903528A (en) * | 2019-12-05 | 2020-03-24 | 深圳雅居乐环保科技有限公司 | Method for preparing composite material by using waste circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20060404 |