JPH07142854A - Laser soldering device - Google Patents

Abstract

PURPOSE:To perform the soldering of an IC package where a row of leads are projected at four sides with a simple mechanism by equipping this device with a driving mechanism which shifts the first slider along the first guide rail. CONSTITUTION:An IC package 2 is sucked and held with a suction head 5, and this is installed in the mounting position of a printed wiring board 1, and also a supporting means 4 is positioned above the mounting position. In this condition, the first slider 75 is shifted along the first guide rail 74 by operating the drive mechanism of a peripheral mechanism 7. Accompanying this, a laser device 6 shifts the periphery of the IC package 2 and a laser beam is applied gradually to a row of leads 21 projected at four sides of the IC package 2. Moreover, in case that there is a discrepancy in the suction and retention position of the IC package by the suction head 5, the position of the laser beam is modified by shifting the second slider 82 of a reciprocating mechanism 8 in the longitudinal direction of the lead along the second guide rail 81.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for soldering an IC package such as QFP on a printed wiring board.
More specifically, the present invention relates to an apparatus that irradiates a laser beam onto a lead row protruding from four sides of an IC package, sweeps the lead row with the laser light, and solders each lead onto a printed wiring board.

[0002]

2. Description of the Related Art Conventionally, as such a laser soldering device,
As shown in FIGS. 3 and 4, a support member (9) vertically supporting the suction head (5) is provided with two guide rails (91) (91) extending on both sides of the suction head (5) in parallel with each other in the horizontal direction. ) Is installed on the guide rails (91) and (91), and sliders (92) holding the laser device (6) are slidably fitted to the guide rails (91) and (91), and a driving member that engages with the ball screw (93). It is known that both sliders (92) and (92) are integrally connected to (90). According to this device, by rotating and driving the ball screw (93), both laser devices (6) and (6) are simultaneously moved in the same direction, and a pair of left and right projections provided on both sides of the IC package (2) are projected. The lead row (21) can be irradiated with a laser beam (61) for soldering.

Further, as shown in FIG. 5, two sliders (92) are slidably fitted to two guide rails (91) (91) which are horizontally installed on a supporting member (9), and both sliders ( 9
2) A device is proposed in which (92) are connected to each other by a rotary link (94), and a laser device (6) is attached to each slider (92) (actual open flat 2-53866). According to this device, by rotating the link (94), both laser devices (6)
By simultaneously moving (6) in opposite directions, a pair of lead rows on both sides of the IC package can be irradiated with laser light (61) to perform soldering.

[0004]

[Problems to be Solved by the Invention] However, QFP
In the case of soldering an IC package having lead rows protruding from each of the four sides as described above, in the conventional laser soldering apparatus, after soldering a pair of lead rows extending in parallel to each other, the entire apparatus is soldered. It is necessary to rotate 90 ° around the vertical axis and solder the remaining pair of lead rows, so that there is a problem that the configuration becomes complicated depending on the equipment of the rotation mechanism.

Further, as shown in FIG.
When the C package (2) is suction-held, if the suction-holding position is displaced, the irradiation position of the laser light (61) is also displaced. In this case, if a mechanism for adjusting the tilt angle of the laser device (6) is equipped, it is possible to adjust the irradiation position of the laser light (61), but with the change of the tilt angle of the laser device (6). As a result, the incident angle of the laser beam (61) and the spot diameter change, and there is a problem that optimum heating conditions cannot be obtained.

An object of the present invention is to make it possible to solder an IC package having lead lines protruding from four sides around it with a simple mechanism, and still keep the incident angle of laser light and the spot diameter constant. It is an object of the present invention to provide a laser soldering device capable of adjusting the irradiation position of laser light as it is.

[0007]

A laser soldering apparatus according to the present invention comprises a support member (4) positioned above an IC package mounting position of a printed wiring board (1) by an actuator (3), and a circulating mechanism ( 7) and the laser device (6) are supported via the reciprocating mechanism (8), and the orbiting mechanism (7) includes a first guide rail (74) that surrounds the adsorption head (5) and orbits in a horizontal plane, A first slider (75) slidably fitted to the first guide rail (74); and a drive mechanism for moving the first slider (75) along the first guide rail (74),
The reciprocating mechanism (8) is the first slider (7) of the orbiting mechanism (7).
A second guide rail (81) attached to the first guide rail (74) and extending in a horizontal plane at right angles to the first guide rail (74); and a second slider (slidably fitted to the second guide rail (81). 82), and the laser device (6) is held by the second slider (82).

[0008]

The IC head (5) is sucked and held by the suction head (5), and the IC package (2) is installed at the mounting position of the printed wiring board (1) and the actuator (3) supports the IC package (2).
Position (4) above the mounting position. In this state, the drive mechanism of the circulation mechanism (7) is operated to move the first slider (75).
Is moved along the first guide rail (74). Along with this, the laser device (6) moves around the IC package (2) and the lead rows protruding from the four sides of the IC package (2) are provided.
The laser light (61) is sequentially irradiated to (21).

[0009] For example, a rectangular I is provided by a orbiting mechanism (7) having a first guide rail (74) extending along a square path.
When soldering the C package (2), when the sweep of the lead row (21) protruding from the short side of the IC package (2) is shifted to the sweep of the long side lead row (21), Alternatively, when the sweep is moved in the opposite direction, the second slider (82) of the reciprocating mechanism (8) is moved along the second guide rail (81) to move the laser beam (61) of the laser device (6). Switch the irradiation position. The second slider (82) can be moved by a known drive mechanism such as a ball screw.

Further, an IC package using the suction head (5)
When there is a deviation in the suction holding position of (2), the irradiation position of the laser beam (61) is also displaced due to the deviation, and at the time of sweeping the lead train (21), the reciprocating mechanism (8) is moved. The second slider (82) is moved along the second guide rail (81) in the lead longitudinal direction to correct the irradiation position of the laser light (61). The moving distance of the second slider (82) in this case can be determined in advance according to the shift of the suction holding position of the IC package (2).

When the reciprocating mechanism (8) is operated as described above, since the laser device (6) moves in parallel in the horizontal direction, the inclination angle of the laser device (6) with respect to the printed wiring board (1), the printed wiring board, and the like. The distance to (1) is unchanged. Therefore, the incident angle of the laser beam (61) and the spot diameter do not change, and the optimum heating condition is maintained.

[0012]

According to the laser soldering apparatus of the present invention, it is possible to perform soldering of an IC package having lead lines protruding from four sides without rotating the entire apparatus around a vertical axis. Since this is possible, the device configuration becomes simple. Of course, the irradiation position of the laser light can be adjusted while keeping the incident angle of the laser light and the spot diameter constant.

[0013]

1 and 2 show an embodiment of the present invention. An actuator composed of an XY linear motion table mechanism and a robot arm, which are conventionally known in surface mounting devices.
The suction head (5) is attached to the output end of (3) through the support member (4)
Is attached. As is well known, the suction head (5) is connected to a vacuum device (not shown), and an IC
It has a suction nozzle (51) for sucking and holding the package (2).

A laser device (6) is supported on the support member (4) through a circulating mechanism (7) and a reciprocating mechanism (8). The orbiting mechanism (7) surrounds the suction head (5) and supports the support member (4).
First guide rail (74) protrudingly provided on the back surface of the first slider and a first slider (75) slidably fitted on the first guide rail (74)
And a drive mechanism for moving the first slider (75) along the first guide rail (74). The first guide rail (74) has a basic shape of a similar quadrangle obtained by enlarging the four sides of the IC package (2), and the four corners of the quadrangle are each formed into a smooth curve by an arc. The radius of curvature of the arc is large enough for the first slider (75) to slide smoothly. If necessary, equip the first slider (75) with roller bearings, etc.
Allows smooth sliding with respect to (74).

The drive mechanism of the circulating mechanism (7) is a drive belt (73) stretched along the inner wall of the first guide rail (74).
And the drive belt (73) along the inner wall of the first guide rail (74)
A plurality of belt guides (76) for guiding the orbital movement of the drive pulley (72) engaged with the drive belt (73),
A motor (71) for rotationally driving (72), a drive belt (7
The first slider (75) is fixed to 3). Therefore, when the motor (71) is rotated, the drive belt (73) is rotated along the inner wall of the first guide rail (74), and the first slider (75) is moved along the first guide rail (74). To move. Thereby, the laser beam (61) of the laser device (6) is I
The four sides around the C package (2) are sequentially swept.

The reciprocating mechanism (8) is the first of the orbiting mechanism (7).
A second guide rail (81) attached to the slider (75) orthogonal to the first guide rail (74), and a second slider (82) slidably fitted on the second guide rail (81). And a drive mechanism (not shown) such as a ball screw for reciprocally driving the second slider (82) along the second guide rail (81),
The laser device (6) is held on the second slider (82) in a predetermined inclined posture. Therefore, by operating the drive mechanism, the second slider (82) moves in the direction orthogonal to the first guide rail (74), and the irradiation position of the laser beam (61) of the laser device (6) is changed. The IC package (2) is moved in the longitudinal direction of the leads.

The operations of the orbiting mechanism (7) and the reciprocating mechanism (8) are controlled by a control circuit (not shown) composed of a microcomputer or the like, and the laser device (6) is operated by operating both mechanisms at the same time. The irradiation position of the laser light (61) can be adjusted in any direction on the horizontal plane.

Hereinafter, I using the above laser soldering apparatus
The surface mounting process of the C package (2) will be described. First, the suction head (5) sucks and holds the IC package (2) of the component supply unit, drives the actuator (3),
The IC package (2) is conveyed to a predetermined mounting position on the printed wiring board (1). At this time, the printed wiring board
Cream solder is applied in advance to the mounting position of (1). Then, the actuator (3) is driven vertically downward to press the IC package (2) to the mounting position.

As described above, the IC package (2) is transported from the component supply section to the mounting position on the printed wiring board (1),
The IC package using the suction nozzle (51) by means of well-known image recognition or the like in the process of pressing to the implementation position.
The deviation of the suction holding position and the attitude of (2) is detected, and the correction amount of the irradiation position by the laser beam (61) of the laser device (6) is adjusted based on the deviation, and the correction amount of the first slider ( Calculated as a function of the orbital movement distance in 75).

Next, the motor (71) of the orbiting mechanism (7) is energized to orbit the laser device (6) around the IC package (2), while the reciprocating mechanism (8) is moved by the correction amount. Are operated to move the laser device (6) in a direction orthogonal to the orbiting direction. Then, in this process, the laser device (6) irradiates the lead line (21) of the IC package (2) with the laser light (61), and the lead lines (21) on the four sides of the IC package (2) are irradiated with the laser light (61). Sweep by 61). This allows the lead column (2
1) and the cream solder on the printed wiring board (1) are heated and the leads are soldered to the printed wiring board (1).

In the above embodiment, since the first guide rail (74) of the orbiting mechanism (7) is formed to be substantially similar to the four sides of the IC package (2), the reciprocating mechanism (8) is exclusively the suction nozzle (51). )
The rectangular IC package (2) can be soldered by the operation of the reciprocating mechanism (8), though it is used to correct the displacement of the suction holding position of the IC package (2). That is, when the sweep of the lead row (21) protruding from the short side of the IC package (2) is changed to the sweep of the lead row (21) of the long side, or when the sweep is changed in the opposite direction, the reciprocation is performed. The irradiation position of the laser beam (61) of the laser device (6) is switched by moving the second slider (82) of the mechanism (8) along the second guide rail (81).

According to the above laser soldering device, the four lead rows protruding from the four sides of the IC package can be sequentially and efficiently soldered to the printed wiring board in a precise and accurate manner. Even when the suction holding position of the IC package is deviated, the irradiation position of the laser light can be adjusted while keeping the incident angle of the laser light and the spot diameter constant, so that high quality soldering can be realized. . Also, the circulation mechanism
Since (7) adopts the traction system using the drive belt (73), the mechanism becomes simpler than the drive system using the link mechanism, the ball screw mechanism, or the like.

The above description of the embodiments is for explaining the present invention, and should not be construed as limiting the invention described in the claims or limiting the scope. The configuration of each part of the present invention is not limited to the above-mentioned embodiment, and it goes without saying that various modifications can be made within the technical scope described in the claims.

For example, in the above-described embodiment, a single laser device (6) is supported via the orbiting mechanism (7) and the reciprocating mechanism (8), but a plurality of laser devices (up to 4) are provided for the orbiting mechanism (7). It is also possible to further increase the production efficiency by connecting the reciprocating mechanism (8) and the laser device (6). Further, the reciprocating mechanism (8) is not limited to be driven by a motor or the like, but may be configured to have only a manual position adjusting function.

[Brief description of drawings]

FIG. 1 is a partially cutaway front view of a laser soldering device according to the present invention.

FIG. 2 is a partially cutaway plan view of the same device.

FIG. 3 is a plan view of a conventional laser soldering device.

FIG. 4 is a front view of the same device.

FIG. 5 is a plan view showing another conventional device.

[Explanation of symbols]

 (1) Printed wiring board (2) IC package (21) Lead row (3) Actuator (4) Support member (5) Suction head (6) Laser device (7) Circulation mechanism (71) Motor (74) First guide Rail (75) First slider (8) Reciprocating mechanism (81) Second guide rail (82) Second slider

Claims (1)

[Claims] 1. A lead row (21) projecting from four sides of an IC package (2) suction-held by a suction head (5) is irradiated with a laser beam (61) to print the lead row (21). In an apparatus for soldering on a board (1), a circulating member (7) and a reciprocating mechanism (8) are mounted on a supporting member (4) positioned above an IC package mounting position of a printed wiring board (1) by an actuator (3). The laser device (6) is supported via the first guide rail (74) that surrounds the suction head (5) and orbits in the horizontal plane, and the first guide rail (74). The reciprocating mechanism (8) includes a first slider (75) slidably fitted in the first slider (75) and a drive mechanism for moving the first slider (75) along the first guide rail (74).
A second guide rail (81) attached to the first slider (75) of (7) and extending in a horizontal plane orthogonal to the first guide rail (74) and sliding on the second guide rail (81). A second slider (82) that fits as much as possible, the second slider (82)
A laser soldering device in which the laser device (6) is held in place.