JPH0713277Y2 - Heat dissipation structure for in-vehicle control unit - Google Patents
Heat dissipation structure for in-vehicle control unitInfo
- Publication number
- JPH0713277Y2 JPH0713277Y2 JP1990039489U JP3948990U JPH0713277Y2 JP H0713277 Y2 JPH0713277 Y2 JP H0713277Y2 JP 1990039489 U JP1990039489 U JP 1990039489U JP 3948990 U JP3948990 U JP 3948990U JP H0713277 Y2 JPH0713277 Y2 JP H0713277Y2
- Authority
- JP
- Japan
- Prior art keywords
- case
- control unit
- heat dissipation
- vehicle control
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【考案の詳細な説明】 〈産業上の利用分野〉 本考案は、車載コントロールユニットの放熱構造に関す
る。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a heat dissipation structure of an in-vehicle control unit.
〈従来の技術〉 従来より、車載電子機器のコントロールユニットにおい
ては、基板上に電子部品を実装して、この基板を箱状の
ケース内に形成された支持部に支持させて収納し、この
ケースの外側に形成された取付け部を介して車体に取り
付けて固定するようにしている。<Prior Art> Conventionally, in a control unit for an on-vehicle electronic device, an electronic component is mounted on a board, and the board is supported and stored by a support portion formed in a box-shaped case. It is mounted and fixed to the vehicle body through a mounting portion formed on the outer side of.
〈考案が解決しようとする課題〉 ところで、この種のコントロールユニットのケースは、
鉄やアルミニウム製が一般的であるが、より軽量化を図
るために、樹脂製のケースが望まれる。<Problems to be solved by the invention> By the way, the case of this type of control unit is
Iron or aluminum is generally used, but a resin case is desired in order to reduce the weight.
しかしながら、樹脂製ケースは、熱伝導率が低いため
に、放熱性が悪いという問題点があった。However, the resin case has a problem that the heat dissipation is poor because the heat conductivity is low.
そこで、基板を、絶縁層内に金属板を埋め込んだメタル
コア基板として、基板における熱の伝導性を良くするこ
とが考えられるが、電子部品等から発生した熱をメタル
コア基板に伝導させても、基板は、樹脂製のケースの支
持部により支持されており、基板が直接車体に接触して
いるわけではないので、基板に伝わった熱が車体に伝導
し難く、放熱効果が余り得られないという問題点があっ
た。Therefore, it is conceivable that the substrate is a metal core substrate in which a metal plate is embedded in an insulating layer to improve heat conductivity in the substrate. However, even if heat generated from electronic components is conducted to the metal core substrate, Is supported by the support part of the resin case, and the board is not in direct contact with the vehicle body, so the heat transferred to the board is difficult to transfer to the vehicle body, and the heat dissipation effect is not very obtained. There was a point.
本考案は、上記の問題点に鑑み、放熱性のよい車載コン
トロールユニットを提供することを目的とする。The present invention has been made in view of the above problems, and an object thereof is to provide an in-vehicle control unit having good heat dissipation.
〈課題を解決するための手段〉 上記の目的を達成するために、本考案は、車載コントロ
ールユニットのケースを、該ケースの車体への取付け部
及び該ケース内に収納される回路基板の支持部に一体の
金属を鋳込んで樹脂により成形し、前記回路基板をメタ
ルコア基板とする構成とする。<Means for Solving the Problems> In order to achieve the above object, the present invention provides a case of an in-vehicle control unit, a mounting portion of the case to a vehicle body, and a support portion of a circuit board housed in the case. An integral metal is cast into and molded with a resin to form the circuit board as a metal core board.
〈作用〉 上記の構成によると、ケースの大部分を樹脂製にして、
メタルコア基板に伝導した熱を、支持部に鋳込まれた金
属に伝導させ、更に、これと一体の取付け部に鋳まれた
金属に伝導させて、車体側に放熱することができる。<Operation> According to the above configuration, most of the case is made of resin,
The heat conducted to the metal core substrate can be conducted to the metal cast in the support portion, and further conducted to the metal cast in the mounting portion integrated with the support portion, and can be radiated to the vehicle body side.
〈実施例〉 以下に本考案に係る一実施例を第１図及び第２図に基づ
いて説明する。<Embodiment> An embodiment according to the present invention will be described below with reference to FIGS. 1 and 2.
樹脂製の、蓋1a付きの箱状のケース１の相対する面側壁
外側下部には、金属製の取付け部２が鋳込んで突設され
ており、取付け部２には、車体（図示せず）にボルトに
より固定するための、取付け孔３が形成されている。A resin-made box-shaped case 1 with a lid 1a is provided with a metal mounting portion 2 that is cast and protrudes from the lower outer side wall opposite to each other. The mounting portion 2 has a body (not shown). ) Is provided with a mounting hole 3 for fixing with a bolt.
また、取付け部２が突設された両側壁の内側には、取付
け部２を形成する金属と一体の金属により、段状に、支
持部４が形成されており、この支持部４には、後述する
回路基板９の四隅をねじ５により固定するためのねじ孔
5aが形成されている。Further, inside the both side walls on which the mounting portion 2 is provided, a supporting portion 4 is formed stepwise by a metal that is integral with the metal forming the mounting portion 2, and the supporting portion 4 includes Screw holes for fixing four corners of a circuit board 9 described later with screws 5.
5a is formed.
回路基板９は、絶縁層７及び金属板８よりなるメタルコ
ア基板９で、電子部品（図示せず）を実装している。The circuit board 9 is a metal core board 9 composed of an insulating layer 7 and a metal plate 8 on which electronic components (not shown) are mounted.
尚、10は、ケース１内の回路を外部の電子機器と接続す
るコネクタ用の孔である。Incidentally, 10 is a hole for a connector for connecting the circuit in the case 1 to an external electronic device.
以上説明したように、本実施例によると、電子部品によ
り発生し、メタルコア基板９に伝導した熱を、支持部４
をなす金属に伝導させ、この金属は、取付け部２をなす
金属と一体であるので、熱は更に、金属内を取付け部２
側に伝導し、取付け部２を介して、最終的に、車体側に
放熱することができる。As described above, according to the present embodiment, the heat generated by the electronic component and conducted to the metal core substrate 9 is applied to the support portion 4.
Is conducted to the metal forming the mounting portion 2, and this metal is integral with the metal forming the mounting portion 2, so that heat is further transmitted through the inside of the metal.
Can be conducted to the side, and finally can be radiated to the vehicle body side via the mounting portion 2.
もって、ケース１の大部分を樹脂により成形して、軽量
化を図りつつ、ケース１全体を金属により成形した場合
と同様の高い放熱性を得ることができる。Therefore, it is possible to obtain the same high heat dissipation performance as in the case where the entire case 1 is made of metal while the majority of the case 1 is made of resin to reduce the weight.
〈考案の効果〉 以上説明したように、本考案によると、軽量化を図れる
樹脂製のケースに、高放熱性を付与することができ、も
って、使用温度が高いエンジンルーム内のコントロール
ユニットのケースとしても充分に使用できるという効果
が得られる。<Effects of the Invention> As described above, according to the present invention, it is possible to impart high heat dissipation to the resin case that can be made lightweight, and thus the case of the control unit in the engine room where the operating temperature is high. However, the effect that it can be used sufficiently is obtained.
第１図は本考案に係る一実施例を示すケースの平面図、
第２図はケースの縦断面図である。 1a…蓋、１…ケース、２…取付け部、４…支持部、９…
メタルコア基板FIG. 1 is a plan view of a case showing an embodiment according to the present invention,
FIG. 2 is a vertical sectional view of the case. 1a ... Lid, 1 ... Case, 2 ... Mounting part, 4 ... Support part, 9 ...
Metal core substrate
Claims (1)
ケースの車体への取付け部及び該ケース内に収納される
回路基板の支持部に一体の金属を鋳込んで樹脂により成
形し、前記回路基板をメタルコア基板としたことを特徴
とする車載コントロールユニットの放熱構造。Claim: What is claimed is: 1. A case of an on-vehicle control unit, wherein a metal integrated with a mounting portion of the case to a vehicle body and a support portion of a circuit board housed in the case is molded with resin to form the circuit board. A heat dissipation structure for an in-vehicle control unit, which uses a metal core substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990039489U JPH0713277Y2 (en) | 1990-04-16 | 1990-04-16 | Heat dissipation structure for in-vehicle control unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990039489U JPH0713277Y2 (en) | 1990-04-16 | 1990-04-16 | Heat dissipation structure for in-vehicle control unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04784U JPH04784U (en) | 1992-01-07 |
| JPH0713277Y2 true JPH0713277Y2 (en) | 1995-03-29 |
Family
ID=31548443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990039489U Expired - Lifetime JPH0713277Y2 (en) | 1990-04-16 | 1990-04-16 | Heat dissipation structure for in-vehicle control unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0713277Y2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2586765Y2 (en) * | 1992-03-17 | 1998-12-09 | 古河電気工業株式会社 | Electrical junction box |
| JP2003298253A (en) | 2002-03-29 | 2003-10-17 | Denso Corp | Housing structure and mounting structure of electronic control apparatus |
| JP2007325344A (en) * | 2006-05-30 | 2007-12-13 | Yazaki Corp | Electrical connection box |
| JP5058609B2 (en) * | 2007-01-19 | 2012-10-24 | パイオニア株式会社 | Mobile body mounting device |
| JP5058610B2 (en) * | 2007-01-19 | 2012-10-24 | パイオニア株式会社 | Mobile body mounting device |
| JP5542815B2 (en) * | 2009-06-26 | 2014-07-09 | 日本特殊陶業株式会社 | Circuit board container |
| JP5721359B2 (en) * | 2010-07-29 | 2015-05-20 | 京セラ株式会社 | Semiconductor device substrate and semiconductor device including the same |
-
1990
- 1990-04-16 JP JP1990039489U patent/JPH0713277Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04784U (en) | 1992-01-07 |
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