JPH07142900A - Board positioning apparatus for mounting machine - Google Patents

Abstract

PURPOSE:To perform replacement of a positioning member easily and quickly by providing a holding member which can be removed from an elevating mechanism with a plate held and can be pulled out of a transfer line. CONSTITUTION:When mounting for a board is completed, a plate 20 and an intermediate plate 27 are integrally pushed down by force of a force applying plate 38. As a result, a positioned and held state of the substrate is canceled, and the substrate is carried to a subsequent process by a conveyer 2a. When a chip part is to be mounted onto boards different in size or pattern, it is necessary to replace a positioning member of the plate 20 according to a change in a mounting board. In this case, supply of air pressure to an air cylinder 31 is cut, and a lower plate 29 is held at a lowered position. Thus it is possible to remove the plate 20 from a board positioning apparatus so that the positioning member of the plate 20 can be easily replaced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting machine for mounting chip parts such as electronic parts on a board, and particularly for mounting the board to be carried at a predetermined mounting work position on a carrying line. The present invention relates to a positioning device.

[0002]

2. Description of the Related Art Conventionally, a printed circuit board (hereinafter, simply referred to as a board) which is carried by a conveyor along a carrying line.
There is known a mounting machine which holds a semiconductor chip in a predetermined mounting work position on a transfer line and automatically mounts a chip component such as an electronic component on the substrate. In such a mounting machine, generally, a plate member is arranged at a predetermined position of the transfer line, and the plate member is
A plurality of types of positioning members for positioning the substrate, such as pins that push up the substrate and pins that engage the substrate, are erected, and this plate member is connected to an elevating mechanism and the like and is interposed in the transfer line. And a position retracted downward from the transport line. That is, when the substrate is transported along the transport line and reaches above the plate member, the plate member is raised and the substrate is positioned and held while being pushed upward by the positioning member above the conveyor. There is. Then, the mounting work is performed on the substrate thus positioned.

[0003]

By the way, in the above-described board positioning apparatus, the mounting position of the positioning member with respect to the plate member can be changed and removed,
For example, a large number of screw holes are provided in the plate member in a vertically and horizontally aligned state, and a positioning member necessary for positioning and holding the substrate is selectively screwed into these screw holes.

That is, when a single mounting machine is used to perform mounting work on substrates having different patterns or substrates having different sizes, the position of the positioning member such as the pin may be changed for each size of the mounted substrate. It is necessary to replace the positioning member. Therefore, by selectively using the plurality of screw holes provided in the plate member as described above, it is possible to position a plurality of types of substrates.

However, the positioning device as described above has a position corresponding to the transfer line in the mounting machine when the mounting position of the positioning member is changed or the positioning member itself is changed according to the change of the type of the board. There is a problem in that it is necessary to perform work such as attachment / detachment of a positioning member with respect to a certain plate member, and the work is difficult because the conveyor or the like is an obstacle, and work efficiency is poor.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a board positioning device for a mounting machine, which enables extremely easy and quick operations such as replacement of positioning members. I am trying.

[0007]

According to the present invention, there is provided a board positioning device configured to position and support a board carried along a carrying line at a predetermined mounting work position on the carrying line. A plate equipped with one or a plurality of types of positioning members for positioning and supporting the substrate from below, an elevating mechanism for vertically elevating and detachably supporting the plate, and a lowering of the plate by the elevating mechanism, And a holding member capable of removing the plate from the elevating mechanism while holding the plate and pulling the transport line outward.

[0008]

In the substrate positioning apparatus of the present invention, when the plate is lowered by the elevating mechanism by a certain amount or more, the plate is detached from the elevating mechanism and held on the holding member so that it can be pulled out to the outside of the transfer line. Therefore, when the size of the mounted substrate is changed, the plate member can be attached / detached to / from the substrate positioning device very easily outside the mounting machine. In addition, for example, a plurality of plates equipped with positioning members according to the number of types of mounting boards, etc. are prepared in advance,
It is also possible to replace these plates and use them.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An example of a substrate positioning device according to the present invention will be described with reference to the drawings.

FIG. 1 is a plan view showing the whole mounting machine to which the board positioning apparatus of the present invention is applied. As shown in the figure, a board transfer conveyor 2 including a pair of parallel conveyors 2a and 2b is arranged on a base 1 of the mounting machine, and a board P is transferred along the board transfer conveyor 2. Then, the board positioning device 3 described in detail later positions and holds the board at a predetermined mounting work position.

A component supply unit 4 is arranged on the side of the substrate carrying conveyor 2. The component supply unit 4 is equipped with a large number of rows of tape feeders 4a. Each tape feeder 4a accommodates and holds small chip-shaped chip components such as ICs, transistors, and capacitors at predetermined intervals from a reel. In addition to being pulled out, the tape feeding end is equipped with a ratchet type feeding mechanism,
As a chip unit is picked up by a head unit 5 described later, the tape is intermittently fed.

A head unit 5 for mounting components is mounted on the base 1 and above the board conveying conveyor 2. The head unit 5 is movable in the X-axis direction (direction of the substrate carrying conveyor 2) and the Y-axis direction (direction orthogonal to the X-axis on a horizontal plane).

That is, a pair of support members 6a are installed on the base 1 in the X-axis direction, and a pair of fixed rails 7 extending in the Y-axis direction on each support member 6a and a Y-axis servomotor 9 rotate the support members 6a. The driven ball screw shaft 8 is provided,
The head unit support member 11 is arranged on the fixed rail 7, and the nut portion 1 provided on the support member 11 is arranged.
2 is screwed onto the ball screw shaft 8. Further, the support member 11 includes a guide member 13 extending in the X-axis direction,
Ball screw shaft 1 driven by X-axis servomotor 15
4 is disposed, the head unit 5 is movably held by the guide member 13, and a nut portion (not shown) provided on the head unit 5 is attached to the ball screw shaft 14
It is screwed to. Then, the ball screw shaft 8 is rotated by the operation of the Y-axis servomotor 9 to move the support member 11 in the Y-axis direction, and the ball screw shaft 14 is rotated by the operation of the X-axis servomotor 15, so that the head unit is rotated. 5
Moves in the X-axis direction with respect to the support member 11.

Although not shown in detail in the head unit 5, the nozzle member 1 for adsorbing a chip component is provided.
6 is provided. In the illustrated embodiment, three nozzle members 16 are provided, and each nozzle member 16 moves in the Z-axis direction (vertical direction) with respect to the frame of the head unit 5 and in the R-axis direction (around the central axis of the nozzle). It is possible to rotate. Further, a negative pressure supply means (not shown) is connected to each nozzle member 16 via a valve or the like, and when necessary,
That is, when the chip component is sucked, a required negative pressure for sucking the component is supplied to the nozzle member 16.

2 to 4 schematically show the structure of the substrate positioning device 3.

The substrate positioning device 3 includes the supporting member 6a.
The inside of the conveyor 2a in the substrate transporting conveyor 2 (see FIGS.
Plate 20 provided with a plurality of types of positioning members for positioning and holding the substrate transported along the substrate transport conveyor 2
And a holding member for supporting the plate 20 so as to be lifted and lowered, and a holding member for detaching the plate 20 from the lifting mechanism and holding the plate 20 to the outside of the substrate transporting conveyor 2 so that the plate 20 can be pulled out.

As shown in FIG. 2, the plate 20 is formed in a rectangular shape, and a large number of screw holes 21 are formed on the surface thereof.
Are screwed vertically and horizontally.

The plate 20 serves as a positioning member.
Pair of first locating pins 22 for locating the substrate with respect to one of the conveyors 2a, a pair of second locating pins 23a, 23b for locating the transported substrate with respect to the plate 20, and the substrate is pressed from below. A plurality of push-up pins 24 (four in FIG. 2) are screwed onto the plate 20. In particular, each push-up pin 24 is attached to a mounting plate 25, and the mounting plate 25 is selectively screwed into the screw hole 21 so that a wide range of position adjustment is possible, and the bolt for mounting the screw is attached. The fine adjustment of the position is possible by being screwed onto the plate 20 through the long hole 25a formed in the plate 25. Further, one pin 23b of the pair of second locate pins 23a, 23b is attached so that the position adjustment in the Y-axis direction is possible. That is, a long hole 26 extending in the Y-axis direction is formed in the plate 20, and the pin 23b is attached to the plate 20 through the long hole 26 so that the position can be adjusted.

As shown in FIGS. 2 and 3, the plate 20 is mounted on a rectangular intermediate plate 27 which is smaller than the plate 20. On this occasion,
The plate 20 is mounted on the intermediate plate 27 with a pair of positioning pins 27a protruding from the upper surface of the intermediate plate 27 being inserted into the perforated portion of the plate 20.

On the lower surface of the intermediate plate 27,
As shown in FIG. 3, a rod of an air cylinder 28 arranged below the support plate 17 is connected to the intermediate plate 27 so that the intermediate plate 27 can be raised or lowered according to the supply or discharge of air pressure to or from the air cylinder 28. It has become. That is, except during mounting, the intermediate plate 27 is brought into contact with a lower plate 29, which will be described later, as shown by the solid line in FIG. On the other hand, the intermediate plate 27 and the plate 20 are integrally lifted as shown by the chain double-dashed line in the figure so that the board is positioned by the above-mentioned positioning members. ing. More specifically, when the intermediate plate 27 and the plate 20 are integrally lifted at the time of mounting, as shown in FIG. 4, each first locating pin 22 of the plate 20 causes a predetermined hole in the side plate 2d of the conveyor 2a or the like. The second locate pins 23a and 23b are projected into predetermined positioning holes of the substrate P while being pushed into the portion, and at the same time, the substrate P is pushed up from below by the push-up pins 24. As a result, the substrate P is separated from the conveyor and is supported by the push-up pins 24, and the locate pins 23a and 23b are prevented from moving, so that the substrate P is positioned at the mounting position.

On the other hand, below the intermediate plate 27,
An elongated lower plate 29 extending in the X-axis direction is provided, and the lower plate 29 can be moved up and down.
That is, the rods of a pair of air cylinders 31 fixed on the support plate 17 are connected to the lower surfaces of both end portions of the lower plate 29, respectively. 3 is moved up and down to a raised position shown by a solid line and a lowered position shown by a chain line.

The lower plate 29 is held in a raised position in a normal state, and when the intermediate plate 27 is lowered, the intermediate plate 27 is laminated on the lower plate 29. It is like this. At this time, a pair of guide pins 27b projecting from the lower surface of the intermediate plate 27 are penetrated through the lower plate 29. In addition, a cylindrical guide portion 30 is joined to the lower surface of the lower plate 29 at a substantially central portion thereof, and the rod of the air cylinder 28 is inserted into the guide portion 30 and is inserted into the lower portion of the lower plate 29. It is adapted to be joined to the lower surface of the intermediate plate 27.

On the supporting plate 17, the air cylinder 3
A pair of holding side plates 32a and 32b forming a holding member are arranged in a portion on the inner side (the inner side in FIG. 3) of 1. Each of the holding side plates 32a and 32b is fixed on the support plate 17 so as to extend in the Y-axis direction and be parallel to each other. The spacing between the side plates 22a and 22b is
The size of the plate 20 is slightly wider than the size of the plate 20 in the X-axis direction, and a plurality of bearings 33 are axially supported at the upper end edges of the respective facing surfaces in a state of being aligned in the Y-axis direction. Moreover, as shown in FIG.
A notch 34 is formed in each of a and 32b at a portion corresponding to the lower plate 29. When the lower plate 29 is lowered, the notch 34 is intervened in the notch 34. There is.

On the other hand, on the support plate 17, brackets 35 are respectively arranged at positions on the outer sides (left and right outer sides in FIG. 3) of the air cylinders 31, and the upper ends of the brackets 35 are oriented inward. A top plate 36 projecting toward the top plate is provided, and a shaft body 37 extending in the vertical direction, a biasing plate 38 moving along the shaft body 37, and a bottom surface of a top end portion of the top plate 36 are provided. The urging plate 3 inserted into the shaft body
And a coil spring 39 for urging 8 downward. As shown in FIG. 3, the urging plate 38 has its distal end abutted against the upper ends of the holding side plates 32a and 32b by the urging force of the coil spring 39 in a normal state. It is in contact with the upper surface of the edge portion of the plate 20 in the X-axis direction. Then, when the plate 20 is raised by raising the intermediate plate 27, as shown by the two-dot chain line in FIG. It is designed to be used.

Next, the operation of the board positioning device 3 will be described in detail while briefly explaining the operation of the mounting machine configured as described above.

First, when the mounting operation is started, each of the conveyors 2a and 2b of the board conveying conveyor 2 is driven,
The substrate P is conveyed from a substrate supply unit (not shown). Then, when the front end portion of the substrate P comes into contact with a stopper member (not shown) along with the transportation, the substrate positioning device 3 is moved at that timing.
Are driven to position the substrate P at a predetermined mounting work position. That is, as described above, the intermediate plate 27
The plate 20 is integrally lifted, and the substrate P is lifted and positioned and held.

When the substrate P is positioned and held as described above, the head unit 5 is moved above the component supply unit 4 by driving the X-axis servomotor 15 and the Y-axis servomotor 9, The nozzle member 16 for sucking is sucked to ascend the desired chip component from the tape feeder 4a. After that, by driving the servo motors 9 and 15 again, the head unit 5 is moved to the disposition position of the component inspection device (not shown), and a predetermined inspection is performed on the chip components adsorbed there. . Then, when this inspection is completed, the head unit 5 is moved onto the substrate P, the nozzle member 16 sucking the chip component is lowered, and the chip component is mounted at a predetermined component mounting position on the substrate P. It will be.

When the predetermined mounting work on the substrate P is completed by repeating the above operation,
The supply of air pressure to the air cylinder 28 is cut off, so that the plate 20 and the intermediate plate 27 are integrally pushed downward by the urging force of the urging plate 38. As a result, the positioning and holding state of the substrate P is released, the substrate P is unloaded to the subsequent process by each of the conveyors 2a and 2b, and a new substrate is loaded along the substrate transporting conveyor 2. .

By the way, in the mounting machine described above, when chip components are mounted on substrates of different sizes or different patterns, the positioning members of the plate 20 are exchanged according to the change of the mounted substrate. There is a need. In this case, in the mounting machine, first, in the state shown in FIG. 3, the supply of air pressure to each of the air cylinders 31 is cut off, and the lower plate 29 is held in the lowered position, so that the plate 20 is placed on the substrate. The positioning device 3 can be detached from the positioning device 3, and the positioning member of the plate 20 can be easily replaced.

More specifically, under the condition shown in FIG. 3, the air pressure is supplied to the air cylinder 31, while the air pressure is not supplied to the air cylinder 28. The intermediate plate 27 and the plate 20 have their own weight, and the lower plate 2 is held in the raised position.
It is in a state of being laminated on the upper part of 9. Therefore, when the supply of the air pressure to the air cylinder 31 is shut off in this state, the lower plate 29 is lowered by its own weight accordingly, and the plate 20 and the intermediate plate 27 are moved according to the lowering of the lower plate 29. Will be lowered together. However, when the plate 20 descends by a certain amount, the plate 20
Both end portions in the X-axis direction ride on the bearings 33 of the holding side plates 32a and 32b, so that only the plate 20 serves as the intermediate plate 27, as shown in FIGS.
And is held on the bearing 33. Therefore, by pulling the plate 20 in the Y-axis direction in this state, the plate 20 is easily pulled out to the outside of the substrate transporting conveyor 2 as shown by the alternate long and short dash line in FIG.

That is, in the mounting machine, since the plate 20 can be easily attached to and detached from the board positioning device 3 as described above, a plurality of plates 20 having the positioning members mounted thereon according to boards of different sizes or boards of different patterns.
Is prepared in advance, and the plate 20 is exchanged every time the type of the substrate is changed, it is possible to cope with the change of the type of the mounted substrate extremely quickly. Therefore, as compared with the conventional substrate positioning apparatus in which a large number of positioning members screwed on the plate are individually replaced each time the type of substrate is changed, the positioning members can be replaced very quickly.

Further, even when the positioning member is exchanged with a single plate 20 and a plurality of types of boards are dealt with, the plate 20 can be pulled out of the mounting machine to replace the positioning member. The operator does not need to replace the positioning member while inserting his or her hand or tool into the board transfer conveyor 2, which is advantageous in terms of workability and safety.

The substrate positioning device of the above embodiment is
It is one embodiment of the present invention, and its specific configuration can be appropriately changed without departing from the gist of the present invention. For example,
In the above-described embodiment, a mechanism using an air cylinder as a drive source is adopted as the plate lifting mechanism, but it may be configured by a lifting mechanism including a motor and a cam.

Also, the pair of locate pins 23a, 2
Instead of 3b, a push-in member 40 as shown in FIG.
May be used. This push-in member 40
Has an air cylinder 43 attached to a bracket 41 attached to the plate 20 via a stay 42, and a block-shaped pusher 4 is attached to a rod of the air cylinder 43.
It has a structure with 4 attached. Then, when the substrate P reaches a predetermined working position, the pusher 45 pushes the substrate P from one side and pushes the substrate P against a receiving member (not shown) on the other side. Even when this push-in member 40 is used, it may be attached to the plate 20 in a positionally adjustable manner.

The structure of the mounting machine to which the above-mentioned board positioning device is applied is not limited to the present invention, and can be changed as appropriate.

[0036]

As described above, in the substrate positioning apparatus of the present invention, when the plate is lowered by the elevating mechanism by a certain amount or more, the plate is detached from the elevating mechanism and held on the holding member so that the plate can be removed from the transfer line. It becomes possible to withdraw to one side. Therefore, the attachment of the positioning member to the plate,
Operations such as replacement can be easily performed outside the mounting machine, and a plurality of plates equipped with positioning members according to the number of types of mounted boards are prepared in advance and used while exchanging these plates. This also makes it possible to easily and quickly replace the positioning member when changing the type of the mounted substrate.

[Brief description of drawings]

FIG. 1 is a plan view showing a mounting machine to which an example of a board positioning device of the present invention is applied.

FIG. 2 is an enlarged plan view showing a substrate positioning device.

FIG. 3 is a view on arrow A in FIG.

4 is a sectional view taken along line IV-IV in FIG.

5 is a view taken in the direction of arrow A in FIG. 2 showing a state in which the lower plate is lowered.

[Fig. 6] IV- in Fig. 2 showing a state in which the lower plate is lowered.
It is an IV sectional view.

FIG. 7 is a side view showing a push-in member.

[Explanation of symbols]

 3 substrate positioning device 20 plate 21 screw hole 22 first locate pin 23a, 23b second locate pin 24 push-up pin 27 intermediate plate 28, 31 air cylinder 29 lower plate 33 bearing 34a, 34b holding side plate

Claims (1)

[Claims] 1. A substrate to be transported along a transport line,
A board positioning device configured to position and support at a predetermined mounting work position on a transfer line, and a plate equipped with one or a plurality of positioning members for positioning and supporting the board from below. An elevating mechanism that lifts and lowers the plate and detachably supports the plate, and at the time of lowering the plate by the elevating mechanism, the plate can be removed from the elevating mechanism while being held and the transfer line can be pulled out to the outside. And a holding member for controlling the board positioning apparatus of the mounting machine.