JPH07132369A - Soldering iron - Google Patents

Abstract

PURPOSE:To execute the soldering of the joining part of a lead pin of a semi- conductor package with the corresponding conductor pattern by melting and separating the solder to be bridged between the conductor patterns of the circuit board on the adjacent conductor pattern without removing the solder. CONSTITUTION:A soldering iron where the solder bridged between the conductor patterns of the circuit board is melted and separated on the adjacent conductor pattern to achieve the purpose of the prescribed soldering has the structure to heat with hot wind the tip part of the soldering iron having the heat resistant insulating film of ceramics 30 formed by adhering the heat resistant insulating agent of the property of dewetting the molten solder to the tip part 10 (made of steel) of the soldering iron. The soldering iron is provided with the tip part having the ceramics 30 of the heat resistant insulating film to be formed on the tip part 10 (made of steel) of the soldering iron except the upper side part of the tip part of the soldering iron to remove the excessive solder on the soldering bridge.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a soldering iron.

[0002]

2. Description of the Related Art In a process of mounting a semiconductor package on a circuit board, a solder bridge formed on an adjacent conductor pattern is completely removed by a solder wick or a solder sucker, and then a wire solder is formed on the conductor pattern. To the
It is designed to be re-soldered with a soldering iron.

Further, in a circuit board on which a semiconductor package or the like is already mounted, when the semiconductor package is replaced, a laser soldering iron may be used. Laser soldering irons are suitable for mounting semiconductor packages with a narrow pitch, but the equipment is larger than ordinary soldering irons, and if you accidentally apply a laser beam to your eyes, you will lose sight. In general, there are many cases in which a normal soldering iron is used because there is a risk that it will occur and the price is high.

[0004]

In recent years, there has been remarkable progress in miniaturization and progress in performance of devices such as personal computers, VCRs, video cameras, DATs and CDs, but these devices are also electronic devices such as semiconductor packages. It may break down due to damage of parts. In this case, repair is performed by removing the broken electronic component from the circuit board of the device and replacing it with a new one.

Recently, a circuit board used in a video camera such as a Sony (registered trademark) Handycam (registered trademark) has an extremely fine QFP (Quad) with a lead pin pitch of 0.25 mm. Flat
A semiconductor package such as a package has come to be mounted.

However, when the broken semiconductor package is removed and replaced with a new one, 0.5 to
When a 0.25 mm pitch semiconductor package is surface-mounted on a circuit board by hand soldering, there is a problem that a conductor pattern on the circuit board or a lead pin may be solder-bridged due to work on a considerably fine portion. .

When the above-mentioned solder bridge occurs in the work of mounting the semiconductor package on the circuit board, the solder at the solder bridge portion is completely removed in the soldering work of the manual soldering with the usual soldering iron. After that, there was a problem that it was necessary to re-solder.
What happens is that if solder bridging is done once, even if you try to completely remove the solder at the solder bridging spots, solder whiskers will often remain on the lead pins of the semiconductor package. This is because there was a problem that solder bridging would occur again even if trying again.

Further, in the conventional soldering work of manual soldering with a soldering iron, the work of mounting a semiconductor package of 0.25 to 0.5 mm pitch on a circuit board has been extremely difficult. What is normal is that the soldering work by hand soldering is usually difficult even if the tip of the conductor pattern on the circuit board and the lead pin connection part of the semiconductor package is extremely fine, unless the tip is thin. Since only heat conduction type soldering irons were popular, it is difficult to heat such as the area of the heating object is larger than the tip of the iron tip, so it is a thick soldering tip with large wattage and large heat capacity. I had to use a trowel. However, since the tip has a thick shape, there is a problem that it is difficult to control the molten solder supplied to the connection portion between the lead pin of the semiconductor package and the conductor pattern of the circuit board to a constant amount.

In the conventional soldering iron, the tip or / and the tip of the tip has a diameter of 0.3 to
It has been difficult to achieve a length of 0.1 mm and a length of 2 to 5 mm. Even if such a tip is made, the temperature gradient between the tip of the tip or / and the tip of the tip and the tip of the heater is too large, that is, the tip far from the heater. Since the temperature becomes lower toward the tip of the tip part, the solder does not melt sufficiently, or even if it melts, the molten solder rises to the tip part of the heater side,
There is a problem that the molten solder hardly adheres to the tip of the iron tip and / or the tip of the iron tip.

Therefore, in order to solve the above-mentioned conventional problems, the present invention separates the solder at the solder bridge portion into the joint portion between the adjacent conductor pattern and the corresponding lead pin of the semiconductor package without removing it. It is an object of the present invention to realize a soldering iron capable of forming a solder alloy.

Further, according to the present invention, the conventional soldering iron tip has a structure in which hot air hits the tip or / and the tip of the tip, so that the tip or / and the tip of the iron melts. The purpose is to realize a soldering iron having a structure in which solder can easily be applied.

[0012]

In order to solve the above-mentioned problems, a soldering iron according to the present invention as defined in claim 1 is a soldering iron tip covered with a heat-resistant insulating film having a property of repelling molten solder, or It is characterized by having a structure for heating the tip end portion of / and the tip with hot air.

According to a second aspect of the present invention, there is provided a soldering iron according to the first aspect of the present invention, in which only the lower part of the tip of the iron tip and / or the lower end of the iron tip is capable of repelling molten solder. It is characterized by being covered with.

A soldering iron according to a third aspect of the present invention is characterized in that it has a structure for heating the tip end portion and / or the tip end portion of the steel structure with hot air.

According to a fourth aspect of the present invention, there is provided a soldering iron according to the third aspect of the present invention, characterized in that a steel material which is hard to be wetted by molten solder is used for the tip of the iron tip and / or the tip of the iron tip.

According to a fifth aspect of the present invention, there is provided a soldering iron having a structure in which a tip end portion and / or a tip end portion of a tip made of a ceramic material having a property of repelling molten solder is heated by hot air. Characterizing

A soldering iron according to a sixth aspect of the present invention is a soldering iron tip formed by processing a non-ferrous metal material having a property of being hard to be wet by molten solder or a property of repelling molten solder, and / or a tip. It is characterized by having a structure for heating the tip portion with hot air.

According to a seventh aspect of the present invention, there is provided a soldering iron having a non-tip tip portion and / or a non-tip tip portion whose tip surface is made of a heat-resistant material having a property of repelling molten solder. In addition, the tip of the iron tip has a tip end portion and / or a tip end portion of a tip made of a metal material that is easily wet by molten solder.

The soldering iron according to the present invention of claim 8 is characterized in that it has a structure for heating the tip end portion of the iron tip and / or the tip end portion of the iron tip according to claim 7 with hot air.

The soldering iron according to the present invention of claim 9 is characterized in that the surface of the base material at the tip of the iron tip and / or the tip of the iron tip processed with a metal material which is easily wetted by the molten solder repels the molten solder. It is characterized by having a structure in which a tip covered with a heat-resistant insulating film is heated by hot air.

In the soldering iron according to the present invention of claim 10, the surface of the base material at the tip of the iron tip and / or the tip of the iron tip processed with a metal material such as steel is formed into a metal film which is easily wet by molten solder. It is characterized in that it has a structure in which the tip covered with a heat-resistant insulating film having a property of repelling molten solder is heated with hot air.

In the soldering iron according to the present invention of claim 11, concave and convex portions corresponding to the pitch interval of the flat type semiconductor package are alternately and continuously provided at a plurality of positions, and the concave portion corresponding to the solder resist of the circuit board is molten solder. It is characterized in that it is covered with a heat-resistant material having a property of repelling metal, and a metal material which is easily wetted by the molten solder is exposed at the convex portion corresponding to the land of the circuit board.

A soldering iron according to a twelfth aspect of the present invention is characterized in that it has a structure for heating the tip end portion and / or the tip end portion of the iron tip according to the eleventh aspect with hot air.

According to a thirteenth aspect of the present invention, in the soldering iron according to the present invention, a plurality of concavities and convexities corresponding to the pitch interval of the flat type semiconductor package are alternately and continuously provided, and the concave portion corresponding to the solder resist of the circuit board is molten solder. Tip covered with a heat-resistant material that repels solder, and its convex portion corresponding to the land of the circuit board is also covered with a heat-resistant material that repels molten solder. It is characterized by having a structure for heating the portion with hot air.

A soldering iron according to a fourteenth aspect of the present invention is a soldering iron tip according to any one of the first, second, third, fourth, fifth, sixth, eighth, ninth, tenth, twelfth and thirteenth aspects. The tip of the tip is
It is characterized in that it has a structure projecting across the center of a hot air outlet that is hollowed out in the shape of a column such as a circle, an ellipse, or a rectangle.

The heat-resistant insulating coating having the property of repelling the molten solder according to the first, second, ninth, and tenth aspects is obtained by ceramic spraying. That is, ceramic spraying is PVD (Physical Vapor Deposition), Plasma CVD (Chemical Vapor Deposition), Ion Play, which is a surface modification technique that is often used in molds and machine parts for the purpose of improving wear resistance and corrosion resistance. As a target (film forming material), titanium nitride (TiN), zirconium nitride (ZrN), chromium nitride (CrN), aluminum nitride (AlN), and other nitrides, carbonization, etc. are used by coating, sputtering, vacuum deposition, plasma spraying, or the like. Titanium (T
iC), carbides such as silicon carbide (SiC), oxides such as aluminum oxide (Al2O3), zirconium oxide (ZrO2) and chromium oxide (CrO2), titanium carbonitride (Ti)
CN), titanium aluminum nitride (TiAlN), diamond-like carbon (DLC) and the like. The heat-resistant insulating film having a property of repelling the molten solder is formed by metal spraying the tip portion of the tip end of the iron tip and / or the tip end of the iron tip, and then oxidizing the surface of the sprayed metal. can do. The sprayed metal is, for example, aluminum or the like.

The heat-resistant insulating film having the property of repelling the molten solder is obtained by subjecting the tip portion of the tip of the tip or / and the tip portion of the tip to a molten aluminum plating, and then artificially oxidizing the plated metal surface. It can be formed by processing. It should be noted that the heat-resistant insulating film forms a thin film of aluminum oxide even after the surface of the plated metal is naturally oxidized after the molten aluminum plating. Even this aluminum oxide thin film has the property of repelling molten solder.

In order to improve the adhesion of the tip of the heat-resistant insulating film having the property of repelling the molten solder to the tip or / and the tip of the tip to the metal surface, the metal surface may be blasted. .

The heat-resistant insulating film having the property of repelling the molten solder can be formed by nitriding the tip of the iron tip and / or the tip of the iron tip made of steel. Since the detailed contents are described in JIS Handbook of Japanese Industrial Standards, such as metal surface treatment, the explanation is omitted.

The reason why the tip of the soldering iron tip and / or the tip of the soldering iron according to claim 3 is made of steel is that the conduction heat of the ceramic heater is used as the heat source like the conventional soldering iron. This is because the use of hot air did not require the use of copper, which has a high thermal conductivity, and the use of a metal material having higher strength and superior toughness. In the conventional soldering iron, since copper was used as the base material and iron-plated, it was difficult to form the iron tip tip portion and / or the tip end portion having a thin and sharp shape with poor strength. Since the detailed contents are described in JIS Handbook, Iron and Steel, etc. of Japanese Industrial Standards, further explanation is omitted.

The steel material which is difficult to get wet with the molten solder according to claim 4 is carbon steel obtained by carburizing such as carburizing and quenching, and the tip of the iron tip and / or the tip of the iron tip which is hard to get wet with the molten solder is provided. It is possible to manufacture a soldering iron having the same. Further, the steel material that is difficult to be wet with the molten solder may be stainless steel, a wrought alloy, or high speed steel. The detailed contents are described in JIS Handbook of Japanese Industrial Standards, such as iron and steel and metal surface treatment, so that the description is omitted.

The ceramic material according to claim 5 is preferably a material having high toughness, and examples thereof include sintered bodies such as alumina, aluminum nitride, zirconia and zircon.

Examples of the non-ferrous metal material having the property of being difficult to wet the molten solder or the property of repelling the molten solder include titanium and titanium alloys, aluminum and aluminum alloys, and the like. It is more effective to oxidize or nitride the surface of the tip of the non-ferrous metal material so that the tip or / and the tip of the tip are hard to be wetted by the molten solder.

The heat-resistant material having the property of repelling molten solder according to claims 7 and 13 can be obtained by the same method as the method for producing the heat-resistant insulating coating that repels the molten solder.

The metal material which is easily wetted by the molten solder according to claims 7, 9 and 11 corresponds to, for example, nickel, iron-nickel alloy, copper-zirconium alloy or the like.

The metal film which is easily wetted by the molten solder according to claim 10 is obtained by sputtering amorphous metal, which is one of ceramic spraying methods using nickel or iron / nickel alloy as a target (film forming material). .

The tip portion of the tip of the iron tip and / or the tip portion of the steel structure at the tip of the tip according to claim 10, which is easily cared for by molten solder by decarburization used for enamel products and the like. It is possible to manufacture a soldering iron having

[0038]

According to the present invention of claim 1, the soldering iron tip has a tip end portion and / or a tip end portion covered with a heat-resistant insulating film which is hard to be wet with the molten solder or has a property of repelling the molten solder. With the soldering tip part, the solder bridge locations on the adjacent conductor patterns on the circuit board can be separated into the adjacent conductor patterns on the adjacent conductor patterns without removing the solder bridge, and the required soldering can be performed. The purpose can be achieved.

According to the second aspect of the present invention, only the lower portion of the tip of the iron tip and / or the tip of the iron tip is covered with the heat-resistant insulating film having the property of repelling molten solder. The tip of the solder tip and / or the tip of the solder tip is applied to the middle solder bridge portion on the conductor pattern that connects the circuit board and the semiconductor package to separate the bridged solder and request excessive molten solder. The solder alloy can be formed on two adjacent conductor patterns by adhering it to the non-lower part (upper part) of the tip of the iron tip or / and the tip of the iron tip according to item 3.

According to the present invention of claim 3, the tip of the tip of the soldering iron tip and / or the tip of the tip has a steel structure and is heated by hot air. As a result, an extremely thin and sharp iron tip-shaped soldering iron having a surface area of 0.01 square mm to 0.5 square mm at the tip of the iron tip and / or the tip of the portion where molten solder comes into contact is manufactured. to enable. By using a soldering iron with a tip,
A defect such as a solder bridge when a circuit board such as a semiconductor package having a narrow pitch of 0.3 mm is mounted is easily repaired.

According to the present invention of claim 4, the tip of the iron tip and / or the tip of the iron tip are adjacent to each other on the circuit board by the tip portion of the soldering iron made of a steel material which is difficult to wet the molten solder. The solder bridge portion on the formed conductor pattern can separate the bridged solder on the adjacent conductor pattern without removing the solder bridge to achieve a desired soldering purpose.

According to the fifth and sixth aspects of the present invention, the tip of the iron tip and / or the tip of the iron tip is less likely to get wet with the molten solder,
Or, with the tip of the soldering iron covered with a heat resistant film that repels molten solder, the solder bridges on the adjacent conductor pattern on the circuit board are bridged without removing the solder bridge. The solder can be melted and separated on adjacent conductor patterns to achieve the desired soldering purpose.

According to the present invention of claims 7, 8, 9 and 10,
By making it possible to manufacture an iron tip portion in which the tip of the tip and / or the tip of the tip are easily wetted by the molten solder and the portion that repels the molten solder, it is possible to manufacture the solder bridge portion. When the solder is melted and separated on the adjacent conductor patterns of the circuit board, even if an uneven amount of solder is deposited on one conductor pattern, the point solder can be easily placed on the tip part. , Can be moved to the other conductor pattern and soldered.

According to the eleventh and twelfth aspects of the present invention, when the lead pins of the narrow pitch semiconductor or the lands of the circuit board are pre-soldered by manual soldering, the respective lead pins or /
Also, it is easy to deposit a uniform amount of solder on each land.

In the thirteenth aspect of the present invention, after the work of the preliminary soldering is completed, when the narrow pitch flat package semiconductor is mounted, even if the lead pin is pressed against the land of the circuit board by the iron tip, The advantage is that the previously melted solder does not adhere.

In the fourteenth aspect of the present invention, since the hot air discharge port can be made one and the required minimum discharge area can be obtained and the tip of the iron tip and / or the tip of the iron tip can be directly heated, Efficiently melts the solder at the bridge portion of the circuit board that contacts it and the solder at the peripheral bridge portion almost instantaneously (within 2 seconds) to limit the spread of the hot air discharged, and It is possible to minimize the adverse effect on the electronic components of.

[0047]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a first embodiment of the present invention.

FIG. 1A is a three-dimensional view of the tip portion of the soldering iron of the present invention. (B) is an AA cross-sectional view of the tip portion (steel) 10 of the tip of the present invention. A ceramic 30 as a heat-resistant insulating film of titanium nitride (TiN) is formed on the tip portion 10 of the iron tip by CVD or sputtering. Also, (C)
The BB sectional drawing of the tip part (steel) 15 in the tip part of this invention is shown. A ceramic 30 as the same heat-resistant insulating film is formed on the tip portion 15 of the iron tip.
The tip of the soldering iron tip and / or the tip of the soldering iron shown in FIG. 1 is made by processing a steel material by heat treatment or the like. It is structured to be heated by the hot air coming out. Further, the iron tip portion having the hot air outlet 21 is structured to be inserted into the heater built-in portion by a screw-in type or a plug-in type. Further, the tip of the iron tip (steel) 10 and the tip of the iron tip (steel) 15 are also inserted into the tip portion having the hot air ventilation port 20, but it is better to integrally manufacture this portion. It can be said that it is more preferable because it becomes a solid one. The hot air soldering iron is HA manufactured by Hakuko Co., Ltd.
Although KKO851 and HS-550 manufactured by Hozan Co., Ltd. are commercially available, they are used for directly applying hot air to an object to be melted to melt the cream solder, or to melt the solder to remove chip parts and the like from the circuit board. The soldering iron of the present invention is completely different from the soldering iron of the present invention in terms of the purpose of use and the structure of the soldering iron. Also,

As described in detail in [Means for Solving the Problems], ceramic spraying of aluminum oxide, chromium oxide, titanium oxide, zirconia, etc., oxidation treatment after hot-dip aluminum plating on the tip portion, oxidation treatment after aluminum spraying, or soldering It is easily conceivable that the iron tip of the iron is subjected to a nitriding treatment using a steel material, or the molten solder is repelled by a carburizing treatment such as carburizing and quenching, or it is difficult to get wet. Although only one type of soldering iron has been described above, it goes without saying that it may have any shape that can be used for the above purpose.

FIG. 2 shows a second embodiment of the present invention.

FIG. 2A shows the tip of a soldering iron (steel) 10 and the tip of a soldering iron (steel) 1 of the soldering iron shown in FIG.
5 is a three-dimensional view of the hot air discharge port 21 shown in FIG.
Although the iron tip portion and the heater built-in portion 35 are not shown in the figure, they are regarded as basically the same as the structure of FIG. (B) is an AA cross-sectional view of the tip portion (steel) 10 of the tip of the present invention. A heat-resistant insulating agent is applied to the lower part of the tip of the iron tip 10 to form a ceramic 30 as a heat-resistant insulating film.
The tip of the soldering iron tip (steel) 10 and the tip of the soldering iron (steel) 15 shown in FIG.
Those that have been subjected to decarburization are more preferable because they are easily wet by the molten solder. Instead of applying the heat-resistant insulating material to the portion where the ceramic 30 shown in FIG. 2 is formed, oxidation treatment after hot-dip aluminum plating, oxidation treatment after aluminum spraying, or aluminum oxide, chromium oxide, titanium oxide,
Of course, a heat-resistant insulating film having a property of repelling molten solder may be formed by ceramic spraying of zirconia or the like. Although only one type of soldering iron has been described above, it goes without saying that it may have any shape that can be used for the above purpose.

FIGS. 3, 4, 5 and 6 show a third embodiment of the present invention, which uses the soldering iron described in the second embodiment of the present invention.

FIG. 3 shows the soldering iron tip point (steel) 10 shown in FIG. 2 which is to be applied to the center of the solder bridge portion 45 of the adjacent conductor pattern of the circuit board. Further, FIG. 4 shows a state in which the solder at the solder bridge portion 45 of the adjacent conductor pattern 40 of the circuit board is separated into the two molten solders 60 by the tip (steel) 10 of the iron tip coated with ceramic. FIG. 5 shows how excessive molten solder 60 adheres to the upper portion of the tip (steel) 10 of the iron tip. FIG. 6 shows how the molten solder 60 separated into two adheres to the adjacent conductor pattern 50 to form the solder alloy 70.

FIGS. 3, 4, 5 and 6 show the QF on the circuit board.
Although a semiconductor package such as P or SOP is mounted and the adjacent lead pins of the semiconductor package are not solder bridged, this third embodiment shows a solder bridge of the lead pins of the semiconductor package mounted on the circuit board. It goes without saying that it is also applied to the defect repair of. Further, it is needless to say that the present invention is also applied to repair of defects in the solder bridge of the lead pin of the semiconductor package such as DIP mounted on the through hole substrate.

FIGS. 7 and 8 show a fourth embodiment of the present invention, which uses a soldering iron having the same structure as described in the first and second embodiments of the present invention except for the tip portion. ing.

7 and 8 are devised to have a tip shape that facilitates pre-soldering to adjacent lands of the circuit board.
In both cases, the tip of the tip has irregularities, the recess has a structure filled with ceramics 30, and the protrusion has a structure in which the metal of the tip (metal) 17 of the tip is exposed. Figure 4
Is merely devised in a tip shape so that the molten solder adhered by the ceramic in the convex portion and the concave portion between the convex portions is easily separated. In each case, (A) shows a plan view of the tip portion. (B) shows an AA cross-sectional view. (C) is BB
A cross-sectional view is shown. In this figure, both the concave portion and the convex portion may be covered with a heat-resistant insulating film that repels molten solder.

FIG. 9A is a three-dimensional view of the tip portion of the soldering iron of the present invention. (B) is an AA cross-sectional view of the tip portion (steel) 10 of the tip of the present invention.

A ceramic 30 is formed on the tip of the iron tip 10 by CVD or sputtering, using titanium nitride (TiN) as a heat-resistant insulating film. The tip of the soldering iron tip shown in FIG. 9 is made by processing a steel material by heat treatment or the like, and is directly heated by the hot air coming out of the hot air outlet 21 through the heater built-in portion 35. It has a structure that Further, the iron tip portion having the hot air outlet 21 is structured to be inserted into the heater built-in portion by a screw-in type or a plug-in type. Further, the tip of the iron tip (steel) 10 is a tip holder 1 having a hot air outlet 21.
It has a structure to be press-fitted in 8, and this part is integrally manufactured. As a product applying the above basic principle, TY-20 from Toyo Technical Co., Ltd.
Solder bridge separator 00 is June 12, 1994
Orders for sale will start from the day. In addition, it will be published in the July 1994 issue of Electronic Technology of Nikkan Kogyo Shimbun as a product introduction article.

[0058]

In the past, when a conductor pattern on a circuit board on which a semiconductor package was mounted was solder bridged, it was necessary to completely remove it with a solder wick and then re-sold it. With a soldering iron that has a soldering iron tip with a heat-resistant insulating agent that repels
Without removing the solder bridge, the bridged solder can be separated on the adjacent conductor pattern to achieve the desired soldering purpose.

Conventionally, a soldering iron having an elongated tip portion of the iron tip portion has a temperature gradient in the iron tip portion, that is, the temperature of the iron tip portion closer to the heater side becomes higher. A phenomenon occurs in which the molten solder rises from the tip of the tip toward the tip of the heater.
Therefore, if the tip of the soldering tip is unnecessarily thin, the molten solder does not easily stick to the tip of the soldering tip, so that the function of the soldering iron cannot be sufficiently exerted. Therefore, even if a soldering iron having an extremely thin iron tip is manufactured in terms of strength and mechanical processing accuracy limit, the tip of the iron tip and / or the tip of the iron tip are excluded. By forming the heat-resistant insulating film that repels the molten solder on the tip portion, the molten solder is easily deposited only on the tip portion of the tip regardless of the temperature gradient of the tip portion. In addition, it is natural that the temperature gradient of the tip portion becomes extremely small by directly heating the tip portion with hot air. In such a soldering iron, since the supply amount of the molten solder in the soldering work is accurately controlled, it is necessary to mount a semiconductor package such as QFP having a narrow pitch of 0.25 to 0.5 mm on a circuit board. Soldering work with solder becomes much easier than conventional soldering irons.

In the soldering iron of the present invention, even when excessive solder on the circuit board is removed by the solder wick, the tip of the soldering iron tip is pressed (rounded) to a suitable 1 mmR. By providing a heat-resistant insulating film that repels molten solder on the metal surface, the work of removing the bridge solder becomes extremely easy.

The soldering iron of the present invention is

As explained in the section of [Operation], the effect of both the hot air and the tip directly heated by the hot air was able to efficiently melt the solder at the solder bridge portion formed on the circuit board and As a result of using only one discharge port to achieve the minimum required discharge area, the solder at the bridge part of the circuit board where the tip contacts and the solder mass at the surrounding bridge part can be efficiently and almost instantaneously (within 2 seconds). It is possible to minimize the adverse effect on other electronic components on the circuit board by melting the heat blown air) and limiting the spread of the discharged hot air.

[Brief description of drawings]

FIG. 1A is a perspective view of a soldering iron tip portion of the present invention, FIG. 1B is a sectional view taken along line AA in FIG. 1A, and FIG. 1C is a sectional view taken along line BB in FIG.

FIG. 2A is a view showing the tip portion of the soldering iron of the present invention,
A perspective view of the tip of the tip and the tip of the tip,
(B) is a sectional view taken along the line AA in (A), and (C) is a sectional view taken along the line BB in (A).

FIG. 3 is a cross-sectional view of a portion where a soldering iron of the present invention is applied to a solder bridge portion between adjacent conductor patterns of a circuit board.

FIG. 4 is a cross-sectional view of a portion of the solder bridge portion where the solder is melted and separated to the adjacent conductor pattern side by the soldering iron of the present invention.

FIG. 5 is a cross-sectional view of a portion of the soldering iron of the present invention where excessive molten solder at a solder bridge portion adheres to the upper side of the tip of the iron tip.

FIG. 6 is a cross-sectional view of a portion where the separated molten solder forms a solder alloy on two adjacent conductor patterns.

7A is a plan view of the tip portion of the soldering iron of the present invention, FIG. 7B is a sectional view taken along the line AA in FIG. 7A, and FIG. 7C is a sectional view taken along the line BB in FIG.

8A is a plan view of the tip portion of the soldering iron of the present invention, FIG. 8B is a sectional view taken along the line AA in FIG. 8A, and FIG. 8C is a sectional view taken along the line BB in FIG.

9A is a perspective view of a soldering iron tip portion of the present invention, and FIG. 9B is a sectional view taken along line AA in FIG. 9A.

[Explanation of symbols]

 10 Tip Tip (Steel) 15 Tip Tip (Steel) 16 Tip Tip (Ceramic) 17 Tip Tip (Metal) 18 Tip Holder 21 Hot Air Discharge Port 30 Ceramic 35 Built-in Heater Part 40 Circuit board 45 Solder bridge location 50 Conductor pattern 60 Molten solder 70 Solder alloy

Claims (14)

[Claims] 1. A soldering iron having a structure in which a tip of an iron tip and / or a tip of an iron tip covered with a heat-resistant insulating film having a property of repelling molten solder is heated by hot air. 2. A soldering iron characterized in that only the lower part of the tip of the iron tip and / or the tip of the ironing tip according to claim 1 is covered with a heat-resistant insulating film that repels molten solder. hand. 3. A soldering iron having a structure for heating a tip end portion and / or a tip end portion of a steel structure with hot air. 4. The soldering iron according to claim 3, wherein the tip of the iron tip and / or the tip of the iron tip is made of a steel material which is hard to be wetted by the molten solder. 5. A soldering iron having a structure in which a tip of an iron tip and / or a tip of an iron tip processed from a ceramic material having a property of repelling molten solder is heated by hot air. 6. A structure having a structure in which a tip end portion and / or a tip end portion formed by processing a non-ferrous metal material having a property of being hard to get wet with molten solder or a property of repelling molten solder is heated with hot air. Soldering iron characterized by. 7. The tip surface has a tip non-tip portion and / or a tip non-tip portion processed by a heat-resistant material having a property of repelling molten solder, and the tip surface is wet with the molten solder. A soldering iron having a structure in which a tip of an iron tip and / or a tip of an iron tip, which is made of a metal material, is heated with hot air. 8. A soldering iron having a structure for heating the tip of an iron tip or / and the tip of an iron tip according to claim 7 with hot air. 9. A soldering iron tip, which is made of a metal material that is easily wetted by molten solder, is coated with a heat-resistant insulating film having a property of repelling molten solder on the surface of the base material at the tip or / and the tip of the soldering tip. A soldering iron having a structure heated by hot air. 10. A heat-resistant material having a property that a base material surface of a tip end portion and / or a tip end portion processed with a metal material such as a steel material is covered with a metal film which is easily wetted by molten solder, and the molten solder is repelled. A soldering iron having a structure in which a tip covered with an insulating film is heated by hot air. 11. A tip-type tip portion and / or a tip-end portion of the tip of a flat type semiconductor package or / and its corresponding circuit board, for facilitating pre-soldering, are attached to a surface to which molten solder is attached. In this way, a plurality of concavities and convexities corresponding to the pitch interval of the flat type semiconductor package are alternately and continuously provided, and the concave portions corresponding to the solder resist of the circuit board are covered with a heat-resistant material having a property of repelling molten solder, and A soldering iron characterized in that a metal material which is easily wetted by molten solder is exposed on the convex portion corresponding to the land. 12. A soldering iron having a structure for heating the tip of an iron tip or / and the tip of an iron tip according to claim 11 with hot air. 13. A concavo-convex pattern corresponding to a pitch interval of a flat type semiconductor package is alternately and continuously provided at a plurality of positions, and the concave portion corresponding to a solder resist of a circuit board is covered with a heat resistant material having a property of repelling molten solder, Also, the convex portion corresponding to the land of the circuit board is covered with a heat-resistant material having a property of repelling molten solder, and has a structure for heating the tip or / and the tip of the iron tip with hot air. Characteristic soldering iron. 14. Claims 1, 2, 3, 4, 5, 6, 8,
The tip of the iron tip or / and the tip of the iron tip described in 9, 10, 12 and 13 crosses the center of the hot air outlet which is hollowed out in the shape of a column such as a circle, an ellipse, or a rectangle. A soldering iron having a protruding structure.