JP2899607B2 - Manufacturing method of chip type thermistor - Google Patents
Manufacturing method of chip type thermistorInfo
- Publication number
- JP2899607B2 JP2899607B2 JP7040690A JP7040690A JP2899607B2 JP 2899607 B2 JP2899607 B2 JP 2899607B2 JP 7040690 A JP7040690 A JP 7040690A JP 7040690 A JP7040690 A JP 7040690A JP 2899607 B2 JP2899607 B2 JP 2899607B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- type thermistor
- terminal electrode
- fired
- fired body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
- Thermistors And Varistors (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、各種電子機器の面実装用に用いるチップ形
サーミスタの製造方法に関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a chip-type thermistor used for surface mounting of various electronic devices.
従来の技術 従来のチップ形サーミスタの製造方法について以下に
説明する。2. Description of the Related Art A conventional method for manufacturing a chip-type thermistor will be described below.
まずマンガン、コバルト、ニッケル、銅及び鉄などの
遷移金属酸化物を原材料とし、これらを目標組成にあわ
せて配合し、湿式混合、仮焼、湿式粉砕、造粒及び成形
の工程を経て焼成する。First, transition metal oxides such as manganese, cobalt, nickel, copper, and iron are used as raw materials, blended according to a target composition, and fired through wet mixing, calcination, wet pulverization, granulation, and molding steps.
次にこの焼成した素子を所定の形状に切断した焼成体
チップの端面にガラス粉末を含む銅、亜鉛及びニッケル
などの卑金属粉末を含有したペーストを塗布し、熱処理
して端子電極を設ける。Next, a paste containing a base metal powder such as copper, zinc, and nickel containing glass powder is applied to the end surface of the fired chip obtained by cutting the fired element into a predetermined shape, and heat treatment is performed to provide terminal electrodes.
発明が解決しようとする課題 上記方法によると、チップ形サーミスタに直接半田付
けして用いられるプリント配線基板は、チップ形サーミ
スタとの熱膨張係数の差が大きく、また使用中にたわみ
を生じやすいため、チップ形サーミスタの半田付け時に
チップ形サーミスタにクラックが生じたり、また使用時
にチップ形サーミスタの端子電極に引張応力がかかり、
端子電極がはずれたり、チップ形サーミスタにクラック
が生じたりするという問題点を有していた。クラックが
生じると抵抗値変化率が大きくなってしまうのである。According to the above method, the printed wiring board used by directly soldering to the chip-type thermistor has a large difference in thermal expansion coefficient from the chip-type thermistor and tends to bend during use. When the chip type thermistor is soldered, cracks occur in the chip type thermistor, and when used, tensile stress is applied to the terminal electrodes of the chip type thermistor.
There has been a problem that the terminal electrode is detached or a crack occurs in the chip type thermistor. If a crack occurs, the rate of change in resistance value increases.
そこで本発明は、端子電極と焼成体チップの接着強度
を向上させるとともに、プリント配線基板との熱膨張係
数の差を従来よりも小さくすることにより、クラックの
発生を抑制し、抗折強度の向上したチップ形サーミスタ
を提供することを目的とするものである。Therefore, the present invention improves the adhesive strength between the terminal electrode and the fired body chip, and suppresses the occurrence of cracks by reducing the difference in the coefficient of thermal expansion between the printed wiring board and the conventional device, thereby improving the bending strength. It is an object of the present invention to provide a chip type thermistor.
課題を解決するための手段 この目的を達成するために本発明のチップ形サーミス
タの製造方法は、焼成体チップ表面全体にガラス粉末を
付着させて熱処理し、焼成体チップ表面および表面付近
内部にガラス成分を拡散させる第１の工程と、次にこの
焼成体チップ端面に銅あるいは亜鉛を主成分とし、ガラ
ス粉末を含有するペーストを塗布して熱処理し端子電極
を形成する第２の工程とを有するものである。Means for Solving the Problems In order to achieve this object, a method for manufacturing a chip-type thermistor of the present invention comprises applying a glass powder to the entire surface of a fired body chip, performing heat treatment, and forming glass on the surface of the fired body chip and in the vicinity of the surface. A first step of diffusing the components and a second step of forming a terminal electrode by applying a paste containing glass powder as a main component and containing copper or zinc on the end face of the fired body chip and heat-treating the paste. Things.
作用 この方法によると、第１の工程において、焼成体チッ
プ表面および表面付近内部の粒界にガラス成分を拡散さ
せるとともに、ガラス成分で表面のポアを埋め、第２の
工程においてペースト中のガラス成分と焼成体チップの
ガラス成分とをなじませることにより、焼成体チップと
端子電極との接着強度を向上させるとともに、実装され
るプリント配線板との熱膨張係数の差を緩和した結果、
クラック及び端子電極のはずれの発生を抑制することが
でき、抵抗値変化が小さく、抗折強度と端子電極の引張
り強度が大きな機械的特性に優れたチップ形サーミスタ
を得ることができる。According to this method, in the first step, the glass component is diffused into the surface of the fired body chip and the grain boundaries inside the vicinity of the surface, and the pores on the surface are filled with the glass component. As a result, by blending the glass component of the fired body chip with the glass component of the fired body chip, the adhesive strength between the fired body chip and the terminal electrode is improved, and the difference in the coefficient of thermal expansion between the printed wiring board to be mounted is reduced.
It is possible to suppress occurrence of cracks and detachment of the terminal electrode, to obtain a chip-type thermistor having a small resistance value change, a large bending strength and a high tensile strength of the terminal electrode, and excellent mechanical properties.
実施例 以下、本発明の実施例について図面を用いて説明す
る。Examples Hereinafter, examples of the present invention will be described with reference to the drawings.
市販のマンガン、ニッケル及び銅の酸化物原料を目的
組成に配合し、これをボールミルで20時間混合し、この
スラリーを乾燥後800℃で仮焼する。この仮焼物すなわ
ち、一次反応物を湿式粉砕したスラリーを乾燥、造粒及
び成形の工程を経て、1200℃〜1300℃で２時間空気中で
焼成する。この焼成体を0.6mmの厚さにスライスした
後、幅が1.95mmで長さが1.2mmになるように切断して焼
成体チップ１とする。Commercially available oxide materials of manganese, nickel and copper are blended in the desired composition, mixed with a ball mill for 20 hours, and the slurry is dried and calcined at 800 ° C. The calcined product, that is, the slurry obtained by wet-milling the primary reactant, is dried, granulated, and shaped, and calcined at 1200 ° C. to 1300 ° C. for 2 hours in the air. After slicing this fired body to a thickness of 0.6 mm, it is cut into a fired body chip 1 having a width of 1.95 mm and a length of 1.2 mm.
この焼成体チップ１を珪素、鉛の酸化物から成るガラ
ス粉末を２重量パーセント混合したジルコニア粉末中に
埋め込み800℃〜900℃で１時間熱処理した後、珪素、鉛
の酸化物から成るガラス粉末を２〜３重量パーセント含
む銅、亜鉛、ニッケルの卑金属粉末を１種又は２種以上
含有した電極用卑金属ペーストを塗布し、熱処理して端
子電極２を設ける。This fired body chip 1 is embedded in zirconia powder in which glass powder composed of silicon and lead oxides is mixed at 2% by weight and heat-treated at 800 ° C. to 900 ° C. for 1 hour. A base metal paste for an electrode containing one or two or more base metal powders of copper, zinc and nickel containing 2 to 3% by weight is applied and heat-treated to provide the terminal electrode 2.
第１表に本発明の実施例におけるチップ形サーミスタ
の機械的特性（たわみ試験による抵抗値変化率と端子電
極の引張り強度）及び電気的特性（比抵抗とサーミスタ
常数）を従来例のチップ形サーミスタと比較して試料数
が各20個の平均値で示した。Table 1 shows the mechanical characteristics (the rate of change in resistance value and the tensile strength of the terminal electrode in the deflection test) and the electrical characteristics (specific resistance and thermistor constant) of the chip-type thermistor in the embodiment of the present invention. The number of samples was shown as the average value of each of 20 samples as compared with.
第２表に、チップ形サーミスタをプリント配線基板に
実装し、熱衝撃試験を行った時の抵抗値変化率を試験サ
イクル数別に、またクラックの発生の有無を本発明の実
施例と従来例とを比較して示した。 Table 2 shows that the rate of change in resistance when a chip-type thermistor is mounted on a printed wiring board and a thermal shock test is performed is determined by the number of test cycles, and whether or not cracks are generated. Are shown in comparison.
熱衝撃試験は、試料を−40℃で30分間放置した後85℃
で30分間の放置を１サイクルとし、−40℃で30分間放置
と85℃で30分間放置ついで−40℃で30分間放置を繰返す
方法である。The thermal shock test was performed after leaving the sample at -40 ° C for 30 minutes and then at 85 ° C.
And 30 minutes at -40 ° C as one cycle, and then left at -40 ° C for 30 minutes, 85 ° C for 30 minutes, and then at -40 ° C for 30 minutes.
以上のように本実施例によれば、焼成体チップの表面
全体にガラス粉末を付着させた後、熱処理して焼成体チ
ップの内部にガラス粉末の成分を熱拡散させることによ
りチップ形サーミスタのたわみ試験による抵抗値変化率
や端子電極の引張り強度を良化させることができる。な
お電気的特性において、サーミスタ常数は殆ど変化なく
比抵抗が少し高くなる。これはチップ形サーミスタの抵
抗値に表面の酸素欠陥が大きく影響するが熱処理により
焼成体チップの表面が改質されるためであると考えられ
る。 As described above, according to the present embodiment, after the glass powder is adhered to the entire surface of the fired body chip, heat treatment is performed to thermally diffuse the components of the glass powder inside the fired body chip, thereby causing the deflection of the chip type thermistor. It is possible to improve the rate of change in resistance and the tensile strength of the terminal electrode by the test. In the electrical characteristics, the thermistor constant hardly changes and the specific resistance slightly increases. This is presumably because oxygen deficiencies on the surface greatly affect the resistance value of the chip type thermistor, but the surface of the fired chip is modified by heat treatment.
また、熱衝撃試験における抵抗値変化率を小さく、チ
ップ形サーミスタのクラックの発生もなくすることがで
きる。したがって、プリント配線基板に直接に半田付け
されてもプリント配線基板のたわみによって端子電極が
はずれたりチップ形サーミスタにクラックが発生したり
することを防止できる。Further, the rate of change in resistance value in the thermal shock test can be reduced, and the occurrence of cracks in the chip type thermistor can be prevented. Therefore, even if the printed wiring board is directly soldered, it is possible to prevent the terminal electrodes from coming off due to the deflection of the printed wiring board and to prevent the chip type thermistor from cracking.
なお、実施例においてガラス粉末は、珪素、鉛の酸化
物を成分としたがこれに限るものでなく、他の成分のガ
ラス粉末としてもよい。In the examples, the glass powder was composed of oxides of silicon and lead. However, the present invention is not limited to this, and glass powder of another component may be used.
また実施例のチップ形サーミスタは、Mn-Ni-Cu系のサ
ーミスタ用酸化物半導体材料を用いたが、サーミスタ用
酸化物半導体材料であるならば、他の組成であってもよ
いことは言うまでもない。Further, although the chip-type thermistor of the example uses an oxide semiconductor material for a Mn-Ni-Cu-based thermistor, it goes without saying that other compositions may be used as long as the oxide semiconductor material for thermistor is used. .
発明の効果 以上本発明によると、第１の工程において、焼成体チ
ップ表面および表面付近内部の粒界にガラス成分を拡散
させるとともに、ガラス成分で表面のポアを埋め、第２
の工程においてペースト中のガラス成分と焼成体チップ
のガラス成分とをなじませることにより、焼成体チップ
と端子電極との接着強度を向上させるとともに、実装さ
れるプリント配線板との熱膨張係数の差を緩和した結
果、クラック及び端子電極のはずれの発生を抑制するこ
とができ、抵抗値変化が小さく、抗折強度と端子電極の
引張り強度が大きな機械的特性に優れたチップ形サーミ
スタを得ることができる。Effects of the Invention According to the present invention, in the first step, the glass component is diffused to the surface of the fired body chip and the grain boundaries inside the vicinity of the surface and the pores of the surface are filled with the glass component,
In the step, the glass component in the paste is mixed with the glass component of the fired chip to improve the adhesive strength between the fired chip and the terminal electrode, and the difference in the coefficient of thermal expansion between the printed wiring board and the printed circuit board to be mounted. As a result, it is possible to suppress the occurrence of cracks and detachment of the terminal electrode, to obtain a chip-type thermistor having a small resistance value change, a large bending strength and a high tensile strength of the terminal electrode, and excellent mechanical properties. it can.
第１図は本発明のチップ形サーミスタの一実施例を示す
断面図である。 １……焼成体チップ、２……端子電極。FIG. 1 is a sectional view showing one embodiment of a chip type thermistor of the present invention. 1 ... Fired chip, 2 ... Terminal electrode.
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) H01C 7/02 - 7/22 ──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. 6 , DB name) H01C 7/02-7/22
Claims (1)
させて熱処理し、焼成体チップ表面および表面付近内部
にガラス成分を拡散させる第１の工程と、次にこの焼成
体チップ端面に銅あるいは亜鉛を主成分とし、ガラス粉
末を含有するペーストを塗布して熱処理し端子電極を形
成する第２の工程とを有するチップ形サーミスタの製造
方法。1. A first step in which glass powder is adhered to the entire surface of a fired chip and heat-treated to diffuse a glass component on the surface of the fired chip and in the vicinity of the surface. A step of applying a paste containing glass powder containing zinc as a main component and subjecting the paste to heat treatment to form a terminal electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7040690A JP2899607B2 (en) | 1990-03-20 | 1990-03-20 | Manufacturing method of chip type thermistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7040690A JP2899607B2 (en) | 1990-03-20 | 1990-03-20 | Manufacturing method of chip type thermistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03270102A JPH03270102A (en) | 1991-12-02 |
| JP2899607B2 true JP2899607B2 (en) | 1999-06-02 |
Family
ID=13430557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7040690A Expired - Fee Related JP2899607B2 (en) | 1990-03-20 | 1990-03-20 | Manufacturing method of chip type thermistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2899607B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19736855A1 (en) * | 1997-08-23 | 1999-02-25 | Philips Patentverwaltung | Circuit arrangement with an SMD component, in particular temperature sensor and method for producing a temperature sensor |
-
1990
- 1990-03-20 JP JP7040690A patent/JP2899607B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03270102A (en) | 1991-12-02 |
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