JPH06223617A - Conductive paste composition - Google Patents
Conductive paste compositionInfo
- Publication number
- JPH06223617A JPH06223617A JP2960693A JP2960693A JPH06223617A JP H06223617 A JPH06223617 A JP H06223617A JP 2960693 A JP2960693 A JP 2960693A JP 2960693 A JP2960693 A JP 2960693A JP H06223617 A JPH06223617 A JP H06223617A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- weight
- conductive paste
- parts
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は導電ぺーストに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive paste.
【０００２】[0002]
【従来の技術】厚膜抵抗体の電極用導電ペーストは、銀
粉末とパラジウム粉末の混合粉末や銀−パラジウム合金
粉末等の貴金属粉末８０〜９５重量部の導電成分と、ガ
ラスフリットと酸化ビスマス（Ｂｉ2Ｏ3）からなる結合
材５〜２０重量部と、有機ビヒクル１〜１６重量部とを
混練して作られる。導電ぺーストはセラミック基板上に
印刷、乾燥された後に、温度約７５０〜９５０℃で焼成
され電極を形成する。該電極が抵抗器用である時はリー
ド線が半田付けされたり、又は直接基板上に半田付けさ
れる。2. Description of the Related Art A conductive paste for an electrode of a thick film resistor is composed of 80 to 95 parts by weight of a noble metal powder such as a mixed powder of silver powder and palladium powder or a silver-palladium alloy powder, a glass frit and bismuth oxide. It is made by kneading 5 to 20 parts by weight of a binder made of Bi 2 O 3 ) and 1 to 16 parts by weight of an organic vehicle. The conductive paste is printed on a ceramic substrate, dried, and then fired at a temperature of about 750 to 950 ° C. to form an electrode. When the electrode is for a resistor, the lead wire is soldered, or directly on the substrate.
【０００３】従来、導電成分のパラジウム重量比率が多
過ぎると焼結温度が高くなるばかりでなく、原料費用も
嵩んでしまい、一方パラジウム重量比率が少な過ぎると
半田リーチ性が劣ってしまうため、（銀：パラジウム）
重量比は１６〜１９に調整されている。Conventionally, if the palladium weight ratio of the conductive component is too large, not only the sintering temperature becomes high, but also the raw material cost becomes high, while if the palladium weight ratio is too low, the solder reach property becomes poor. (Silver: palladium)
The weight ratio is adjusted to 16-19.
【０００４】半田リーチ性が劣ると半田浴中で導体が腐
食されたり、あるいは半田付け時に電極が消耗してしま
い半田付けしたリード線の接着強さが低下したり、電極
としての十分な導通が確保できない問題が生じる。また
半田濡れ性が悪いと半田付け作業が安定して行われず、
品質特性が不安定となる。If the solder reachability is inferior, the conductor is corroded in the solder bath, or the electrodes are consumed during soldering to reduce the adhesive strength of the soldered lead wires, and sufficient conduction as an electrode is not achieved. There is a problem that cannot be secured. If the solder wettability is poor, the soldering work will not be stable,
The quality characteristics become unstable.
【０００５】[0005]
【発明が解決しようとする課題】導電成分のパラジウム
含有率が小さくても十分な半田濡れ性、半田リーチ性及
びリード線の接着強さを有する導電ペースト用組成物を
提供することにある。SUMMARY OF THE INVENTION It is an object of the present invention to provide a composition for a conductive paste having sufficient solder wettability, solder reachability and lead wire adhesion strength even if the palladium content of the conductive component is small.
【０００６】[0006]
【課題を解決するための手段】実質的にＰｂＯ４０〜７
５重量％、ＳｉＯ2１５〜４０重量％、Ｂ2Ｏ3１〜１０
重量％、ＳｒＯ０．５〜５重量％及びＡｌ2Ｏ3０〜１７
重量％のガラス粉末を３〜６重量部と、酸化ビスマス粉
末を４〜８重量部と、Ａｌ2Ｏ3粉末を０．８〜２重量部
と、貴金属粉末８４〜９２．２重量部とからなり、且
つ、該ガラス粉末が該Ａｌ2Ｏ3粉末重量部の２．８〜４
倍の重量部である導電ペースト用組成物を用いることに
より課題は達成される。[Means for Solving the Problems] PbO40 to 7
5% by weight, SiO 2 15-40% by weight, B 2 O 3 1-10
Wt%, SrO 0.5-5 wt% and Al 2 O 3 0-17
From 3 to 6 parts by weight of glass powder, 4 to 8 parts by weight of bismuth oxide powder, 0.8 to 2 parts by weight of Al 2 O 3 powder, and 84 to 92.2 parts by weight of noble metal powder. And the glass powder is 2.8 to 4 parts by weight of the Al 2 O 3 powder.
The object can be achieved by using a double weight part of the composition for conductive paste.
【０００７】[0007]
【作用】本発明は、導電ぺーストの焼成時にＰｂＯ−Ｓ
ｉＯ2−ＳｒＯ−Ａｌ2Ｏ3−Ｂ2Ｏ3系ガラスとＡｌ2Ｏ3
粉末を添加した結合材組成物から均一で微細な析出相
（ＳｒＡｌ2Ｓｉ2Ｏ8）が析出することにより優れた半
田リーチ性と優れたリード線との接着強さを呈すると考
えられる。The function of the present invention is to make PbO-S during firing of the conductive paste.
iO 2 -SrO-Al 2 O 3 -B 2 O 3 based glass and Al 2 O 3
It is considered that the uniform and fine precipitation phase (SrAl 2 Si 2 O 8 ) is precipitated from the binder composition to which the powder is added to exhibit excellent solder reachability and excellent adhesion strength with the lead wire.
【０００８】ガラス粉末の組成は実質的にＰｂＯ４０〜
７５重量％、ＳｉＯ2１５〜４０重量％、Ｂ2Ｏ3１〜１
０重量％、ＳｒＯ０．５〜５重量％及びＡｌ2Ｏ3０〜１
７重量％ならない。The composition of the glass powder is substantially PbO40-
75% by weight, SiO 2 15-40% by weight, B 2 O 3 1-1
0 wt%, SrO 0.5-5 wt% and Al 2 O 3 0-1
Not 7% by weight.
【０００９】ＰｂＯが４０重量％未満であると析出相が
十分析出せず、一方７５重量％を越えると電極の焼結性
が劣ってしまう。ＳｉＯ2が１５重量％未満であると析
出相が十分析出せず、一方４０重量％を越えると軟化温
度が高くなり過ぎて焼結性が劣ってしまう。Ｂ2Ｏ3が１
重量％未満であると析出相が十分析出せず、一方１０重
量％を越えると析出相が十分析出しない。Ｓｒ０が０．
５重量％未満であると析出相が十分析出せず、一方５重
量％を越えると軟化温度が高くなり過ぎる。Ａｌ2Ｏ3が
５重量％未満であると析出相が十分析出せず、一方２０
重量％を越えると軟化温度が高くなり過ぎる。When PbO is less than 40% by weight, the precipitation phase is not sufficiently precipitated, while when it exceeds 75% by weight, the sinterability of the electrode is deteriorated. If SiO 2 is less than 15% by weight, the precipitation phase is not sufficiently precipitated, while if it exceeds 40% by weight, the softening temperature becomes too high and the sinterability deteriorates. B 2 O 3 is 1
If it is less than 10% by weight, the precipitated phase is not sufficiently precipitated, while if it exceeds 10% by weight, the precipitated phase is not sufficiently precipitated. Sr0 is 0.
If it is less than 5% by weight, the precipitation phase is not sufficiently precipitated, while if it exceeds 5% by weight, the softening temperature becomes too high. If the Al 2 O 3 content is less than 5% by weight, the precipitation phase is not sufficiently precipitated, while
If it exceeds the weight%, the softening temperature becomes too high.
【００１０】上記ガラス粉末は実質的にＰｂＯ−ＳｉＯ
2−ＳｒＯ−Ａｌ2Ｏ3−Ｂ2Ｏ3系ガラスであるが、外に
ＴｉＯ2、ＺｎＯ、ＺｒＯ2等のガラス成分を合計最大１
０重量％程度含んでも良い。The glass powder is essentially PbO-SiO.
Is a 2 -SrO-Al 2 O 3 -B 2 O 3 based glass, TiO 2, ZnO outside, total glass components such as ZrO 2 up to 1
You may contain about 0 weight%.
【００１１】又、ガラス粉末の平均粒径は３０μｍ以下
が好ましい。ガラス粉末の配合量は３〜６重量部でなけ
ればならない。３重量部未満であると形成された電極と
アルミナ基板との十分な接着強さが得られない、一方６
重量部を越えると半田濡れ性が悪化し、十分な接着強さ
が得られない。The average particle size of the glass powder is preferably 30 μm or less. The blending amount of glass powder should be 3 to 6 parts by weight. If it is less than 3 parts by weight, sufficient adhesion strength between the formed electrode and the alumina substrate cannot be obtained, while 6
If it exceeds the weight part, the solder wettability deteriorates, and sufficient adhesive strength cannot be obtained.
【００１２】酸化ビスマス粉末の配合量は４〜８重量部
でなければならない。２重量部未満では接着強さが不十
分であり、８重量部を越えると半田濡れ性が悪くなる。
酸化ビスマス粉末の平均粒径は３０μｍ以下が好まし
い。The amount of bismuth oxide powder compounded should be 4 to 8 parts by weight. If it is less than 2 parts by weight, the adhesive strength is insufficient, and if it exceeds 8 parts by weight, the solder wettability becomes poor.
The average particle size of the bismuth oxide powder is preferably 30 μm or less.
【００１３】酸化物粉末は、Ａｌ2Ｏ3粉末の配合量０．
８〜１．８重量部を添加しなければならない。Ａｌ2Ｏ3
粉末が０．８重量部未満であると、析出相の析出量が不
十分であり、一方、２重量部を越えると導電膜の機械的
強度が低下してしまう。上記Ａｌ2Ｏ3粉末は平均粒径は
３０μｍ以下が好ましい。As the oxide powder, the compounding amount of Al 2 O 3 powder was 0.
8 to 1.8 parts by weight have to be added. Al 2 O 3
If the amount of the powder is less than 0.8 parts by weight, the amount of the precipitation phase deposited is insufficient, while if it exceeds 2 parts by weight, the mechanical strength of the conductive film is reduced. The Al 2 O 3 powder preferably has an average particle size of 30 μm or less.
【００１４】上記酸化物粉末はガラス粉末重量部に比例
した重量部添加量する必要があり、該ガラス粉末が該Ａ
ｌ2Ｏ3粉末重量部の２．８〜４倍の重量部であると最も
析出相が析出して好ましい。It is necessary to add the above oxide powder in a weight proportion proportional to the weight of the glass powder.
It is preferable that the amount of 2.8 to 4 times the weight of the 1 2 O 3 powder is the most because the precipitation phase is most precipitated.
【００１５】導電材としては、銀粉末とパラジウム粉末
の混合粉や銀−パラジウム合金粉末等の貴金属粉末が使
用できる。該貴金属粉末の配合量は８４〜９２．２重量
部でなければならない。８４重量部未満であると上記電
極の導電性が悪くなり、一方９２．２重量部を越えると
アルミナ基板との密着性に問題が生じる。パラジウムの
含有量は好ましくは（銀：パラジウム）重量比が１６以
上が好ましく、更に３０〜５０が好ましい。又、該金属
粉末の平均粒径は３０μｍ以下が好ましい。As the conductive material, a mixed powder of silver powder and palladium powder or a noble metal powder such as silver-palladium alloy powder can be used. The amount of the noble metal powder blended should be 84 to 92.2 parts by weight. When the amount is less than 84 parts by weight, the conductivity of the electrode is deteriorated, while when the amount is more than 92.2 parts by weight, the adhesion to the alumina substrate becomes problematic. The content of palladium is preferably 16 or more (silver: palladium) weight ratio, more preferably 30 to 50. The average particle size of the metal powder is preferably 30 μm or less.
【００１６】上記貴金属粉末、上記ガラス粉末と、上記
酸化ビスマスと、酸化物粉末とビヒクルとを所定量配合
し、３本ロールミル等により混練して導電ペーストとす
る。該導電ペーストを基板上にスクリーン印刷し、乾燥
した後に、温度７５０〜９５０℃焼成して電極を形成す
る。この焼成中にガラスおよび酸化物から析出相が導体
中に均一に析出する。この析出相が熔融半田の侵食を防
いでいると想像される。A predetermined amount of the noble metal powder, the glass powder, the bismuth oxide, the oxide powder, and the vehicle are mixed and kneaded by a three-roll mill or the like to obtain a conductive paste. The conductive paste is screen-printed on a substrate, dried, and then baked at a temperature of 750 to 950 ° C. to form an electrode. During this firing, a precipitation phase is uniformly precipitated from the glass and the oxide in the conductor. It is supposed that this precipitation phase prevents the erosion of the molten solder.
【００１７】なお、ビヒクルは樹脂を溶剤に溶解した物
で、一般に使用できる物は総て使用でき、例えばエチル
セルロース、ニトロセルロース等の セルロース樹脂
や、メチルメタアクリレート、エチルエタアクリレート
等のアクリル系樹脂等を用いる。溶剤としては、ターピ
ネオール、デカノール等のアルコール系溶媒、ミネラル
スピリット、スーパーゾル等のナフサ系溶媒、メチルエ
チルケトン等のケトン系溶媒を用いる。またビヒクルの
上記配合量は特に制限されないが、上記貴金属粉末と、
上記ガラス粉末と、上記酸化ビスマスと、酸化物粉末と
の総重量の１〜１６重量％が好ましい。The vehicle is a resin dissolved in a solvent, and all of the commonly used materials can be used. For example, cellulose resins such as ethyl cellulose and nitrocellulose, acrylic resins such as methyl methacrylate and ethyl ethacrylate, etc. To use. As the solvent, alcoholic solvents such as terpineol and decanol, naphtha solvents such as mineral spirit and super sol, and ketone solvents such as methyl ethyl ketone are used. The amount of the vehicle is not particularly limited, but with the precious metal powder,
It is preferably 1 to 16% by weight of the total weight of the glass powder, bismuth oxide, and oxide powder.
【００１８】[0018]
【実施例】各々純度９９．９重量％のＳｒＯ粉末、Ｐｂ
Ｏ粉末、ＳｉＯ2粉末、Ａｌ2Ｏ3粉末、ＴｉＯ2粉末、Ｚ
ｎＯ粉末、Ｂ2Ｏ3粉末、Ｖ2Ｏ5粉末及びＢａＣＯ3粉末
とを適量配合し、擂潰機で粉砕混合し、温度７００〜８
００℃で３０分間仮焼した後に、スタンプミルあるいは
乳鉢を用いて粉砕して粉砕物を得た。該粉砕物を電気炉
中で温度１１００〜１４００℃で熔融後、黒鉛板上に流
して急冷固化させて３種のガラスを得た。該ガラスをス
タンプミル、擂潰機、ボールミル等により粉砕し、平均
粒径１．２５μｍのガラス粉末を得た。該ガラスの酸化
物換算組成を表１に示す。EXAMPLES SrO powder and Pb each having a purity of 99.9% by weight
O powder, SiO 2 powder, Al 2 O 3 powder, TiO 2 powder, Z
nO powder, B 2 O 3 powder, V 2 O 5 powder and BaCO 3 powder were mixed in appropriate amounts, pulverized and mixed by a crusher, and the temperature was 700-8.
After calcination at 00 ° C. for 30 minutes, it was crushed using a stamp mill or a mortar to obtain a crushed product. The pulverized product was melted at a temperature of 1100 to 1400 ° C. in an electric furnace, then poured onto a graphite plate and rapidly solidified to obtain three kinds of glass. The glass was crushed by a stamp mill, a crusher, a ball mill or the like to obtain glass powder having an average particle size of 1.25 μm. Table 1 shows the oxide-equivalent composition of the glass.
【００１９】[0019]
【表１】 [Table 1]
【００２０】又、前記Ａｌ2Ｏ3粉末と、純度９９．９重
量％のＢｉ2Ｏ3粉末とをボールミルで粉砕し、各々平均
粒径２．２μｍの酸化物粉末とした。平均粒径０．０５
μｍのＰｄ粒状粉末と，平均粒径１μｍのＡｇ粒状粉末
と、上記ガラス粉末と、上記酸化物粉末と種々の割合で
配合し、ビヒクルとを三本ロールミルで混揀し、ぺース
トとした。上記ビヒクルは２０重量％エチルセルロース
を含有するターピネオール溶液を使用した。該ペースト
の配合を表２に示す。[0020] Also, with the Al 2 O 3 powder and a Bi 2 O 3 powder having a purity of 99.9% by weight was ground in a ball mill, were respectively an oxide powder having an average particle size of 2.2 .mu.m. Average particle size 0.05
Pd granular powder having a particle size of μm, Ag granular powder having an average particle size of 1 μm, the glass powder, and the oxide powder were mixed at various ratios, and the vehicle was kneaded with a three-roll mill to form a paste. The vehicle used was a terpineol solution containing 20% by weight of ethyl cellulose. The formulation of the paste is shown in Table 2.
【００２１】[0021]
【表２】 [Table 2]
【００２２】該ペーストを純度９５重量％のアルミナ基
板上に２ｍｍ×２ｍｍ形状で厚さ約３０μｍでスクリー
ン印刷し、メッシュベルト式連続焼成炉で温度８５０℃
で１０分間大気雰囲気中で焼成し電極を形成した。電気
半田鏝で該電極に線径０．６５ｍｍの錫めっき銅線を３
７重量％Ｐｂ−６３重量％Ｓｎ半田により電気半田ごて
で接合した。接合直後に、温度１５０℃で２４時間加熱
エージング処理した２種類のものを引張り試験機（アイ
コウエンジニアリング株式会社製、型式２１５２−ＨＴ
Ｔ）でリード線接合部の引っ張り強さを測定した。測定
結果を合わせて表２に示す。The paste was screen-printed on an alumina substrate having a purity of 95% by weight in a shape of 2 mm × 2 mm and a thickness of about 30 μm, and the temperature was 850 ° C. in a mesh belt type continuous firing furnace.
And baked in an air atmosphere for 10 minutes to form an electrode. Use an electric soldering iron to attach a tin-plated copper wire with a wire diameter of 0.65 mm to the electrode.
7 wt% Pb-63 wt% Sn solder was used for joining with an electric soldering iron. Immediately after joining, two types of materials subjected to a heat aging treatment at a temperature of 150 ° C. for 24 hours were subjected to a tensile tester (manufactured by Aiko Engineering Co., Ltd., Model 2152-HT).
In T), the tensile strength of the lead wire joint was measured. The measurement results are also shown in Table 2.
【００２３】又、上記と同様にしてアルミナ基板上に１
０ｍｍ×１０ｍｍ形状で厚さ約３０μｍでスクリーン印
刷し、焼成して電極を形成した。電極部にフラックス
（株式会社タムラ製作所製、商品名Ｆ−ＡＬ−４）を滴
下し、直径４ｍｍ×高さ８．２５ｍｍの上記半田ブロッ
クを載せ、該基板を２３０℃の半田浴上に１０秒間浮か
べ上記半田ブロックを熔融させた後に基板を取り出し
た。半田の広がり直径を測定し、半田濡れ性を評価し
た。半田濡れ性が良い程半田の広がり直径が大きい。測
定結果を合わせて表２に示す。Further, in the same manner as above, 1 is formed on the alumina substrate.
An electrode was formed by screen printing with a shape of 0 mm × 10 mm and a thickness of about 30 μm and firing. Flux (manufactured by Tamura Corporation, trade name F-AL-4) was dropped on the electrode portion, the above-mentioned solder block having a diameter of 4 mm and a height of 8.25 mm was placed thereon, and the substrate was placed on a solder bath at 230 ° C. for 10 seconds. Floating After melting the solder block, the substrate was taken out. The spread diameter of the solder was measured to evaluate the solder wettability. The better the solder wettability, the larger the spread diameter of the solder. The measurement results are also shown in Table 2.
【００２４】さらに、上記と同様にして制作した１０ｍ
ｍ×１０ｍｍ形状の電極を形成した基板を温度２重量％
Ａｇ−６２重量％Ｓｎ−３６重量％Ｐｂ組成の半田浴に
６０秒間浸漬後、取り出して、テスター（電圧抵抗ミリ
アンペア計）により電極部の両端部間の導通の有無を計
り半田リーチ性を調べた。電極が半田浴によって侵食を
受けると空隙の多い組織となり導通が無くなる。結果を
合わせて表２に示す。Furthermore, 10 m produced in the same manner as above.
2% by weight at a temperature of a substrate on which an electrode of m × 10 mm shape is formed
After being immersed in a solder bath having a composition of Ag-62 wt% Sn-36 wt% Pb for 60 seconds, the solder bath was taken out, and the presence or absence of continuity between both ends of the electrode portion was measured by a tester (voltage resistance milliamp meter) to examine solder reachability. . When the electrode is eroded by the solder bath, it becomes a tissue with many voids, and the conduction is lost. The results are shown together in Table 2.
【００２５】表２によると、上記ガラス粉末が上記酸化
物粉末の１．５〜２倍の重量部である導電ペースト用結
合材を用いた導電ペーストは半田濡れ性、半田リーチ性
及び接着強さとも優れていることが分かる。またパラジ
ウム量の多い従来材（実験番号９）と比較しても、本発
明品は半田濡れ性、半田リーチ性及び接着強さとも同等
或いは優れていることが分かる。According to Table 2, the conductive paste using the binder for conductive paste in which the glass powder is 1.5 to 2 parts by weight of the oxide powder has solder wettability, solder reach and adhesive strength. Is also excellent. Further, it can be seen that the product of the present invention has the same or superior solder wettability, solder reachability, and adhesive strength as compared with the conventional material having a large amount of palladium (Experiment No. 9).
【００２６】[0026]
【発明の効果】本発明の導電ペースト用結合材組成物を
用いた導電ペーストによると、導電成分が低パラジウム
でも優れた半田濡れ性と、半田リーチ性と、リード線と
の接着強度を有する電極が形成できる。According to the conductive paste using the binder composition for a conductive paste of the present invention, an electrode having excellent solder wettability, solder reachability, and adhesive strength with lead wires even when the conductive component is low palladium. Can be formed.
Claims (2)
Ｏ2１５〜４０重量％、Ｂ2Ｏ3１〜１０重量％、ＳｒＯ
０．５〜５重量％及びＡｌ2Ｏ3０〜１７重量％のガラス
粉末を３〜６重量部と、酸化ビスマス粉末を４〜８重量
部と、Ａｌ2Ｏ3粉末を０．８〜２重量部と、貴金属粉末
８４〜９２．２重量部とからなり、且つ、該ガラス粉末
が該Ａｌ2Ｏ3粉末重量部の２．８〜４倍の重量部である
導電ペースト用組成物。1. Substantially 40 to 75% by weight of PbO, Si
O 2 15-40 wt%, B 2 O 3 1-10 wt%, SrO
3 to 6 parts by weight of glass powder of 0.5 to 5% by weight and 0 to 17% by weight of Al 2 O 3 , 4 to 8 parts by weight of bismuth oxide powder, and 0.8 to 2 of Al 2 O 3 powder. A composition for a conductive paste, which comprises 4 parts by weight of noble metal powder and 84 to 92.2 parts by weight of the noble metal powder, and the glass powder is 2.8 to 4 parts by weight of the Al 2 O 3 powder.
比が１６以上である請求項１の導電ペースト用組成物。2. The composition for conductive paste according to claim 1, wherein the weight ratio of the noble metal powder (silver: palladium) is 16 or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2960693A JPH06223617A (en) | 1993-01-27 | 1993-01-27 | Conductive paste composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2960693A JPH06223617A (en) | 1993-01-27 | 1993-01-27 | Conductive paste composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06223617A true JPH06223617A (en) | 1994-08-12 |
Family
ID=12280729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2960693A Pending JPH06223617A (en) | 1993-01-27 | 1993-01-27 | Conductive paste composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06223617A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005306699A (en) * | 2004-04-26 | 2005-11-04 | Taiyo Ink Mfg Ltd | Glass composition for silver paste, photosensitive silver paste using the same and electrode pattern |
| JP2007103594A (en) * | 2005-10-03 | 2007-04-19 | Shoei Chem Ind Co | Resistor composition and thick film resistor |
| US9815215B2 (en) | 2011-11-28 | 2017-11-14 | Koninklijke Philips N.V. | Variable cutting length hair clipping system |
-
1993
- 1993-01-27 JP JP2960693A patent/JPH06223617A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005306699A (en) * | 2004-04-26 | 2005-11-04 | Taiyo Ink Mfg Ltd | Glass composition for silver paste, photosensitive silver paste using the same and electrode pattern |
| JP2007103594A (en) * | 2005-10-03 | 2007-04-19 | Shoei Chem Ind Co | Resistor composition and thick film resistor |
| US9815215B2 (en) | 2011-11-28 | 2017-11-14 | Koninklijke Philips N.V. | Variable cutting length hair clipping system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5303552B2 (en) | Conductive paste for ceramic substrate and electric circuit | |
| KR102488165B1 (en) | Conductive composition, method for producing a conductor, and method for forming wiring of electronic parts | |
| KR102488162B1 (en) | Manufacturing method of conductive composition and terminal electrode | |
| JP2010287678A (en) | Front electrode and back electrode of chip resistor | |
| JP2000048642A (en) | Conductive paste and glass circuit substrate | |
| JP3637286B2 (en) | Conductive paste for calcined zirconia substrate | |
| JP6931455B2 (en) | A composition for a resistor, a resistor paste containing the same, and a thick film resistor using the same. | |
| JP6623919B2 (en) | Conductive composition, method for producing conductor, and method for forming wiring of electronic component | |
| JP4423832B2 (en) | Glass composition and thick film paste using the same | |
| JPH0955118A (en) | Conductive paste and ceramic-layered capacitor | |
| JPH06223617A (en) | Conductive paste composition | |
| JPH0945130A (en) | Conductor paste composite | |
| JPH06215617A (en) | Conductive paste for baking | |
| JPH06223616A (en) | Conductive paste composition | |
| JP2965222B2 (en) | Conductor paste | |
| JPH11292569A (en) | Conductive paste and glass plate with conductor | |
| JPH05128910A (en) | Conductor paste | |
| JP3318299B2 (en) | Pb-free low-temperature firing type conductive paint | |
| JP2931450B2 (en) | Conductor paste | |
| JPH0850806A (en) | Composition for thick film conductor | |
| JPH0950904A (en) | Electrically conductive paste and ntc thermistor using it | |
| JP6836184B2 (en) | Composition for forming a thick film conductor and a method for producing a thick film conductor | |
| JPH0349108A (en) | Copper conductor composition material | |
| JP3939634B2 (en) | Conductive paste for ohmic electrode formation | |
| JP3926142B2 (en) | Conductor paste |