JPH0381694U - - Google Patents
Info
- Publication number
- JPH0381694U JPH0381694U JP14234889U JP14234889U JPH0381694U JP H0381694 U JPH0381694 U JP H0381694U JP 14234889 U JP14234889 U JP 14234889U JP 14234889 U JP14234889 U JP 14234889U JP H0381694 U JPH0381694 U JP H0381694U
- Authority
- JP
- Japan
- Prior art keywords
- casing
- board
- power
- supported
- support structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Description
第１図は本考案の実施例を示す構成図、第２図
はパワーＩＣの実装状態図、第３図は従来の基板
支持構造の説明図、第４図はパワーＩＣの放熱取
付不良の説明図である。
図中、１０……パワーＩＣ、１１……ホルダ、
１２……基板、２２……筺体の下蓋（底面）、２
３……放熱板、２５……ネジ、３０……固定部材
である。
Fig. 1 is a configuration diagram showing an embodiment of the present invention, Fig. 2 is a diagram of the mounting state of a power IC, Fig. 3 is an explanatory diagram of a conventional board support structure, and Fig. 4 is an explanation of poor heat dissipation installation of a power IC. It is a diagram. In the figure, 10... power IC, 11... holder,
12... Board, 22... Lower cover (bottom surface) of the housing, 2
3... Heat sink, 25... Screw, 30... Fixing member.
Claims (1)
支持し、該パワーＩＣを該筺体の放熱板２３に圧
接する電子機器の基板支持構造において、前記基
板を、前記筺体底面に取付けた柔構造の固定部材
３０で支持するようにしてなることを特徴とする
基板支持構造。 In a board support structure for an electronic device in which a board 12 on which a power IC 10 is mounted is supported in a casing and the power IC is pressed against a heat sink 23 of the casing, the board is attached to a bottom surface of the casing with a flexible structure fixing member. A substrate support structure characterized in that it is supported by 30.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14234889U JPH0381694U (en) | 1989-12-08 | 1989-12-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14234889U JPH0381694U (en) | 1989-12-08 | 1989-12-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0381694U true JPH0381694U (en) | 1991-08-21 |
Family
ID=31689180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14234889U Pending JPH0381694U (en) | 1989-12-08 | 1989-12-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0381694U (en) |
-
1989
- 1989-12-08 JP JP14234889U patent/JPH0381694U/ja active Pending
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