JPH07138676A - Alloy powder for conductive paste and its production - Google Patents
Alloy powder for conductive paste and its productionInfo
- Publication number
- JPH07138676A JPH07138676A JP5284938A JP28493893A JPH07138676A JP H07138676 A JPH07138676 A JP H07138676A JP 5284938 A JP5284938 A JP 5284938A JP 28493893 A JP28493893 A JP 28493893A JP H07138676 A JPH07138676 A JP H07138676A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- conductive paste
- alloy
- grinding
- resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000843 powder Substances 0.000 title claims abstract description 67
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 24
- 239000000956 alloy Substances 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 238000000227 grinding Methods 0.000 claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims abstract description 10
- 239000012298 atmosphere Substances 0.000 claims abstract description 6
- 239000000203 mixture Substances 0.000 claims abstract description 6
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- 239000012535 impurity Substances 0.000 claims abstract description 3
- 239000000126 substance Substances 0.000 claims abstract description 3
- 230000001590 oxidative effect Effects 0.000 claims description 4
- 239000011812 mixed powder Substances 0.000 claims description 3
- 238000013508 migration Methods 0.000 abstract description 15
- 230000005012 migration Effects 0.000 abstract description 15
- 230000003647 oxidation Effects 0.000 abstract description 9
- 238000007254 oxidation reaction Methods 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 3
- 229910052737 gold Inorganic materials 0.000 abstract description 3
- 239000003054 catalyst Substances 0.000 abstract description 2
- 238000010298 pulverizing process Methods 0.000 abstract 2
- 239000002245 particle Substances 0.000 description 8
- 238000005476 soldering Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229910002708 Au–Cu Inorganic materials 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- 239000012300 argon atmosphere Substances 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910001315 Tool steel Inorganic materials 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ベアチップＩＣ、フリ
ップチップＩＣ等のチップオンボード（ＣＯＢ）実装、
その他の微細電子回路の製造に用いる導電性ペースト用
合金粉末およびその製造方法に関するものである。The present invention relates to chip-on-board (COB) mounting of bare chip ICs, flip chip ICs, etc.
The present invention relates to an alloy powder for a conductive paste used for manufacturing other fine electronic circuits and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】従来より、ＣＯＢ実装等に用いる導電性
ペースト用合金粉末としては、Ａｇのマイグレーション
の問題から、Ａｇ−Ｐｄ合金粉末あるいはＡｇ−Ｃｕ合
金粉末等が用いられている。ここにＡｇのマイグレーシ
ョンとは、Ａｇがイオン化して移動し、移動先において
電荷を失ってそこで析出する現象であって、このような
マイグレーションが生じると、最終的には回路が短絡
し、電子部品として機能しなくなる。2. Description of the Related Art Conventionally, Ag-Pd alloy powder or Ag-Cu alloy powder has been used as a conductive paste alloy powder used for COB mounting or the like because of the problem of Ag migration. Here, the migration of Ag is a phenomenon in which Ag ionizes and moves, loses electric charge at the destination and precipitates there. Eventually, when such migration occurs, the circuit is short-circuited and the electronic component Will not function as.
【０００３】これらの導電性ペースト用合金粉末は、エ
ポキシあるいはポリエステル等の樹脂、およびブチルカ
ルビトールアセテートのような溶剤と混合してペースト
状とされ、スクリ−ン印刷等の方法により基板上にパタ
ーン形成されるか、転写等の方法により接合部に塗布さ
れたのち、溶剤が除去されて固化する。このようにして
形成された基板は、さらに大きい基板に搭載されてマル
チチップモジュ−ルとされることもあるが、このとき、
基板間の接続には半田付けが用いられるため、基板は２
００℃以上の温度に曝されることとなる。These alloy powders for conductive paste are mixed with a resin such as epoxy or polyester and a solvent such as butyl carbitol acetate to form a paste, which is patterned on a substrate by a method such as screen printing. After being formed or applied to the bonding portion by a method such as transfer, the solvent is removed and solidified. The substrate thus formed may be mounted on a larger substrate to form a multi-chip module. At this time,
Since soldering is used to connect the boards,
It will be exposed to a temperature of 00 ° C. or higher.
【０００４】Ａｇ−Ｐｄ合金粉末を導電性ペースト用粉
末として用いた場合、上記の半田付け温度においてＰｄ
が触媒作用をなし、固化剤として添加してある樹脂を分
解してしまうため、十分に固化しないという不都合を生
じる。また、導電性ペースト用粉末としてＡｇ−Ｃｕ合
金を用いた場合は、Ａｇリッチな合金ではマイグレーシ
ョンの問題があり、Ｃｕリッチな合金では上記の半田付
けの温度での耐酸化性が十分でないため、電子部品の寿
命の安定性を損うという不都合がある。Ａｕは化学的に
安定であり、導電性も導電材料として十分に良好である
が高価である。When Ag-Pd alloy powder is used as a powder for conductive paste, Pd is used at the above soldering temperature.
Acts as a catalyst and decomposes the resin added as a solidifying agent, resulting in the inconvenience of insufficient solidification. When an Ag-Cu alloy is used as the conductive paste powder, the Ag-rich alloy has a problem of migration, and the Cu-rich alloy has insufficient oxidation resistance at the soldering temperature. There is an inconvenience that the stability of the life of the electronic component is impaired. Au is chemically stable and has good conductivity as a conductive material, but is expensive.
【０００５】[0005]
【発明が解決しようとする課題】以上の現状に鑑みて、
本発明が解決しようとする課題は、導電性ペースト用と
して十分なほどに電気抵抗が低く、半田付け程度の温度
での加熱において耐酸化性に優れ、また触媒作用がな
く、耐マイグレーション性に優れ、かつ安価な導電性ペ
ースト用合金粉末とその製造方法を提供することにあ
る。In view of the above situation,
The problem to be solved by the present invention is that the electric resistance is low enough for a conductive paste, the oxidation resistance is excellent when heated at a temperature of soldering, and there is no catalytic action, and the migration resistance is excellent. Another object is to provide an inexpensive alloy powder for conductive paste and a method for producing the same.
【０００６】[0006]
【課題を解決するための手段】前記目的を達成するため
の本発明による導電性ペースト用合金粉末は、 （１）化学組成が重量％で、Ａｕ：５〜９０％、Ｃｕ：
１０〜９５％、その他不可避的不純物よりなることを特
徴とする。 （２）上記導電性ペースト用合金粉末の製造方法とし
て、Ａｕ粉末およびＣｕ粉末を混合する工程と、前記の
混合粉末を機械的粉砕手段で摩砕する工程と、前記の摩
砕した粉末を温度２００〜６００℃の非酸化性雰囲気中
において加熱する工程と、前記の加熱した粉末を機械的
粉砕手段で摩砕する工程とを含むことを特徴とする。MEANS FOR SOLVING THE PROBLEMS An alloy powder for a conductive paste according to the present invention for achieving the above object is as follows: (1) Chemical composition is wt%, Au: 5 to 90%, Cu:
It is characterized by comprising 10 to 95% and other unavoidable impurities. (2) As a method for producing the alloy powder for conductive paste, a step of mixing Au powder and Cu powder, a step of grinding the mixed powder with a mechanical crushing means, and a temperature of the ground powder. The method is characterized by including a step of heating in a non-oxidizing atmosphere at 200 to 600 ° C. and a step of grinding the heated powder with a mechanical grinding means.
【０００７】本発明の導電性ペースト用合金粉末では、
Ａｕ−Ｃｕ系合金とすることによってＡｇにおけるマイ
グレーションの問題を回避し、導電ペースト用として十
分なほどに電気抵抗を低くし、かつ、価額を低減するこ
とができる。Ａｕの含有率が５％未満では耐酸化性が十
分でなく、また９０％を超えてＡｕを含有しても前記の
効果が飽和し、いたずらに価格を高めるだけなのでＡｕ
含有率の上限を９０％とする。In the alloy powder for conductive paste of the present invention,
By using an Au-Cu-based alloy, the problem of migration in Ag can be avoided, the electric resistance can be made low enough for a conductive paste, and the price can be reduced. If the content of Au is less than 5%, the oxidation resistance is not sufficient, and even if the content of Au exceeds 90%, the above effect is saturated and the price is unnecessarily increased.
The upper limit of the content rate is 90%.
【０００８】本発明の導電性ペースト用合金粉末の製造
方法では、まず、所定の平均粒径をもつＡｕ粉末と同じ
く所定の平均粒径をもつＣｕ粉末を目的とする組成とな
る割合で混合し、次いで、機械的粉砕手段、例えばボー
ルミルによって摩砕する。このとき、Ａｕ粉末とＣｕ粉
末はボールによって一層微細に粉砕されて好ましいフレ
ーク状になると同時に、得られるフレーク粉において
は、そのフレ−ク粉内部でＡｕ微細粉末とＣｕ微細粉末
とが積層して互いが物理的に密着した状態で接触するこ
とになり、お互の原子間距離は極めて短縮した状態とな
る。In the method for producing an alloy powder for a conductive paste according to the present invention, first, an Au powder having a predetermined average particle diameter and a Cu powder having a predetermined average particle diameter are mixed at a ratio to achieve a target composition. Then, it is ground by mechanical grinding means, for example a ball mill. At this time, the Au powder and the Cu powder are more finely pulverized by the balls to form a preferable flake shape, and at the same time, in the obtained flake powder, the Au fine powder and the Cu fine powder are laminated inside the flake powder. They come into contact with each other in a state where they are physically in close contact with each other, and the interatomic distance between them becomes extremely short.
【０００９】機械的粉砕手段による摩砕の条件は、例え
ばボ−ルミルの場合、ボ−ルミルの形式やボールの径、
ボールミルの内径や回転速度、また粉末の混合割合や粒
径などの要因によって適宜に選択されるので、一義的に
決めるわけにはいかない。前述のフレーク粉における原
子間距離を短縮することは後述する熱処理時にフレーク
粉の合金化を促進するので、用いるＡｕ粉末とＣｕ粉末
の平均径は１０μｍ以下であることが好ましい。Grinding conditions by the mechanical grinding means are, for example, in the case of a ball mill, the type of ball mill, the diameter of balls,
Since it is appropriately selected depending on factors such as the inner diameter and rotation speed of the ball mill, the powder mixing ratio, and the particle size, it cannot be uniquely determined. Since shortening the interatomic distance in the flake powder promotes alloying of the flake powder during the heat treatment described later, the average diameter of the Au powder and Cu powder used is preferably 10 μm or less.
【００１０】また、ボールミル等による摩砕時に、混合
粉に対し０．１〜５重量％程度のステアリン酸や適当量
のアセトンを添加しておくと、粉砕−フレーク化の処理
を円滑に進めることができて好適である。上記の摩砕処
理によって得られたフレーク粉は、次に非酸化性雰囲気
中で加熱される。この加熱により、フレーク化粉内部で
積層しているＡｕとＣｕは、互いの接触界面で相互拡散
してＡｕ−Ｃｕ合金に転化し、Ａｕ−Ｃｕ合金フレーク
粉になる。Further, when milling with a ball mill or the like, if 0.1 to 5% by weight of stearic acid or an appropriate amount of acetone is added to the mixed powder, the crushing-flaking process can proceed smoothly. It is possible because it is possible. The flake powder obtained by the above grinding treatment is then heated in a non-oxidizing atmosphere. By this heating, Au and Cu laminated inside the flake powder are interdiffused at their contact interfaces and converted into Au-Cu alloy to become Au-Cu alloy flake powder.
【００１１】適用する非酸化性雰囲気としては、例え
ば、窒素雰囲気やアルゴン雰囲気が好適である。前述の
摩砕処理によってＡｕ粉末とＣｕ粉末とにおけるＡｕ−
Ｃｕの原子間距離が短縮しているので、温度２００℃と
いった比較的低い温度での加熱によって相互の合金化が
可能である。６００℃を超える高い温度で加熱するとフ
レーク粉が焼結して解粒が困難となるので熱処理温度の
上限を６００℃とする。As the non-oxidizing atmosphere to be applied, for example, a nitrogen atmosphere or an argon atmosphere is suitable. Au- in Au powder and Cu powder by the above-mentioned milling treatment
Since the interatomic distance of Cu is shortened, they can be alloyed with each other by heating at a relatively low temperature of 200 ° C. When heated at a high temperature exceeding 600 ° C., the flake powder sinters and it becomes difficult to disintegrate, so the upper limit of the heat treatment temperature is set to 600 ° C.
【００１２】加熱時間は、加熱温度やフレーク粉の粒径
によっても変るが、概ね１０〜１８０分程度で十分であ
る。加熱処理した粉末を再びボールミルのような機械的
粉砕手段によって摩砕することによって微細なフレーク
粉とする。Although the heating time varies depending on the heating temperature and the particle size of the flake powder, about 10 to 180 minutes is generally sufficient. The heat-treated powder is ground again by a mechanical grinding means such as a ball mill to obtain fine flake powder.
【００１３】[0013]
【実施例】平均粒径１μｍのＡｕ粉末、平均粒径１μｍ
のＣｕ粉末、市販のＡｇ粉末およびＰｄ粉末を表１の粉
末組成の欄に示す組成となるように配合し、それぞれそ
の２５ｇを取り、これにステアリン酸０．７５ｇおよび
アセトン１００ｇを加え、直径５ｍｍのＳＵＪ２製のボ
ール１００ｇと一緒に、内径９５ｍｍ、長さ１３０ｍｍ
の工具鋼製のボールミルに入れて、６０ｒｐｍで５０時
間ボールミルを運転した。その後ボールと粉末とを分離
し、粉末をアルゴン雰囲気中において表１の熱処理の欄
に示す条件で加熱処理し、さらにボールミルで１０時間
摩砕して合金粉末を得た。なお、比較例２では原料粉を
混合、磨砕後６５０℃で加熱処理したところ、焼結して
しまい解粒することができなかったので、この後の試験
は行わなかった。Example: Au powder having an average particle size of 1 μm, average particle size of 1 μm
Cu powder, commercially available Ag powder and Pd powder were blended so as to have the composition shown in the column of powder composition in Table 1, 25 g of each was taken, 0.75 g of stearic acid and 100 g of acetone were added thereto, and the diameter was 5 mm. 95mm inner diameter, 130mm length with 100g SUJ2 ball
The ball mill was operated for 50 hours at 60 rpm in a ball mill made of tool steel. After that, the balls and the powder were separated, and the powder was heat-treated in an argon atmosphere under the conditions shown in the column of heat treatment in Table 1 and further ground for 10 hours in a ball mill to obtain an alloy powder. In Comparative Example 2, when the raw material powders were mixed and ground and then heat-treated at 650 ° C., the powder was sintered and could not be disintegrated, so the subsequent test was not performed.
【００１４】これらの粉末について耐酸化性を評価し
た。耐酸化性は、大気中で昇温しつつ、熱天秤により重
量変化を測定し重量変化の生じる温度によって評価し
た。上記の各粉末７０重量部に対して、固化剤としてエ
ポキシ樹脂３０重量部、溶剤としてブチールカルビトー
ルアセテート１０重量部を加えて混合し、ペースト状と
した。粒ゲージを用いてこのペースト中の粉末の粒径を
測定したところ、最大径、平均径はそれぞれ、３μｍ、
２μｍであった。The oxidation resistance of these powders was evaluated. The oxidation resistance was evaluated by measuring the weight change with a thermobalance while raising the temperature in the atmosphere and measuring the temperature at which the weight change occurred. To 70 parts by weight of each of the above powders, 30 parts by weight of an epoxy resin as a solidifying agent and 10 parts by weight of butyl carbitol acetate as a solvent were added and mixed to form a paste. When the particle diameter of the powder in this paste was measured using a particle gauge, the maximum diameter and average diameter were 3 μm,
It was 2 μm.
【００１５】このペーストについて耐熱性、電気抵抗、
耐マイグレーション性を評価した。耐熱性の評価法はつ
ぎの通りである。端面の面積４ｍｍ2 のＡｕ端子の端面
にペーストを塗布し、対向する端子の端面に押しつけた
まま溶剤を蒸発させて固化し、これを１５０℃で６０分
間加熱して試験片とした。端子面に対して垂直方向に引
張力を負荷して破断時の引張力を測定した。About this paste, heat resistance, electric resistance,
The migration resistance was evaluated. The heat resistance evaluation method is as follows. The paste was applied to the end surface of the Au terminal having an end surface area of 4 mm 2, the solvent was evaporated and solidified while being pressed against the end surface of the opposing terminal, and this was heated at 150 ° C. for 60 minutes to obtain a test piece. A tensile force was applied in the direction perpendicular to the terminal surface, and the tensile force at break was measured.
【００１６】電気抵抗はメタルマスク印刷によって、ガ
ラスエポキシ基板上に膜厚２０μｍの膜を形成し、４探
針法によって測定した。耐マイグレーション性の評価法
はつぎの通りである。メタルマスクを用いてペーストを
ガラスエポキシ基板上に印刷し、溶剤を蒸発させて固化
し、マイグレーション測定用電極を形成した。電極間に
脱イオン水を２０μｌ滴下した後、直流電圧５Ｖをか
け、電極間に電流が流れ始めるまでの時間を測定して、
これをマイグレーション時間とした。The electrical resistance was measured by a 4-probe method after forming a film with a film thickness of 20 μm on a glass epoxy substrate by metal mask printing. The evaluation method of migration resistance is as follows. The paste was printed on a glass epoxy substrate using a metal mask, and the solvent was evaporated to solidify to form a migration measurement electrode. After dropping 20 μl of deionized water between the electrodes, apply a DC voltage of 5 V and measure the time until the current starts to flow between the electrodes.
This was taken as the migration time.
【００１７】これらの評価結果を比較例の結果とともに
表１に示す。なお、比較例３および比較例５の粉末は、
Ａｇ粉末およびＣｕ粉末をそのまま、あるいはペ−スト
化して試験に供した。The results of these evaluations are shown in Table 1 together with the results of the comparative examples. The powders of Comparative Example 3 and Comparative Example 5 were
The Ag powder and the Cu powder were used as they were or after being formed into a paste and tested.
【表１】 表１において耐熱性の○印は破断引張力３００ｇｆ以
上、×印は３００ｇｆ未満を示し、耐酸化性の○印は重
量増加開始温度２５０℃以上、×印は２５０℃未満を示
し、耐マイグレーション性の○印はマイグレーション時
間６００秒以上、×印は６００秒未満を示す。[Table 1] In Table 1, the heat-resistant ◯ mark indicates a tensile strength at break of 300 gf or more, and the x mark indicates less than 300 gf, and the oxidation resistance ◯ mark indicates a weight increase starting temperature of 250 ° C. or higher, and the x mark indicates less than 250 ° C. The circle mark indicates a migration time of 600 seconds or longer, and the cross mark indicates a migration time of less than 600 seconds.
【００１８】表１から明らかなように、本発明になる合
金粉末は導電性ペーストとして十分に低い電気抵抗の値
をもち、耐熱性、耐酸化性、耐マイグレーション性も優
れていることが判る。As is clear from Table 1, the alloy powder according to the present invention has a sufficiently low electric resistance value as a conductive paste and is excellent in heat resistance, oxidation resistance and migration resistance.
【００１９】[0019]
【発明の効果】以上説明したように、本発明によると、
導電ペースト用として十分なほどに電気抵抗が低く、半
田付け程度の温度での加熱において耐酸化性に優れ、ま
た触媒作用がなく、耐マイグレーション性に優れ、かつ
安価な導電性ペースト用合金粉末とその製造方法を提供
することができるという効果がある。As described above, according to the present invention,
Electrical resistance low enough for conductive paste, excellent in oxidation resistance when heated at a temperature of soldering, no catalytic action, excellent migration resistance, and inexpensive conductive paste alloy powder There is an effect that the manufacturing method can be provided.
Claims (2)
％、Ｃｕ：１０〜９５％、その他不可避的不純物よりな
ることを特徴とする導電性ペースト用合金粉末。1. A chemical composition of, by weight, Au: 5 to 90.
%, Cu: 10 to 95%, and other unavoidable impurities, an alloy powder for a conductive paste.
と、 前記の混合粉末を機械的粉砕手段で摩砕する工程と、 前記の摩砕した粉末を温度２００〜６００℃の非酸化性
雰囲気中において加熱する工程と、 前記の加熱した粉末を機械的粉砕手段で摩砕する工程と
を含むことを特徴とする請求項１記載の導電性ペースト
用合金粉末の製造方法。2. A step of mixing Au powder and Cu powder, a step of grinding the mixed powder with a mechanical grinding means, and a step of grinding the ground powder in a non-oxidizing atmosphere at a temperature of 200 to 600 ° C. The method for producing an alloy powder for a conductive paste according to claim 1, further comprising a step of heating in step 1 and a step of grinding the heated powder with a mechanical grinding means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5284938A JPH07138676A (en) | 1993-11-15 | 1993-11-15 | Alloy powder for conductive paste and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5284938A JPH07138676A (en) | 1993-11-15 | 1993-11-15 | Alloy powder for conductive paste and its production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07138676A true JPH07138676A (en) | 1995-05-30 |
Family
ID=17685015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5284938A Pending JPH07138676A (en) | 1993-11-15 | 1993-11-15 | Alloy powder for conductive paste and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07138676A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020028368A (en) * | 2000-10-09 | 2002-04-17 | 김수경 | Conductor of manufacturing method using gold and ceramic compound matter and the Conductor thereof |
-
1993
- 1993-11-15 JP JP5284938A patent/JPH07138676A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020028368A (en) * | 2000-10-09 | 2002-04-17 | 김수경 | Conductor of manufacturing method using gold and ceramic compound matter and the Conductor thereof |
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