JP2019195820A - Iron tip for soldering iron - Google Patents

Iron tip for soldering iron Download PDF

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Publication number
JP2019195820A
JP2019195820A JP2018090152A JP2018090152A JP2019195820A JP 2019195820 A JP2019195820 A JP 2019195820A JP 2018090152 A JP2018090152 A JP 2018090152A JP 2018090152 A JP2018090152 A JP 2018090152A JP 2019195820 A JP2019195820 A JP 2019195820A
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tip
corrosion
iron
resistant member
soldering
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JP6483892B1 (en
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建治 千葉
Kenji Chiba
建治 千葉
耕平 鵜口
Kohei Uguchi
耕平 鵜口
和弥 七種
Kazuya Nanakusa
和弥 七種
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Japan Unix Co Ltd
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Japan Unix Co Ltd
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Priority to CN201910373308.3A priority patent/CN110449686A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/02Soldering irons; Bits
    • B23K3/025Bits or tips

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

To provide an iron tip for a soldering iron, which can extend its life by improving durability against corrosion of solder by a simple structure.SOLUTION: An iron tip for a soldering iron is used to perform a soldering operation by melting linear solder. The iron tip is formed by applying an iron plating layer 8 to a surface of a copper base material 4. A corrosion-resistant member 7 more corrosion-resistant against solder than against copper is attached to a region, which is brought into contact with the linear solder during the soldering operation, of the iron tip.SELECTED DRAWING: Figure 2

Description

本発明は、ICやLSIなどの電子部品のはんだ接合に使用するはんだ鏝用の鏝先に関するものである。   The present invention relates to a soldering iron tip used for soldering an electronic component such as an IC or LSI.

従来から、線状はんだを溶かしてICやLSIといった電子部品をプリント配線基板等にはんだ付けするはんだ鏝用の鏝先は知られている。特許文献1に示すように、この種の鏝先は、熱伝導性が高く且つはんだの濡れ性がよい銅製の基材の表面に鉄めっきし、ヒーターで加熱された該鏝先に線状はんだを供給することで、はんだ付けが行われるように成っている。一方、基材を構成する銅は、熱伝導性がよく、また、はんだの濡れ性がよい材料であるかわりに、はんだの成分である錫に浸食されやすいことから、この種の鏝先は、前記基材の表面に鉄めっき(鉄−ニッケルめっき)から成る保護層を施し、鏝先の耐食性が高められているものが一般的である。   2. Description of the Related Art Conventionally, a soldering iron tip for melting an electronic component such as an IC or LSI onto a printed wiring board by melting linear solder is known. As shown in Patent Document 1, this type of iron tip is iron-plated on the surface of a copper base material having high thermal conductivity and good solder wettability, and linear solder is applied to the iron tip heated by a heater. By supplying, soldering is performed. On the other hand, copper constituting the base material has good thermal conductivity, and instead of being a material with good solder wettability, it is easy to be eroded by tin which is a component of solder. In general, the surface of the base material is provided with a protective layer made of iron plating (iron-nickel plating) to enhance the corrosion resistance of the tip.

図20、図21は、この種の鏝先を用いてプリント基板21上に設けられたはんだ付け対象22にはんだ付けをしている様子を示しているものである。
ところが、従来の鏝先20の、はんだ供給ノズル26から送られる線状はんだ27が接触する部位は、線状はんだ27による機械的な圧力が作用すると共に、図20中矢印で示すように、当該部位には、溶融したはんだ28の渦が発生してはんだが繰り返し接触するため、はんだとの接触延べ時間が他の部位より多く、接触するはんだ量も他の部位より多い。そのため、はんだ付け作業が繰り返されることに伴い、図21に示すように、徐々に当該部位が摩耗して基材23を被覆する鉄めっき層24が剥がれ易く、該鉄めっき層24が剥がれた部位から、はんだが鏝先20内部に侵入して基材23がはんだに浸食され、その結果、鏝先20が早期に劣化してしまう場合があった。
20 and 21 show a state where soldering is performed on a soldering target 22 provided on the printed circuit board 21 using this kind of iron tip.
However, the portion of the conventional tip 20 where the linear solder 27 sent from the solder supply nozzle 26 contacts is subjected to mechanical pressure by the linear solder 27 and, as shown by the arrows in FIG. Since the vortex of the melted solder 28 is generated in the part and the solder is repeatedly contacted, the total contact time with the solder is longer than that of the other part, and the amount of solder to be contacted is also larger than that of the other part. Therefore, as the soldering operation is repeated, as shown in FIG. 21, the iron plating layer 24 covering the base material 23 is gradually peeled off and the iron plating layer 24 is peeled off. Therefore, the solder penetrates into the tip 20 and the base material 23 is eroded by the solder. As a result, the tip 20 may be deteriorated early.

特開2000−317629号公報JP 2000-317629 A

はんだの浸食に対する耐久性を高めて長寿命化を達成することが可能なはんだ鏝用の鏝先を提供することにある。   An object of the present invention is to provide a soldering iron tip capable of increasing the durability against erosion of solder and achieving a long life.

前記課題を解決するため、本発明によれば、線状はんだを溶かしてはんだ付けをするはんだ鏝用の鏝先であって、該鏝先は、銅製の基材の表面に鉄めっき層を施すことにより形成され、該鏝先の、はんだ付けの際に線状はんだが接触する部位に、銅よりもはんだに対する耐食性のある耐食性部材が取り付けられていることを特徴とするはんだ鏝用の鏝先が提供される。   In order to solve the above-mentioned problem, according to the present invention, a soldering iron tip for melting and soldering linear solder, the iron tip is provided with an iron plating layer on the surface of a copper base material The tip of the soldering iron is characterized in that a corrosion-resistant member that is more resistant to soldering than copper is attached to a portion of the soldering tip that contacts the linear solder during soldering. Is provided.

本発明において好ましくは、前記耐食性部材は、鉄めっき層で覆われていることである。或いは、前記耐食性部材は、鉄めっき層から露出してもよい。   In the present invention, preferably, the corrosion-resistant member is covered with an iron plating layer. Alternatively, the corrosion resistant member may be exposed from the iron plating layer.

また、本発明においては、前記耐食性部材は、鉄、ニッケル、アルミニウムのうちの何れかの金属素材で形成されていることが好ましい。或いは、前記耐食性部材は、アルミナ、ジルコニア、窒化珪素、窒化アルミニウムのうちの何れかの非金属で形成することもできる。   Moreover, in this invention, it is preferable that the said corrosion-resistant member is formed with the metal raw material in any one of iron, nickel, and aluminum. Alternatively, the corrosion resistant member can be formed of any non-metal of alumina, zirconia, silicon nitride, and aluminum nitride.

また、本発明において、前記耐食性部材は、前記基材に設けられた窪みに埋め込まれていてもよい。或いは、前記耐食性部材は、前記基材を貫通する貫通孔に挿入されていてもよい。   In the present invention, the corrosion-resistant member may be embedded in a recess provided in the base material. Or the said corrosion-resistant member may be inserted in the through-hole which penetrates the said base material.

本発明の鏝先によれば、はんだ付けの際に線状はんだが接触する部位に、銅よりもはんだに対する耐食性のある耐食性部材を取り付けたので、はんだの浸食に対する耐久性を高めて、長寿命化を達成することができる。   According to the tip of the present invention, a corrosion-resistant member that is more resistant to soldering than copper is attached to the portion where the linear solder contacts during soldering, so that durability against solder erosion is improved and long life is achieved. Can be achieved.

本発明に係るはんだ鏝用の鏝先の第1の実施形態を示す平面図である。It is a top view which shows 1st Embodiment of the tip for soldering irons concerning this invention. 図1の鏝先先端部付近を示す部分拡大断面図である。It is a partial expanded sectional view which shows the tip tip vicinity vicinity of FIG. 第1実施形態の鏝先の製造方法を示す図で、初期形状が円柱形をした基材を準備した状態を示す概略部分拡大図である。It is a figure which shows the manufacturing method of the tip of 1st Embodiment, and is a general | schematic fragmentary enlarged view which shows the state which prepared the base material whose initial shape was a column shape. 図3の状態から基材に貫通穴を形成した状態を示す概略部分拡大図である。FIG. 4 is a schematic partial enlarged view showing a state in which through holes are formed in the base material from the state of FIG. 3. 図4の状態から貫通穴に耐食性部材を挿入した状態を示す概略部分拡大図である。FIG. 5 is a schematic partial enlarged view showing a state in which a corrosion-resistant member is inserted into the through hole from the state of FIG. 4. 図5の状態から基材を鏝先形状に加工した状態を示す概略部分拡大図である。FIG. 6 is a schematic partial enlarged view showing a state in which the base material is processed into a tip shape from the state of FIG. 5. 図6の状態から基材に鉄めっき処理を施した状態を示す概略部分拡大図である。It is a general | schematic fragmentary enlarged view which shows the state which performed the iron plating process to the base material from the state of FIG. 第1実施形態の変形例の鏝先の製造方法を示す図で、初期形状が円柱形をした基材を鏝先形状に加工すると共に基材の側面に貫通穴を形成した状態を示す概略部分拡大図である。It is a figure which shows the manufacturing method of the tip of the modification of 1st Embodiment, and is the schematic part which shows the state which formed the through-hole in the side surface of a base material while processing the base material whose initial shape was a column shape into the tip shape It is an enlarged view. 図8の状態から貫通穴に耐食性部材を挿入した状態を示す概略部分拡大図である。It is a schematic partial enlarged view which shows the state which inserted the corrosion-resistant member in the through-hole from the state of FIG. 図9の状態から基材に鉄めっき処理を施した状態を示す概略部分拡大図である。FIG. 10 is a schematic partially enlarged view showing a state in which the base material is subjected to iron plating treatment from the state of FIG. 9. 本発明に係るはんだ鏝用の鏝先の第2の実施形態を示す平面図である。It is a top view which shows 2nd Embodiment of the tip for soldering irons concerning this invention. 図11の鏝先先端部付近を示す部分拡大図である。FIG. 12 is a partially enlarged view showing the vicinity of the tip of the tip of FIG. 11. 第2実施形態の鏝先の製造方法を示す図で、初期形状が円柱形をした基材の側面に窪みを凹設した状態を示す概略部分拡大図である。It is a figure which shows the manufacturing method of the tip of 2nd Embodiment, and is a general | schematic fragmentary enlarged view which shows the state which hollowed in the side surface of the base material whose initial shape was a column shape. 図13の状態から前記窪みに耐食性部材を埋め込んだ状態を示す概略部分拡大図である。It is a general | schematic fragmentary enlarged view which shows the state which embedded the corrosion-resistant member in the said hollow from the state of FIG. 図14の状態から基材を鏝先形状に加工した状態を示す概略部分拡大図である。It is a general | schematic fragmentary enlarged view which shows the state which processed the base material into the tip shape from the state of FIG. 図15の状態から基材の上に鉄めっき処理を施した状態を示す概略部分拡大図である。It is a general | schematic fragmentary enlarged view which shows the state which performed the iron plating process on the base material from the state of FIG. 第2実施形態の変形例の鏝先の製造方法を示す図で、初期形状が円柱形をした基材を鏝先形状に形成すると共に該基材に窪みを形成した状態を示す概略部分拡大図である。It is a figure which shows the manufacturing method of the tip of the modification of 2nd Embodiment, and is the schematic partial enlarged view which shows the state which formed the hollow in the base material while forming the base material into which the initial shape was a column shape. It is. 図17の状態から前記窪みに耐食性部材を埋め込んだ状態を示す概略部分拡大図である。It is a general | schematic fragmentary enlarged view which shows the state which embedded the corrosion-resistant member in the said hollow from the state of FIG. 図18の状態から基材の上に鉄めっき処理を施した状態を示す概略部分拡大図である。It is a schematic partial enlarged view which shows the state which performed the iron plating process on the base material from the state of FIG. 従来の鏝先を用いてはんだ付け作業を行っている状態を示す概略部分拡大断面図である。It is a general | schematic fragmentary expanded sectional view which shows the state which is performing the soldering operation | work using the conventional iron tip. 図20の状態から鏝先がはんだにより局部的に浸食された状態を示す概略部分拡大断面図である。It is a general | schematic fragmentary expanded sectional view which shows the state in which the tip was locally eroded with the solder from the state of FIG.

本発明に係る第1の実施形態のはんだ鏝用の鏝先を図1−図10を用いて説明する。前記鏝先1Aは、はんだ鏝に取り付けて使用するもので、線状はんだを溶融し、溶かしたはんだではんだ対象箇所のはんだ付けを行うものである。この鏝先1Aは、自動はんだ付け装置に用いられるはんだ鏝に装着してもよく、或いは、手動操作式の手持ちのはんだ鏝に装着してもよい。   A soldering iron tip according to the first embodiment of the present invention will be described with reference to FIGS. The tip 1A is used by being attached to a soldering iron, and melts linear solder and solders the solder target portion with the melted solder. The tip 1A may be attached to a soldering iron used in an automatic soldering apparatus, or may be attached to a manually operated soldering iron.

図1に示すように、前記鏝先1Aは、円柱形の鏝先本体部2と、この鏝先本体部2の先端に配された鏝先先端部3とを有している。前記鏝先本体部2は、はんだ鏝に内蔵されたヒーターからの熱を蓄熱して、蓄熱した熱を鏝先先端部3に伝熱するためのものである。鏝先先端部3は、線状はんだと直接接触して線状はんだを溶融させ、はんだ付対象箇所に溶融はんだを付着させる部分である。この鏝先先端部3は、前端に向かって次第に先細り形状に形成されていると共に、両側面に平らなはんだ付け面5,5が形成されたのみ型状を成していて、これらはんだ付け面5,5の前端部分がはんだと接触する濡れ面として構成されている。   As shown in FIG. 1, the tip 1 </ b> A has a cylindrical tip main body 2 and a tip end 3 disposed at the tip of the tip main body 2. The tip body 2 stores heat from a heater built in the soldering iron and transfers the stored heat to the tip 3 of the tip. The tip end portion 3 is a portion that directly contacts the linear solder to melt the linear solder and adheres the molten solder to the soldering target portion. The tip 3 of the tip is gradually tapered toward the front end, and has only a shape in which flat soldering surfaces 5 and 5 are formed on both side surfaces. The front end portions of 5 and 5 are configured as wet surfaces that come into contact with the solder.

鏝先本体部2及び鏝先先端部3は、熱伝導性に優れた銅製の基材4の表面に、保護皮膜としての鉄めっき層8を被覆することにより形成されている。   The tip body portion 2 and the tip end portion 3 are formed by covering the surface of a copper base 4 excellent in thermal conductivity with an iron plating layer 8 as a protective film.

前記鉄めっき層8は、鏝先1の耐食性を高めるためのものである。鉄めっき層8の厚さは、はんだ付け対象箇所の素材や形状等に応じて適宜の厚さ(例えば50μm−500μm)に形成される。ただし、その厚さが薄いほど鏝先1の耐食性は低くなり、厚さが厚いほど鏝先1の熱伝導性が低下するため、両者のバランスを考慮した厚さに形成される。なお、この鉄めっき層8の上には、鉄めっきとは異なる他のめっき処理を施すことができ、例えば、濡れ面となる部分を除くその他の部分、即ち鏝先本体部2の外面には、該鉄めっき層8の上から、はんだを付着しにくくするための硬質のクロムめっき層を設け、前記濡れ面にははんだの濡れ性をよくするためにはんだめっき層を設けることができるが、それらの図示は省略されている。   The iron plating layer 8 is for enhancing the corrosion resistance of the tip 1. The thickness of the iron plating layer 8 is formed to an appropriate thickness (for example, 50 μm to 500 μm) according to the material, shape, and the like of the location to be soldered. However, the thinner the thickness, the lower the corrosion resistance of the tip 1, and the thicker the thickness, the lower the thermal conductivity of the tip 1. In addition, on this iron plating layer 8, other plating processes different from iron plating can be performed, for example, other parts except the part used as a wet surface, ie, the outer surface of the tip main-body part 2, are provided. In addition, a hard chromium plating layer is provided on the iron plating layer 8 to make it difficult to adhere solder, and a solder plating layer can be provided on the wet surface in order to improve the wettability of the solder. Their illustration is omitted.

さらに、前記基材4には、はんだ付け時に線状はんだの先端が接触する部位に、銅よりもはんだに対する耐食性のある耐食性部材7が取り付けられている。この耐食性部材7は、はんだの濡れ性がよい素材で形成され、図示した例は鉄で形成されている。前記線状はんだが接触する部位とは、前記鏝先先端部3に形成されたはんだ付け面5のうちの一部分であり、このはんだ付け面5には、一対のはんだ付け面5,5を貫通する円形の貫通穴6が形成されていて、この貫通穴6に円柱状に形成された前記耐食性部材7がぴったりと密に挿入されている。耐食性部材7の両端面は、はんだ付け面5,5の傾斜に沿ってカットされ、基材4と連続した同一面を成している。そして、耐食性部材7の上から鉄めっき処理が施されることで、基材4の表面及び耐食性部材7の端面上に前記鉄めっき層8が配されている。
前記貫通穴6は、楕円形や多角形であっても良く、その場合、前記耐食性部材7も、穴形状に合わせて楕円形や多角形の断面形状を有するように形成される。
Furthermore, the base material 4 is provided with a corrosion-resistant member 7 that is more resistant to solder than copper at a site where the tip of the linear solder contacts during soldering. The corrosion-resistant member 7 is made of a material having good solder wettability, and the illustrated example is made of iron. The portion where the linear solder contacts is a part of the soldering surface 5 formed at the tip end portion 3, and the soldering surface 5 penetrates a pair of soldering surfaces 5, 5. A circular through-hole 6 is formed, and the corrosion-resistant member 7 formed in a cylindrical shape is inserted into the through-hole 6 closely and closely. Both end surfaces of the corrosion-resistant member 7 are cut along the inclination of the soldering surfaces 5, 5 and form the same surface that is continuous with the base material 4. And the said iron plating layer 8 is distribute | arranged on the surface of the base material 4 and the end surface of the corrosion-resistant member 7 by performing an iron plating process from the corrosion-resistant member 7 top.
The through hole 6 may be oval or polygonal. In this case, the corrosion-resistant member 7 is also formed to have an oval or polygonal cross-sectional shape in accordance with the hole shape.

なお、耐食性部材7を形成する素材は、前記鉄の他、例えば、ニッケル、アルミニウム等の金属素材で形成することもできるし、或いは、アルミナ、ジルコニア、窒化珪素、窒化アルミニウム等の非金属素材で形成することも可能である。   The material forming the corrosion-resistant member 7 can be made of a metal material such as nickel or aluminum in addition to the iron, or a non-metal material such as alumina, zirconia, silicon nitride, or aluminum nitride. It is also possible to form.

前記の如く、前記鏝先1Aは、基材4の線状はんだが当たる部位に銅よりもはんだに対する耐食性に優れた耐食性部材7が取り付けられているため、線状はんだの接触により機械的な圧力が作用したり、溶解したはんだの渦流が発生することによってはんだとの接触延べ時間が長くなったり、はんだの接触量が多くなったりした場合でも、はんだによる基材4の浸食を食い止めることができ、その結果、鏝先1Aの劣化を抑制して長寿命化を図ることができる。   As described above, since the tip 1A is provided with the corrosion-resistant member 7 having a higher corrosion resistance to the solder than copper at the portion where the linear solder hits the base material 4, mechanical pressure is exerted by the contact of the linear solder. Even if the total contact time with the solder becomes longer due to the action of the solder or the eddy current of the melted solder or the amount of contact with the solder increases, the erosion of the base material 4 by the solder can be prevented. As a result, it is possible to extend the life by suppressing the deterioration of the tip 1A.

前記鏝先1Aの製造方法の一例について図3−図7を用いて順に説明する。
先ずは、図3に示すように、未だ鏝先形状を成していない、初期形状が円柱状をした銅製基材4を準備する。次に、図4及び図5に示すように、前記基材4の先端部に、該基材4の側面を径方向に貫通する貫通穴6を穿設すると共に、この貫通穴6に、未加工で円柱形をした鉄製の耐食性部材7を挿入する。耐食性部材7は、貫通穴6の口径と略一致する直径を有していて、貫通穴6内に基材4の径方向中央に位置するように圧入等の適宜手段で押入する。
An example of the manufacturing method of the said tip 1A is demonstrated in order using FIGS. 3-7.
First, as shown in FIG. 3, a copper base material 4 having an initial shape which is not formed into a tip shape and having an initial column shape is prepared. Next, as shown in FIGS. 4 and 5, a through hole 6 that penetrates the side surface of the base material 4 in the radial direction is formed at the tip of the base material 4, and An iron corrosion-resistant member 7 having a cylindrical shape is inserted by processing. The corrosion-resistant member 7 has a diameter that substantially matches the diameter of the through hole 6, and is pressed into the through hole 6 by appropriate means such as press-fitting so as to be positioned at the center in the radial direction of the substrate 4.

それから、図6に示すように、前記耐食性部材7が取り付けられた位置に、前記はんだ付け面5が形成されるように、基材4と耐食性部材7とを切削し、鏝先本体部2及び鏝先先端部3を有する鏝先形状に加工する。そして、図7に示すように、前記耐食性部材7の上から前記基材4に鉄めっき処理を施すことで、該基材4及び耐食性部材7の上に鉄めっき層8を形成した鏝先1Aが製造される。なお、鏝先1Aには、鉄めっき層8の上からさらに前記クロムめっき処理やはんだめっき処理等の後加工が施される。   Then, as shown in FIG. 6, the base material 4 and the corrosion-resistant member 7 are cut so that the soldering surface 5 is formed at the position where the corrosion-resistant member 7 is attached, and the tip main body 2 and It is processed into a tip shape having a tip end portion 3. And as shown in FIG. 7, the tip 1A which formed the iron plating layer 8 on this base material 4 and the corrosion-resistant member 7 by performing the iron plating process to the said base material 4 from on the said corrosion-resistant member 7 Is manufactured. The tip 1A is further subjected to post-processing such as chromium plating and solder plating from above the iron plating layer 8.

なお、耐食性部材7が金属製である場合には、耐食性部材7を基材4に溶接により固定することができ、耐食性部材7が非金属である場合には、該耐食性部材7を基材4に接着剤で接着することもできる。接着剤としては、セラミックボンドのような無機系接着剤類や熱伝導セメント等が挙げられる。   When the corrosion resistant member 7 is made of metal, the corrosion resistant member 7 can be fixed to the base material 4 by welding. When the corrosion resistant member 7 is non-metallic, the corrosion resistant member 7 is attached to the base material 4. It can also be bonded to the adhesive. Examples of the adhesive include inorganic adhesives such as ceramic bonds and heat conductive cement.

鏝先1Aの前記の製造方法では、前記耐食性部材7を、鏝先形状に加工する前の未だ円柱状を成す基材4に取り付け、そのあと該基材4を鏝先形状に加工しているが、先に、基材4を鏝先形状に加工してから該基材4に耐食性部材7を取り付けることもできる。それを、図8−図10を用いて説明する。   In the manufacturing method of the tip 1A, the corrosion-resistant member 7 is attached to the base material 4 that is still cylindrical before being processed into the tip shape, and then the base material 4 is processed into the tip shape. However, the corrosion-resistant member 7 can also be attached to the base material 4 after the base material 4 is first processed into a tip shape. This will be described with reference to FIGS.

先ず、図8に示すように、先に円柱状をした基材4をのみ型の鏝先形状に切削加工すると共に、はんだ付け面5,5を貫通する貫通穴6を形成する。それから、前記貫通穴6に、未加工で円柱形をした耐食性部材7を挿入する。このとき、図9に示すように、基材4は、既に先端が先細りした形の鏝先形状に加工されていることから、耐食性部材7がはんだ付け面5,5から突き出した状態と成っている。この状態で、基材4の表面に鉄めっき処理を施すことで、基材4と、はんだ付け面5から突き出た耐食性部材の上に鉄めっき層8が形成される。その後、適切な形の鏝先形状に形成するため、前記はんだ付け面5,5の傾斜に沿って耐食性部材7の突き出た余剰部分をカットすると、図10に示すように、耐食性部材7の表面と鉄めっき層8とが連続する同一面に表れた変形例ののみ型鏝先1Bを得ることができる。つまり、この方法によれば、耐食性部材7の表面が鉄めっき層8で覆われていない鏝先1Bが得られる。   First, as shown in FIG. 8, the base material 4 having a cylindrical shape is cut into a die tip shape, and a through hole 6 penetrating the soldering surfaces 5 and 5 is formed. Then, a corrosion-resistant member 7 that is not processed and is cylindrical is inserted into the through-hole 6. At this time, as shown in FIG. 9, the base material 4 has already been processed into a tip shape with a tapered tip, so that the corrosion-resistant member 7 protrudes from the soldering surfaces 5 and 5. Yes. In this state, the iron plating layer 8 is formed on the base material 4 and the corrosion-resistant member protruding from the soldering surface 5 by performing the iron plating process on the surface of the base material 4. Thereafter, in order to form an appropriate shape of the tip, when the protruding surplus portion of the corrosion-resistant member 7 is cut along the inclination of the soldering surfaces 5 and 5, the surface of the corrosion-resistant member 7 as shown in FIG. The mold tip 1B can be obtained only in a modified example in which the iron plating layer 8 appears on the same continuous surface. That is, according to this method, the tip 1B in which the surface of the corrosion-resistant member 7 is not covered with the iron plating layer 8 is obtained.

本発明のはんだ鏝用の鏝先の第2の実施形態を図11−図19を用いて説明する。
図11及び図12に示すように、この第2の実施形態の鏝先1Cは、前記鏝先先端部3の前端部分に、プリント配線基板に設けられたピン状端子を受け入れ可能な溝部9を有している。すなわち、この鏝先1Cは、前記ピン状端子の列に沿って、はんだ鏝を移動させながらはんだ付けを行う、移動はんだ付け引きはんだ用の鏝先である。
A second embodiment of the soldering iron tip of the present invention will be described with reference to FIGS.
As shown in FIGS. 11 and 12, the tip 1C of the second embodiment has a groove 9 that can receive a pin-like terminal provided on a printed wiring board at the front end of the tip 3 of the tip. Have. That is, the tip 1C is a tip for moving soldering soldering that performs soldering while moving the soldering iron along the row of pin-shaped terminals.

この第2実施形態の鏝先1Cは、前記溝部9の溝底に連続しかつ所定の角度に傾斜するはんだ供給面10を有している。このはんだ供給面10は、線状はんだを接触させることで、線状はんだを溶融させて前記溝部9に供給するための部分である。前記はんだ供給面10の、線状はんだが接触する部位には窪み11が設けられていて、該窪み11に前記耐食性部材7が埋め込まれている。そして、耐食性部材7の上から前記基材4に鉄めっき処理が施されることにより、基材4と耐食性部材7との表面に鉄めっき層8が形成されている。   The tip 1C of the second embodiment has a solder supply surface 10 that is continuous with the groove bottom of the groove 9 and is inclined at a predetermined angle. The solder supply surface 10 is a portion for bringing the linear solder into contact with the linear solder by supplying the linear solder to the groove portion 9. A recess 11 is provided at a portion of the solder supply surface 10 where the linear solder contacts, and the corrosion-resistant member 7 is embedded in the recess 11. And the iron plating layer 8 is formed in the surface of the base material 4 and the corrosion-resistant member 7 by performing the iron plating process to the said base material 4 from on the corrosion-resistant member 7. FIG.

第2の実施形態の鏝先1Cの製造方法の一例について図13−図16を用いて説明する。先ず、図13に示すように、初期形状が円柱形をした銅製の基材4を準備し、基材4に、該基材4の径方向に窪んだ前記窪み11を形成する。窪み11の底部は平坦に形成する。そして、図14に示すように、円柱状をした未加工の耐食性部材7を、窪み11の底部に当たるまで押入し、図15に示すように、該耐食性部材7が取り付けられた位置に、前記はんだ供給面10が形成されるように、基材4と耐食性部材7とを切削し、鏝先本体部2及び鏝先先端部3を有する移動はんだ鏝用の鏝先形状に加工する。そして、前記耐食性部材7の上から前記基材4に鉄めっき処理を施すことで、該基材4及び耐食性部材7の上に鉄めっき層8を形成した鏝先1Cが製造される。   An example of the manufacturing method of the tip 1C of 2nd Embodiment is demonstrated using FIGS. 13-16. First, as shown in FIG. 13, a copper base material 4 whose initial shape is a columnar shape is prepared, and the recess 11 that is recessed in the radial direction of the base material 4 is formed on the base material 4. The bottom of the recess 11 is formed flat. Then, as shown in FIG. 14, the column-shaped raw corrosion-resistant member 7 is pushed in until it hits the bottom of the recess 11, and as shown in FIG. 15, the solder-resistant member 7 is attached to the position where the corrosion-resistant member 7 is attached. The base material 4 and the corrosion-resistant member 7 are cut so that the supply surface 10 is formed, and processed into a tip shape for the moving solder iron having the tip body portion 2 and the tip end portion 3. And the iron tip 1C which formed the iron plating layer 8 on this base material 4 and the corrosion-resistant member 7 is manufactured by iron-plating the said base material 4 from on the said corrosion-resistant member 7.

なお、図17−図19に示すように、移動はんだ鏝用の鏝先を製造する場合にも、先に、基材4を鏝先形状に切削加工したあと、耐食性部材7を基材4に取り付ける製造手順を踏むことができる。
この場合には、先ず、図17に示すように、初期形状が円柱状をした基材4を、前記鏝先本体部2と鏝先先端部3とを有する移動はんだ鏝用の鏝先形状に切削すると共に、前記はんだ供給面10に窪み11を形成する。それから、図18に示すように、円柱形をした未加工の耐食性部材7を窪み11の底部にあたるまで押入して、はんだ供給面10から耐食性部材7が突出した状態で基材4に鉄めっき処理をする。それから、前記はんだ供給面10の傾斜に沿って耐食性部材7の突き出た余剰部分をカットすることで、図19に示すように、耐食性部材7の表面と鉄めっき層8とが連続する同一面に表れた変形例の鏝先1Dを得ることができる。この方法により、耐食性部材7の表面が鉄めっき層8から露出した鏝先1Dが得られる。
In addition, as shown in FIGS. 17-19, also when manufacturing the tip for moving soldering irons, after cutting the base material 4 into the tip shape first, the corrosion-resistant member 7 is made into the base material 4. You can follow the manufacturing procedure to install.
In this case, first, as shown in FIG. 17, the base material 4 having an initial column shape is formed into a tip shape for a moving solder iron having the tip main body portion 2 and the tip end portion 3. In addition to cutting, a recess 11 is formed in the solder supply surface 10. Then, as shown in FIG. 18, the raw corrosion-resistant member 7 having a cylindrical shape is pushed in until it hits the bottom of the recess 11, and the substrate 4 is iron-plated with the corrosion-resistant member 7 protruding from the solder supply surface 10. do. Then, by cutting the protruding excess portion of the corrosion-resistant member 7 along the inclination of the solder supply surface 10, as shown in FIG. 19, the surface of the corrosion-resistant member 7 and the iron plating layer 8 are continuous on the same surface. A modified tip 1D can be obtained. By this method, the tip 1D in which the surface of the corrosion-resistant member 7 is exposed from the iron plating layer 8 is obtained.

1A−1D 鏝先
4 基材
6 貫通穴
7 耐食性部材
8 鉄めっき層
11 窪み
1A-1D Tip 4 Substrate 6 Through hole 7 Corrosion resistant member 8 Iron plating layer 11 Dimple

前記課題を解決するため、本発明によれば、線状はんだを溶かしてはんだ付けをするはんだ鏝用の鏝先であって、該鏝先は、銅製の基材の表面に鉄めっき層を施すことにより形成されていて、はんだ付け時に前記線状はんだの先端と接触して該線状はんだを溶融させる鏝先先端部を有し、前記鏝先先端部には、前記線状はんだの先端が接触するはんだ接触部位を有する一方の側面から他方の側面に向けて、該鏝先先端部の内部を鏝先の径方向に延びる貫通穴又は非貫通の窪みからなる部材挿入のための部分が形成され、前記部材挿入のための部分の内部には、銅よりもはんだに対する耐食性を有する耐食性部材が挿入されており、前記耐食性部材の端面は、前記鏝先先端部の側面の前記はんだ接触部位において前記基材から露出している、ことを特徴とするはんだ鏝用の鏝先が提供される。 In order to solve the above-mentioned problem, according to the present invention, a soldering iron tip for melting and soldering linear solder, the iron tip is provided with an iron plating layer on the surface of a copper base material A tip of the tip of the linear solder that melts the linear solder in contact with the tip of the linear solder during soldering. A part for inserting a member consisting of a through-hole or a non-penetrating recess extending in the radial direction of the tip is formed inside the tip of the tip from one side having the solder contact portion to the other side. In addition, a corrosion-resistant member having corrosion resistance against solder rather than copper is inserted inside the portion for inserting the member, and the end surface of the corrosion-resistant member is at the solder contact portion on the side surface of the tip end portion of the tip. is exposed from the substrate, this Soldering tip of the soldering 鏝用 is provided, wherein.

本発明においては、前記耐食性部材は円柱からなり、前記部材挿入のための部分は円形の貫通穴からなっていて、該貫通穴の内部に、前記耐食性部材が、前記はんだ接触部位から前記鏝先先端部の他方の側面まで達するように、前記基材を貫通した状態に挿入されていても、あるいは、前記耐食性部材は円柱からなり、前記部材挿入のための部分は円形の窪みからなっていて、該窪みの内部に、前記耐食性部材が、端面を前記はんだ接触部位において前記基材から露出させた状態に挿入されていても良い。 In the present invention, the corrosion-resistant member is formed of a cylinder, and the portion for inserting the member is formed of a circular through hole, and the corrosion-resistant member is inserted into the through-hole from the solder contact portion to the tip of the tip. Even if it is inserted in a state of penetrating the base material so as to reach the other side surface of the tip portion, or the corrosion-resistant member is made of a cylinder, and the portion for inserting the member is made of a circular depression The corrosion-resistant member may be inserted into the recess with the end face exposed from the base material at the solder contact portion.

また、本発明において、前記耐食性部材の端面は、鉄めっき層で覆われていても、鉄めっき層から露出していても構わない。 Moreover, in this invention, the end surface of the said corrosion-resistant member may be covered with the iron plating layer, or may be exposed from the iron plating layer.

また、本発明において、前記耐食性部材は、鉄、ニッケル、アルミニウムのうちの何れかの金属素材で形成されていても、アルミナ、ジルコニア、窒化珪素、窒化アルミニウムのうちの何れかの非金属で形成されていても良い。
Further, in the present invention, the corrosion-resistant member is formed of a non-metal of alumina, zirconia, silicon nitride, or aluminum nitride even if formed of a metal material of iron, nickel, or aluminum. May have been.

Claims (7)

線状はんだを溶かしてはんだ付けをするはんだ鏝用の鏝先であって、
該鏝先は、銅製の基材の表面に鉄めっき層を施すことにより形成され、該鏝先の、はんだ付けの際に線状はんだが接触する部位に、銅よりもはんだに対する耐食性のある耐食性部材が取り付けられていることを特徴とするはんだ鏝用の鏝先。
It is a tip for soldering iron that melts linear solder and solders,
The tip is formed by applying an iron plating layer on the surface of a copper base material, and the tip of the tip is in contact with the linear solder during soldering. A soldering iron tip characterized by having a member attached thereto.
前記耐食性部材は、鉄めっき層で覆われていることを特徴とする請求項1に記載のはんだ鏝用の鏝先。   The tip for soldering iron according to claim 1, wherein the corrosion-resistant member is covered with an iron plating layer. 前記耐食性部材は、鉄めっき層から露出していることを特徴とする請求項1に記載のはんだ鏝用の鏝先。   The tip of the soldering iron according to claim 1, wherein the corrosion-resistant member is exposed from the iron plating layer. 前記耐食性部材は、鉄、ニッケル、アルミニウムのうちの何れかの金属素材で形成されていることを特徴とする請求項1−3の何れかに記載のはんだ鏝用の鏝先。   The tip for soldering iron according to any one of claims 1 to 3, wherein the corrosion-resistant member is formed of any metal material of iron, nickel, and aluminum. 前記耐食性部材は、アルミナ、ジルコニア、窒化珪素、窒化アルミニウムのうちの何れかの非金属で形成されていることを特徴とする請求項1−3の何れかに記載のはんだ鏝用の鏝先。   4. The soldering iron tip according to claim 1, wherein the corrosion-resistant member is made of any non-metal of alumina, zirconia, silicon nitride, and aluminum nitride. 前記耐食性部材は、前記基材に設けられた窪みに埋め込まれていることを特徴とする請求項1−5の何れかに記載のはんだ鏝用の鏝先。   The tip for soldering iron according to claim 1, wherein the corrosion-resistant member is embedded in a recess provided in the base material. 前記耐食性部材は、前記基材を貫通する貫通孔に挿入されていることを特徴とする請求項1−5の何れかに記載のはんだ鏝用の鏝先。   The tip for soldering iron according to claim 1, wherein the corrosion-resistant member is inserted into a through-hole penetrating the base material.
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